PD - 9.767A IRGPF50F INSULATED GATE BIPOLAR TRANSISTOR Fast Speed IGBT Features C " Switching-loss rating includes all "tail" losses VCES = 900V " Optimized for medium operating frequency (1 to 10kHz) See Fig. 1 for Current vs. Frequency curve VCE(sat) d" 2.7V G @VGE = 15V, IC = 28A E n-channel Description Insulated Gate Bipolar Transistors (IGBTs) from International Rectifier have higher usable current densities than comparable bipolar transistors, while at the same time having simpler gate-drive requirements of the familiar power MOSFET. They provide substantial benefits to a host of high-voltage, high- current applications. TO-247AC Absolute Maximum Ratings Parameter Max. Units VCES Collector-to-Emitter Voltage 900 V IC @ TC = 25°C Continuous Collector Current 51 IC @ TC = 100°C Continuous Collector Current 28 A ICM Pulsed Collector Current 100 ILM Clamped Inductive Load Current 100 VGE Gate-to-Emitter Voltage Ä…20 V EARV Reverse Voltage Avalanche Energy 20 mJ PD @ TC = 25°C Maximum Power Dissipation 200 W PD @ TC = 100°C Maximum Power Dissipation 78 TJ Operating Junction and -55 to +150 TSTG Storage Temperature Range °C Soldering Temperature, for 10 sec. 300 (0.063 in. (1.6mm) from case) Mounting torque, 6-32 or M3 screw. 10 lbf" in (1.1N" m) Thermal Resistance Parameter Min. Typ. Max. Units R¸JC Junction-to-Case ------ ------ 0.64 R¸CS Case-to-Sink, flat, greased surface ------ 0.24 ------ °C/W R¸JA Junction-to-Ambient, typical socket mount ------ ------ 40 Wt Weight ------ 6 (0.21) ------ g (oz) Revision 0 C-267 IRGPF50F Electrical Characteristics @ TJ = 25°C (unless otherwise specified) Parameter Min. Typ. Max. Units Conditions V(BR)CES Collector-to-Emitter Breakdown Voltage 900 ---- ---- V VGE = 0V, IC = 250µA V(BR)ECS Emitter-to-Collector Breakdown Voltage 20 ---- ---- V VGE = 0V, IC = 1.0A "V(BR)CES/"TJ Temperature Coeff. of Breakdown Voltage ---- 0.74 ---- V/°C VGE = 0V, IC = 1.0mA VCE(on) Collector-to-Emitter Saturation Voltage ---- 2.1 2.7 IC = 28A VGE = 15V ---- 2.7 ---- V IC = 51A See Fig. 2, 5 ---- 2.4 ---- IC = 28A, TJ = 150°C VGE(th) Gate Threshold Voltage 3.0 ---- 5.5 VCE = VGE, IC = 250µA "VGE(th)/"TJ Temperature Coeff. of Threshold Voltage ---- -9.7 ---- mV/°C VCE = VGE, IC = 250µA gfe Forward Transconductance 12 18 ---- S VCE = 100V, IC = 28A ICES Zero Gate Voltage Collector Current ---- ---- 250 µA VGE = 0V, VCE = 900V ---- ---- 2000 VGE = 0V, VCE = 900V, TJ = 150°C IGES Gate-to-Emitter Leakage Current ---- ---- Ä…100 nA VGE = Ä…20V Switching Characteristics @ TJ = 25°C (unless otherwise specified) Parameter Min. Typ. Max. Units Conditions Qg Total Gate Charge (turn-on) ---- 81 120 IC = 28A Qge Gate - Emitter Charge (turn-on) ---- 16 24 nC VCC = 400V See Fig. 8 Qgc Gate - Collector Charge (turn-on) ---- 29 44 VGE = 15V td(on) Turn-On Delay Time ---- 32 ---- TJ = 25°C tr Rise Time ---- 22 ---- ns IC = 28A, VCC = 720V td(off) Turn-Off Delay Time ---- 200 280 VGE = 15V, RG = 5.0&! tf Fall Time ---- 130 180 Energy losses include "tail" Eon Turn-On Switching Loss ---- 1.1 ---- Eoff Turn-Off Switching Loss ---- 1.8 ---- mJ See Fig. 9, 10, 11, 14 Ets Total Switching Loss ---- 2.9 4.1 td(on) Turn-On Delay Time ---- 32 ---- TJ = 150°C, tr Rise Time ---- 20 ---- ns IC = 28A, VCC = 720V td(off) Turn-Off Delay Time ---- 480 ---- VGE = 15V, RG = 5.0&! tf Fall Time ---- 450 ---- Energy losses include "tail" Ets Total Switching Loss ---- 5.7 ---- mJ See Fig. 10, 14 LE Internal Emitter Inductance ---- 13 ---- nH Measured 5mm from package Cies Input Capacitance ---- 2300 ---- VGE = 0V Coes Output Capacitance ---- 180 ---- pF VCC = 30V See Fig. 7 Cres Reverse Transfer Capacitance ---- 27 ---- Å‚ = 1.0MHz Notes: Repetitive rating; V =20V, pulse width Pulse width 5.0µs, Repetitive rating; pulse width limited GE limited by max. junction temperature. single shot. by maximum junction temperature. ( See fig. 13b ) VCC=80%(VCES), VGE=20V, L=10µH, Pulse width d" 80µs; duty factor d" 0.1%. RG= 5.0&!, ( See fig. 13a ) C-268 IRGPF50F 60 For both: Triangula r w ave: Duty c yc le: 50% TJ = 125°C T s i n k = 90°C G ate d rive as s pec ified Clamp voltage: P ow e r Dissipa tion = 4 0W 40 80% of rated Square w ave: 60% of rated voltage 20 Ideal diodes 0 0.1 1 10 100 f, Fre quency (kH z) Fig. 1 - Typical Load Current vs. Frequency (For square wave, I=IRMS of fundamental; for triangular wave, I=I ) PK 1000 1000 TJ = 25°C 100 100 TJ = 150°C TJ = 150°C TJ = 25 °C 10 10 V C = 100V V G E = 15V C 5µs P UL S E W IDTH 20µs P ULSE W ID TH 1 1 5 10 15 20 1 10 VG E , G ate -to-E m itter Volta ge (V ) VC E , Collector-to-Em itter V oltage (V) Fig. 2 - Typical Output Characteristics Fig. 3 - Typical Transfer Characteristics C-269 LOAD CURRENT (A) C C I , C ollector-to-Emitter Current (A) I , Collector-to-Em itter C urrent (A ) IRGPF50F 60 4.0 V G E = 15V VG E = 15V 80µs P ULSE W ID TH 50 3.5 I C = 56A 40 3.0 30 2.5 I C = 28A 2.0 20 I C = 14A 1.5 10 1.0 0 -60 -40 -20 0 20 40 60 80 100 120 140 160 25 50 75 100 125 150 T C , C ase Tem perature (°C) TC , C ase Tem perature (°C) Fig. 4 - Maximum Collector Current vs. Fig. 5 - Collector-to-Emitter Voltage vs. Case Temperature Case Temperature 1 D = 0.50 0.20 0.1 0.10 PDM 0.05 t1 t 2 0.02 SIN GLE P U LSE N otes: (TH ER M AL R E SP ON SE ) 0.01 1 . D uty fac tor D = t 1 / t 2 2. P ea k TJ = P Z t h J C + T C D M x 0.01 0.00001 0.0001 0.001 0.01 0.1 1 10 t 1 , R ectangular Pulse Duration (sec) Fig. 6 - Maximum Effective Transient Thermal Impedance, Junction-to-Case C-270 Maximum DC Collector C urrent (A) C E V , C ollector-to-Emitter Voltage (V) thJC Thermal R esponse (Z ) IRGPF50F 50 0 0 20 V GE = 0V, f = 1MHz VC E = 400V C = C + C , C SHORTED ies ge gc ce I C = 28A C = C res gc C ce + C gc = C 40 0 0 oes 16 C ies 30 0 0 12 C oes 20 0 0 8 10 0 0 4 C res 0 0 1 10 10 0 0 20 40 60 80 100 V C E , Collector-to-Em itter V oltage (V) Q g , Total G ate Charge (nC) Fig. 7 - Typical Capacitance vs. Fig. 8 - Typical Gate Charge vs. Collector-to-Emitter Voltage Gate-to-Emitter Voltage 4.4 100 VC C = 720V R G = 5 &! VG E = 15V V G E = 15V 4.2 TC = 25°C V C C = 720V I C = 28A 4.0 I C = 56A 3.8 10 I C = 28A 3.6 I C = 14A 3.4 3.2 1 3.0 2.8 2.6 0.1 0 10 2 0 30 40 50 60 -60 -40 -20 0 20 40 60 80 100 120 140 160 R G , G ate R esistance (&! ) TC, Case Tem perature (°C) W Fig. 9 - Typical Switching Losses vs. Gate Fig. 10 - Typical Switching Losses vs. Resistance Case Temperature C-271 C, C apacitance (pF) G E V , Gate-to-Emitter Voltage (V) T o tal S w itching L osse s (m J) T otal S w itching Losses (m J) IRGPF50F 16 1000 RG = 5 &! VG E = 20V G E T C = 150°C TJ = 125°C V C C = 720V V G E = 15V 12 100 SA FE OP E RA TIN G A RE A 10 8 1 4 0.1 0 1 10 100 1000 10 20 30 40 50 60 VC E , C olle ctor-to-E m itter V oltage (V ) I C , Collector-to-E mitter Current (A) Fig. 11 - Typical Switching Losses vs. Fig. 12 - Turn-Off SOA Collector-to-Emitter Current Refer to Section D for the following: Appendix F: Section D - page D-8 Fig. 13a - Clamped Inductive Load Test Circuit Fig. 13b - Pulsed Collector Current Test Circuit Fig. 14a - Switching Loss Test Circuit Fig. 14b - Switching Loss Waveform Package Outline 3 - JEDEC Outline TO-247AC (TO-3P) Section D - page D-13 C-272 Total Sw itching Losses (m J) C I , C ollecto r-to-E m itter C urre nt (A )