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VH. CONCLUSION

An integrated inspection method of sdder pastę depositing based on the machinę vision was presented. To improve the positioning precision of the inspection locations, the position compensation method was performed. A texture-based algorithm is also proposed to enlarge the differences of the grayscale values between the solder pastę and the PCB base, which makes the mulli-threshdd method morę stable and precise. Furthermore, the 2D and pseudo-3D inspection approach can be used to inspect the solder pastę depositing defects effectively. The experiment results demonstrated the feasibility androbustness of the integrated method.

References

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