©2003 Fairchild Semiconductor Corporation

Rev. A, June 2003

F

Q

P

5

N60C/F

QPF

5

N60

C

QFET

TM

FQP5N60C/FQPF5N60C

600V N-Channel MOSFET

General Description

These N-Channel enhancement mode power field effect
transistors are produced using Fairchild’s proprietary,
planar stripe, DMOS technology.
This advanced technology has been especially tailored to
minimize on-state resistance, provide superior switching
performance, and withstand high energy pulse in the
avalanche and commutation mode. These devices are well
suited for high efficiency switched mode power supplies,
active power factor correction, electronic lamp ballasts
based on half bridge topology.

Features

• 4.5A, 600V, R

DS(on)

= 2.5

Ω

@V

GS

= 10 V

• Low gate charge ( typical 15 nC)
• Low Crss ( typical 6.5 pF)
• Fast switching
• 100% avalanche tested
• Improved dv/dt capability

Absolute Maximum Ratings

T

C

= 25°C unless otherwise noted

* Drain current limited by maximum junction temperature.

Thermal Characteristics

Symbol

Parameter

FQP5N60C

FQPF5N60C

Units

V

DSS

Drain-Source Voltage

600

V

I

D

Drain Current

- Continuous (T

C

= 25°C)

4.5

4.5 *

A

- Continuous (T

C

= 100°C)

2.6

2.6 *

A

I

DM

Drain Current

- Pulsed

(Note 1)

18

18 *

A

V

GSS

Gate-Source Voltage

±

30

V

E

AS

Single Pulsed Avalanche Energy

(Note 2)

210

mJ

I

AR

Avalanche Current

(Note 1)

4.5

A

E

AR

Repetitive Avalanche Energy

(Note 1)

10

mJ

dv/dt

Peak Diode Recovery dv/dt

(Note 3)

4.5

V/ns

P

D

Power Dissipation (T

C

= 25°C)

100

33

W

- Derate above 25°C

0.8

0.26

W/°C

T

J

, T

STG

Operating and Storage Temperature Range

-55 to +150

°C

T

L

Maximum lead temperature for soldering purposes,

1/8" from case for 5 seconds

300

°C

Symbol

Parameter

FQP5N60C

FQPF5N60C

Units

R

θ

JC

Thermal Resistance, Junction-to-Case

1.25

3.79

°C/W

R

θ

CS

Thermal Resistance, Case-to-Sink Typ.

0.5

--

°C/W

R

θ

JA

Thermal Resistance, Junction-to-Ambient

62.5

62.5

°C/W

TO-220

FQP Series

G

S

D

TO-220F

FQPF Series

G

S

D

●

●

●

●

●

●

●

●

●

●

●

●

▲

▲

▲

▲

!

!

!

!

!

!

!

!

!

!

!

!

◀

◀

◀

◀

●

●

●

●

●

●

●

●

●

●

●

●

▲

▲

▲

▲

!

!

!

!

!

!

!

!

!

!

!

!

◀

◀

◀

◀

S

D

G

Rev. A, June 2003

F

Q

P

5

N60C/F

QPF

5

N60

C

©2003 Fairchild Semiconductor Corporation

Electrical Characteristics

T

C

= 25°C unless otherwise noted

Notes:
1. Repetitive Rating : Pulse width limited by maximum junction temperature
2. L = 18.9mH, I

AS

= 4.5 A, V

DD

= 50V, R

G

= 25

Ω,

Starting T

J

= 25°C

3. I

SD

≤

4.5A, di/dt

≤

200A/

µ

s, V

DD

≤

BV

DSS,

Starting T

J

= 25°C

4. Pulse Test : Pulse width

≤

300

µ

s, Duty cycle

≤

2%

5. Essentially independent of operating temperature

Symbol

Parameter

Test Conditions

Min

Typ

Max

Units

Off Characteristics

BV

DSS

Drain-Source Breakdown Voltage

V

GS

= 0 V, I

D

= 250

µ

A

600

--

--

V

∆

BV

DSS

/

∆

T

J

Breakdown Voltage Temperature
Coefficient

I

D

= 250

µ

A, Referenced to 25°C

--

0.6

--

V/°C

I

DSS

Zero Gate Voltage Drain Current

V

DS

= 600 V, V

GS

= 0 V

--

--

1

µ

A

V

DS

= 480 V, T

C

= 125°C

--

--

10

µ

A

I

GSSF

Gate-Body Leakage Current, Forward

V

GS

= 30 V, V

DS

= 0 V

--

--

100

nA

I

GSSR

Gate-Body Leakage Current, Reverse

V

GS

= -30 V, V

DS

= 0 V

--

--

-100

nA

On Characteristics

V

GS(th)

Gate Threshold Voltage

V

DS

= V

GS

, I

D

= 250

µ

A

2.0

--

4.0

V

R

DS(on)

Static Drain-Source
On-Resistance

V

GS

= 10 V, I

D

= 2.25 A

--

2.0

2.5

Ω

g

FS

Forward Transconductance

V

DS

= 40 V, I

D

= 2.25 A

(Note 4)

--

4.7

--

S

Dynamic Characteristics

C

iss

Input Capacitance

V

DS

= 25 V, V

GS

= 0 V,

f = 1.0 MHz

--

515

670

pF

C

oss

Output Capacitance

--

55

72

pF

C

rss

Reverse Transfer Capacitance

--

6.5

8.5

pF

Switching Characteristics

t

d(on)

Turn-On Delay Time

V

DD

= 300 V, I

D

= 4.5A,

R

G

= 25

Ω

(Note 4, 5)

--

10

30

ns

t

r

Turn-On Rise Time

--

42

90

ns

t

d(off)

Turn-Off Delay Time

--

38

85

ns

t

f

Turn-Off Fall Time

--

46

100

ns

Q

g

Total Gate Charge

V

DS

= 480 V, I

D

= 4.5A,

V

GS

= 10 V

(Note 4, 5)

--

15

19

nC

Q

gs

Gate-Source Charge

--

2.5

--

nC

Q

gd

Gate-Drain Charge

--

6.6

--

nC

Drain-Source Diode Characteristics and Maximum Ratings

I

S

Maximum Continuous Drain-Source Diode Forward Current

--

--

4.5

A

I

SM

Maximum Pulsed Drain-Source Diode Forward Current

--

--

18

A

V

SD

Drain-Source Diode Forward Voltage

V

GS

= 0 V, I

S

= 4.5 A

--

--

1.4

V

t

rr

Reverse Recovery Time

V

GS

= 0 V, I

S

= 4.5 A,

dI

F

/ dt = 100 A/

µ

s

(Note 4)

--

300

--

ns

Q

rr

Reverse Recovery Charge

--

2.2

--

µ

C

Rev. A, June 2003

©2003 Fairchild Semiconductor Corporation

F

Q

P

5

N60C/F

QPF

5

N60

C

0.2

0.4

0.6

0.8

1.0

1.2

1.4

10

-1

10

0

10

1

150℃

※ Notes :
1. V

GS

= 0V

2. 250μ s Pulse Test

25℃

I

DR

, Re

ve

rs

e

Dr

ai

n

Cu

rr

e

nt

[

A

]

V

SD

, Source-Drain voltage [V]

0

4

8

12

16

0

2

4

6

8

10

12

V

DS

= 300V

V

DS

= 120V

V

DS

= 480V

※ Note : I

D

= 4.5A

V

GS

, G

a

te

-S

our

ce

V

o

ltage [

V

]

Q

G

, Total Gate Charge [nC]

0

2

4

6

8

10

0

1

2

3

4

5

6

V

GS

= 20V

V

GS

= 10V

※ Note : T

J

= 25℃

R

DS

(O

N

)

[

Ω

],

D

rai

n-

S

o

u

rce O

n

-R

e

si

st

a

nce

I

D

, Drain Current [A]

Typical Characteristics

Figure 5. Capacitance Characteristics

Figure 6. Gate Charge Characteristics

Figure 3. On-Resistance Variation vs

Drain Current and Gate Voltage

Figure 4. Body Diode Forward Voltage

Variation with Source Current

and Temperature

Figure 2. Transfer Characteristics

Figure 1. On-Region Characteristics

10

-1

10

0

10

1

0

200

400

600

800

1000

C

iss

= C

gs

+ C

gd

(C

ds

= shorted)

C

oss

= C

ds

+ C

gd

C

rss

= C

gd

※ Notes ;
1. V

GS

= 0 V

2. f = 1 MHz

C

rss

C

oss

C

iss

C

apa

ci

ta

nce [

p

F

]

V

DS

, Drain-Source Voltage [V]

10

-1

10

0

10

1

10

-2

10

-1

10

0

10

1

V

GS

Top : 15.0 V

10.0 V

8.0 V

7.0 V

6.5 V

6.0 V

5.5 V

5.0 V

Bottom : 4.5 V

※ Notes :
1. 250μ s Pulse Test

2. T

C

= 25℃

I

D

, D

rai

n C

u

rr

e

nt

[

A

]

V

DS

, Drain-Source Voltage [V]

2

4

6

8

10

10

-1

10

0

10

1

150

o

C

25

o

C

-55

o

C

※ Notes :
1. V

DS

= 40V

2. 250μ s Pulse Test

I

D

, D

ra

in C

u

rr

ent

[

A

]

V

GS

, Gate-Source Voltage [V]

Rev. A, June 2003

F

Q

P

5

N60C/F

QPF

5

N60

C

©2003 Fairchild Semiconductor Corporation

10

0

10

1

10

2

10

3

10

-2

10

-1

10

0

10

1

100 ms

10

µ

s

DC

10 ms

1 ms

100

µ

s

Operation in This Area
is Limited by R

DS(on)

※ Notes :

1. T

C

= 25

o

C

2. T

J

= 150

o

C

3. Single Pulse

I

D

, D

rai

n C

u

rr

ent

[

A

]

V

DS

, Drain-Source Voltage [V]

10

0

10

1

10

2

10

3

10

-2

10

-1

10

0

10

1

100 ms

DC

10 ms

1 ms

100

µ

s

Operation in This Area
is Limited by R

DS(on)

※ Notes :

1. T

C

= 25

o

C

2. T

J

= 150

o

C

3. Single Pulse

I

D

, Dr

ai

n

Cu

rr

e

n

t [

A

]

V

DS

, Drain-Source Voltage [V]

Typical Characteristics

(Continued)

Figure 9-1. Maximum Safe Operating Area

for FQP5N60C

Figure 10. Maximum Drain Current

vs Case Temperature

Figure 7. Breakdown Voltage Variation

vs Temperature

Figure 8. On-Resistance Variation

vs Temperature

Figure 9-2. Maximum Safe Operating Area

for FQPF5N60C

25

50

75

100

125

150

0

1

2

3

4

5

I

D

,

D

rai

n

C

u

rr

en

t [

A

]

T

C

, Case Temperature [℃]

-100

-50

0

50

100

150

200

0.8

0.9

1.0

1.1

1.2

※ Notes :
1. V

GS

= 0 V

2. I

D

= 250 μ A

BV

DS

S

, (

N

or

m

al

iz

ed

)

D

ra

in-

S

ou

rc

e B

re

ak

dow

n V

ol

tag

e

T

J

, Junction Temperature [

o

C]

-100

-50

0

50

100

150

200

0.0

0.5

1.0

1.5

2.0

2.5

3.0

※ Notes :
1. V

GS

= 10 V

2. I

D

= 2.25 A

R

DS

(O

N)

, (

N

or

m

a

lized)

D

rai

n-

S

our

ce

O

n

-R

esi

st

ance

T

J

, Junction Temperature [

o

C]

Rev. A, June 2003

F

Q

P

5

N60C/F

QPF

5

N60

C

©2003 Fairchild Semiconductor Corporation

1 0

- 5

1 0

- 4

1 0

- 3

1 0

- 2

1 0

- 1

1 0

0

1 0

1

1 0

- 2

1 0

- 1

1 0

0

※ N o te s :
1 . Z

θ

J C

( t ) = 3 . 7 9 ℃ / W M a x .

2 . D u t y F a c t o r , D = t

1

/ t

2

3 . T

J M

- T

C

= P

D M

* Z

θ

J C

( t )

s i n g le p u ls e

D = 0 . 5

0 . 0 2

0 . 2

0 . 0 5

0 . 1

0 . 0 1

Z

θ

JC

(t

),

T

h

er

m

a

l R

e

s

ponse

t

1

, S q u a r e W a v e P u ls e D u r a t io n [ s e c ]

1 0

- 5

1 0

- 4

1 0

- 3

1 0

- 2

1 0

- 1

1 0

0

1 0

1

1 0

- 2

1 0

- 1

1 0

0

※ N o t e s :
1 . Z

θ

J C

( t ) = 1 . 2 5 ℃ / W M a x .

2 . D u t y F a c t o r , D = t

1

/ t

2

3 . T

J M

- T

C

= P

D M

* Z

θ

J C

( t )

s in g le p u ls e

D = 0 . 5

0 . 0 2

0 . 2

0 . 0 5

0 . 1

0 . 0 1

Z

θ

JC

(

t)

, T

h

e

r

m

a

l

R

e

sp

on

se

t

1

, S q u a r e W a v e P u ls e D u r a t io n [ s e c ]

Typical Characteristics

(Continued)

Figure 11-1. Transient Thermal Response Curve for FQP5N60C

Figure 11-2. Transient Thermal Response Curve for FQPF5N60C

t

1

P

DM

t

2

t

1

P

DM

t

2

Rev. A, June 2003

F

Q

P

5

N60C/F

QPF

5

N60

C

©2003 Fairchild Semiconductor Corporation

Gate Charge Test Circuit & Waveform

Resistive Switching Test Circuit & Waveforms

Unclamped Inductive Switching Test Circuit & Waveforms

Charge

V

GS

10V

Q

g

Q

gs

Q

gd

3mA

V

GS

DUT

V

DS

300nF

50KΩ

200nF

12V

Same Type

as DUT

Charge

V

GS

10V

Q

g

Q

gs

Q

gd

3mA

V

GS

DUT

V

DS

300nF

50KΩ

200nF

12V

Same Type

as DUT

V

GS

V

DS

10%

90%

t

d(on)

t

r

t

on

t

off

t

d(off)

t

f

V

DD

10V

V

DS

R

L

DUT

R

G

V

GS

V

GS

V

DS

10%

90%

t

d(on)

t

r

t

on

t

off

t

d(off)

t

f

V

DD

10V

V

DS

R

L

DUT

R

G

V

GS

E

AS

=

L I

AS

2

----

2

1

--------------------

BV

DSS

- V

DD

BV

DSS

V

DD

V

DS

BV

DSS

t

p

V

DD

I

AS

V

DS

(t)

I

D

(t)

Time

10V

DUT

R

G

L

I

D

t

p

E

AS

=

L I

AS

2

----

2

1

E

AS

=

L I

AS

2

----

2

1

----

2

1

--------------------

BV

DSS

- V

DD

BV

DSS

V

DD

V

DS

BV

DSS

t

p

V

DD

I

AS

V

DS

(t)

I

D

(t)

Time

10V

DUT

R

G

L

L

I

D

I

D

t

p

Rev. A, June 2003

F

Q

P

5

N60C/F

QPF

5

N60

C

©2003 Fairchild Semiconductor Corporation

Peak Diode Recovery dv/dt Test Circuit & Waveforms

DUT

V

DS

+

_

Driver

R

G

Same Type

as DUT

V

GS

• dv/dt controlled by R

G

• I

SD

controlled by pulse period

V

DD

L

I

SD

10V

V

GS

( Driver )

I

SD

( DUT )

V

DS

( DUT )

V

DD

Body Diode

Forward Voltage Drop

V

SD

I

FM

, Body Diode Forward Current

Body Diode Reverse Current

I

RM

Body Diode Recovery dv/dt

di/dt

D =

Gate Pulse Width

Gate Pulse Period

--------------------------

DUT

V

DS

+

_

Driver

R

G

Same Type

as DUT

V

GS

• dv/dt controlled by R

G

• I

SD

controlled by pulse period

V

DD

L

L

I

SD

10V

V

GS

( Driver )

I

SD

( DUT )

V

DS

( DUT )

V

DD

Body Diode

Forward Voltage Drop

V

SD

I

FM

, Body Diode Forward Current

Body Diode Reverse Current

I

RM

Body Diode Recovery dv/dt

di/dt

D =

Gate Pulse Width

Gate Pulse Period

--------------------------

D =

Gate Pulse Width

Gate Pulse Period

--------------------------

Rev. A, June 2003

F

Q

P

5N60C/F

QPF

5N60

C

©2003 Fairchild Semiconductor Corporation

Mechanical Dimensions

Dimensions in Millimeters

TO - 220

Rev. A, June 2003

F

Q

P

5

N60C/F

QPF

5

N60

C

©2003 Fairchild Semiconductor Corporation

Package Dimensions

(Continued)

(7.00)

(0.70)

MAX1.47

(30

°

)

#1

3.30

±

0.10

15.80

±

0.20

15.87

±

0.20

6.68

±

0.20

9.75

±

0.30

4.70

±

0.20

10.16

±

0.20

(1.00x45

°

)

2.54

±

0.20

0.80

±

0.10

9.40

±

0.20

2.76

±

0.20

0.35

±

0.10

ø3.18

±

0.10

2.54TYP

[2.54

±

0.20

]

2.54TYP

[2.54

±

0.20

]

0.50

+0.10
–0.05

TO-220F

Dimensions in Millimeters

©2003 Fairchild Semiconductor Corporation

DISCLAIMER

FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY
PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY
LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN;
NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.

LIFE SUPPORT POLICY

FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR
CORPORATION.
As used herein:

1. Life support devices or systems are devices or systems
which, (a) are intended for surgical implant into the body,
or (b) support or sustain life, or (c) whose failure to perform
when properly used in accordance with instructions for use
provided in the labeling, can be reasonably expected to
result in significant injury to the user.

2. A critical component is any component of a life support
device or system whose failure to perform can be
reasonably expected to cause the failure of the life support
device or system, or to affect its safety or effectiveness.

PRODUCT STATUS DEFINITIONS

Definition of Terms

Datasheet Identification

Product Status

Definition

Advance Information

Formative or In
Design

This datasheet contains the design specifications for
product development. Specifications may change in
any manner without notice.

Preliminary

First Production

This datasheet contains preliminary data, and
supplementary data will be published at a later date.
Fairchild Semiconductor reserves the right to make
changes at any time without notice in order to improve
design.

No Identification Needed

Full Production

This datasheet contains final specifications. Fairchild
Semiconductor reserves the right to make changes at
any time without notice in order to improve design.

Obsolete

Not In Production

This datasheet contains specifications on a product
that has been discontinued by Fairchild semiconductor.
The datasheet is printed for reference information only.

Rev. I3

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The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not
intended to be an exhaustive list of all such trademarks.

FACT™
FACT Quiet series™
FAST

®

FASTr™
FRFET™
GlobalOptoisolator™
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HiSeC™
I

2

C™

ImpliedDisconnect™
ISOPLANAR™
LittleFET™
MicroFET™
MicroPak™
MICROWIRE™
MSX™
MSXPro™
OCX™
OCXPro™
OPTOLOGIC

®

OPTOPLANAR™

PACMAN™
POP™
Power247™
PowerTrench

®

QFET

®

QS™
QT Optoelectronics™
Quiet Series™
RapidConfigure™
RapidConnect™
SILENT SWITCHER

®

SMART START™

SPM™
Stealth™
SuperSOT™-3
SuperSOT™-6
SuperSOT™-8
SyncFET™
TinyLogic

®

TruTranslation™
UHC™
UltraFET

®

VCX™

ACEx™
ActiveArray™
Bottomless™
CoolFET™
CROSSVOLT™
DOME™
EcoSPARK™
E

2

CMOS™

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