CHAPTER 1

OVERVIEW OF IC PACKAGES

page

Package overview

1 - 2

Through-hole mount packages

1 - 4

Surface mount packages

1 - 5

Package type overview with lead count

1 - 6

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Philips Semiconductors

Overview of IC packages

Chapter 1

PACKAGE OVERVIEW

The development of the IC package is a dynamic technology. Applications that were unattainable only a few years ago
are today common place thanks in part to advances in package design. From mobile telecommunications and satellite
broadcasting to aerospace and automotive applications, each imposes its own individual demands on the electronic
package.

To meet such a diverse range of application requirements, our IC package range encompasses over thirty different types,
most of which are sub-divided into a number of outline versions. An overview of this range is shown in Fig.1, with
packages classified into board mounting methods, construction form and power handling capability. The packages in
these “power” categories offer a high thermal dissipation enabling IC usage in some of the most demanding application
areas.

Notable extensions to our range since the last publication of this book include the Ball Gate Array (BGA) packages with
their high pin count, and the miniature LFBGA packages.

A photograph of each package type is given on pages 1 - 4 and 1 - 5, and a package overview with lead count is
presented in the tables on pages 1 - 6 to 1 - 8.

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Overview of IC packages

Chapter 1

Fig.1 Package classification.

gewidth

MLC751

CERAMIC

CDIL

THROUGH HOLE

PACKAGES

PLASTIC

POWER

DIP
SDIP
SIL

HDIP

DBS

SIL

RDBS

RBS

TBS

CPGA

SURFACE MOUNT

PACKAGES

IC

PACKAGES

PLASTIC

CERAMIC

CLLCC
CWQCCN

HSOP
HTSSOP

MSQFP

PLLMC

ARRAY

DUAL

QUAD

VSO

SO
SSOP
TSSOP

PMFP

HTQFP

HLQFP
HQFP
HSQFP

HBCC

POWER

POWER

HCPGA

POWER

HBGA

POWER

CONTACTLESS

PACKAGES

PLASTIC

METAL

SQFP

QFP

LQFP

BCC

TQFP
VQFN

PLCC

BGA
LFBGA

VFBGA

TFBGA

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Philips Semiconductors

Overview of IC packages

Chapter 1

TROUGH-HOLE MOUNT PACKAGES

CDIL

CPGA

DIP

SDIP

HDIP

SIL.MPF

DBS.MPF

SIL.MP

RBS.MPF

SIL.P

DBS.P

DBS.P

Exposed die pad

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Philips Semiconductors

Overview of IC packages

Chapter 1

SURFACE MOUNT PACKAGES

CLLCC

CWQCCN

SO

VSO

SSOP

HTSSOP

HSOP

PMFP

TSSOP

LQFP

QFP

SQFP

HLQFP

HTQFP

TQFP

PLCC

BGA

HBGA

LFBGA

BCC

VQFN

TFBGA
VFBGA

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Chapter 1

PACKAGE TYPE OVERVIEW WITH LEAD COUNT

Surface mount packages (part 1 of 2)

PACKAGE

NAME

NUMBER OF LEADS

4

8

9

10

13

14 16 20 24 28 30 32 38 40 44 48 52 56 64 68 80 81

84

96 100 114 120

128

132

144

156

160

BGA

X

HBCC

X

X

X

X

HBGA

HLQFP

X

X

HQFP

X

HSOP

X

X

HSQFP

HTQFP

X

X

X

X

X

HTSSOP

X

X

LFBGA

X

X

X

X

X

X

LQFP

X

X

X

X

X

X

X

X

X

MSQFP

PLCC

X

X

X

X

X

X

PMFP

X

QFP

X

X

X

X

X

X

X

X

X

SMS.P

X

X

SO

X

X

X

X

X

X

X

X

SOJ

X

SQFP

X

SSOP

X

X

X

X

X

X

X

TFBGA

X

X

X

X

X

X

X

TQFP

X

X

X

X

X

TSSOP

X

X

X

X

X

X

X

X

X

X

X

X

VSO

X

X

VFBGA

X

VQFN

X

X

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Chapter 1

Surface mount packages (part 2 of 2)

PACKAGE

NAME

NUMBER OF LEADS

176 180 208 240 256 272 280 292 304 316 324 329 352 388 420 456 492 504 516 553 596 600 656 776 1140 1160 1312

BGA

X

X

X

X

X

X

X

X

X

X

X

X

X

X

X

X

HBCC

HBGA

X

X

X

X

X

X

X

X

X

X

HLQFP

HQFP

HSOP

HSQFP

X

X

HTQFP

HTSSOP

LFBGA

X

LQFP

X

X

MSQFP

X

PLCC

PMFP

QFP

SMS.P

SO

SOJ

SQFP

X

X

X

SSOP

TFBGA

X

X

X

TQFP

TSSOP

VSO

VFBGA

VQFN

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Chapter 1

Trough-hole mount packages

PACKAGE

NAME

NUMBER OF LEADS

3

7

8

9

13

14

16

17

18

20

22

23

24

27

28

32

40

42

48

52

56

64

DBS.MP

X

DBS.MPF

X

DBS.P

X

X

X

X

X

X

DIP

X

X

X

X

X

X

X

X

X

X

X

X

HDIP

X

RBS.MPF

X

RDBS.P

X

X

SDIP

X

X

X

X

X

X

SIL.MP

X

SIL.MPF

X

SIL.P

X

X

TBS.P

X

TO-92

X

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