SERVICE
Cellular Phone
SCH-A302
Manual
Cellular Phone
CONTENTS
1. Specification
2. Trouble Shooting
3. Tune-up Procedure &
Test Procedure list
4. Frequency Synthesizer Circuit &
Spurious Radiation
Suppression Circuit
5. NAM Programming
6. Electrical Parts List
7. Exploded Views & Parts List
8. Block Diagram
9. PCB Diagrams
10. Circuit Description &
Circuit Diagrams
©Samsung Electronics Co.,Ltd. December. 2001
Pinted in Korea.
Code No.: GH68-02488A
BASIC.
ELECTRONICS
1. SCH-A302 Specification (REF TIA/EIA/IS-137-A-1)
1. GENERAL
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1-1
ITEM
CDMA
TX Freq. Range
824 ~ 849 MHz
RX Freq. Range
869 ~ 894 MHz
Channel Bandwidth
1.23 MHz
Channel Spacing
30 kHz
Number of Channels
20 FA
Duplex Separation
45 MHz
In/Output Impedance
50
Ω
TX Intermediate Freq.
130.38 MHz
RX Intermediate Freq.
85.38 MHz
TX Local Freq.
1st(F
TX
+ 130.38 MHz)
2nd(260.76 MHz)
RX Local Freq.
1st(F
TX
+ 210.38 MHz)
2nd(170.76 MHz)
TCXO freq.
19.68 MHz
Freq. Stability
(F
RX
- 45 MHz) ± 350 Hz
Operating Temperature
-30 °C ~ +60 °C
Supply Voltage
+ 3.8 V
SMALL : 81 x 42 x 21 mm 84 g
Size and Weight
MIDDLE : 81 x 42 x 22 mm 87 g
LARGE : 81 x 42 x 25 mm 98 g
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1-2
SCH-A302
Specification
2. 800 MHz CDMA
2-1. GENERAL
TX Freq. Range
824 ~ 849 MHz
RX Freq. Range
869 ~ 894 MHz
Channel Bandwidth
1.23 MHz
Channel Spacing
30 kHz
Number of Channels
20 FA
Duplex Separation
45 MHz
In/Output Impedance
50
Ω
TX Intermediate Frequency
130.38 MHz
RX Intermediate Frequency
85.38 MHz
TX Local Frequency
1st (F
TX
+ 130.38 MHz)
2nd (260.76 MHz)
RX Local Frequency
1st (F
RX
+ 85.38 MHz)
2nd (170.76 MHz)
TCXO Frequency
19.68 MHz
Freq. Stability
(FRX - 45 MHz) ± 150 Hz
Operating Temperature
-30 °C ~ +60 °C
Supply Voltage
+ 3.8 V
2-2. TRANSMITTER
Waveform Quality
0.944 or more
Open Loop Power Control
-25 dBm
-57.5 dBm ~ -38.5 dBm
-65 dBm
-17.5 dBm ~ +1.5 dBm
-104 dBm
+18.0 dBm ~ +30.0 dBm
Minimum TX Power Control
Below -50 dBm
Closed Loop TX Power Control Range
± 24 dB
Maximum RF Output Power
200 mW (+24.5 dBm)
Occupied Band Width
1.32 MHz
Conducted Spurious Emission @900 kHz
-42 dBc / 30 kHz
@1.25 MHz
-54 dBc / 30 kHz
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1-3
SCH-A302
Specification
2-3. RECEIVER
Rx Sensitivity and Dynamic Range
-104 dBm, FER=0.5 % or less
-25 dBm, FER=0.5 % or less
Conducted Spurious Emission
869 ~ 894 MHz
< -81 dBm
824 ~ 849 MHz
< -61 dBm
All other Frequencies
< -47 dBm
Single Tone Desensitization
Rx Power level -101 dBm
Tone Power level -30 dBm
Lower than 1 %
Tone Offset from Carrier ± 900 kHz
Intermoculation Spurious Response Attenuation
Tone 1 offset from carrier = ± 900 kHz
Tone 2 offset from carrier = ± 1,700 kHz
-Test 1, 2
Rx power = -101 dBm
Tone 1 power = -43 dBm
Tone 2 power = -43 dBm
-Test 3, 4
Lower than 1 %
Rx power = -90 dBm
Tone 1 power = -32 dBm
Tone 2 power = -32 dBm
-Test 5, 6
Rx power = -79 dBm
Tone 1 power = -21 dBm
Tone 2 power = -21 dBm
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2-1
2. SCH-A302 Trouble Shooting
1. Logic Section
1-1. No Power
Y
U501 pin38 Input=HIGH
Check Q507, Q509 and its
neighboring circuits
N
Y
U501 pin6 & pin10
output=2.8 V?
Check U501 pin6 & pin10 and its
neighboring circuits
N
Y
U501 pin39
Input=HIGH?
Check R536 and its neighboring
circuits
N
END
Press PWR button
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2-2
SCH-A302
Trouble Shooting
1-2. Abnormal Initial Operation
Y
TCXO CLK
applied to U609 pina17/U404
pin7?
Check VCTCXO output.
Replace if required.
N
Y
TCXO CLK
signal outputted from OSC401
pin3?
Check OSC401 and its neighboring
circuits. Replace if required.
N
Y
TCXO CL
signal outputted from OSC401
pin4?
Check OSC401 and its neighvoring
circuits. Replace if required.
N
Y
TCXO CL
signal outputted from OSC402
pin4?
Check OSC402 and its neighvoring
circuits. Replace if required.
N
Y
LED on?
Check the LED and its neighboring
circuits. Replace if required.
N
Y
Normal initial
display on LCD?
Check the LCD pins and its
neighboring circuits. Replace if
required.
N
Press PWR Key
END
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2-3
SCH-A302
Trouble Shooting
1-3. Abnormal Backlight Operation
Y
‘L’ level outputted
from U501 pin1?
Check U501 pin1 and its neighboring
circuits. Replace if required.
N
Y
‘L’ level outputted
from U501 pin2?
Check U501 pin1 and its neighboring
circuits. Replace if required.
N
Press any button on the phone
Backlight LED on
1-4. Abnormal Key Data Input
Y
Scanning signals
outputted from U609 pins C2,
A3, E4, D3, C1?
Check keypad dom switch.
Replace if required.
N
Check initial status
END
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2-4
SCH-A302
Trouble Shooting
1-5. Abnormal Keytone
Y
CLK wavefrom outputted
from U609 pin L16 & pin M17?
Check the U609 pin and its
neighboring circuits.
Replace if required.
N
Y
CLK waveform outputted
from CON500 pin 5?
Resolder CON500 and its neighboring
circuits. Replace if required.
N
Y
Key tone waveform
applied to C561?
Check C631. Replace if required.
N
Y
Normal Keytone?
Replace the SPK assembly.
N
Abnormal Keytone
END
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2-5
SCH-A302
Trouble Shooting
1-6. Abnormal Alert Tone
Y
CLK waveform outputted
from U609 pin C14.
Check the U609 pin and its
neighboring circuits. Replace if
required.
N
Y
CLK waveform applied to
Q511 Base?
Check R552, Q511 and its neighboring
circuits. Replace if required.
N
Y
Is the buzzer connection
correct?
Connect the buzzer correctly.
N
Abnormal Keytone
Check the buzzer and
replace if required.
2. Transmitter Section
Abormal transmitter section
Y
Turn On Max PWR
N
Check U402 local level.
Y
Check U204 TX RFT
out level OK?
N
Check U201 PWR AMP
out level OK?
N
-10~0 dBm
CDMA : 25~26 dBm
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2-6
SCH-A302
Trouble Shooting
3. Receiver Section : CDMA MODE
Y
Check CDMA Rx path.
N
Y
Setup CDMA call.
OK?
Normal CDMA
SVC & ROAM OK?
Check Transmitter.
N
Start CDMA mode
Measure CDMA FER
N
Normal CDMA RF?
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2-7
SCH-A302
Trouble Shooting
4. Repair Guide
4-1. TX Part Check Point
Using commands in test mode
-01, 09 (0363), 07, 34, 71 (380)
(1) 130.38 MHz (TX IF) output line
- RFT3100 (U204) PIN #14,#15 (about -30 dBm)
- IF TXIF problem Then Check TX 2
nd
LOCAL (260.76 MHz)
- TX 2
nd
LOCAL check - RFT 3100 PIN #19 (about 23 dBm)
(2) TXRF (824~849 MHz) out lines.
From RFT3100 (U204) pin #15 to CELLA_OUT
- F201 input and output is ok? - Pin #2 and #5 (about 16 dBm)
- PAM input is ok? U201 pin #2 (about 20 dBm)
- PAM voltage is ok? U201 pin #3 (3 V), 1,4 (3.7 V)
- PA output is ok? U201 pin #5 (about +10 dBm)
- Duplex input and out put is ok? Duplex input is same with PAM output.
Output is You can check CN302 #2 (about 10 dBm)
4-2. RX Part Check Point
(1) RX RF (869~894 MHz) Signal input lines.
- HP Equipment setting
- RF ch 363 (RX:880.89 MHz, TX:835.89 MHz)- at CALL CTRL MENU
- sctr A pwr : -25 dBm (for more easy to check use Spectrum Analyzer)
- Rf Lvl offset : -1.4 at config screen
- Spectrum Analyzer Setting
- center Freq: 880.89 MHz (when check RXRF in 363 Ch)
- span : 5 MHz
- RF input line from Duplex to Mixer check point
- CN302 input and Duplex out (You can check Duplex out at C652) is ok?
- LNA (U360)input ,output and operating voltage is ok?
:Operating voltage-pin#1 (2.5 v) in & out (#3 66 dBm,#4 49 dBm)
- F303 input and output is ok? #2,#5 (about 50 dBm)
- RX Mixer (U361) input is ok? #1 (about 49 dBm)
(2) RF IF circuit (Received RXRF Signal + 1
st
local = RX IF (85.38 MHz fixed)
- 1
st
local is ok? U361 #4,#5 (about 13 dBm)
- Voltage is ok? U361 pin #3 3.0v
- Mixer output is ok? U361 pin #6 RXIF (85.38 Mhz-fixed) (about 50 dBm)
- F301 input and output is ok?
(3) IFR (U302) neighbor circuit
- IF input is ok? U300 pin #11,12 (about 75 dBm)
- RX 2
nd
local is ok? U300 pin #21,22 (about 25 dBm)
- 3.0 V IF (3.0IF) lines are ok? IFR operating voltage
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2-8
SCH-A302
Trouble Shooting
4-3. PLL Part Check Point
(1) VCO (Voltage Controlled Oscillator)
- Operating voltage is ok? OSC402 pin #7
- VT voltage is ok? OSC402 pin #5 (VT voltage was changed according to CH)
- Out is ok? OSC402 pin#1 output 1
st
local frequency each CH
(2) PLL(Phase Looped Lock)
- Operating voltages are ok? It use + 3.0 VR lines voltages
- TCXO_IN input is ok? U402 pin#8 It use TCXO Freq (19.68 MHz) for Reference.
4-4. Power Line Check Point
(1) U501 VBATT - #4 check
Reset - #B7 check
(2) X501 (Sleep X-tal) 32.768 MHz (pk-pk 2.7 v)
(3) TCXO(OSC401) 19.68 MHz
(4) IFR3000(U302) - #37 check TCXO-N (4.96 MHz) TCXO/N
#38 check CHIP X8-(9.84 MHz)
4-5. Reference Regulators
PM1000 U501
RESET : B7 RESET SIGNAL OUT
3.0_RX : H5 - RX CIRCUIT OPERATING VOLTAGE
3.0_TX : G5 TX CIRCUIT OPERATING VOLTAGE. (Controlled By Idle Signal)
3.0_IF : H7 RFT3100,IFR3000 AND Etc.
4-6. SAMPLING REPAIR RESULT (SCH-A302)
(1) No.1 : 24108148669 Tx Power Problem
- TX IF does not out from RFT3100 (U204) pin#1,2.
- 2
nd
local and operating voltages (3.0 IF,3.0 VR,VDC) are ok.
- Estimated factor: IFT After replace IFT It working ok.
(2) No.2 : 24108205255 - Tx Power Problem
- TX IF does not out from RFT3100 (U402)pin#6,7.
- 2
nd
local and operating voltages (3.0_MP, 3.0_TX, 3.0_TX_IF, 3.0_TXRF, 3.0_TX_LO) are ok.
- PA ON signal does not out from MSM.
- MSM also failed to J-TAG Tester.
- Estimated factor: MSM defect
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2-9
SCH-A302
Trouble Shooting
(3) No.3 : 24108167813 - Tx Power Problem
- All TX path is good from RFT 3100 to Mixer input port.
- Mixer output is lower than normal status.
- 1
st
local and operating voltages are ok.
- TX AGC ADJ voltage is too low.
- Estimated factor: Chip capacitor (C203) which connect to TX AGC ADJ
voltage line C203 Replace ok.
(4) No.4 : Tx Power Problem
- All TX path and voltages are ok from Duplex input to RFT3100 input
- CELLA_OUT (-pin#17) is ok, But U201 RF_IN (-pin#2)is not good.
- Estimated factor : F201 Replace ok.
(5) No.5 : 24108146584 When touch MSM, RX RSSI value has lost.
- All RX path is good from Duplex to Mixer input port .
- 1
st
local & TCXO did not oscillate.
- TCXO upper case pushed then case and inside components were short when B'D is twisted.
Estimated factor : TCXO After replace TCXO It working ok.
(6) No.6 : 24108221088 - Problem with display (When power on, display was abnormal working)
- LCD and neighbor patterns are ok.
- Estimated Factor: Broken data which is in E2PROM. Data Rebuilding OK
(7) No.7 : 24108134768 - RX problem (No SVC)
- Handset doe not acquire SVC then searching CH repeat very quickly.
- All RX value is good at Rx Part Check Point.
- Ec/Io value (in debug screen) is bad.
- Estimated factor : MSM does not decode receiving signal.
(8) No.8 : No Power on (Can't not power on)
- X501 Sleep X-tal (32.768 MHz) is O.K
- V_DC 3.0V is O.K
- CHIP X8 No output IFR #38
- TCXO_N No output IFR #37
- TCXO Not oscillator Pin # 3
- TCXO crack : TCXO replace O.K
(9) No.9 : 24108233382 - ESN INVALID
- ESN No was broken : 0000000
- ESN data at E2PROM was broken caused ESD or Electric shock.
- E2PROM replace and rewriting ESN number.
3. SCH-A302 Tune-up Rrocedure & Test Procedure list
1. List of Equipment
•
DC Power Supply
•
Test Jig : HHP I/F TESTJIG GH80-10502C
•
Test Cable : GH3900052A
•
RF Cable : GH3900075A
•
CDMA Mobile Station Test Set HP8924C, HP83236A, CMD-80, etc
•
Spectrum Analyzer(include CDMA Test Mode) HP8596E
2. Configuration of Test
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3-1
RF cable
DUT
Data cable
Test Jig
To A-Out
To A-In
Directional
Coupler
DC Power Supply
(+3.93 V)
RF
IN/OUT
Audio
OUT
Audio
IN
HP8924C
RF IN
Spectrum Analyzer
•
CAUTION : The test jig and data cable has a voltage drop of 0.15 V at FM Max power output,
you’d better set the DC power supply is 3.8 V for normal test condition.
(Nominal voltage of battery is 3.8 V at cellular phone)
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3-2
SCH-A302
Tune-up Rrocedure & Test Procedure list
3-2. Test Cable Connections
1
MHC 172
2
RF CABLE (1.4 dB Loss for CDMA800 and AMPS, 2.1 dB Loss for PCS)
3
BNC CONECTOR (RF)
4
PLUG CONNECT TO SCH-A302
5
DATA CABLE
6
Dsub 25PIN CONNECTOR (DATA)
3. Test Cable Description for SCH-A302
3-1. Test Cable
1
2
3
4
5
6
Change to Test Mode
A. To Change the phone’s state from Normal Mode to Test Mode, You should enter the following keys.
: Press [ 7 5 9 # 8 1 3 5 8 0 "(A+Y)"]
B. The Command “2 1” is mode and channel change.
“20363”
Channel number
Mode : CDMA
and Push the [OK] Key to save.
C. The command “0 1” is Suspend.
D. To finish the Test Mode, You should enter the command “0 2”.
Channel Selection and Tx Power Output Level Control
1. CDMA
A. Enter to Test Mode [
7 5 9 # 8 1 3 5 8 0 "(A+Y)"]
B. The command “2 1” is mode and channel change.
“20363”
Channel number
Mode : CDMA
Push the [OK] Key to save.
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3-3
SCH-A302
Tune-up Rrocedure & Test Procedure list
C. “0 1” : Suspend.
D. “2 1 + 2 0 3 6 3 ‘#’ “ : Set to ‘0363’ channel.
E. “0 7” “ Carrier On.
F. “3 4” : Spread spectrum to 1.23 MHz band width.
G. “7 1
“ : Adjust RF power level.
Set the acurate power with press ‘SEND’ (power growing up) or ‘END’ (power growing down).
“
“ means AGC level and AGC level range is from 000 to 511.
2. CDMA
TEST ITEMS
PROCEDURE
1. PREPARANCE
Set test equipments up.
[
7 5 9 # 8 1 3 5 8 0 "(A+Y)"
] : Enter the Test Mode
“0 1” : Suspend
Confirm that the phone is in te “CDMA Mode”.
(If not CDMA Mode, Use Test COMMAND “21” “2XXXX” and Push
the [OK] Key to “save”, and enter “0 2” to restart)
If you select a wrong key, press “CLR”, then enter new command.
To exit the Test Mode at any time, just press [0 2].
2. FREQUENCY
“0 1” : Suspend.
ACCURACY
“0 9 + 0 3 6 3 ‘#’ ” : Set channel to 363.
“0 7” : Carrier On.
“3 4” : Spread spectrum.
“7 1 3 0 0 ‘#’ ” : Set AGC level.
Measure the TX frequency : 836.49 MHz ± 300 Hz.
3. OCCUPIED CDMA
“0 1” : Suspend.
BANDWIDTH
“0 9 + 0 3 6 3 ‘#’ ” : Set channel to 383.
“0 7” : Carrier On.
“3 4” : Spread spectrum.
“7 1 X X X ‘#’ ” : Enter AGC Code(XXX) to adjust RF Output Power.
Measure the bandwidth (spec : 1.23 MHz)
4. LIMITATIONS ON
“0 1” : Suspend.
EMISSIONS
“0 9 + 0 3 6 3 ‘#’ ” : Set channel to 363.
“0 7” : Carrier On.
“3 4” : Spread spectrum.
“7 1 X X X ‘#’ ” : Enter AGC Code(XXX) to adjust RF Output Power.
Measure the spurious at Fc ± 900 kHz, Fc ± 1.98 MHz, 2F
c
, 3F
c
, 1/2F
c
.
spec : F
c
± 900 kHz below 42 dBc / 30 kHz
F
c
± 1.98 kHz below 54 dBc / 30 kHz
Outside Receive Band 43 + 10 log (PY)
PY : Mean Output Power in watts
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3-4
SCH-A302
Tune-up Rrocedure & Test Procedure list
3. CDMA Test Procedure
(1) PREPARATION
(2) FREQUENCY ACCURACY
Set to HP8924c auto test mode.
Then run auto test.
See the auto test result.
(3) OCCUPIED CDMA BANDWIDTH
Before call condition.
HP8924c call control screen.
1. RF channel : equal to CDMA terminal.
2. Protocol : IS-95a
3. RF CH STD : MS AMPS
4. Traffic data mode : SVC OPT 2
5. Data rate : full rate
6. Power : avg power
7. Sector a power : -75 dBm
Range screen setting
8. Piolot : -7 dBm
9. Traffic : -7.4 dBm
10.Pwr cotl : always up
Config screen(shift + test)
1. RF level offset : on
2. RF in/out : -1.4 dBm
Etc
1. Test cable loss : -1.4 dBm
2. Splitter loss : input measured loss
A method of measurement
Call control screen
1. HP8924C channel equal to CDMA terminal.
2. Send call
Power : Always up.
Sector A power : -104 dBm
3. Spectrum analyser
Mode : cdma analyser - Freq - occupy bandwidth - occupied
4. Read Max power
(4) LIMITATIONS ON EMISSIONS
Before call control
HP8924C call control screen
1. RF channel : Equal to CDMA terminal
2. Protocol : IS-95a
3. RF CH STD : MS AMPS
4. Traffic data mode : SVC OPT 2
5. Data Rate : FULL Rate
6. Power : CH power
7. Sector A power : -60 dBm
8. PWR COTL : CLOSED LOOP
1
1
1
2
3
4
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3-5
SCH-A302
Tune-up Rrocedure & Test Procedure list
Config Screen (shift + test) screen
1. RF Level Offset : ON
2. RF In/Out : Input measured LOSS
ETC
1. Test cable loss : -1.4 dBm
2. SPLITTER : Input measured loss
A method of measurement
Call control screen
1. HP8924C channel equal to CDMA terminal.
2. Send call
3. Spectrum analyser
Mode : cdma analyser - more - more - xmtr spurious-spurious close
Measure -13 dB spurious
4. Change segment F-, F+, Fc then check wave form quality
Specification
"A" is pass, or when "A" was fail, "B" and "C" must pass.
4. Download New software
To download program, you need to connect your pc and mobile using data link cable or jig
box. Please make sure your phone is in DM mode ( menu 4 -> 9 ) before you are using
Ndloader. (It is easier this way)
(1) Connect your pc and handset using data link cable or jig box.
(2) Power on the phone. Please check that the phone is in DM mode. (Menu->4->9).
If it is in Handsfree mode, please change it to DM mode and press ok.
The phone will be restarted.
(3) Run the Ndloader.
(4) To make sure that your phone is connected with Ndloader, click ? icon on the program,
you would get the phone information.
(5) Click folder icon on the Ndloader to choose new binary file to download.
You will see the file information.
(6) On the right middle of Ndloader, you will see download types. Choose Normal.
(7) Now you are ready to download new software.
Then Click download icon ( the green runner ) to start download. Please wait until download is done.
If download is completed properly, the phone will be restarted.
2
2
3
1
IN BAND
OUT BAND
Center
*30 kHz bandwidth-over 900 kHz
*30 kHz bandwidth-over 1.98 MHz
Frequency
*1 MHz bandwidth-over 1.385 MHz
*1 MHz bandwidth-over 2.465 MHz
OFF set
(A) -42dBc / 30kHz
(A) -54dBc / 30kHz
(B) -60dBc / 30 kHz
(B) -60dBc / 30 kHz
(C) -55dBm / 30 kHz
(C) -55dBm / 30 kHz
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4-1
4. SCH-A302 Frequency Synthesizer Circuit &
Spurious radiation suppression circuit
1. Frequency Synthesizer Circuit
The Frequency synthesizer is an indirect frequency synthesizer PLL(Phased Locked Loop).
It consists of a VCTCXO(OSC401), PLL, VCO (OSC402, U402), and loop filter.
VCTCXO
The VCTCXO is a reference source of the frequency synthesizer. It provides 19.68MHz reference frequency
to PLL, VCO (OSC402, U402). The VCTCXO is a Voltage Controlled Temperature Compensated Crystal
Oscillator having 19.68 MHz
±
2.5 ppm frequency stability over all useful temperature range. A correct
frequency tuning is made by the control voltage.
VCO, PLL
The PLL, VCO Module(OSC402, U402) generates the signal having 966
±
12.5 MHz center frequency with
the voltage control. The PLL, VCO (OSC402, U402) controls this signal.
The PLL, VCO Module(OSC402, U402) includes prescalers and charge pump. The reference divider in the
PLL, VCO Module(OSC402, U402) divides the frequency of VCTCXO by 1968 and makes reference
frequency 10kHz. This reference frequency is supplied to one of the input of phase detector. The signal
generated at the PLL, VCO Module(OSC402, U402) goes into another input stage of the phase detector
through a prescaler and the main divider.
At this point, the error proportional to the phase difference of two inputs is occurred.
This error signal is supplied to the frequency control input stage of the PLL, VCO (OSC402, U402) through
the loop filter consisted RC.
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4-2
SCH-A302
Frequency Synthesizer circuit & Spurious radiation suppression circuit
2. Spurious Radiation Suppression Circuit
The spurious signal from antenna is suppressed at the duplexer. The duplexer has a flat characteristics to
the receive signal and a high attenuation characteristics to the harmonic signal of transmission.
So it suppress the spurious radiation
Table: The characteristic of CDMA duplexer filter(F302)
T X
R X
T X to R X
PARAMETER
VALUE
Center Frequency
836.5 MHz (F
T
)
Bandwidth
F
T
± 12.5 MHz
Insertion Loss at BW
3.0 dB Max
VSWR at BW
1.8 Max
Input power
3.0 W Max
Attenuation
869 ~ 894 MHz 40 dB Min
Ripple at BW
1.6 dB Max
Center Frequency
881.5 MHz (F
R
)
Bandwidth
F
R
± 12.5 MHz
Insertion Loss at BW
4.0 dB Max
VSWR at BW
1.8 Max
Input power
1 W Max
Attenuation
824 ~ 849 MHz 56 dB Min
Ripple at BW
2.0 dB Max
Isolation
824 ~ 849 MHz 55 dB Max
869 ~ 894 MHz 49 dB Max
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5-1
5. SCH-A302 NAM Programming
NAM features can be programmed as follows:
Notes:
•
If you enter the NAM program mode, each item shows the currenly stored data.
Go to the next item by pressing OK.
•
You can modify the data by entering a new data.
•
If you enter a wrong digit, press CLR to delete the last digit. Press and hold CLR to delete all digits.
•
To scroll items backwards or forwards, press the VOLUME button on the left side of the phone.
1. General Setup
LCD Display
Key in
Function
47 869#08#9
-selects NAM programming
NAM Program
1:General
2.NAM1 Setup
1
-Choose ‘General’
3:NAM2 Setup
4:Advanced
ESN
B0000000
Volume
-Electronic Serial Number of the phone is displayed
CAI version
3
Volume
-Common Air Interface version is displayed
13K EVRC/8K
Vocoder sample rate
13K voice
or #
-changes the status.
OK
-stores it.
-8K is not supported.
SCM
-Station Class Mark displays the power class,
01101010
Volume
transmission, slotted class, dual mode.
Lock Code
Volume
Lock code, current status is displayed
0000
4-digit code
-to change, enter new code.
OK
-stores it
Slot Mode
Slot mode. ‘Yes’ indicates the slot mode.
Yes
or #
-changes the status.
OK
-stores it.
Slot Index
Volume
Slot mode index. The higher,the longer sleeping time
2
0~7
-to change, enter new one.
OK
-stores it.
SAMSUNG Proprietary-Contents may change without notice
5-2
SCH-A302 NAM Programming
2. Setting Up NAM
LCD Display
Key in
Function
NAM Program
1:General
2.NAM1 Setup
2
-Choose ‘NAM1 Setup’
3:NAM2 setup
4:Advanced
CDMA TEL NO.
number
MIN1,MIN2 is displayed
3003003000
OK
-to change, enter new one.
-stores it.
IMSI MCC
number
IMSI Moble Country Code,current code is displayed.
000
OK
-to change, enter new one.
-stores it.
IMSI MNC
number
IMSI Moble Network Code,current code is displayed.
00
OK
-to change, enter new one.
-stores it.
SYSTEM
Standard
OK
- Only ‘Standard’ mode is supported.
ACCOLC
CDMA Access Overload Class,current status is
0
class number
displayed.
OK
-to change,enter new one.
-stores it.
Pchn Sys A
Primary CDMA Channel for System A is displayed
000
channel number
-to change, enter new one.
OK
-stores it.
Pchn Sys B
Primary CDMA Channel for System B is displayed
000
channel number
-to change, enter new one.
OK
-stores it.
Schn Sys A
Secondary CDMA Channel for System A is displayed
000
channel number
-to change, enter new one.
OK
-stores it.
Schn Sys B
Secondary CDMA Channel for System B is displayed
000
channel number
-to change, enter new one.
OK
-stores it.
LockoutSID 1~10
CDMA SID to lockout is displayed
0000
SID number
-to change, enter new one.
OK
-stores it.
CDMA HOME SID
CDMA Home system ID, current value is displayed.
Yes
# or
-changes the status.
OK
-stores it.
SAMSUNG Proprietary-Contents may change without notice
5-3
SCH-A302 NAM Programming
LCD Display
Key in
Function
CDMA fSID
CDMA foreign SID, current value is displayed.
Yes
# or
-changes the status.
OK
-stores it.
CDMA fNID
CDMA foreign NID, current value is displayed.
Yes
# or
-changes the status.
OK
-stores it.
HomeSID #1 ~ #4
CDMA HOME SIDs written in the list, current value is
4120
number
displayed.
OK
-to change, enter new one.
-stores it.
HomeNID #1 ~ #4
CDMA HOME NIDs written in the list, current value is
65535
number
displayed.
OK
-to change, enter new one.
-stores it.
SAMSUNG Proprietary-Contents may change without notice
6-1
6. SCH-A302 Electrical parts list
0 GH92-00996A
1
GH41-00192A
PCB-SCHA302 MAIN SCH-A302, -, 6L, -, 0.7T, 100 x 138 mm, -, 3, -, -
1 GH71-00052A
NPR-ANT.CONTACT SCH-A100,
BE-CU,
T0.1,
AU
1
GH73-00214A
RMO-ANTENNA RUBBER SPH-A1000, RUBBER, 2 x 3 x T0.5, BLK, 50
1
GH73-00442A
RMO-BUZZER HOLDER SCH-A300, RUBBER, -, BLK, 50, -
1
GH74-00843A
MPR-FPCB CUSHION SCH-A8800, 71TS, T3, BRN, -
1
GH74-00892A
MPR-SHIELD TAPE 5 SCH-A8800, TAPE, T0.14, -, -
1
GH74-00898A
MPR-SHIELD TAPE 6 SCH-A300, -, 6 x 4, S/BLU, -
1
3002-001101
AU501
BUZZER-MAGNETIC 88 dB, 3.6 V, 100 mA, 2550 Hz, TP
1
2203-000254
C101
C-CERAMIC, CHIP 10 nF, 10 %, 16 V, X7R, TP, 1005, -
1
2203-000995
C102
C-CERAMIC, CHIP 0.047 nF, 5 %, 50 V, NP0, TP, 1005
1
2203-000254
C103
C-CERAMIC, CHIP 10 nF, 10 %, 16 V, X7R, TP, 1005, -
1
2203-000940
C104
C-CERAMIC, CHIP 470 pF, 10 %, 50 V, X7R, TP, 1005, -
1
2203-000940
C105
C-CERAMIC, CHIP 470 pF, 10 %, 50 V, X7R, TP, 1005, -
1
2203-000254
C106
C-CERAMIC, CHIP 10 nF, 10 %, 16 V, X7R, TP, 1005, -
1
2203-005061
C107
C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
1
2203-005061
C108
C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
1
2203-000254
C109
C-CERAMIC, CHIP 10 nF, 10 %, 16 V, X7R, TP, 1005, -
1
2203-000233
C110
C-CERAMIC, CHIP 0.1 nF, 5 %, 50 V, NP0, TP, 1005
1
2203-005061
C111
C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
1
2203-000233
C112
C-CERAMIC, CHIP 0.1 nF, 5 %, 50 V, NP0, TP, 1005
1
2203-005061
C113
C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
1
2203-000940
C114
C-CERAMIC, CHIP 470 pF, 10 %, 50 V, X7R, TP, 1005, -
1
2203-000940
C115
C-CERAMIC, CHIP 470 pF, 10 %, 50 V, X7R, TP, 1005, -
1
2203-000254
C116
C-CERAMIC, CHIP 10 nF, 10 %, 16 V, X7R, TP, 1005, -
1
2203-000233
C117
C-CERAMIC, CHIP 0.1 nF, 5 %, 50 V, NP0, TP, 1005
1
2203-000233
C118
C-CERAMIC, CHIP 0.1 nF, 5 %, 50 V, NP0, TP, 1005
1
2203-000438
C119
C-CERAMIC, CHIP 1 nF, 10 %, 50 V, X7R, TP, 1005, -
1
2203-000438
C120
C-CERAMIC, CHIP 1 nF, 10 %, 50 V, X7R, TP, 1005, -
1
2203-000438
C121
C-CERAMIC, CHIP 1 nF, 10 %, 50 V, X7R, TP, 1005, -
1
2203-005061
C122
C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
1
2203-000254
C123
C-CERAMIC, CHIP 10 nF, 10 %, 16 V, X7R, TP, 1005, -
1
2203-005061
C124
C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
Level
SEC CODE
Design LOC
DESCRIPTIONS
SAMSUNG Proprietary-Contents may change without notice
6-2
SCH-A302 Electrical parts list
1
2203-000438
C125
C-CERAMIC, CHIP 1 nF, 10 %, 50 V, X7R, TP, 1005, -
1
2203-000438
C126
C-CERAMIC, CHIP 1 nF, 10 %, 50 V, X7R, TP, 1005, -
1
2203-000438
C127
C-CERAMIC, CHIP 1 nF, 10 %, 50 V, X7R, TP, 1005, -
1
2203-000254
C128
C-CERAMIC, CHIP 10 nF, 10 %, 16 V, X7R, TP, 1005, -
1
2203-000714
C129
C-CERAMIC, CHIP 3.3 nF, 10 %, 50 V, X7R, TP, 1005, -
1
2203-000254
C140
C-CERAMIC, CHIP 10 nF, 10 %, 16 V, X7R, TP, 1005, -
1
2203-005061
C142
C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
1
2203-005061
C143
C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
1
2203-000254
C144
C-CERAMIC, CHIP 10 nF, 10 %, 16 V, X7R, TP, 1005, -
1
2203-000940
C145
C-CERAMIC, CHIP 470 pF, 10 %, 50 V, X7R, TP, 1005, -
1
2203-000254
C146
C-CERAMIC, CHIP 10 nF, 10 %, 16 V, X7R, TP, 1005, -
1
2203-000438
C147
C-CERAMIC, CHIP 1 nF, 10 %, 50 V, X7R, TP, 1005, -
1
2203-000438
C150
C-CERAMIC, CHIP 1 nF, 10 %, 50 V, X7R, TP, 1005, -
1
2203-000438
C151
C-CERAMIC, CHIP 1 nF, 10 %, 50 V, X7R, TP, 1005, -
1
2203-000438
C152
C-CERAMIC, CHIP 1 nF, 10 %, 50 V, X7R, TP, 1005, -
1
2404-001017
C160
C-TA, CHIP 1 uF, 20 %, 10 V, GP, TP, 2012, 2, 0
1
2203-000940
C161
C-CERAMIC, CHIP 470 pF, 10 %, 50 V, X7R, TP, 1005, -
1
2203-000940
C162
C-CERAMIC, CHIP 470 pF, 10 %, 50 V, X7R, TP, 1005, -
1
2203-000628
C201
C-CERAMIC, CHIP 0.022 nF, 5 %, 50 V, NP0, TP, 1005
1
2203-005061
C202
C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
1
2203-000885
C203
C-CERAMIC, CHIP 4.7 nF, 10 %, 25 V, X7R, TP, 1005, -
1
2203-000995
C204
C-CERAMIC, CHIP 0.047 nF, 5 %, 50 V, NP0, TP, 1005
1
2203-000254
C205
C-CERAMIC, CHIP 10 nF, 10 %, 16 V, X7R, TP, 1005, -
1
2203-000233
C207
C-CERAMIC, CHIP 0.1 nF, 5 %, 50 V, NP0, TP, 1005
1
2203-000254
C208
C-CERAMIC, CHIP 10 nF, 10 %, 16 V, X7R, TP, 1005, -
1
2203-001598
C209
C-CERAMIC, CHIP 2200 nF, +80-20 %, 16 V, Y5 V, TP, 2012
1
2203-005503
C210
C-CERAMIC, CHIP 0.18 nF, 5 %, 25 V, NP0, TP, 1005
1
2203-005503
C211
C-CERAMIC, CHIP 0.18 nF, 5 %, 25 V, NP0, TP, 1005
1
2203-001598
C213
C-CERAMIC, CHIP 2200 nF, +80-20 %, 16 V, Y5 V, TP, 2012
1
2203-000254
C214
C-CERAMIC, CHIP 10 nF, 10 %, 16 V, X7R, TP, 1005, -
1
2203-000233
C215
C-CERAMIC, CHIP 0.1 nF, 5 %, 50 V, NP0, TP, 1005
1
2203-000995
C216
C-CERAMIC, CHIP 0.047 nF, 5 %, 50 V, NP0, TP, 1005
1
2203-000254
C217
C-CERAMIC, CHIP 10 nF, 10 %, 16 V, X7R, TP, 1005, -
1
2203-001072
C218
C-CERAMIC, CHIP 0.056 nF, 5 %, 50 V, NP0, TP, 1005
Level
SEC CODE
Design LOC
DESCRIPTIONS
SAMSUNG Proprietary-Contents may change without notice
6-3
SCH-A302 Electrical parts list
1
2203-000254
C219
C-CERAMIC, CHIP 10 nF, 10 %, 16 V, X7R, TP, 1005, -
1
2404-001151
C220
C-TA, CHIP 33 uF, 20 %, 6.3 V, LZ, TP, 3216
1
2203-001017
C221
C-CERAMIC, CHIP 0.004 nF, 0.25 pF, 50 V, NP0, TP, 1005
1
2203-001259
C222
C-CERAMIC, CHIP 0.008 nF, 0.5 pF, 50 V, NP0, TP, 1005
1
2203-001072
C223
C-CERAMIC, CHIP 0.056 nF, 5 %, 50 V, NP0, TP, 1005
1
2203-000940
C226
C-CERAMIC, CHIP 470 pF, 10 %, 50 V, X7R, TP, 1005, -
1
2404-001017
C227
C-TA, CHIP 1 uF, 20 %, 10 V, GP, TP, 2012, 2, 0
1
2203-000233
C229
C-CERAMIC, CHIP 0.1 nF, 5 %, 50 V, NP0, TP, 1005
1
2203-000438
C23
C-CERAMIC, CHIP 1 nF, 10 %, 50 V, X7R, TP, 1005, -
1
2203-000254
C230
C-CERAMIC, CHIP 10 nF, 10 %, 16 V, X7R, TP, 1005, -
1
2203-000233
C231
C-CERAMIC, CHIP 0.1 nF, 5 %, 50 V, NP0, TP, 1005
1
2203-001072
C234
C-CERAMIC, CHIP 0.056 nF, 5 %, 50 V, NP0, TP, 1005
1
2203-000438
C235
C-CERAMIC, CHIP 1 nF, 10 %, 50 V, X7R, TP, 1005, -
1
2203-000995
C237
C-CERAMIC, CHIP 0.047 nF, 5 %, 50 V, NP0, TP, 1005
1
2203-000995
C238
C-CERAMIC, CHIP 0.047 nF, 5 %, 50 V, NP0, TP, 1005
1
2203-000386
C240
C-CERAMIC, CHIP 0.015 nF, 5 %, 50 V, NP0, TP, 1005
1
2203-000438
C250
C-CERAMIC, CHIP 1 nF, 10 %, 50 V, X7R, TP, 1005, -
1
2203-001437
C318
C-CERAMIC, CHIP 5 pF, 0.25 pF, 50 V, X7R, TP, 1005, 1.0
1
2203-000254
C320
C-CERAMIC, CHIP 10 nF, 10 %, 16 V, X7R, TP, 1005, -
1
2203-005382
C321
C-CERAMIC, CHIP 0.006 nF, 0.1 pF, 50 V, NP0, TP, 1005
1
2203-001437
C323
C-CERAMIC, CHIP 5 pF, 0.25 pF, 50 V, X7R, TP, 1005, 1.0
1
2203-000438
C331
C-CERAMIC, CHIP 1 nF, 10 %, 50 V, X7R, TP, 1005, -
1
2203-000438
C332
C-CERAMIC, CHIP 1 nF, 10 %, 50 V, X7R, TP, 1005, -
1
2404-001105
C333
C-TA, CHIP 10 uF, 20 %, 6.3 V, GP, TP, 2012
1
2203-000254
C334
C-CERAMIC, CHIP 10 nF, 10 %, 16 V, X7R, TP, 1005, -
1
2203-000233
C335
C-CERAMIC, CHIP 0.1 nF, 5 %, 50 V, NP0, TP, 1005
1
2203-000233
C337
C-CERAMIC, CHIP 0.1 nF, 5 %, 50 V, NP0, TP, 1005
1
2203-000254
C338
C-CERAMIC, CHIP 10 nF, 10 %, 16 V, X7R, TP, 1005, -
1
2203-000885
C339
C-CERAMIC, CHIP 4.7 nF, 10 %, 25 V, X7R, TP, 1005, -
1
2203-000254
C340
C-CERAMIC, CHIP 10 nF, 10 %, 16 V, X7R, TP, 1005, -
1
2203-005061
C341
C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
1
2203-000438
C342
C-CERAMIC, CHIP 1 nF, 10 %, 50 V, X7R, TP, 1005, -
1
2203-000359
C343
C-CERAMIC, CHIP 0.15 nF, 5 %, 50 V, NP0, TP, 1005
1
2203-005395
C344
C-CERAMIC, CHIP 0.0047 nF, 0.1 pF, 50 V, NP0, TP, 1005
Level
SEC CODE
Design LOC
DESCRIPTIONS
SAMSUNG Proprietary-Contents may change without notice
6-4
SCH-A302 Electrical parts list
1
2203-000885
C345
C-CERAMIC, CHIP 4.7 nF, 10 %, 25 V, X7R, TP, 1005, -
1
2203-000359
C346
C-CERAMIC, CHIP 0.15 nF, 5 %, 50 V, NP0, TP, 1005
1
2203-005480
C349
C-CERAMIC, CHIP 33 nF, 10 %, 10 V, X7R, TP, 1005, -
1
2404-001086
C350
C-TA, CHIP 4.7 uF, 20 %, 6.3 V, GP, TP, 2012, -
1
2203-005383
C370
C-CERAMIC, CHIP 7 pF, 0.1 pF, 50 V, NPO, TP, 1005, -
1
2203-000628
C371
C-CERAMIC, CHIP 0.022 nF, 5 %, 50 V, NP0, TP, 1005
1
2203-000438
C372
C-CERAMIC, CHIP 1 nF, 10 %, 50 V, X7R, TP, 1005, -
1
2203-000233
C373
C-CERAMIC, CHIP 0.1 nF, 5 %, 50 V, NP0, TP, 1005
1
2203-000696
C375
C-CERAMIC, CHIP 0.002 nF, 0.25 pF, 50 V, NP0, TP, 1005
1
2203-005444
C376
C-CERAMIC, CHIP 0.003 nF, 0.1 pF, 50 V, NP0, TP, 1005
1
2203-000438
C377
C-CERAMIC, CHIP 1 nF, 10 %, 50 V, X7R, TP, 1005, -
1
2203-005061
C378
C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
1
2404-001105
C379
C-TA, CHIP 10 uF, 20 %, 6.3 V, GP, TP, 2012
1
2203-000233
C380
C-CERAMIC, CHIP 0.1 nF, 5 %, 50 V, NP0, TP, 1005
1
2203-000278
C381
C-CERAMIC, CHIP 0.01 nF, 0.5 pF, 50 V, NP0, TP, 1005
1
2203-000438
C382
C-CERAMIC, CHIP 1 nF, 10 %, 50 V, X7R, TP, 1005, -
1
2203-005444
C383
C-CERAMIC, CHIP 0.003 nF, 0.1 pF, 50 V, NP0, TP, 1005
1
2203-002443
C384
C-CERAMIC, CHIP 0.33 nF, 10 %, 50 V, X7R, TP, 1005
1
2203-005480
C385
C-CERAMIC, CHIP 33 nF, 10 %, 10 V, X7R, TP, 1005, -
1
2203-005061
C386
C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
1
2203-000233
C387
C-CERAMIC, CHIP 0.1 nF, 5 %, 50 V, NP0, TP, 1005
1
2203-005061
C388
C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
1
2404-001105
C389
C-TA, CHIP 10 uF, 20 %, 6.3 V, GP, TP, 2012
1
2203-000386
C390
C-CERAMIC, CHIP 0.015 nF, 5 %, 50 V, NP0, TP, 1005
1
2203-000386
C391
C-CERAMIC, CHIP 0.015 nF, 5 %, 50 V, NP0, TP, 1005
1
2203-000233
C392
C-CERAMIC, CHIP 0.1 nF, 5 %, 50 V, NP0, TP, 1005
1
2203-000885
C393
C-CERAMIC, CHIP 4.7 nF, 10 %, 25 V, X7R, TP, 1005, -
1
2203-005061
C394
C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
1
2203-000885
C395
C-CERAMIC, CHIP 4.7 nF, 10 %, 25 V, X7R, TP, 1005, -
1
2203-001432
C396
C-CERAMIC, CHIP 47 nF, +80-20 %, 16 V, Y5 V, TP, 1005
1
2404-001105
C397
C-TA, CHIP 10 uF, 20 %, 6.3 V, GP, TP, 2012
1
2203-000438
C398
C-CERAMIC, CHIP 1 nF, 10 %, 50 V, X7R, TP, 1005, -
1
2203-000438
C407
C-CERAMIC, CHIP 1 nF, 10 %, 50 V, X7R, TP, 1005, -
1
2203-000233
C408
C-CERAMIC, CHIP 0.1 nF, 5 %, 50 V, NP0, TP, 1005
Level
SEC CODE
Design LOC
DESCRIPTIONS
SAMSUNG Proprietary-Contents may change without notice
6-5
SCH-A302 Electrical parts list
1
2203-000438
C409
C-CERAMIC, CHIP 1 nF, 10 %, 50 V, X7R, TP, 1005, -
1
2203-000254
C410
C-CERAMIC, CHIP 10 nF, 10 %, 16 V, X7R, TP, 1005, -
1
2203-000233
C411
C-CERAMIC, CHIP 0.1 nF, 5 %, 50 V, NP0, TP, 1005
1
2203-000233
C412
C-CERAMIC, CHIP 0.1 nF, 5 %, 50 V, NP0, TP, 1005
1
2203-000233
C413
C-CERAMIC, CHIP 0.1 nF, 5 %, 50 V, NP0, TP, 1005
1
2203-001072
C414
C-CERAMIC, CHIP 0.056 nF, 5 %, 50 V, NP0, TP, 1005
1
2404-001151
C415
C-TA, CHIP 33 uF, 20 %, 6.3 V, LZ, TP, 3216
1
2203-000725
C416
C-CERAMIC, CHIP 3.9 nF, 10 %, 50 V, X7R, TP, 1005, -
1
2203-005061
C417
C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
1
2203-000254
C418
C-CERAMIC, CHIP 10 nF, 10 %, 16 V, X7R, TP, 1005, -
1
2203-000254
C419
C-CERAMIC, CHIP 10 nF, 10 %, 16 V, X7R, TP, 1005, -
1
2203-000585
C420
C-CERAMIC, CHIP 220 pF, 10 %, 50 V, X7R, TP, 1005, -
1
2404-001092
C421
C-TA, CHIP 220 nF, 20 %, 20 V, GP, TP, 2012, -
1
2203-000254
C422
C-CERAMIC, CHIP 10 nF, 10 %, 16 V, X7R, TP, 1005, -
1
2203-000233
C423
C-CERAMIC, CHIP 0.1 nF, 5 %, 50 V, NP0, TP, 1005
1
2203-000233
C424
C-CERAMIC, CHIP 0.1 nF, 5 %, 50 V, NP0, TP, 1005
1
2203-000254
C425
C-CERAMIC, CHIP 10 nF, 10 %, 16 V, X7R, TP, 1005, -
1
2203-000233
C426
C-CERAMIC, CHIP 0.1 nF, 5 %, 50 V, NP0, TP, 1005
1
2203-000278
C427
C-CERAMIC, CHIP 0.01 nF, 0.5 pF, 50 V, NP0, TP, 1005
1
2203-000254
C428
C-CERAMIC, CHIP 10 nF, 10 %, 16 V, X7R, TP, 1005, -
1
2203-000995
C429
C-CERAMIC, CHIP 0.047 nF, 5 %, 50 V, NP0, TP, 1005
1
2203-000233
C431
C-CERAMIC, CHIP 0.1 nF, 5 %, 50 V, NP0, TP, 1005
1
2203-000233
C432
C-CERAMIC, CHIP 0.1 nF, 5 %, 50 V, NP0, TP, 1005
1
2203-000233
C433
C-CERAMIC, CHIP 0.1 nF, 5 %, 50 V, NP0, TP, 1005
1
2203-000254
C435
C-CERAMIC, CHIP 10 nF, 10 %, 16 V, X7R, TP, 1005, -
1
2203-000233
C436
C-CERAMIC, CHIP 0.1 nF, 5 %, 50 V, NP0, TP, 1005
1
2203-000233
C437
C-CERAMIC, CHIP 0.1 nF, 5 %, 50 V, NP0, TP, 1005
1
2203-000233
C438
C-CERAMIC, CHIP 0.1 nF, 5 %, 50 V, NP0, TP, 1005
1
2203-000254
C501
C-CERAMIC, CHIP 10 nF, 10 %, 16 V, X7R, TP, 1005, -
1
2203-000254
C502
C-CERAMIC, CHIP 10 nF, 10 %, 16 V, X7R, TP, 1005, -
1
2203-000254
C503
C-CERAMIC, CHIP 10 nF, 10 %, 16 V, X7R, TP, 1005, -
1
2203-000254
C504
C-CERAMIC, CHIP 10 nF, 10 %, 16 V, X7R, TP, 1005, -
1
2404-001151
C506
C-TA, CHIP 33 uF, 20 %, 6.3 V, LZ, TP, 3216
1
2203-000233
C507
C-CERAMIC, CHIP 0.1 nF, 5 %, 50 V, NP0, TP, 1005
Level
SEC CODE
Design LOC
DESCRIPTIONS
SAMSUNG Proprietary-Contents may change without notice
6-6
SCH-A302 Electrical parts list
1
2203-005061
C508
C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
1
2404-001151
C509
C-TA, CHIP 33 uF, 20 %, 6.3 V, LZ, TP, 3216
1
2203-005061
C510
C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
1
2203-000679
C513
C-CERAMIC, CHIP 0.027 nF, 5 %, 50 V, NP0, TP, 1005
1
2203-000679
C514
C-CERAMIC, CHIP 0.027 nF, 5 %, 50 V, NP0, TP, 1005
1
2203-005065
C515
C-CERAMIC, CHIP 1000 nF, +80-20 %, 10 V, Y5 V, TP, 1608
1
2203-000254
C516
C-CERAMIC, CHIP 10 nF, 10 %, 16 V, X7R, TP, 1005, -
1
2203-005061
C517
C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
1
2203-000233
C519
C-CERAMIC, CHIP 0.1 nF, 5 %, 50 V, NP0, TP, 1005
1
2203-001724
C520
C-CERAMIC, CHIP 4700 nF, +80-20 %, 16 V, Y5 V, TP, 3216
1
2203-000233
C522
C-CERAMIC, CHIP 0.1 nF, 5 %, 50 V, NP0, TP, 1005
1
2203-005065
C523
C-CERAMIC, CHIP 1000 nF, +80-20 %, 10 V, Y5 V, TP, 1608
1
2203-005061
C524
C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
1
2203-001724
C525
C-CERAMIC, CHIP 4700 nF, +80-20 %, 16 V, Y5 V, TP, 3216
1
2203-000233
C526
C-CERAMIC, CHIP 0.1 nF, 5 %, 50 V, NP0, TP, 1005
1
2203-001724
C527
C-CERAMIC, CHIP 4700 nF, +80-20 %, 16 V, Y5 V, TP, 3216
1
2203-005061
C528
C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
1
2203-000233
C529
C-CERAMIC, CHIP 0.1 nF, 5 %, 50 V, NP0, TP, 1005
1
2203-001598
C530
C-CERAMIC, CHIP 2200 nF, +80-20 %, 16 V, Y5 V, TP, 2012
1
2203-005061
C531
C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
1
2203-001598
C532
C-CERAMIC, CHIP 2200 nF, +80-20 %, 16 V, Y5 V, TP, 2012
1
2404-001017
C533
C-TA, CHIP 1 uF, 20 %, 10 V, GP, TP, 2012, 2, 0
1
2203-005061
C534
C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
1
2203-000233
C535
C-CERAMIC, CHIP 0.1 nF, 5 %, 50 V, NP0, TP, 1005
1
2203-005065
C536
C-CERAMIC, CHIP 1000 nF, +80-20 %, 10 V, Y5 V, TP, 1608
1
2203-005061
C537
C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
1
2203-005061
C538
C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
1
2203-000233
C539
C-CERAMIC, CHIP 0.1 nF, 5 %, 50 V, NP0, TP, 1005
1
2203-000233
C540
C-CERAMIC, CHIP 0.1 nF, 5 %, 50 V, NP0, TP, 1005
1
2203-000254
C542
C-CERAMIC, CHIP 10 nF, 10 %, 16 V, X7R, TP, 1005, -
1
2203-005061
C549
C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
1
2203-001432
C556
C-CERAMIC, CHIP 47 nF, +80-20 %, 16 V, Y5 V, TP, 1005
1
2203-000438
C566
C-CERAMIC, CHIP 1 nF, 10 %, 50 V, X7R, TP, 1005, -
1
2203-000359
C567
C-CERAMIC, CHIP 0.15 nF, 5 %, 50 V, NP0, TP, 1005
Level
SEC CODE
Design LOC
DESCRIPTIONS
SAMSUNG Proprietary-Contents may change without notice
6-7
SCH-A302 Electrical parts list
1
2203-000438
C568
C-CERAMIC, CHIP 1 nF, 10 %, 50 V, X7R, TP, 1005, -
1
2203-001432
C601
C-CERAMIC, CHIP 47 nF, +80-20 %, 16 V, Y5 V, TP, 1005
1
1405-001082
C602
VARISTOR 5.6 V, 20 A, 1 x 0.5 x 0.6 mm, TP
1
1405-001082
C603
VARISTOR 5.6 V, 20 A, 1 x 0.5 x 0.6 mm, TP
1
2404-001151
C604
C-TA, CHIP 33 uF, 20 %, 6.3 V, LZ, TP, 3216
1
2203-000585
C605
C-CERAMIC, CHIP 220 pF, 10 %, 50 V, X7R, TP, 1005, -
1
2404-001105
C606
C-TA, CHIP 10 uF, 20 %, 6.3 V, GP, TP, 2012
1
2203-005061
C607
C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
1
2203-005061
C608
C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
1
2203-000254
C609
C-CERAMIC, CHIP 10 nF, 10 %, 16 V, X7R, TP, 1005, -
1
2203-005061
C610
C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
1
2203-005061
C611
C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
1
2203-005061
C612
C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
1
2203-005061
C613
C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
1
2203-005061
C615
C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
1
2203-000254
C616
C-CERAMIC, CHIP 10 nF, 10 %, 16 V, X7R, TP, 1005, -
1
2203-005061
C617
C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
1
2203-005061
C618
C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
1
2203-005061
C619
C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
1
2203-000254
C620
C-CERAMIC, CHIP 10 nF, 10 %, 16 V, X7R, TP, 1005, -
1
2203-000254
C621
C-CERAMIC, CHIP 10 nF, 10 %, 16 V, X7R, TP, 1005, -
1
2203-000254
C622
C-CERAMIC, CHIP 10 nF, 10 %, 16 V, X7R, TP, 1005, -
1
2203-005061
C640
C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
1
2203-005061
C641
C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
1
2203-005061
C651
C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
1
2203-000438
C652
C-CERAMIC, CHIP 1 nF, 10 %, 50 V, X7R, TP, 1005, -
1
2203-000233
C653
C-CERAMIC, CHIP 0.1 nF, 5 %, 50 V, NP0, TP, 1005
1
2203-000254
C654
C-CERAMIC, CHIP 10 nF, 10 %, 16 V, X7R, TP, 1005, -
1
2203-000233
C655
C-CERAMIC, CHIP 0.1 nF, 5 %, 50 V, NP0, TP, 1005
1
2203-000438
C656
C-CERAMIC, CHIP 1 nF, 10 %, 50 V, X7R, TP, 1005, -
1
2203-000438
C663
C-CERAMIC, CHIP 1 nF, 10 %, 50 V, X7R, TP, 1005, -
1
3710-001653
CN101
CONNECTOR-SOCKET 18P, 1R, 0.5 mm, SMD-A, A uF
1
3705-001178
CN302
CONNECTOR-COAXIAL SMC, JACK, 100 Mohm, 50 ohm, .5DB
1
3722-001530
CN303
JACK-PHONE 5P, 2.6PI, A uF, BLK, -
Level
SEC CODE
Design LOC
DESCRIPTIONS
SAMSUNG Proprietary-Contents may change without notice
6-8
SCH-A302 Electrical parts list
1
0407-000115
D160
DIODE-ARRAY DAN202U, 80 V, 100 mA, CA2-3, SC-70,
1
0405-001035
D201
DIODE-VARACTOR 1SV279, 15 V, 3 nA, USC, TP
1
0405-001035
D202
DIODE-VARACTOR 1SV279, 15 V, 3 nA, USC, TP
1
0405-001035
D302
DIODE-VARACTOR 1SV279, 15 V, 3 nA, USC, TP
1
0405-001035
D303
DIODE-VARACTOR 1SV279, 15 V, 3 nA, USC, TP
1
0409-001016
D350
DIODE-PIN BAR63-02 W, 50 V, 100 mA, SCD-80, TP
1
0409-001016
D351
DIODE-PIN BAR63-02 W, 50 V, 100 mA, SCD-80, TP
1
0407-000115
D501
DIODE-ARRAY DAN202U, 80 V, 100 mA, CA2-3, SC-70,
1
0407-001006
D601
DIODE-ARRAY DA221, 20 V, 100 mA, C2-3, EM3, TR
1
0407-001006
D602
DIODE-ARRAY DA221, 20 V, 100 mA, C2-3, EM3, TR
1
2901-001193
F101
FILTER-EMI SMD 25 V, 0.1 A, -, 35 pF, 3.2 x 1.6 x 0.75 mm, TP
1
2901-001193
F102
FILTER-EMI SMD 25 V, 0.1 A, -, 35 pF, 3.2 x 1.6 x 0.75 mm, TP
1
2901-001193
F103
FILTER-EMI SMD 25 V, 0.1 A, -, 35 pF, 3.2 x 1.6 x 0.75 mm, TP
1
2904-001172
F201
FILTER-SAW 836.5 MHz, 25 MHz, +-12.5 MHz/1.5, TP, +-12.5 MHz/2.5 dB,
1
2904-001236
F301
FILTER-SAW 85.38 MHz, -, 0.8, TP, 9.4 dB, -
1
2909-001122
F302
FILTER-DUPLEXER 881.5 MHz, 836.5 MHz, 4/2.5 dB, TP, 824-849
1
2904-001173
F303
FILTER-SAW 881.5 MHz, 25 MHz, +-12.5 MHz/2 dB, TP, +-12.5 MHz/3.5 dB,
1
4709-001242
F401
COUPLER-DIRECTION 925-960 MHz, 10+-1.5 dB, 23 dB, 2 x 1.25 x 1 mm,
1
3710-001585
J101
CONNECTOR-SOCKET 20P, 2R, 0.5 mm, SMD-S, A uF
1
3710-001585
J102
CONNECTOR-SOCKET 20P, 2R, 0.5 mm, SMD-S, A uF
1
3301-001120
L201
CORE-FERRITE BEAD AB, 30 ohm, 2 x 1.25 x 0.85 mm, 3000 mA, TP,
1
3301-001105
L202
CORE-FERRITE AB, 1.6 x 0.8 x 0.8 mm, -, -
1
2703-001726
L204
INDUCTOR-SMD 27 nH, 5 %, 1 x 0.5 x 0.5 mm
1
2703-001726
L205
INDUCTOR-SMD 27 nH, 5 %, 1 x 0.5 x 0.5 mm
1
2703-001786
L206
INDUCTOR-SMD 10 nH, 5 %, 1.0 x 0.5 x 0.5 mm
1
2703-001543
L209
INDUCTOR-SMD 33 nH, 5 %, 1.8 x 1.12 x 1.02 mm
1
3301-001105
L210
CORE-FERRITE AB, 1.6 x 0.8 x 0.8 mm, -, -
1
3301-001105
L211
CORE-FERRITE AB, 1.6 x 0.8 x 0.8 mm, -, -
1
3301-001342
L212
CORE-FERRITE BEAD AB, 1.5 kohm, 1 x 0.5 x 0.5 mm, 100 mA, TP, M,
1
3301-001342
L213
CORE-FERRITE BEAD AB, 1.5 kohm, 1 x 0.5 x 0.5 mm, 100 mA, TP, M,
1
2703-001126
L307
INDUCTOR-SMD 270 nH, 5 %, 2.29 x 1.73 x 1.52 mm
1
2703-001914
L311
INDUCTOR-SMD 180 nH, 2 %, 1.6 x 0.8 x 0.8 mm
1
3301-001105
L318
CORE-FERRITE AB, 1.6 x 0.8 x 0.8 mm, -, -
1
2703-001514
L319
INDUCTOR-SMD 68 nH, 5 %, 1.8 x 1.12 x 1.02 mm
Level
SEC CODE
Design LOC
DESCRIPTIONS
SAMSUNG Proprietary-Contents may change without notice
6-9
SCH-A302 Electrical parts list
1
2703-001954
L320
INDUCTOR-SMD 2.7 nH, 0.3 nH, 1.0 x 0.5 x 0.5 mm
1
3301-001105
L321
CORE-FERRITE AB, 1.6 x 0.8 x 0.8 mm, -, -
1
3301-001105
L322
CORE-FERRITE AB, 1.6 x 0.8 x 0.8 mm, -, -
1
2703-002106
L323
INDUCTOR-SMD 220 nH, 5 %, 1.6 x 0.8 x 0.8 mm
1
2703-001595
L324
INDUCTOR-SMD 47 nH, 5 %, 1.0 x 0.5 x 0.5 mm
1
2703-001790
L325
INDUCTOR-SMD 3.3 nH, 0.3 nH, 1.0 x 0.5 x 0.5 mm
1
2703-001728
L326
INDUCTOR-SMD 1.5 nH, 0.3 nH, 1 x 0.5 x 0.5 mm
1
2703-001952
L327
INDUCTOR-SMD 8.2 nH, 5 %, 1.0 x 0.5 x 0.5 mm
1
2703-001772
L328
INDUCTOR-SMD 18 nH, 5 %, 1.0 x 0.5 x 0.5 mm
1
2703-001772
L329
INDUCTOR-SMD 18 nH, 5 %, 1.0 x 0.5 x 0.5 mm
1
2703-000175
L331
INDUCTOR-SMD 270 nH, 10 %, 0.8 x 1.6 x 0.8 mm
1
2703-001409
L332
INDUCTOR-SMD 12 nH, 10 %, 1 x 0.5 x 0.5 mm
1
3301-001105
L402
CORE-FERRITE AB, 1.6 x 0.8 x 0.8 mm, -, -
1
3301-001105
L403
CORE-FERRITE AB, 1.6 x 0.8 x 0.8 mm, -, -
1
2703-001952
L405
INDUCTOR-SMD 8.2 nH, 5 %, 1.0 x 0.5 x 0.5 mm
1
2703-001748
L406
INDUCTOR-SMD 5.6 nH, 0.3 nH, 1.0 x 0.5 x 0.5 mm
1
3301-001342
L501
CORE-FERRITE BEAD AB, 1.5 kohm, 1 x 0.5 x 0.5 mm, 100 mA, TP, M,
1
2703-001748
L601
INDUCTOR-SMD 5.6 nH, 0.3 nH, 1.0 x 0.5 x 0.5 mm
1
2703-001952
L602
INDUCTOR-SMD 8.2 nH, 5 %, 1.0 x 0.5 x 0.5 mm
1
2809-001241
OSC401
OSCILLATOR-VCTCXO 19.68 MHz, 2ppm, 10 kohm//10 pF, TP, 2.8 V, 1.5mA
1
2806-001200
OSC402
OSCILLATOR-VCO 967 MHz, -, 50, TP, 3 V, 8.5 mA
1
0501-002202
Q101
TR-SMALL SIGNAL MMBT2222AWT1, NPN, 150 mW, SOT-323
1
0501-002202
Q102
TR-SMALL SIGNAL MMBT2222AWT1, NPN, 150 mW, SOT-323
1
0504-000167
Q160
TR-DIGITAL RN1102, NPN, 100 mW, 10K/10K, SSM, TP
1
0501-000162
Q161
TR-SMALL SIGNAL 2SA1576, PNP, 200 mW, SOT-323, TP, 180-390
1
0501-000218
Q350
TR-SMALL SIGNAL 2SC4081, NPN, 200 mW, UMT, TP, 180-3
1
0504-000172
Q501
TR-DIGITAL RN2104, PNP, 100 mW, 47K/47K, SSM, TP
1
0501-000225
Q502
TR-SMALL SIGNAL 2SC4617, NPN, 200 mW, EM3, TP, 120-5
1
0501-002202
Q503
TR-SMALL SIGNAL MMBT2222AWT1, NPN, 150 mW, SOT-323
1
0505-001165
Q505
FET-SILICON
SI3443D V, P, -20 V, +-3.5 mA, 65mohm
1
0501-000225
Q507
TR-SMALL SIGNAL 2SC4617, NPN, 200 mW, EM3, TP, 120-5
1
0504-000168
Q508
TR-DIGITAL RN1104, NPN, 100 mW, 47K/47K, SSM, TP
1
0504-000168
Q509
TR-DIGITAL RN1104, NPN, 100 mW, 47K/47K, SSM, TP
1
0501-002202
Q511
TR-SMALL SIGNAL MMBT2222AWT1, NPN, 150 mW, SOT-323
Level
SEC CODE
Design LOC
DESCRIPTIONS
SAMSUNG Proprietary-Contents may change without notice
6-10
SCH-A302 Electrical parts list
1
2007-000148
R101
R-CHIP 10 kohm, 5 %, 1/16 W, DA, TP, 1005
1
2007-003019
R103
R-CHIP 430 ohm, 5 %, 1/16 W, DA, TP, 1005
1
2007-000157
R104
R-CHIP 47 kohm, 5 %, 1/16 W, DA, TP, 1005
1
2007-000758
R105
R-CHIP 330 kohm, 5 %, 1/16 W, DA, TP, 1005
1
2007-007771
R106
R-CHIP 0 ohm, 5 %, 1/16 W, DA, TP, 1005
1
2007-000138
R108
R-CHIP 100 ohm, 5 %, 1/16 W, DA, TP, 1005
1
2007-000140
R109
R-CHIP 1 kohm, 5 %, 1/16 W, DA, TP, 1005
1
2007-000153
R110
R-CHIP 22 kohm, 5 %, 1/16 W, DA, TP, 1005
1
2007-000932
R111
R-CHIP 470 ohm, 5 %, 1/16 W, DA, TP, 1005
1
2007-000138
R115
R-CHIP 100 ohm, 5 %, 1/16 W, DA, TP, 1005
1
2007-000165
R117
R-CHIP 200 kohm, 5 %, 1/16 W, DA, TP, 1005
1
2007-000165
R118
R-CHIP 200 kohm, 5 %, 1/16 W, DA, TP, 1005
1
2007-000165
R122
R-CHIP 200 kohm, 5 %, 1/16 W, DA, TP, 1005
1
2007-007771
R123
R-CHIP 0 ohm, 5 %, 1/16 W, DA, TP, 1005
1
2007-000157
R124
R-CHIP 47 kohm, 5 %, 1/16 W, DA, TP, 1005
1
2007-000138
R125
R-CHIP 100 ohm, 5 %, 1/16 W, DA, TP, 1005
1
2007-000138
R126
R-CHIP 100 ohm, 5 %, 1/16 W, DA, TP, 1005
1
2007-001313
R127
R-CHIP 330 ohm, 5 %, 1/16 W, DA, TP, 1005
1
2007-000138
R128
R-CHIP 100 ohm, 5 %, 1/16 W, DA, TP, 1005
1
2007-000138
R129
R-CHIP 100 ohm, 5 %, 1/16 W, DA, TP, 1005
1
2007-000162
R130
R-CHIP 100 kohm, 5 %, 1/16 W, DA, TP, 1005
1
2007-001319
R131
R-CHIP 1.2 kohm, 5 %, 1/16 W, DA, TP, 1005
1
2007-001313
R132
R-CHIP 330 ohm, 5 %, 1/16 W, DA, TP, 1005
1
2007-000165
R133
R-CHIP 200 kohm, 5 %, 1/16 W, DA, TP, 1005
1
2007-000140
R134
R-CHIP 1 kohm, 5 %, 1/16 W, DA, TP, 1005
1
2007-000148
R136
R-CHIP 10 kohm, 5 %, 1/16 W, DA, TP, 1005
1
2007-000140
R137
R-CHIP 1 kohm, 5 %, 1/16 W, DA, TP, 1005
1
2007-000148
R138
R-CHIP 10 kohm, 5 %, 1/16 W, DA, TP, 1005
1
2007-000148
R139
R-CHIP 10 kohm, 5 %, 1/16 W, DA, TP, 1005
1
2007-000140
R140
R-CHIP 1 kohm, 5 %, 1/16 W, DA, TP, 1005
1
2007-000140
R141
R-CHIP 1 kohm, 5 %, 1/16 W, DA, TP, 1005
1
2007-007771
R142
R-CHIP 0 ohm, 5 %, 1/16 W, DA, TP, 1005
1
2007-007771
R144
R-CHIP 0 ohm, 5 %, 1/16 W, DA, TP, 1005
1
2007-000140
R147
R-CHIP 1 kohm, 5 %, 1/16 W, DA, TP, 1005
Level
SEC CODE
Design LOC
DESCRIPTIONS
SAMSUNG Proprietary-Contents may change without notice
6-11
SCH-A302 Electrical parts list
1
2007-007771
R148
R-CHIP 0 ohm, 5 %, 1/16 W, DA, TP, 1005
1
2007-000148
R149
R-CHIP 10 kohm, 5 %, 1/16 W, DA, TP, 1005
1
2007-000148
R160
R-CHIP 10 kohm, 5 %, 1/16 W, DA, TP, 1005
1
2007-000137
R161
R-CHIP 2 kohm, 5 %, 1/16 W, DA, TP, 1005
1
2007-000157
R169
R-CHIP 47 kohm, 5 %, 1/16 W, DA, TP, 1005
1
2007-000138
R170
R-CHIP 100 ohm, 5 %, 1/16 W, DA, TP, 1005
1
2007-000138
R171
R-CHIP 100 ohm, 5 %, 1/16 W, DA, TP, 1005
1
2007-007771
R172
R-CHIP 0 ohm, 5 %, 1/16 W, DA, TP, 1005
1
2007-007771
R175
R-CHIP 0 ohm, 5 %, 1/16 W, DA, TP, 1005
1
2007-007771
R201
R-CHIP 0 ohm, 5 %, 1/16 W, DA, TP, 1005
1
2007-000140
R202
R-CHIP 1 kohm, 5 %, 1/16 W, DA, TP, 1005
1
2007-001311
R203
R-CHIP 270 ohm, 5 %, 1/16 W, DA, TP, 1005
1
2007-000162
R204
R-CHIP 100 kohm, 5 %, 1/16 W, DA, TP, 1005
1
2007-000162
R205
R-CHIP 100 kohm, 5 %, 1/16 W, DA, TP, 1005
1
2007-000148
R206
R-CHIP 10 kohm, 5 %, 1/16 W, DA, TP, 1005
1
2007-000140
R207
R-CHIP 1 kohm, 5 %, 1/16 W, DA, TP, 1005
1
2007-007771
R208
R-CHIP 0 ohm, 5 %, 1/16 W, DA, TP, 1005
1
2007-000148
R209
R-CHIP 10 kohm, 5 %, 1/16 W, DA, TP, 1005
1
2007-007309
R210
R-CHIP 12 kohm, 1 %, 1/16 W, DA, TP, 1005
1
2007-007771
R211
R-CHIP 0 ohm, 5 %, 1/16 W, DA, TP, 1005
1
2007-007771
R213
R-CHIP 0 ohm, 5 %, 1/16 W, DA, TP, 1005
1
2007-001320
R214
R-CHIP 1.8 kohm, 5 %, 1/16 W, DA, TP, 1005
1
2007-000165
R215
R-CHIP 200 kohm, 5 %, 1/16 W, DA, TP, 1005
1
2007-000138
R216
R-CHIP 100 ohm, 5 %, 1/16 W, DA, TP, 1005
1
2007-001284
R218
R-CHIP 4.7 ohm, 5 %, 1/16 W, DA, TP, 1005
1
2007-001284
R219
R-CHIP 4.7 ohm, 5 %, 1/16 W, DA, TP, 1005
1
2007-001298
R220
R-CHIP 51 ohm, 5 %, 1/16 W, DA, TP, 1005
1
2007-007137
R221
R-CHIP 1.2 kohm, 1 %, 1/16 W, DA, TP, 1005
1
2007-007771
R222
R-CHIP 0 ohm, 5 %, 1/16 W, DA, TP, 1005
1
2007-000140
R312
R-CHIP 1 kohm, 5 %, 1/16 W, DA, TP, 1005
1
2007-000775
R313
R-CHIP 33 kohm, 5 %, 1/16 W, DA, TP, 1005
1
2007-001313
R315
R-CHIP 330 ohm, 5 %, 1/16 W, DA, TP, 1005
1
2007-000148
R316
R-CHIP 10 kohm, 5 %, 1/16 W, DA, TP, 1005
1
2007-000148
R317
R-CHIP 10 kohm, 5 %, 1/16 W, DA, TP, 1005
Level
SEC CODE
Design LOC
DESCRIPTIONS
SAMSUNG Proprietary-Contents may change without notice
6-12
SCH-A302 Electrical parts list
1
2007-007771
R318
R-CHIP 0 ohm, 5 %, 1/16 W, DA, TP, 1005
1
2007-001317
R319
R-CHIP 910 ohm, 5 %, 1/16 W, DA, TP, 1005
1
2007-000140
R330
R-CHIP 1 kohm, 5 %, 1/16 W, DA, TP, 1005
1
2007-000140
R331
R-CHIP 1 kohm, 5 %, 1/16 W, DA, TP, 1005
1
2007-000172
R370
R-CHIP 10 ohm, 5 %, 1/16 W, DA, TP, 1005
1
2007-000172
R371
R-CHIP 10 ohm, 5 %, 1/16 W, DA, TP, 1005
1
2007-001319
R372
R-CHIP 1.2 kohm, 5 %, 1/16 W, DA, TP, 1005
1
2007-000172
R373
R-CHIP 10 ohm, 5 %, 1/16 W, DA, TP, 1005
1
2007-000140
R374
R-CHIP 1 kohm, 5 %, 1/16 W, DA, TP, 1005
1
2007-007771
R375
R-CHIP 0 ohm, 5 %, 1/16 W, DA, TP, 1005
1
2007-000172
R376
R-CHIP 10 ohm, 5 %, 1/16 W, DA, TP, 1005
1
2007-000932
R377
R-CHIP 470 ohm, 5 %, 1/16 W, DA, TP, 1005
1
2007-001298
R380
R-CHIP 51 ohm, 5 %, 1/16 W, DA, TP, 1005
1
2007-007771
R404
R-CHIP 0 ohm, 5 %, 1/16 W, DA, TP, 1005
1
2007-000172
R406
R-CHIP 10 ohm, 5 %, 1/16 W, DA, TP, 1005
1
2007-003006
R410
R-CHIP 16 ohm, 5 %, 1/16 W, DA, TP, 1005
1
2007-007771
R411
R-CHIP 0 ohm, 5 %, 1/16 W, DA, TP, 1005
1
2007-003010
R413
R-CHIP 20 ohm, 5 %, 1/16 W, DA, TP, 1005
1
2007-000141
R414
R-CHIP 2.2 kohm, 5 %, 1/16 W, DA, TP, 1005
1
2007-000144
R415
R-CHIP 5.1 kohm, 5 %, 1/16 W, DA, TP, 1005
1
2007-007771
R418
R-CHIP 0 ohm, 5 %, 1/16 W, DA, TP, 1005
1
2007-000172
R420
R-CHIP 10 ohm, 5 %, 1/16 W, DA, TP, 1005
1
2007-007771
R424
R-CHIP 0 ohm, 5 %, 1/16 W, DA, TP, 1005
1
2007-000170
R427
R-CHIP 1 Mohm, 5 %, 1/16 W, DA, TP, 1005
1
2007-007771
R480
R-CHIP 0 ohm, 5 %, 1/16 W, DA, TP, 1005
1
1404-001040
R501
THERMISTOR-NTC 10 kohm, 5 %, 3650K, -, TP
1
2007-000142
R502
R-CHIP 2.7 kohm, 5 %, 1/16 W, DA, TP, 1005
1
2007-000147
R503
R-CHIP 8.2 kohm, 5 %, 1/16 W, DA, TP, 1005
1
2007-000143
R504
R-CHIP 4.7 kohm, 5 %, 1/16 W, DA, TP, 1005
1
2007-000140
R506
R-CHIP 1 kohm, 5 %, 1/16 W, DA, TP, 1005
1
2007-000153
R507
R-CHIP 22 kohm, 5 %, 1/16 W, DA, TP, 1005
1
2007-000140
R508
R-CHIP 1 kohm, 5 %, 1/16 W, DA, TP, 1005
1
2007-001325
R509
R-CHIP 3.3 kohm, 5 %, 1/16 W, DA, TP, 1005
1
2007-001294
R510
R-CHIP 36 ohm, 5 %, 1/16 W, DA, TP, 1005
Level
SEC CODE
Design LOC
DESCRIPTIONS
SAMSUNG Proprietary-Contents may change without notice
6-13
SCH-A302 Electrical parts list
1
2007-001294
R511
R-CHIP 36 ohm, 5 %, 1/16 W, DA, TP, 1005
1
2007-001294
R512
R-CHIP 36 ohm, 5 %, 1/16 W, DA, TP, 1005
1
2007-007771
R514
R-CHIP 0 ohm, 5 %, 1/16 W, DA, TP, 1005
1
2007-000148
R515
R-CHIP 10 kohm, 5 %, 1/16 W, DA, TP, 1005
1
2007-007771
R521
R-CHIP 0 ohm, 5 %, 1/16 W, DA, TP, 1005
1
2007-007771
R524
R-CHIP 0 ohm, 5 %, 1/16 W, DA, TP, 1005
1
2007-000305
R528
R-CHIP 10 Mohm, 5 %, 1/16 W, DA, TP, 1608
1
2007-007771
R529
R-CHIP 0 ohm, 5 %, 1/16 W, DA, TP, 1005
1
2007-007771
R531
R-CHIP 0 ohm, 5 %, 1/16 W, DA, TP, 1005
1
2007-007771
R535
R-CHIP 0 ohm, 5 %, 1/16 W, DA, TP, 1005
1
2007-000146
R536
R-CHIP 6.8 kohm, 5 %, 1/16 W, DA, TP, 1005
1
2007-000148
R537
R-CHIP 10 kohm, 5 %, 1/16 W, DA, TP, 1005
1
2007-000162
R539
R-CHIP 100 kohm, 5 %, 1/16 W, DA, TP, 1005
1
2007-000162
R540
R-CHIP 100 kohm, 5 %, 1/16 W, DA, TP, 1005
1
2007-000162
R541
R-CHIP 100 kohm, 5 %, 1/16 W, DA, TP, 1005
1
2007-000143
R542
R-CHIP 4.7 kohm, 5 %, 1/16 W, DA, TP, 1005
1
2007-000153
R543
R-CHIP 22 kohm, 5 %, 1/16 W, DA, TP, 1005
1
2007-000162
R544
R-CHIP 100 kohm, 5 %, 1/16 W, DA, TP, 1005
1
2007-000140
R552
R-CHIP 1 kohm, 5 %, 1/16 W, DA, TP, 1005
1
2007-007771
R553
R-CHIP 0 ohm, 5 %, 1/16 W, DA, TP, 1005
1
2007-007137
R554
R-CHIP 1.2 kohm, 1 %, 1/16 W, DA, TP, 1005
1
2007-000165
R603
R-CHIP 200 kohm, 5 %, 1/16 W, DA, TP, 1005
1
2007-000162
R604
R-CHIP 100 kohm, 5 %, 1/16 W, DA, TP, 1005
1
2007-000162
R605
R-CHIP 100 kohm, 5 %, 1/16 W, DA, TP, 1005
1
2007-000143
R606
R-CHIP 4.7 kohm, 5 %, 1/16 W, DA, TP, 1005
1
2007-007771
R607
R-CHIP 0 ohm, 5 %, 1/16 W, DA, TP, 1005
1
2007-000141
R611
R-CHIP 2.2 kohm, 5 %, 1/16 W, DA, TP, 1005
1
2007-000242
R612
R-CHIP 1.5 kohm, 5 %, 1/16 W, DA, TP, 1005
1
2007-000140
R613
R-CHIP 1 kohm, 5 %, 1/16 W, DA, TP, 1005
1
2007-001339
R614
R-CHIP 180 kohm, 5 %, 1/16 W, DA, TP, 1005
1
2007-000148
R616
R-CHIP 10 kohm, 5 %, 1/16 W, DA, TP, 1005
1
2007-000168
R617
R-CHIP 470 kohm, 5 %, 1/16 W, DA, TP, 1005
1
2007-000148
R618
R-CHIP 10 kohm, 5 %, 1/16 W, DA, TP, 1005
1
2007-001339
R619
R-CHIP 180 kohm, 5 %, 1/16 W, DA, TP, 1005
Level
SEC CODE
Design LOC
DESCRIPTIONS
SAMSUNG Proprietary-Contents may change without notice
6-14
SCH-A302 Electrical parts list
1
2007-000137
R620
R-CHIP 2 kohm, 5 %, 1/16 W, DA, TP, 1005
1
2007-000140
R622
R-CHIP 1 kohm, 5 %, 1/16 W, DA, TP, 1005
1
2007-000831
R628
R-CHIP 39 kohm, 5 %, 1/16 W, DA, TP, 1005
1
2007-000161
R629
R-CHIP 82 kohm, 5 %, 1/16 W, DA, TP, 1005
1
2007-000162
R631
R-CHIP 100 kohm, 5 %, 1/16 W, DA, TP, 1005
1
2007-000162
R632
R-CHIP 100 kohm, 5 %, 1/16 W, DA, TP, 1005
1
2007-000148
R636
R-CHIP 10 kohm, 5 %, 1/16 W, DA, TP, 1005
1
2007-001298
R643
R-CHIP 51 ohm, 5 %, 1/16 W, DA, TP, 1005
1
2007-001305
R645
R-CHIP 120 ohm, 5 %, 1/16 W, DA, TP, 1005
1
2007-001305
R646
R-CHIP 120 ohm, 5 %, 1/16 W, DA, TP, 1005
1
2007-001298
R647
R-CHIP 51 ohm, 5 %, 1/16 W, DA, TP, 1005
1
1106-001274
U101
IC-SRAM 616U4110, 256K x 16BIT, CSP, 48P, -, 70NS, 3 V, -, -, -40TO85 C,
1
1109-001158
U103
IC-ETC. MEMORY 84VD22194, 4M x 8/2M x 16Bit, BGA, 73P, 457MIL, 90nS,
1
1103-001184
U106
IC-EEPROM 24C256, 32K x 8Bit, dBGA, 8P, 92MIL, -, 2.7 V, -, PLASTIC, -
1
1201-001491
U201
IC-POWER AMP 912, LCC, 7P, 226MIL, SINGLE, 28 dB, PLASTIC, 4.2 V, -, -
1
0505-001376
U202
FET-SILICON FDC6329L, N/P, 8 V, 2.5A, -, 0.7 W, SC-74
1
0505-001376
U203
FET-SILICON FDC6329L, N/P, 8 V, 2.5A, -, 0.7 W, SC-74
1
1204-001682
U204
IC-IF/FM/AM RFT3100, BCC, 32P, 196MIL, PLASTIC, 3 V, -, -30to+85C, TP, -
1
1204-001581
U302
IC-IF CIRCUIT IFR3000-48BCCF-TR, BCC, 48P, -, PLASTIC, 3.5 V, -, -
1
1205-001943
U360
IC-DATA COMM./GEN. RF2366TR7, SOT23-6, 6P, -, PLASTIC, 8 V, -, -
1
1205-001928
U361
IC-MIXER CMY212B, SOP, 8P, 63MIL, PLASTIC, 5 V, -, -55to+150C, TP, -
1
1209-001197
U402
IC-PLL LMX2332LSLB, CSP, 20P, -, PLASTIC,
1
1201-001248
U404
IC-CASCODE AMP 0916, SOT-143, 4P, -, -, 2.7 V, -, 6Vd
1
1203-001967
U501
IC-POWER SUPERVISOR 1000, BGA, 64P, 315MIL, PLASTIC, 1.6/3.3 V, -, -
1
1202-000192
U601
IC-PHASE COMPARATOR 75W393, -, 8P, -, DUAL, 36 V, CMOS, PL
1
1205-002032
U609
IC-TRANSCEIVER MSM3100C, FBGA, 208P, -, PLASTIC, 3.7 V, -, -
1
1201-001248
U610
IC-CASCODE AMP 0916, SOT-143, 4P, -, -, 2.7 V, -, 6Vd
1
3711-004642
VCON1
CONNECTOR-HEADER NOWALL, 2P, 1R, 2.5 mm, SMD-S, A uF
1
3711-004642
VCON2
CONNECTOR-HEADER NOWALL, 2P, 1R, 2.5 mm, SMD-S, A uF
1
2801-003856
X501
CRYSTAL-SMD 0.032768 MHz, 20PPM, 28-ACP, 7 pF, 65 kohm, TP
1
0406-001051
ZD101
DIODE-TVS SMS05C, 6 V, 300 W, SOT-23-6
1
0406-001051
ZD102
DIODE-TVS SMS05C, 6 V, 300 W, SOT-23-6
1
0406-001051
ZD103
DIODE-TVS SMS05C, 6 V, 300 W, SOT-23-6
1
0403-001387
ZD601
DIODE-ZENER UDZS5.1B, 4.89-5.2 V, 200 mW, SOD-323, TP
Level
SEC CODE
Design LOC
DESCRIPTIONS
SAMSUNG Proprietary-Contents may change without notice
7-1
7. SCH-A302 Exploded View & parts list
1. Cellular phone Exploded View
1
2
4
5
3
7
8
9
10
20
21
22
17
18
19
6
11
13
14
15
12
16
23
24
SAMSUNG Proprietary-Contents may change without notice
7-2
SCH-A302 Exploded view and its Part List
2. Cellular phone Parts List
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
DUAL WINDOW
SUA, FOLDER UPPER
FPCB ASS’Y
LCD PBA
SPEAKER
VIBRATOR
SUA, FOLDER LOWER
LCD WINDOW
DUMMY LABEL
SCREW MACHINE ( M1.4 X L3)
IF CONN-COVER
MIC
MIC HOLDER
SUA, FRONT COVER
VOLUME KEY
KEY PAD
SUA, SHIELD COVER
KEY FPCB
PBA
ANTENNA
RF JACK
SUA, REAR COVER
SCREW MACHINE ( M1.4 X L5)
BATTERY
Description
Remark
SEC CODE
Gold
Silver
Location
No.
GH72-03350A
GH75-01081C
GH59-00109A
GH96-00918A
3001-001176
GH31-00018A
GH75-01016D
GH72-02386J
GH68-00370H
6001-000464
GH73-00921B
3003-001053
GH73-00441A
GH75-00687D
GH72-01572A
GH72-01582L
GH75-00719A
GH59-00107A
GH92-00996A
GH42-00126A
GH73-00440D
GH75-00690E
6001-000883
GH43-00339A
GH43-00332A
GH72-03350A
GH75-01081B
GH59-00109A
GH96-00918A
3001-001176
GH31-00018A
GH75-01016B
GH72-02386H
GH68-00370J
6001-000464
GH73-00921A
3003-001053
GH73-00441A
GH75-00687B
GH72-01572A
GH72-01582K
GH75-00719A
GH59-00107A
GH92-00996A
GH42-00126A
GH73-00440B
GH75-00690D
6001-000883
GH43-00338A
GH43-00331A
520mAh
820mAh
SAMSUNG Proprietary-Contents may change without notice
8-1
8. SCH-A302 Block Diagram
C
H
A
N
N
E
L
C
O
D
E
C
C
P
U
A
R
M
7
V
O
C
O
D
E
R
V
it
e
r
b
i
D
E
C
O
D
E
R
M
O
D
U
L
A
T
O
R
&
D
e
m
o
d
.
U
A
R
T
2
5
6
K
E
E
P
R
O
M
L
C
D
M
O
D
U
L
E
K
E
Y
F
P
C
A
S
S
’Y
C
O
D
E
C
3
2
M
/
4
M
M
E
M
O
R
Y
V
C
O
1
/2
T
X
IF
P
L
L
V
C
O
1
/2
2
6
0
.7
6
M
H
z
T
A
N
K
C
I
R
C
U
IT
V
C
T
C
X
O
1
9
.6
8
M
H
z
1
7
0
.7
6
M
H
z
T
A
N
K
C
I
R
C
U
IT
P
L
L
V
C
O
A
N
T
E
N
N
A
D
U
P
L
E
X
E
R
B
U
F
F
E
R
B
U
F
F
E
R
82
4.
64
~
84
8.
37
M
H
z
8
69
.6
4
~
8
9
3.
37
M
H
z
L
N
A
95
5.
02
~
97
8.
75
M
H
z
9
55
.0
2
~
97
8.
7
5M
H
z
F
c
=
1
3
0
.3
8
MHMH
Z
IF
A
M
P
M
H
z
F
c
=
8
5
.3
8
3
.6
V
B
A
T
T
E
R
Y
3
.0
M
C
R
E
C
E
IV
E
R
U
n
it
M
IC
M
S
M
.
3
.0
M
A
D
R
IV
E
R
3
.0
M
P
3
.0
IF
3
.0
S
Y
N
C
O
U
P
L
E
R
R
F
T
3
1
0
0
I
F
R
3
0
0
0
L
O
C
K
S
E
N
S
IN
G
4
M
S
R
A
M
3
.
0
T
C
X
O
3
.
0
T
X
3
.
0
R
X
P
.A
P
M
1
0
0
0
P
A
M
VCCVCC
SAMSUNG Proprietary-Contents may change without notice
8-2
SCH-A302 Block Diagram
MEMO
SAMSUNG Proprietary-Contents may change without notice
9-1
9. SCH-A302 PCB Diagrams
1. Main PCB Top Diagram
C 1 0 4
C 1 1 4
C 1 2 9
C 1 4 4
C160
C161
C162
C201
C202
C203
C204
C205
C207
C208
C 2 0 9
C 2 1 0
C 2 1 1
C 2 1 3
C 2 1 4
C215
C 2 1 6
C 2 1 7
C218
C219
C220
C 2 2 1
C222
C223
C225
C226
C227
C 2 2 9
C 2 3
C 2 3 0
C 2 3 1
C 2 3 3
C234
C235
C 2 3 7
C 2 3 8
C239
C 2 4 0
C243
C244
C 2 5 0
C 3 1 8
C 3 2 0
C 3 2 1
C 3 2 3
C 3 3 1
C 3 3 2
C333
C 3 3 4
C 3 3 5
C 3 3 7
C 3 3 8
C 3 3 9
C 3 4 0
C 3 4 1
C342
C343
C 3 4 4
C 3 4 5
C346
C349
C350
C370
C371
C372
C373
C374
C375
C376
C377
C 3 7 8
C379
C380
C 3 8 1
C 3 8 2
C 3 8 3
C 3 8 4
C385
C 3 8 6
C 3 8 7
C 3 8 8
C389
C 3 9 0
C 3 9 1
C 3 9 2
C 3 9 3
C 3 9 4
C395
C396
C397
C 3 9 8
C 4 2 8
C 5 0 1
C 5 0 2
C 5 0 3
C 5 1 3
C514
C525
C 5 2 6
C 5 3 8
C549
C 5 6 6
C 5 6 7
C 5 6 8
C 6 0 8
C 6 1 5
C 6 1 6
C 6 1 9
C 6 2 0
C 6 2 1
CN101
CN303
D160
D201
D202
D302
D303
D350
D351
D601
F303
L201
L202
L 2 0 4
L 2 0 5
L206
L209
L210
L211
L 2 1 2
L311
L318
L319
L321
L322
L323
L324
L325
L 3 2 6
L327
L328
L329
L330
L331
L332
Q160
Q161
Q 3 5 0
R 1 0 3
R 1 0 4
R 1 0 5
R 1 0 8
R 1 0 9
R 1 1 1
R 1 3 6
R 1 3 8
R 1 4 1
R 1 4 7
R160
R161
R162
R 1 6 9
R 1 7 0
R171
R172
R175
R202
R203
R 2 0 4
R 2 0 5
R206
R207
R 2 0 8
R209
R 2 1 0
R 2 1 1
R212
R 2 1 3
R 2 1 4
R215
R216
R 2 1 8
R 2 1 9
R220
R 2 2 1
R311
R 3 1 2
R 3 1 3
R 3 1 5
R316
R 3 1 7
R 3 1 8
R319
R 3 3 0
R 3 3 1
R 3 5 1
R 3 5 2
R370
R 3 7 1
R 3 7 2
R 3 7 3
R374
R375
R376
R 3 7 7
R 3 7 8
R380
R501
R 5 0 2
R 5 0 3
R524
R 5 3 2
R560
R 6 2 1
R622
R 6 2 5
U101
U103
U106
U202
U203
U204
U302
U360
U361
U501
U609
V100
V101
V102
V103
X501
ZD103
SAMSUNG Proprietary-Contents may change without notice
9-2
SCH-A302 PCB Diagrams
2. Main PCB Bottom Diagram
AU501
C1
01
C102
C1
03
C105
C1
06
C1
07
C108
C109
C1
10
C1
11
C112
C113
C1
15
C1
16
C1
17
C1
18
C119
C120
C121
C122
C123
C1
24
C125
C126
C127
C128
C1
40
C142
C143
C145
C146
C147
C150
C151
C152
C224
C3
19
C406
C407
C408
C409
C4
10
C411
C4
12
C4
13
C4
14
C415
C416
C4
17
C4
18
C419
C4
20
C421
C4
22
C4
23
C4
24
C425
C426
C4
27
C4
29
C4
31
C4
32
C4
33
C435
C436
C437
C438
C504
C5
05
C506
C507
C508
C509
C510
C515
C5
16
C517
C519
C520
C522
C523
C524
C527
C528
C5
29
C530
C5
31
C532
C533
C5
34
C535
C536
C5
37
C539
C5
40
C5
42
C5
45
C5
46
C556
C600
C601
C6
02
C6
03
C604
C605
C606
C6
07
C609
C6
10
C611
C612
C6
13
C6
14
C617
C618
C622
C640
C6
41
C651
C652
C653
C654
C655
C6
56
C6
63
CN301
CN302
D501
D602
F101
F102
F103
F201
F301
F302
F401
J101
J102
L213
L3
02
L3
03
L307
L320
L402
L403
L405
L406
L501
L601
L602
LWR1
OSC401
OSC402
Q101
Q102
Q501
Q502
Q503
Q505
Q507
Q508
Q509
Q511
R1
01
R106
R1
10
R1
15
R117
R118
R1
21
R122
R1
23
R1
24
R1
25
R1
26
R127
R128
R1
29
R130
R1
31
R132
R133
R134
R137
R139
R140
R1
42
R1
43
R1
44
R1
45
R1
48
R149
R1
50
R201
R222
R4
04
R4
06
R4
10
R4
11
R413
R4
14
R4
15
R4
18
R420
R4
24
R425
R426
R4
27
R4
80
R5
04
R506
R507
R5
08
R509
R5
10
R5
11
R5
12
R514
R515
R518
R5
19
R5
21
R5
23
R528
R529
R5
31
R534
R535
R536
R5
37
R5
38
R539
R5
40
R541
R5
42
R543
R5
44
R552
R553
R554
R601
R6
02
R603
R604
R605
R606
R6
07
R611
R6
12
R6
13
R614
R616
R6
17
R618
R619
R620
R626
R628
R6
29
R6
30
R631
R6
32
R636
R6
43
R6
45
R6
46
R647
R6
48
R649
T101
T102
T103
T104
T105
T106
U201
U402
U404
U601
U610
VCON1
VCON2
ZD101
ZD102
ZD601
SAMSUNG Proprietary-Contents may change without notice
10-1
10. SCH-A302 Circuit description & Circuit Diagrams
1. Logic Section
(1) Power Supply
For the POWER ON, with the battery installed on the phone and by pressing the PWR key, the VBAT
and ON_SW signals will be connected, also by connecting the TA(travel adaptor). This will turn on
Q507(2SC4617). This will turn on U501. This voltage is supplied to pin 6 and pin10 of PM(power
management) U501 , thus releasing them from the shut-down state to output regulated 2.8 V,
thus releasing them from the shut-down state to output regulated 2.8 V.
Simultaneously, VBAT applied to ON_SW will turn on Q508(DTC144EE/TR) resulting in the signal
ON_SW_SENSE to change state from HIGH to LOW. This will allow MSM to send out
PS_HOLD(logical HIGH) to turn on Q507(2SC4617) even after the PWR key is released.
For the POWER OFF, by pressing PWR_KEY of the keypad for few seconds the VBAT voltage will be
applied to the ON_SW and will drive Q508(DTC144EE/TR) to input LOW on the ON_SW_SENSE of
the MSM. The MSM will recognize this and will output LOW on the PS_HOLD.
The voltage(+2.8 V) from the pin 6 and pin10 of the U501 is used in the digital parts of MSM.
The voltage(+3.0 V) from the pin 20 of the U501 is used in the parts of IFR.
The voltage(+3.0 V) from the pin 15 of the U501 is used in the RX parts of RF.
The voltage(+3.0 V) from the pin 18 of the U501 is used in the TX parts of RF.
The voltage(+2.7 V) from U501 is used in the analog part.
(2) Logic Part
The logic part consists of internal CPU of MSM, Memory and EEPROM. The MSM receives TCXO and
CHIPX8 clock signals from the IFR and controls the phone during the CDMA and the FM mode.
The major components are as follows:
•
CPU : MSM3100C(U609)
- ARM7TDMI µ-processor
•
Memory : U103(MB84VD2219EC-90PBS)
- 16MBIT FLASH ROM
U101(KM616U4110CLZI-7L)
- 4MBIT SRAM
•
EEPROM : U106(AT24C256-10UI-2.7-T.R)
- 256KBIT SERIAL EEPROM
CPU
ARM7TDMI µ-processor is used for the main processing.
The CPU controls all the circuitry. For the CPU clock, 27 MHz resonator is used.
MEMORY (U103 and U101)
16M FLASH ROM(U103)and 4M SRAM(U101) packages are used to store the terminal’s program,
the internal flag information, call processing data, data service, and timer data.
Using the down-loading program, the program can be changed even after the terminal is fully
assembled.
EEPROM(U106)
One 256KBIT EEPROM is used to store ESN, NAM, power level, volume level, and telephone number.
SAMSUNG Proprietary-Contents may change without notice
10-2
SCH-A302
Circuit description & Circuit Diagrams
KEY MATRIX
For key recognition, key matrix is setup using KEYSENE0-2 of KEYSENSE signals and KEYSENE0-2 of
input ports of MSM. Ten LEDs and backlight circuitry are included in the board for easy operation in
the dark.
LCD MODULE
LCD module contains a controller which will display the information onto the LCD by 8-bit data from
the MSM.
(3) Baseband Part
MOBILE SYSTEM MODEM (MSM)
The MSM equipped with the QUALCOMM ARM7TDMI µ-processor is an important component of the
CDMA cellular phone. The MSM comes in a 208 pins FBGA package.
MICROPROCESSOR INTERFACE
The interface circuitry consists of reset circuit, address bus(A1-A20), data bus(D1-D16), and memory
controls (~LBE,~UBE,~LWR,~RAM_CS1,~ROM_CS,~RD,~RESIN).
INPUT CLOCK
•
CPU clock: 19.68 MHz, 32.769 kHz(sub-clock)
•
TCXO(pin A17): 19.68 MHz.
This clock signal from the IFR is the reference clock for the MSM
except in CDMA mode.
•
CHIPX8(pin 2G): 9.8304 MHz.
The reference clock used during the CDMA mode.
•
SLEEP-XTAL-IN/OUT(pins R17,T17) : 32.768 MHz
IFR INTERFACE
CDMA, FM Data Interface
•
TXIQDATA0-7 (pins 11, 12, 13, 14, 15, 16, 17, 18):TX data bus used during COMA and FM mode.
•
C_RX_IDATA0-3 (pins 45-48) and C_RX_QDATA0-3 (pins 39-42):RX data bus used during CDMA
mode.
•
FM_RX_IDATA (pin 47) and FM_RX_QDATA (pin 48):RX data bus used during FM mode.
Clock
•
TX_CLK(pin 19), TX_CLK/(pin 20):Analog to Digital Converter(ADC) reference clock used in
TX mode.
•
CHIPX8: ADC reference clock used in CDMA RX mode.
•
FMCLK: Reference clock in FM RX mode.
Data Port Interface
Includes the UART. Also, supports Diagnostic Monitor(DM) and HP equipment interface.
RF Interface
TX: TX_AGC_ADJ(pin 2L) port is used to control the TX power level.
The PA_ON(pin 1P) signal is used to control the power amplifier.
RX: TRK_LO_ADJ(pin 1R) is used to compensate the TCXO clock.
General Purpose I/O Register Pins
Input/output ports to control external devices.
SAMSUNG Proprietary-Contents may change without notice
10-3
SCH-A302
Circuit description & Circuit Diagrams
Power Consumption Control
When the phone is the sleep mode, it is disabled all the pins except for the basic operation of the MSM.
(4) Audio Part
TX AUDIO PATH
The voice signal from the microphone is filtered and amplified by the internal OP-AMP1 and the
external OP-AMP2, is converted to PCM data by the MSM(U609)’s internal CODEC.
This signal then applied to the MSM’s internal vocoder.
RX AUDIO PATH
The PCM data from the MSM is converted to audio signal by ADC of MSM CODEC, is then amplified
by MSM’s internal CODEC to be sent to the speaker unit.
FM TX PATH
Pre-Emphasis Circuit
The circuit features +6 dB/oct to reduce signal loss and noise in Tx path.
Compressor
The compressor features 2:1 level to reduce signal loss and noise in Tx path. The zero crossing level of
the compressor is
±
2.9 kHz/dev, attack time is 3 mS, and release time is 13.5 mS.
Limiter
The limiter performs to cut
±
0.53 Vp-p or higher audio signal level so that the FM frequency deviation
is not over
±
12 kHz/dev. The function is sued confusion over phone line. LPF is used to reduce a
specific high frequency of limited signal.
RX AUDIO PATH
De-Emphasis Circuit
This circuit is lst LPE featuring -6 dB/oct to reduce signal loss and noise in Rx path.
Expander
The expander features 1:2 level to reduce signal loss and noise in Rx path. The zero crossing level of the
expander is ±2.9 kHz/dev, attack time is 3 mS, and release time is 13.5 mS.
Vloume Adjust
Volume can be adjusted up to 3 steps for the user to obtain a proper loudness of received signal.
(5) TX WBD, ST, and SAT
Thess signals are generated from MSM. The modulation level of TX WBD and ST is
±
8 kHz/dev, and
SAT is
±
2 kHz/dev.
(6) Buzzer Driving Circuitry
Buzzer generate alert tone. When the buzzer receives the timer signal from the MSM,
it generates alert tone. The buzzer level is adjusted by the alert signal’s period generated from the MSM
timer.
SAMSUNG Proprietary-Contents may change without notice
10-4
SCH-A302
Circuit description & Circuit Diagrams
2. CDMA
(1) Receiver
Low Noise Amplifier(LNA)
The low noise amplifier featuring 1.8 dB Noise Figure and 14.5 dB gain amplifier a weak signal receiver
from the base station to obtain the optimum signal level.
Down Converter(MIXER)
First local signal is applied to this down converter. The down converter tranfers the signal amplified at
the LNA into 85.38 MHz IF signal. 85.38 MHz IF signal is made by subtracting 881
±
12.5 MHz RF
signal 966
±
12.5 MHz first local signal.
The LNA and down converter is U361.
RF Band Pass Filter(BPF)
The RF BPF(F303) passes only a specific frequency(881.49
±
12.5 MHz) from the signal received from the
mobile station. The width is 25 MHz.
IF SAW Band Pass Filter(CDMA)
If SAW BPF(F200) is used for CDMA system having 1.23 MHz wide band and
±
630 kHz bandwidth.
The filter also eliminates the image product generated by the mixer.
Voltage Controlled Oscillator, Phase Locked Loop(PLL)
The VCO+PLL (OSC402 , U402) generates the signal having 966 MHz center frequency
and
±
12.5 MHz deviation with voltage control. The VCO , PLL Module(OSC402, U402) controls this
signal.
Input reference frequency is generated at VC-TCXO(OSC402, U402) and RF local signal is generated at
VCO , PLL (OSC402, U402). The VCO , PLL (OSC402, U402) compares the two signals and generates the
desired signal with a preprogrammed counter which controls voltage.
Voltage Controlled Temperature Compensated Crystal Oscillator
It provides 19.68 MHz reference frequency to VCO , PLL (OSC402, U402) and RFT3100(U204),
IFR(U302). A correct frequency tunning is made by the voltage control.
Duplexer
Duplexer(F302) controls to transmit through the antenna only signals within acceptable TX frequency
range(836.03
±
12.5 MHz). It also matches LNA(U360) input in receiving part and PA output in
transmitter part with the antenna.
(2) Transmitter
Power Amp
Power amp module(U201) amplifiers the signal to be sent out to the base station through the antenna.
RFT3100
The RFT3100(U204) receives the first local signal to generate 836.03
±
12.5 MHz.
836.03
±
12.5 MHz signal comes out from the mixer output by substracting 130.38 MHz IF signal to
967.41
±
12.5 MHz first local signal.
Antenna
Antenna allows signal to send to receive from the base station.
SAMSUNG Proprietary-Contents may change without notice
10-5
SCH-A302
Circuit description & Circuit Diagrams
RF Band Pass Filter(BPF)
The RF BPF(F303, F201) accepts only specific frequency(836.03
±
12.5 MHz) to send it out to base station
module. The bandwidth is 25 MHz.
PM1000
The PM1000(U501) supply a regulated power to each part of transmitter.
U501 supplies 3.0 V to the RFT3100(U204) and V
BATT
is connected to power amp module(U201) directly.
SAMSUNG Proprietary-Contents may change without notice
10-6
SCH-A302
Circuit description & Circuit Diagrams
3. BASIC BLOCK DIAGRAM
PL L
USB
U A RT 1
U A RT 2
M SM 3 1 0 0 C
H K A D Cs
V o lt age Regul at o r
A RM7 T DMI
Ge n er n al
P ur p o s e
I nt e r f ac e
V o c o de r
EV RC
1 3 K
Mo de Sel ec t
I nt er f ac e
AN SI/ I EEE 11 49. 1A - 199 3
JT A G Int er f c e
SB I
D F M
P ro ce ss or
C D M A
P ro ce ss or
T x
D A C s
I F R 30 0 0
R F T 3 10 0
T r ansmit I and Q Data
Receive Data
P OWE R A M P
M O DU L E
RF R X
PA R T
D U PL E X ER
19.68 MHz
RINGER
T W L 2 2 1 4
Char gi ng
sy st em
PC
C o nn ec t iv it y
T es t / D eb ug
Sy s t em
V CT C XO
Digital Test Bus
32. 768 K hz
SRA M , FL A S H,
E EP RO M ,
L CD d isp la y
BUS
K E Y PA D
C OD EC
RF
I nt e r f ace
SAMSUNG Proprietary-Contents may change without notice
10-7
Date Changed
Changed by
10
8
4
Size
12
City
D
C
Drawn by
of
B
Engineer
6
1
1
3
Drawing Number
1
Time Changed
F
D
5
COMPANY NAME
TITLE
11
B
8
G
G
11
H
H
9
SCH-A302 (i)
A2
7
2
3
C
R&D CHK
3
4
DOC CTRL CHK
12
6
E
A
5
2
E
QA CHK
REV
9
10
MFG ENGR CHK
Sheet
Address
A
7
F
LJC
2001.09.18
5:00:42 pm
LJC
LJC
0 6
R145
NC
VBATT
470PF
C105
1NF
C151
47K
R124
NC
R143
0
R142
R622
2
TMS
1K
100NF
C619
10K
R149
IN
2
IN
IN
3
IN
4
5
OUT
OUT
6
OUT
7
8
OUT
F103
G
9
10
G
1
2
3
1
C145
470PF
V102
Q160
100
R128
VCON2
1
1
2
2
3
3
2
1K
R147
Q102
1
3
IN
IN
3
IN
4
5
OUT
OUT
6
OUT
7
8
OUT
F101
G
9
10
G
1
IN
2
220PF
C605
R606
4.7K
NC
R625
T106
330
R127
CN303
1
2
3
4
5
100
R170
1
47K
R169
180K
R619
CN101-1
R175
0
3.0_MA
3.0_MP
R133
200K
470PF
C162
R171
100
R115
C161
470PF
V101
3.0_MP
100
9
V100
200K
R118
C115
470PF
9
9
6
V103
20
20
3
3
4
4
5
5
6
6
7
7
8
8
13
13
14
14
15
15
16
16
17
17
18
18
19
19
2
2
J101
1
1
10
10
11
11
12
12
2.2K
R611
3.0_MP
D602
100K
R604
D601
R614
180K
10K
R138
16
R172
0
3.0_MP
6
OUT
7
OUT
OUT
8
R132
330
F102
9
G
G
10
IN
1
IN
2
3
IN
4
IN
OUT
5
C101
10NF
100NF
C111
1NF
C152
1NF
C150
TDI
3.0_MP
R140
1K
1A
_LB
2A
_OE
2B
_UB
_WE
5G
3E
NC3
NC4
6H
VCC1
1E
6D
VCC2
1D
VSS1
VSS2
6E
5B
_CS1
6C
I/O3
I/O4
5D
5E
I/O5
I/O6
5F
I/O7
6F
6G
I/O8
1B
I/O9
2G
NC1
NC2
1H
I/O11
2C
2D
I/O12
I/O13
2E
2F
I/O14
1F
I/O15
I/O16
1G
5C
I/O2
4B
A4
A5
3C
4C
A6
A7
4D
2H
A8
A9
3H
CS2
6A
I/O1
6B
I/O10
1C
3G
A12
A13
4G
3F
A14
A15
4F
4E
A16
A17
3D
5A
A2
A3
3B
U101
3A
A0
A1
4A
4H
A10
A11
5H
2K
R620
10NF
1K
R109
C103
19
1NF
C127
D160
3
1
2
6.3V
33UF
C604
C110
10NF
C616
100NF
C611
100PF
10
3.0_MA
3.0_MA
C614
NC
C612
100NF
C143
100NF
0
R123
10NF
C144
TDO
C119
3.0_MP
1NF
C607
100NF
200K
R117
C606
10UF
6.3V
100K
R130
C120
1NF
C147
1NF
100NF
C610
DGND
NC
R601
100
R125
C106
10NF
100
R129
12
R144
0
C641
5
100NF
R618
10K
R148
7
4
0
TRST_N
C622
10NF
17
C620
10NF
10K
4
6
T104
R136
ZD101
2
1
3
5
3.0_MP
C121
R160
10K
1NF
1NF
C126
100NF
C122
F_WE
100NF
C617
0
8
R106
R161
2K
470K
R617
10K
R616
R122
3.0_MP
3.0_MP
200K
C601
47NF
3.0_MP
3.0_MP
C640
100NF
R602
NC
C613
100NF
T103
3.0_TCXO
C104
470PF
C116
10NF
1
3
2
C113
100NF
14
Q161
R110
22K
18
C112
100PF
470PF
C114
T105
100K
R605
R111
470
3.0_MP
100PF
C117
100NF
C615
100
330K
R105
R126
100
3.0_TCXO
R108
C603
VBA
TT
5
4
6
15
ZD103
2
1
3
VCON1
1
1
2
2
3
3
C123
10NF
TCK
D4
C6
_WE
C5
_WP/ACC
100NF
C618
J6
VSS1
G3
J9
VSS2
J2
_CE1S
_CEF
H2
_LBS
C4
_OE
H3
_RESET
D5
_UBS
NC
NC
B10
C1
NC
NC
E9
F1
NC
E5
RY/_BY
SA
G8
J5
VCCF
VCCS
L5
L6
NC
L10
NC
NC
M1
NC
M10
NC
A10
B1
NC
NC
B5
B6
K3
DQ8
DQ9
H4
A1
NC
NC
F9
F10
NC
NC
G1
NC
G10
L1
NC
NC
K8
DQ14
DQ15/A-1
H8
DQ2
K4
H5
DQ3
DQ4
H6
K7
DQ5
G7
DQ6
DQ7
J8
H9
K6
CIOS
DQ0
J3
G4
DQ1
J4
DQ10
DQ11
K5
J7
DQ12
DQ13
H7
D2
F3
A4
E3
A5
A6
D3
A7
C3
C7
A8
A9
E7
CE2S
D6
CIOF
F8
A15
D9
G9
A16
A17
F4
E4
A18
A19
D7
E2
A2
E6
A20
A3
U103
G2
A0
A1
F2
F7
A10
A11
C8
A12
D8
A13
E8
A14
10NF
C109
20
1K
R137
13
3
C108
NC
R150
100NF
C124
100NF
R101
10K
10NF
C128
C621
C608 100NF
100NF
C142
10NF
BOUT
7
GND
4
8
VCC
U601
3
A+
A-
2
1
AOUT
5
B+
B-
6
100NF
C651
DP_TX_DA
T
A
10NF
C146
R603
200K
22
21
11
1
3
2
T102
Q101
C107
100NF
C160
1UF
10V
10NF
C140
NC
10NF
C609
39K
R121
R141
1K
R628
3.0_MC
C602
3
4
4
5
5
6
6
7
7
8
8
9
9
14
15
15
16
16
17
17
18
18
19
19
2
2
20
20
3
J102
1
1
10
10
11
11
12
12
13
13
14
R103
430
R162
NC
R621
NC
1.5K
R612
T101
NC
R626
C118
100PF
R613
3.0_TX
1K
3.0_MP
C129
3.3NF
HP_PWR
DP_RX_DA
T
A
2
1
3
5
4
6
ZD102
R139
C600
3.0_TCXO
10K
220PF
R134
1K
D9
K4
VDD_C2
VDD_C3
M15
E14
VDD_P1
VDD_P2
M4
P8
VDD_P3
WDOG_EN
M16
U15
XT
AL48_IN
XT
AL48_OUT
U14
Y
AMN1
C12
TDO
TMODE
B17
C3
TMS
TRK_LO_ADJ
B11
C6
TRST_N
TX_AGC_ADJ
A12
VDD_A1
D5
D10
VDD_A2
VDD_A3
F4
F15
VDD_A4
VDD_A5
L14
VDD_C1
SBCK
A1
B1
SBDT
B2
SBST
A8
SLEEP_N
SLEEP_XT
AL_IN
T17
R17
SLEEP_XT
AL_OUT
SYNTH_LOCK
C10
D4
TCK
TCXO
A17
TDI
B4
A5
RD_N
N17
RESIN_N
RESOUT_N
P17
RFR_N
E17
J3
RFR_N2
RINGER
C14
R15
ROM_CS1_N
P4
ROM_CS2_N
RSVD1
A16
B16
RSVD2
A11
RX_AGC_ADJ
D6
C11
PA_ON2
PA_R0
A9
D7
PA_R1
C8
PDM1
PDM2
B9
Q_OFFSET
B10
B5
Q_OUT
Q_OUT_N
A6
P14
RAM_CS1_N
RAM_CS2_N
N4
R14
H14
MIC2P
MICBIAS
G17
G14
MICFBN
G15
MICFBP
MICINN
G16
MICINP
H17
J17
MICOUTN
MICOUTP
H16
U17
MODE0
R16
MODE1
PA_ON
G1
H2
KEYSENS4
LCD_CS_N
P12
LCD_EN
P13
LNA_GAIN
B12
LNA_RANGE0
C7
C9
LNA_RANGE1
LWR_N
P16
K17
MIC1N
J16
MIC1P
MIC2N
H15
G3
F1
HKADC5
HKADC6
G2
P15
HWR_N
B7
IDLE_N
A10
I_OFFSET
I_OUT
A7
B6
I_OUT_N
E3
KEYSENS0
KEYSENS1
D2
D1
KEYSENS2
KEYSENS3
P2
GPIO5
R3
GPIO6
N1
GPIO7
GPIO8
P3
N2
GPIO9
P6
GP_CS_N
HKADC0
E2
F3
HKADC1
HKADC2
E1
F2
HKADC3
HKADC4
GPIO33
GPIO34
E4
A3
GPIO35
GPIO36
C2
GPIO4
P1
T14
GPIO42
GPIO43
U16
T15
GPIO44
GPIO45
T16
T13
GPIO46
GPIO47
U13
GPIO22
GPIO23
K3
J1
GPIO24
GPIO25
K2
GPIO26
L3
GPIO27
A4
B8
GPIO28
GPIO29
A2
R1
GPIO3
B3
GPIO30
GPIO32
C1
D3
GPIO0
U1
GPIO1
T1
GPIO10
M1
N3
GPIO1
1
GPIO12
M2
L1
GPIO13
GPIO14
M3
L2
GPIO16
GPIO17
K1
GPIO2
R2
J2
P9
L4
GND12
GND2
P5
GND3
G4
GND4
C5
D1
1
GND5
GND6
K15
F14
GND7
GND8
H3
D8
GND9
F16
GND_RET
J4
D17
DP_TX_DA
T
A
H1
DP_TX_DA
T
A
2
M17
EAR10N
EAR10P
L16
K14
EAR20
FM_RX_IDATA
B15
B14
FM_RX_QDATA
A15
FM_RX_STB
D12
GND1
L15
GND10
GND11
R11
D2
D3
T10
U9
D4
D5
P10
R10
D6
D7
T9
U8
D8
D9
R9
DAC_IREF
C4
D16
DP_RX_DA
T
A
DP_RX_DA
T
A
2
C13
B13
C_RX_QDATA2
C_RX_QDATA3
A13
R12
D0
D1
U10
T8
D10
D11
U7
R8
D12
D13
T7
U6
D14
D15
P7
AUX_PCM_CLK
AUX_PCM_DIN
E16
D14
AUX_PCM_DOUT
F17
AUX_PCM_SYNC
CCOMP
E15
C15
CTS_N
CTS_N2
H4
A14
CX8_FM_CLK
C17
C_RX_IDATA2
C_RX_IDATA3
C16
C_RX_QDATA0
D13
C_RX_QDATA1
T12
A4
A5
U11
T11
A6
A7
P11
R7
A8
A9
T6
AUX0N
K16
AUX0P
L17
AUX1N
J15
AUX1P
J14
D15
R5
A15
U4
T3
A16
A17
R4
U3
A18
A19
U2
U12
A2
T2
A20
A21
N14
M14
A22
A3
R13
U609
MSM3100C
N16
A0
A1
N15
U5
A10
A11
R6
T5
A12
A13
T4
A14
ZD601
47PF
C102
R131
1.2K
C125
1NF
A2
3
4
GND
SCL
6
5 SDA
VCC
8
7
WP
3.0_MP
U106
1
A0
A1
2
47K
LWR1
R104
AD(5)
AD(3)
AD(1)
VIBRATOR
SPK-
AD(7)
VBATT
LNA_GAIN
DP_TX_DATA2
DP_RX_DATA2
VBATT
DP_TX_DATA2
DP_RX_DATA2
CX8
A(0)
RAM_CS2
RAM_CS1
A(21)
GP_CS
LCD_CS
LCD_EN
LWR
CD
RTS
CTS
V_F
VBATT
DTR
SPK+
AD(2)
A(2)
AD(6)
AD(4)
AD(0)
SPK+
EL_EN_A
RESET
LED_ON
ALT_LED_ON
3.0_MP
ON_SW
SVC_LED_ON
KEY3
VBATT
HALL_EFFECT_IC
MIC
MIC
DP_TX_DATA
DP_RX_DATA
HP_PWR
DGND
VBATT
LWR
A(21)
SLEEP
TCXO_ON_OFF
RESET
EL_EN_A
DTR
DSR
TX_AGC_ADJ
IREF
SPK-
A(0)
RAM_CS2
LWR
RAM_CS1
RAM_CS1
HALL_EFFECT_IC
C_F
V_F
VIBRATOR
AD(3)
AD(4)
AD(5)
AD(6)
AD(7)
AD(8)
AD(9)
AD(10)
AD(11)
AD(12)
AD(13)
AD(14)
AD(15)
AD(0:15)
HP_DET
MSM_INT
SDA
PLL_DATA
JACK_S
PLL_CLK
SEND_END
PS_HOLD
RINGER
RX_AGC_ADJ
PA_ON
DSR
SCL
SDA
LOCK
A(0:20)
AD(0)
A(1:18)
A(1)
A(2)
A(3)
A(4)
A(5)
A(6)
A(7)
A(8)
A(9)
A(10)
A(11)
A(12)
A(13)
A(14)
A(15)
A(16)
A(17)
A(18)
AD(1)
AD(2)
DP_RX_DATA
DP_TX_DATA
RI
CD
RTS
DSR
CTS
DTR
RI
ALT_LED_ON
SVC_LED_ON
SCL
PLL_EN
CD
RTS
CTS
SLEEP_CLK
Q_OFFSET
I_OFFSET
C_RX_QD(1)
C_RX_QD(2)
C_RX_QD(3)
C_RX_ID(1)
C_RX_ID(2)
C_RX_ID(3)
TRK_LO_ADJ
A(22)
LWR
RX_AUDIO
C_F
TX_AUDIO
DP_RX_DATA
DP_TX_DATA
RI
HP_PWR
A(12)
A(13)
A(14)
A(15)
A(16)
A(17)
A(18)
A(19)
TX_AUDIO
JACK_S
SEND_END
RX_AUDIO
SBCK
SBST
DP_TX_DATA
DP_RX_DATA
AD(14)
AD(15)
AD(0:15)
AD(1)
AD(2)
AD(3)
AD(4)
AD(5)
AD(6)
AD(7)
AD(8)
AD(9)
AD(10)
AD(11)
AD(12)
AD(13)
AD(14)
A(1)
A(2)
A(3)
A(4)
A(5)
A(6)
A(7)
A(8)
A(9)
A(10)
A(11)
A(4)
A(5)
A(6)
A(7)
A(8)
A(9)
A(10)
A(11)
A(12)
A(13)
A(14)
A(15)
A(16)
A(17)
A(18)
A(19)
A(20)
AD(0:15)
AD(0)
AD(1)
AD(2)
AD(3)
AD(4)
AD(5)
AD(6)
AD(7)
AD(8)
AD(9)
AD(10)
AD(11)
AD(12)
AD(13)
A(0)
A(20)
A(21)
A(22)
C_RX_QD(0)
AD(0)
AD(15)
C_RX_ID(0)
V_F_CON
GP_CS
TX_I
TX_IB
ON_SW_SENSE
LCD_CS
LCD_EN
LWR
PA_R0
TX_Q
TX_QB
RAM_CS2
RESET
SBDT
MSM_TCXO
A(1)
A(1:20)
A(2)
A(3)
4. RF Circuit Diagram
SCH-A302
Circuit description & Circuit Diagrams
SCH-A302
Circuit description & Circuit Diagrams
SAMSUNG Proprietary-Contents may change without notice
10-8
12
B
3
11
6
5
8
D
5
2
7
R&D CHK
7
QA CHK
8
2
REV
Drawn by
DOC CTRL CHK
Engineer
1
3
1
City
4
4
10
2
F
COMPANY NAME
SCH-302 (i)
A2
9
D
11
E
G
Date Changed
3
Address
Time Changed
6
10
E
Sheet
12
G
C
of
TITLE
Changed by
H
Drawing Number
C
A
F
9
Size
MFG ENGR CHK
A
H
B
LJC
LJC
4:55:22 pm
LJC
2001.09.18
0 6
C209
2.2UF
16V
C424
100PF
R643
51
L210
3.0_TX_RF
3.0_TX_RF
3.0_TX
3
R1C1 6
R2
1
4
VINR1
5
VON/OFF
R414
2.2K
U203
2 C1
C2
R426
NC
C229
100PF
3.0_TX
L211
1NF
3.0_SYN
100PF
C433
R413
20
C409
51
R647
100PF
L602
8.2nH
NC
C244
C653
10NF
C230
C210
180PF
180PF
C211
1NF
C250
C655
100PF
D202
C225
NC
R208
0
R216
100
1NF
C235
56PF
C234
R215
200K
10NF
C217
10V
1UF
C227
47PF
C238
4.7
R219
47PF
C237
C429
470PF
L201
0
R424
R404
0
LABEL
2
RFIN
RFOUT
5
VCC1
14
VCC2
VREF
3
3.0_TX_LO
G
6
8
G
G
9
G
10
11
G
G
12
7
U201
10NF
C208
L601
5.6nH
U610
22PF
C201
L406
1K
R207
10
5.6nH
0
R418
R406
4.7
R218
NC
C215
100PF
C239
3.0_TX_LO
100PF
C207
1NF
C656
L202
C23
1NF
0
R213
100PF
C231
D201
10NF
NC
C233
NC
C214
R201
C224
47PF
0
3.0_TX_IF
C204
C202
100NF
1K
R202
10PF
C427
C432
100PF
1NF
C407
C422
R214
10NF
220PF
1.8K
33nH
L209
C420
VDDA2
9
10
VDDA3
11
VDDA4
16
VDDA5
18
VDDA6
29
VDDD
20
VDDM
TXVCO_T1
30
31
TXVCO_T2
3
TX_I
4
TX_IB
TX_Q
1
2
TX_QB
8
VCONTROL
VDDA1
5
12
PCSB_OUT
PD_ISET
27
28
PD_OUT
RF_LO
19
24
SBCK
SBDT
23
22
SBST
TCXO
25
34
G
35
G
36
G
6
IF_BPF1
IF_BPF2
7
IREF
32
26
LOCK_DET
PA
_
O
N
17
PCSA_OUT
13
AB_SEL
21
CELLA_OUT
15
14
CELLB_OUT
33
G
C220
33UF
6.3V
RFT3100-32BCCPF-MT
U204
3.0_TX_RF
3.0_TX_IF
100PF
C413
C418
C408
100PF
10NF
10NF
C416
3.9NF
10nH
L206
C428
3.0_TX
3.0_TX
3.0_TX
3.0_TX
47PF
C216
0
R211
G
3
G
4
GG
6
IN
2
5
OUT
3.0_TCXO
R648
F201
1
NC
120
120
R645
R646
C240
15PF
C221
4PF
C218
56PF
100K
R205
10NF
C205
3.0_RX
5.1K
R415
10NF
C435
100PF
C438
10K
R206
U404
1
GND1
GND2
4
2
RF_IN
3
RF_OUT
R410
16
3.0_MP
L402
4.7NF
C203
2.2UF
C213
16V
C412
100PF
C437
100PF
56PF
C223
C654
10NF
100K
R204
270
R203
VINR1
VON/OFF
5
0
R411
U202
2
C1
3
C2
R1C1
6
R2 1
4
R222
0
1M
R427
100PF
C423
C426
100PF
100PF
C436
L403
VCC
VCC1
24
2
VP
VP1
22
17
_IF_IN
_RX_IN
6
GND5
GND6 13
16
GND7
GND8 19
21
GND9
IF_IN
18
5
RX_IN
8
TCXO_IN
23
DOIF
DO_RF
3
EN
15
FOLD
11
1
GND1
GND2
4
GND3 7
GND4
9
10
U402
12
CLK
14
D
ATA
20
R480
0
10NF
10NF
C219
C425
R649
NC
27NH
L204
1.2K
C243
NC
R221
C222
8PF
6.3V
33UF
C415
NC
C406
R210
12K,1%
C226
470PF
R209
4
COUP
2
G
G
5
1
IN
6
ISO
OUT
3
100PF
C411
F401
8.2nH
L405
10NF
C410
R420
10
56PF
C414
L205
27NH
L212
3
OUT
VC 1
VCC
4
OSC401
2
GND
R425
100PF
C431
7
VT
5
NC
OSC402
G1
2
G2
3 4
G3
G4
6 8
G5
1 OUT
VCC
L213
20V
220NF
C421
C419
10NF
3.0_SYN
100NF
C417
51
R220
TCXO
RFT_TCXO
TX_LO
RFT_TCXO
IFR_TCXO
NC
R212
TX_Q
TX_AGC_ADJ
RFT-IFR_TCXO
TX_QB
TX_IB
TX_I
SBST
SBDT
SBCK
TX_LO
PA_ON
LOCK
IREF
VBATT
TXOUTPUT
RX_LO
PA_R0
PA_ON
RX_IF_IN
RX_IF_DO
PLL_CLK
PLL_EN
PLL_DATA
TRK_LO_ADJ
5. RF Circuit Diagram
SAMSUNG Proprietary-Contents may change without notice
10-9
SCH-A302
Circuit description & Circuit Diagrams
Date Changed
Size
C
7
F
12
H
6
R&D CHK
COMPANY NAME
A
Engineer
11
QA CHK
1
Drawn by
of
8
Address
5
Drawing Number
E
5
3
MFG ENGR CHK
REV
F
City
E
Time Changed
G
6
12
TITLE
B
9
D
3
SCH-A302 (i)
A2
D
A
C
G
10
10
Sheet
2
11
4
9
DOC CTRL CHK
4
2
7
8
B
H
1
3
Changed by
3
LJC
2001.09.18
5:11:41 pm
LJC
LJC
0 6
C509
33UF
6.3V
C372
1NF
R543
22K
C338
10NF
R540
C392
100PF
3.0_MP
3.0_MP
100K
R31
1
33
6PF
C321
47nH
100NF
C534
4.7NF
C393
L324
47NF
C556
G
6
7
G
G
8
9
G
G
10
13
RX
3
TX
G
15
G
16
G
17
19
G
G
20
2
G
G
4
5
G
F302
18
ANT
G
1
11
G
G
12
14
G
2.7K
R502
10V
1UF
C533
G
IN
2
OUT
5
1K
R331
F303
G
1 3
G G
4 6
R312
27PF
1K
100PF
C519
C513
Q502
2
3
1
3.0_MC
2.2UF
C530
3.0_TX
C532
2.2UF
16V
16V
3.0_MP
2PF
C375
C504
10NF
10
R371
100NF
C508
R518
NC
3.0_MC
L322
3PF
C376
C371
VBATT
22PF
3.0_MP
L319
68nH
4.7UF
NC
R523
100K
C520
R632
3.0_MP
3.0_MP
3
1
2
100K
R631
NC
C319
D501
D350
1NF
C382
C395
4.7NF
C397
10UF
6.3V
33NF
C385
3.0_IF
3.0_RX
D302
47NF
C320
AU501
C396
0
R318
33NF
C349
R528
10M
0
R375
100PF
C337
VBATT
3.0_IF
Q505
1
2
5
6
G
3
4
10
9 IN-
5
OUT+
OUT- 4
G1
1
2
G2 G3
3
G4
6
7
G5 G6
8
IN+
0
R514
F301
10K
R515
100NF
C549
L327
8.2nH
C380
100PF
10UF
6.3V
C523
1UF
10V
3.0_RX
C389
3.0_IF
NC
L302
36
NC
C545
R511
C516
100K
10NF
CN301
1
1
2
2
3
3
R544
4.7K
R504
3.0_TX
C332
1NF
R501
2
1
C394
100NF
10NF
C340
C391
18PF
1NF
C566
L325
3.9nH
2
C388
100NF
Q508
1
3
180nH
L311
X501
2
3
4
1
C318
5PF
100NF
C531
3.0_MP
R541
100K
R542
4.7K
R534
R535
0
NC
R509
3.3K
10NF
C502
100PF
C529
C333
10UF
6.3V
NC
100NF
C378
L330
10K
3.0_IF
3.0_SYN
R636
3.0_RX
R521
470
R377
R330
0
C503
1K
C390
10NF
C398
18PF
3.0_RX
1NF
C339
4.7NF
100K
R539
C542
10NF
1NF
C342
C374
0
R524
3.0_MP
NC
150PF
C346
100PF
C526
3PF
C383
R374
1K
L323
220nH
R553
330
R315
C506
33UF
6.3V
0
10NF
22K
C334
C331
R507
1NF
0
R531
27PF
C514
R503
8.2K
2
3
1
C343
150PF
R537
10K
Q501
L307
270nH
C539
100PF
100NF
C341
L328
18nH
2
R316
10K
Q350
1
3
3.0_RX
100PF
C387
36
C652
1NF
C384
330PF
R510
NC
100PF
C540
C546
100NF
C517
3.0_MC
C344
L303
NC
4.7PF
1
3
2
R552
1K
0
Q511
R319
R529
R317
3.0_TCXO
910
L321
10K
C335
100PF
1
3
2
2.7nH
Q503
L320
100PF
C507
100NF
C527
4.7UF
D303
C510
NC
C505
C524
100NF
6.3V
10UF
C379
16V
4.7UF
C525
VDD6
20
24
VDD7
35
VDD8
VDDM
44
3.0_SYN
36
TCXO
37
TCXO/N
VCONTROL
7
VDD1
4
6
VDD2
14
VDD3
15
VDD4
VDD5
17
39
RXQD3
25
RXVCO_OUT
RXVCO_T1
21
22
RXVCO_T2
32
SBCK_SLEEP/
31
SBDT_FM/
SBI_EN
26
SBST_IDLE/
30
GND8
GND9
34
28
I_OFFSET
Q_OFFSET
27
46
RXID2
RXID3
45
RXQD0
42
41
RXQD1
RXQD2
40
GND1
43
GND10
GND2
5
GND3
8
13
GND4
GND5
16
18
GND6
GND7
19
23
DNC
10
FM_IF
FM_IF/
9
RM_RX_CLK
1
47
FM_RX_IDATA_RXID1
FM_RX_QDATA_RXID0
48
FM_RX_STB
2
29
FM_SLOT
3
U302
CDMA_IF
11
12
CDMA_IF/
38
CHIPX8
33
2
Q507
2
3
1
Q509
1
3
C515
1UF
C501
10NF
R538
NC
C522
100PF
C537
100NF
D351
6.3V
7PF
C370
C350
4.7UF
C568
1NF
1K
R508
3.0_MA
3.0_IF
82K
R629
5
RFIN
3
4
RFOUT
6
SEL
1
VREF/PD
U360
2
GND1 GND2
NC
R532
3.0_TCXO
L318
R378
R554
1.2K
R536
6.8K
NC
NC
L501
1K
L326
1.8NH
R506
R380
R519
NC
51
C323
5PF
C567
150PF
1
2
2
3
3
4
4
5
5
6
6
1NF
CN302
1
R512
36
C377
C535
100PF
C538
100NF
C663
1NF
NC
R630
18nH
L329
100PF
C373
L332
12nH
C536
1UF
10V
4
LOIN
1
RFIN
VD
3
L331
270nH
U361
BPC
5
GND
2
7
GND
IFIN 8
IFOUT
6
G5
H8
VREG_SYNT
G7
VREG_TCXO
A7
XTAL_BYP
A6
XTAL_IN
A5
XTAL_OUT
3.0_MA
A3
VDD6
C1
VIBRATOR_DRV
B3
H7
VREG_IF
D6
VREG_MSMA
VREG_MSMC
E8
VREG_MSMP
D8
VREG_RF_RX
H5
VREG_RF_TX
TCXO_OUT
F4
VBAT1
G4
VBAT2
H1
VCHARGER
D7
VDD1
G6
VDD2
VDD3
H6
VDD4
G8
VDD5
RINGER_DRV
RINGER_TONE
B1
SBCK
E3
E4
SBDT
H4
SBST
C6
SCI_IN
SLEEP_CLK
C5
C7
TCXO_IN
C8
A2
B2
LCD_DRV
MSM_INTERRUPT
B8
NC
B6
PON_RESET/
B7
PS_HOLD
A4
B4
REF_BYP
RESERVED
C4
A1
D3
D2
KHADC4
HKADC5
D1
HKADC6
C3
C2
HKADC7
ICHARGE
F3
ICHARGEOUT
G2
A8
KBDPWR_ON
KEYBD_DRV
GND1
GND2
D5
E5
GND3
GND4
E6
E7
GND5
GND6
F5
F6
GND7
GND8
F7
HKADC3
E2
CCNT1
H3
G3
CCNT2
CHARGER_SEL
F1
G1
CHG_FET/
B5
COIN_CELL
F8
EL_INTENSITY
GATE_LIMIT
F2
D4
U501
BAT2_FET/
E1
H2
BATVOLT
BAT1_FET/
10
0
R607
R376
10
R370
33K
R313
R372
1.2K
4.7NF
C345
10PF
C381
C386
100NF
R373
C528
100NF
RINGER
PS_HOLD
LNA_GAIN
RX_LO
VBATT
V_IN
MSM_TCXO
RFT-IFR_TCXO
IFR_TCXO
10
Q_OFFSET
I_OFFSET
LED_ON
KBDPWR_ON
HP_PWR
ON_SW_SENSE
PS_HOLD
ON_SW
TXOUTPUT
KBDPWR_ON
HP_DET
V_IN
EL_EN_A
RX_AGC_ADJ
RX_IF_DO
SBCK
SBST
V_F_CON
V_F
MSM_INT
RESET
SBDT
TCXO_ON_OFF
SLEEP_CLK
TCXO
C_RX_QD(0:3)
C_RX_QD(3)
C_RX_QD(2)
C_RX_QD(1)
C_RX_QD(0)
C_RX_ID(0:3)
C_RX_ID(3)
C_RX_ID(2)
C_RX_ID(1)
C_RX_ID(0)
RXIF
_RXIF
RXIF
_RXIF
CX8
SLEEP
SBCK
SBDT
SBST
RX_IF_IN
6. RF Circuit Diagram
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