Darlington Transistors
NPN Silicon
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
Collector–Emitter Voltage
V
CES
30
Vdc
Collector–Base Voltage
V
CBO
30
Vdc
Emitter–Base Voltage
V
EBO
10
Vdc
Collector Current — Continuous
I
C
500
mAdc
Total Device Dissipation @ T
A
= 25
°
C
Derate above 25
°
C
P
D
625
5.0
mW
mW/
°
C
Total Device Dissipation @ T
C
= 25
°
C
Derate above 25
°
C
P
D
1.5
12
Watts
mW/
°
C
Operating and Storage Junction
Temperature Range
T
J
, T
stg
–55 to +150
°
C
THERMAL CHARACTERISTICS
Characteristic
Symbol
Max
Unit
Thermal Resistance, Junction to Ambient
R
JA
200
°
C/W
Thermal Resistance, Junction to Case
R
JC
83.3
°
C/W
ELECTRICAL CHARACTERISTICS
(T
A
= 25
°
C unless otherwise noted)
Characteristic
Symbol
Min
Max
Unit
OFF CHARACTERISTICS
Collector–Emitter Breakdown Voltage
(I
C
= 100
µ
Adc, I
B
= 0)
V
(BR)CES
30
—
Vdc
Collector Cutoff Current
(V
CB
= 30 Vdc, I
E
= 0)
I
CBO
—
100
nAdc
Emitter Cutoff Current
(V
EB
= 10 Vdc, I
C
= 0)
I
EBO
—
100
nAdc
Preferred devices are ON Semiconductor recommended choices for future use and best overall value.
Semiconductor Components Industries, LLC, 2001
March, 2001 – Rev. 1
1
Publication Order Number:
MPSA13/D
MPSA13
MPSA14
*ON Semiconductor Preferred Device
CASE 29–04, STYLE 1
TO–92 (TO–226AA)
*
1
2
3
COLLECTOR 3
BASE
2
EMITTER 1
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2
ELECTRICAL CHARACTERISTICS
(T
A
= 25
°
C unless otherwise noted) (Continued)
Characteristic
Symbol
Min
Max
Unit
ON CHARACTERISTICS
(1)
DC Current Gain
(I
C
= 10 mAdc, V
CE
= 5.0 Vdc)
MPSA13
MPSA14
(I
C
= 100 mAdc, V
CE
= 5.0 Vdc)
MPSA13
MPSA14
h
FE
5,000
10,000
10,000
20,000
—
—
—
—
—
Collector–Emitter Saturation Voltage
(I
C
= 100 mAdc, I
B
= 0.1 mAdc)
V
CE(sat)
—
1.5
Vdc
Base–Emitter On Voltage
(I
C
= 100 mAdc, V
CE
= 5.0 Vdc)
V
BE(on)
—
2.0
Vdc
SMALL–SIGNAL CHARACTERISTICS
Current–Gain – Bandwidth Product
(2)
(I
C
= 10 mAdc, V
CE
= 5.0 Vdc, f = 100 MHz)
f
T
125
—
MHz
1. Pulse Test: Pulse Width
300
s; Duty Cycle
2.0%.
2. f
T
= |h
fe
|
f
test
.
R
S
i
n
e
n
IDEAL
TRANSISTOR
Figure 1. Transistor Noise Model
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3
NOISE CHARACTERISTICS
(V
CE
= 5.0 Vdc, T
A
= 25
°
C)
Figure 2. Noise Voltage
f, FREQUENCY (Hz)
50
100
200
500
20
Figure 3. Noise Current
f, FREQUENCY (Hz)
Figure 4. Total Wideband Noise Voltage
R
S
, SOURCE RESISTANCE (k
Ω
)
Figure 5. Wideband Noise Figure
R
S
, SOURCE RESISTANCE (k
Ω
)
5.0
50
70
100
200
30
10
20
1.0
10
10
20
50 100 200 500 1k 2k
5k 10k 20k 50k 100k
2.0
1.0
0.7
0.5
0.3
0.2
0.1
0.07
0.05
0.03
0.02
BANDWIDTH = 1.0 Hz
R
S
≈
0
I
C
= 1.0 mA
100
µ
A
10
µ
A
BANDWIDTH = 1.0 Hz
I
C
= 1.0 mA
100
µ
A
10
µ
A
e n
, NOISE VOL
TAGE (nV)
i n
, NOISE CURRENT
(pA)
2.0
5.0
10
20
50
100 200
500
1000
BANDWIDTH = 10 Hz TO 15.7 kHz
I
C
= 10
µ
A
100
µ
A
1.0 mA
8.0
10
12
14
6.0
0
4.0
1.0
2.0
5.0
10
20
50 100
200
500 1000
2.0
BANDWIDTH = 10 Hz TO 15.7 kHz
10
µ
A
100
µ
A
I
C
= 1.0 mA
V T
, T
OT
AL
WIDEBAND NOISE VOL
TAGE (nV)
NF
, NOISE FIGURE (dB)
10 20
50 100 200 500 1k 2k
5k 10k 20k 50k 100k
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4
SMALL–SIGNAL CHARACTERISTICS
Figure 6. Capacitance
V
R
, REVERSE VOLTAGE (VOLTS)
5.0
7.0
10
20
3.0
Figure 7. High Frequency Current Gain
I
C
, COLLECTOR CURRENT (mA)
Figure 8. DC Current Gain
I
C
, COLLECTOR CURRENT (mA)
Figure 9. Collector Saturation Region
I
B
, BASE CURRENT (
µ
A)
2.0
200k
5.0
0.04
4.0
2.0
1.0
0.8
0.6
0.4
0.2
T
J
= 25
°
C
C, CAP
ACIT
ANCE (pF)
1.5
2.0
2.5
3.0
1.0
0.5
|h
fe
|, SMALL-SIGNAL
CURRENT
GAIN
h FE
, DC CURRENT
GAIN
V CE
, COLLECT
OR-EMITTER VOL
TAGE (VOL
TS)
0.1
0.2
0.4
1.0 2.0
4.0
10
20
40
C
ibo
C
obo
0.5
1.0
2.0
0.5
10
20
50
100 200
500
V
CE
= 5.0 V
f = 100 MHz
T
J
= 25
°
C
100k
70k
50k
30k
20k
10k
7.0k
5.0k
3.0k
2.0k
7.0 10
20
30
50 70 100
200 300
500
T
J
= 125
°
C
25
°
C
-55
°
C
V
CE
= 5.0 V
0.1 0.2 0.5 1.0 2.0
5.0 10 20 50 100 200 500 1000
T
J
= 25
°
C
I
C
= 10 mA 50 mA
250 mA 500 mA
Figure 10. “On” Voltages
I
C
, COLLECTOR CURRENT (mA)
Figure 11. Temperature Coefficients
I
C
, COLLECTOR CURRENT (mA)
1.6
5.0
-1.0
V,
VOL
TAGE (VOL
TS)
1.4
1.2
1.0
0.8
0.6
7.0
10
20 30
50 70 100 200 300
500
V
BE(sat)
@ I
C
/I
B
= 1000
R
V,
TEMPERA
TURE COEFFICIENTS (mV/
C)
°
θ
T
J
= 25
°
C
V
BE(on)
@ V
CE
= 5.0 V
V
CE(sat)
@ I
C
/I
B
= 1000
-2.0
-3.0
-4.0
-5.0
-6.0
5.0 7.0 10
20 30
50 70 100
200 300
500
25
°
C TO 125
°
C
-55
°
C TO 25
°
C
*R
VC
FOR V
CE(sat)
VB
FOR V
BE
25
°
C TO 125
°
C
-55
°
C TO 25
°
C
*APPLIES FOR I
C
/I
B
≤
h
FE
/3.0
MPSA13 MPSA14
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5
Figure 12. Thermal Response
t, TIME (ms)
1.0
r(t), TRANSIENT
THERMAL
2.0
5.0
1.0
0.5
0.2
0.1
RESIST
ANCE (NORMALIZED)
0.7
0.5
0.3
0.2
0.1
0.07
0.05
0.03
0.02
0.01
20
50
10
200
500
100
1.0k
2.0k
5.0k 10k
Figure 13. Active Region Safe Operating Area
V
CE
, COLLECTOR-EMITTER VOLTAGE (VOLTS)
1.0k
0.4
700
500
300
200
100
70
50
30
20
10
0.6
1.0
2.0
4.0 6.0
10
20
40
I C
, COLLECT
OR CURRENT
(mA)
T
A
= 25
°
C
D = 0.5
0.2
0.1
0.05
SINGLE PULSE
SINGLE PULSE
CURRENT LIMIT
THERMAL LIMIT
SECOND BREAKDOWN LIMIT
Z
θ
JC(t)
= r(t)
•
R
θ
JC
T
J(pk)
- T
C
= P
(pk)
Z
θ
JC(t)
Z
θ
JA(t)
= r(t)
•
R
θ
JA
T
J(pk)
- T
A
= P
(pk)
Z
θ
JA(t)
1.0 ms
100
µ
s
T
C
= 25
°
C
1.0 s
Design Note: Use of Transient Thermal Resistance Data
FIGURE A
t
P
P
P
P
P
t
1
1/f
DUTYCYCLE t1f
t1
tP
PEAK PULSE POWER = P
P
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6
PACKAGE DIMENSIONS
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. CONTOUR OF PACKAGE BEYOND DIMENSION R
IS UNCONTROLLED.
4. DIMENSION F APPLIES BETWEEN P AND L.
DIMENSION D AND J APPLY BETWEEN L AND K
MINIMUM. LEAD DIMENSION IS UNCONTROLLED
IN P AND BEYOND DIMENSION K MINIMUM.
R
A
P
J
L
F
B
K
G
H
SECTION X–X
C
V
D
N
N
X X
SEATING
PLANE
DIM
MIN
MAX
MIN
MAX
MILLIMETERS
INCHES
A
0.175
0.205
4.45
5.20
B
0.170
0.210
4.32
5.33
C
0.125
0.165
3.18
4.19
D
0.016
0.022
0.41
0.55
F
0.016
0.019
0.41
0.48
G
0.045
0.055
1.15
1.39
H
0.095
0.105
2.42
2.66
J
0.015
0.020
0.39
0.50
K
0.500
---
12.70
---
L
0.250
---
6.35
---
N
0.080
0.105
2.04
2.66
P
---
0.100
---
2.54
R
0.115
---
2.93
---
V
0.135
---
3.43
---
1
STYLE 1:
PIN 1. EMITTER
2. BASE
3. COLLECTOR
CASE 029–04
(TO–226AA)
ISSUE AD
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7
Notes
MPSA13 MPSA14
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8
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