IC26_CHAPTER_1_2000_2.copy Page 1 Tuesday, May 23, 2000 1:01 PM
CHAPTER 1
OVERVIEW OF IC PACKAGES
page
Package overview 1 - 2
Through-hole mount packages 1 - 4
Surface mount packages 1 - 5
Package type overview with lead count 1 - 6
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Philips Semiconductors
Overview of IC packages Chapter 1
PACKAGE OVERVIEW
The development of the IC package is a dynamic technology. Applications that were unattainable only a few years ago
are today common place thanks in part to advances in package design. From mobile telecommunications and satellite
broadcasting to aerospace and automotive applications, each imposes its own individual demands on the electronic
package.
To meet such a diverse range of application requirements, our IC package range encompasses over thirty different types,
most of which are sub-divided into a number of outline versions. An overview of this range is shown in Fig.1, with
packages classified into board mounting methods, construction form and power handling capability. The packages in
these  power categories offer a high thermal dissipation enabling IC usage in some of the most demanding application
areas.
Notable extensions to our range since the last publication of this book include the Ball Gate Array (BGA) packages with
their high pin count, and the miniature LFBGA packages.
A photograph of each package type is given on pages 1 - 4 and 1 - 5, and a package overview with lead count is
presented in the tables on pages 1 - 6 to 1 - 8.
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Philips Semiconductors
Overview of IC packages Chapter 1
gewidth
POWER HCPGA
CERAMIC CDIL
CPGA
THROUGH HOLE
PACKAGES DIP
SDIP
PLASTIC SIL
DBS
POWER HDIP
RBS
RDBS
SIL
TBS
CERAMIC CLLCC
CWQCCN
IC SURFACE MOUNT
PMFP
PACKAGES PACKAGES
SO
SSOP
PLASTIC DUAL TSSOP
VSO
POWER HSOP
HTSSOP
BCC
LQFP
PLCC
QFP
QUAD
SQFP
TQFP
VQFN
POWER HBCC
HLQFP
HQFP
HSQFP
HTQFP
BGA
ARRAY
LFBGA
TFBGA
VFBGA
POWER HBGA
METAL MSQFP
CONTACTLESS
PLASTIC PLLMC
PACKAGES
MLC751
Fig.1 Package classification.
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Philips Semiconductors
Overview of IC packages Chapter 1
TROUGH-HOLE MOUNT PACKAGES
CDIL CPGA
DIP SDIP
HDIP
SIL.MPF DBS.MPF SIL.MP RBS.MPF
SIL.P DBS.P DBS.P
Exposed die pad
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Philips Semiconductors
Overview of IC packages Chapter 1
SURFACE MOUNT PACKAGES
CLLCC CWQCCN
SO VSO SSOP HTSSOP HSOP PMFP
TSSOP
LQFP
QFP SQFP HLQFP
HTQFP
TQFP
PLCC BGA HBGA
LFBGA BCC VQFN
TFBGA
VFBGA
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PACKAGE TYPE OVERVIEW WITH LEAD COUNT
Surface mount packages (part 1 of 2)
NUMBER OF LEADS
PACKAGE
NAME
4 8 9 10 13 14 16 20 24 28 30 32 38 40 44 48 52 56 64 68 80 81 84 96 100 114 120 128 132 144 156 160
BGA X
HBCC X X X X
HBGA
HLQFP XX
HQFP X
HSOP X X
HSQFP
HTQFP X X X X X
HTSSOP X X
LFBGA X X X X X X
LQFP X X X X X X X X X
MSQFP
PLCC X X X X X X
PMFP X
QFP X X X X X X X X X
SMS.P X X
SO X X X X X X X X
SOJ X
SQFP X
SSOP X X X X X X X
TFBGA X X X X X X X
TQFP X X X X X
TSSOP X X X X X X X X X X X X
VSO X X
VFBGA X
VQFN X X
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Overview of IC packages
1 - 6
Chapter 1
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Surface mount packages (part 2 of 2)
NUMBER OF LEADS
PACKAGE
NAME
176 180 208 240 256 272 280 292 304 316 324 329 352 388 420 456 492 504 516 553 596 600 656 776 1140 1160 1312
BGA X X X X X X X X X X X X X X X X
HBCC
HBGA X X X X X X X X X X
HLQFP
HQFP
HSOP
HSQFP X X
HTQFP
HTSSOP
LFBGA X
LQFP X X
MSQFP X
PLCC
PMFP
QFP
SMS.P
SO
SOJ
SQFP X X X
SSOP
TFBGA X X X
TQFP
TSSOP
VSO
VFBGA
VQFN
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Overview of IC packages
1 - 7
Chapter 1
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Trough-hole mount packages
NUMBER OF LEADS
PACKAGE
NAME
3 7 8 9 13 14 16 17 18 20 22 23 24 27 28 32 40 42 48 52 56 64
DBS.MP X
DBS.MPF X
DBS.P X X X X X X
DIP X X X X X X X X X X X X
HDIP X
RBS.MPF X
RDBS.P X X
SDIP X X X X X X
SIL.MP X
SIL.MPF X
SIL.P X X
TBS.P X
TO-92 X
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Philips Semiconductors
Overview of IC packages
1 - 8
Chapter 1