BYV29 series 300 500

background image

Philips Semiconductors

Product specification

Rectifier diodes

BYV29 series

ultrafast

FEATURES

SYMBOL

QUICK REFERENCE DATA

• Low forward volt drop

V

R

= 300 V/ 400 V/ 500 V

• Fast switching
• Soft recovery characteristic

V

F

1.03 V

• High thermal cycling performance
• Low thermal resistance

I

F(AV)

= 9 A

t

rr

60 ns

GENERAL DESCRIPTION

PINNING

SOD59 (TO220AC)

Ultra-fast, epitaxial rectifier diodes

PIN

DESCRIPTION

intended for use as output rectifiers
in high frequency switched mode

1

cathode

power supplies.

2

anode

The BYV29 series is supplied in the
conventional

leaded

SOD59

tab

cathode

(TO220AC) package.

LIMITING VALUES

Limiting values in accordance with the Absolute Maximum System (IEC 134).

SYMBOL

PARAMETER

CONDITIONS

MIN.

MAX.

UNIT

BYV29

-300

-400

-500

V

RRM

Peak repetitive reverse voltage

-

300

400

500

V

V

RWM

Crest working reverse voltage

-

300

400

500

V

V

R

Continuous reverse voltage

-

300

400

500

V

I

F(AV)

Average forward current

1

square wave;

δ

= 0.5;

-

9

A

T

mb

123 ˚C

I

FRM

Repetitive peak forward current t = 25

µ

s;

δ

= 0.5;

-

18

A

T

mb

123 ˚C

I

FSM

Non-repetitive peak forward

t = 10 ms

-

100

A

current.

t = 8.3 ms

-

110

A

sinusoidal; with reapplied
V

RRM(max)

T

stg

Storage temperature

-40

150

˚C

T

j

Operating junction temperature

-

150

˚C

THERMAL RESISTANCES

SYMBOL

PARAMETER

CONDITIONS

MIN.

TYP.

MAX.

UNIT

R

th j-mb

Thermal resistance junction to

-

-

2.5

K/W

mounting base

R

th j-a

Thermal resistance junction to

in free air.

-

60

-

K/W

ambient

k

a

1

2

1

tab

2

1 Neglecting switching and reverse current losses.

September 1998

1

Rev 1.300

background image

Philips Semiconductors

Product specification

Rectifier diodes

BYV29 series

ultrafast

ELECTRICAL CHARACTERISTICS

T

j

= 25 ˚C unless otherwise stated

SYMBOL

PARAMETER

CONDITIONS

MIN.

TYP.

MAX.

UNIT

V

F

Forward voltage

I

F

= 8 A; T

j

= 150˚C

-

0.90

1.03

V

I

F

= 8 A

-

1.05

1.25

V

I

F

= 20 A

-

1.20

1.40

V

I

R

Reverse current

V

R

= V

RRM

-

2.0

50

µ

A

V

R

= V

RRM

; T

j

= 100 ˚C

-

0.1

0.35

mA

Q

s

Reverse recovery charge

I

F

= 2 A to V

R

30 V;

-

40

60

nC

dI

F

/dt = 20 A/

µ

s

t

rr

Reverse recovery time

I

F

= 1 A to V

R

30 V;

-

50

60

ns

dI

F

/dt = 100 A/

µ

s

I

rrm

Peak reverse recovery current

I

F

= 10 A to V

R

30 V;

-

4.0

5.5

A

dI

F

/dt = 50 A/

µ

s; T

j

= 100˚C

V

fr

Forward recovery voltage

I

F

= 10 A; dI

F

/dt = 10 A/

µ

s

-

2.5

-

V

Fig.1. Definition of t

rr

, Q

s

and I

rrm

Fig.2. Definition of V

fr

Fig.3. Maximum forward dissipation P

F

= f(I

F(AV)

);

square wave where I

F(AV)

=I

F(RMS)

x

D.

Fig.4. Maximum forward dissipation P

F

= f(I

F(AV)

);

sinusoidal current waveform where a = form

factor = I

F(RMS)

/ I

F(AV)

.

Q

s

100%

10%

time

dI

dt

F

I

R

I

F

I

rrm

t

rr

0

5

10

15

0

5

10

15

0.5

0.2

0.1

BYV29

IF(AV) / A

PF / W

D = 1.0

Rs = 0.0190 Ohms

Vo = 0.8900 V

D =

t

p

t

p

T

T

t

I

Tmb(max) / C

150

137.5

125

112.5

time

time

V F

V

fr

V F

I

F

0

2

4

6

8

10

0

2

4

6

8

10

12

a = 1.57

1.9

2.2

2.8

4

BYV29

Rs = 0.019 Ohms

Vo = 0.89V

IF(AV) / A

PF / W

Tmb(max) / C

150

145

140

135

130

125

120

September 1998

2

Rev 1.300

background image

Philips Semiconductors

Product specification

Rectifier diodes

BYV29 series

ultrafast

Fig.5. Maximum t

rr

at T

j

= 25˚C and 100˚C

Fig.6. Maximum I

rrm

at T

j

= 25˚C and 100˚C.

Fig.7. Typical and maximum forward characteristic

I

F

= f(V

F

); parameter T

j

Fig.8. Maximum Q

s

at T

j

= 25˚C

Fig.9. Transient thermal impedance Z

th j-mb

= f(t

p

)

1

10

trr / ns

1

10

100

1000

100

dIF/dt (A/us)

1A

IF=10 A

Tj = 25 C
Tj = 100C

0

1

2

30

20

10

0

typ

max

IF / A

0.5

1.5

VF / V

Tj=150 C

Tj=25 C

BYW29

10

1

0.1

0.01

Irrm / A

1

10

100

-dIF/dt (A/us)

IF=1A

IF=10A

Tj = 25 C
Tj = 100C

1

10

100

1000

Qs / nC

1.0

10

100

-dIF/dt (A/us)

IF = 10 A

2 A

1us

10us

100us

1ms

10ms

100ms

1s

10s

0.001

0.01

0.1

1

10

BYV29

pulse width, tp (s)

Transient thermal impedance, Zth j-mb (K/W)

D =

t

p

t

p

T

T

P

t

D

September 1998

3

Rev 1.300

background image

Philips Semiconductors

Product specification

Rectifier diodes

BYV29 series

ultrafast

MECHANICAL DATA

Dimensions in mm

Net Mass: 2 g

Fig.10. SOD59 (TO220AC). pin 1 connected to mounting base.

Notes
1. Refer to mounting instructions for TO220 envelopes.
2. Epoxy meets UL94 V0 at 1/8".

10,3
max

3,7

2,8

3,0

3,0 max

not tinned

1,3

max

(2x)

2,4

0,6

4,5

max

5,9

min

15,8

max

1,3

0,9 max (2x)

13,5

min

5,08

1

2

September 1998

4

Rev 1.300

background image

Philips Semiconductors

Product specification

Rectifier diodes

BYV29 series

ultrafast

DEFINITIONS

Data sheet status

Objective specification

This data sheet contains target or goal specifications for product development.

Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.

Product specification

This data sheet contains final product specifications.

Limiting values

Limiting values are given in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one
or more of the limiting values may cause permanent damage to the device. These are stress ratings only and
operation of the device at these or at any other conditions above those given in the Characteristics sections of
this specification is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the specification.

Philips Electronics N.V. 1998

All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the
copyright owner.

The information presented in this document does not form part of any quotation or contract, it is believed to be
accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any
consequence of its use. Publication thereof does not convey nor imply any license under patent or other
industrial or intellectual property rights.

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices or systems where malfunction of these
products can be reasonably expected to result in personal injury. Philips customers using or selling these products
for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting
from such improper use or sale.

September 1998

5

Rev 1.300


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