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Intersema's Technology
presentation




 

The pressure sensor is an assembly of
a micromachined silicon part and pyrex™ glas. Four polysilicon
Piezo Resistances have been implemented, on top of silicon,
just above the sensor's membrane. The membrane is only a few
micrometers thick and deflects depending on the pressure
difference existing between its two sides.For
differential sensors, the pyrex™ is drilled with a hole
below the membrane (see picture left) so that pressure can be
applied on both sides. For absolute sensors, the pyrex™
has no hole and vacuum is created in the cavity underneath the
sensor when the pyrex™ is sealed with the silicon. This step
is called "Anodic bonding".




Most Important Manufacturing steps 


Electrical
Wafer Sort (EWS)
 

SP4 process

Sensor design optimized for high output
signal
1-12 bar sensors absolute and gauge
8 Mask levels
Implanted Piezo Resistors
Low offset drift
Wafer are 100% electrically tested (see
picture on the left)

 



Micromachining process

Anisotropic KOH etching of silicon for
membrane forming
Thickness control with eletrochemical
etch-stop
Anodic bonding of pyrex™ glas to silicon
Double sided wafer alignment
Reliable hermetic connection
Wafer dicing on blue tape
Two sides optical inspection
 
KOH
etching

 


Die
attach
 

Thick Film Hybrid Assembly

Screenprinting
Die attach
Pick & Place

 



Thick Film Hybrid Assembly (continued)

Wire bonding (gold and aluminium)
Reflow soldering for SMD components
Chip coating (globtop)
Low stress humidity protection
Flux free leadframe soldering
Laser trimming of thick film resistors
Laser marking
 
Wire
bonding

 


Electrical
trimming in pressure chamber
 

Test & Calibration

Automated sensor testing with temperature and
pressure from -40°C to +125°C
Passive and active laser trimming
Electrical (on-chip) trimming
High throughput pressure/temperature chamber
Sensor characterization before mounting
Pressure calibrators
Printable version
 










 


 



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