STB45NF0 N CHANNEL 60V 38A


STB45NF06
N-CHANNEL 60V - 0.022&! - 38A D2PAK
STripFET"! POWER MOSFET
PRELIMINARY DATA
TYPE VDSS RDS(on) ID
STB45NF06 60V <0.028&! 38A
TYPICAL RDS(on) = 0.022&!
EXCEPTIONAL dv/dt CAPABILITY
3
DESCRIPTION
1
This Power Mosfet is the latest development of
D2PAK
STMicroelectronics unique  Single Feature
Size"! strip-based process. The resulting tran-
sistor shows extremely high packing density for
low on-resistance, rugged avalance characteris-
tics and less critical alignment steps therefore a re-
markable manufacturing reproducibility.
INTERNAL SCHEMATIC DIAGRAM
APPLICATIONS
HIGH-EFFICIENCY DC-DC CONVERTERS
SOLENOID AND RELAY DRIVERS
MOTOR CONTROL, AUDIO AMPLIFIERS
DC-DC & DC-AC CONVERTERS
ABSOLUTE MAXIMUM RATINGS
Symbol Parameter Value Unit
VDS Drain-source Voltage (VGS = 0) 60 V
VDGR Drain-gate Voltage (RGS = 20 k&!) 60 V
VGS Gate- source Voltage Ä…20 V
ID Drain Current (continuos) at TC = 25°C 38 A
ID Drain Current (continuos) at TC = 100°C 26 A
IDM ( ) Drain Current (pulsed) 152 A
PTOT Total Dissipation at TC = 25°C 80 W
Derating Factor 0.53 W/°C
dv/dt (1) Peak Diode Recovery voltage slope 7 V/ns
Tstg Storage Temperature  65 to 175 °C
Tj Max. Operating Junction Temperature 175 °C
( ) Pulse width limited by safe operating area
(1) ISD d"38A, di/dt d"300A/µs, VDD d" V(BR)DSS, Tj d" TJMAX.
Aug 2000 1/6
This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to change without notice.
STB45NF06
THERMAL DATA
Rthj-case Thermal Resistance Junction-case Max 1.87 °C/W
Rthj-amb Thermal Resistance Junction-ambient Max 62.5 °C/W
Tl Maximum Lead Temperature For Soldering Purpose 300 °C
AVALANCHE CHARACTERISTICS
Symbol Parameter Max Value Unit
IAR Avalanche Current, Repetitive or Not-Repetitive 38 A
(pulse width limited by Tj max)
EAS Single Pulse Avalanche Energy 135 mJ
(starting Tj = 25 °C, ID = IAR, VDD = 50 V)
ELECTRICAL CHARACTERISTICS (TCASE = 25 °C UNLESS OTHERWISE SPECIFIED)
OFF
Symbol Parameter Test Conditions Min. Typ. Max. Unit
V(BR)DSS Drain-source ID = 250 µA, VGS = 0 60 V
Breakdown Voltage
VDS = Max Rating 1 µA
IDSS Zero Gate Voltage
Drain Current (VGS = 0)
VDS = Max Rating, TC = 125 °C 10 µA
IGSS Gate-body Leakage VGS = Ä…20V Ä…100 nA
Current (VDS = 0)
ON (1)
Symbol Parameter Test Conditions Min. Typ. Max. Unit
VGS(th) Gate Threshold Voltage VDS = VGS, ID = 250µA 2 3 4 V
RDS(on) Static Drain-source On VGS = 10 V, ID = 19 A 0.022 0.028 &!
Resistance
VDS > ID(on) x RDS(on)max,
ID(on) On State Drain Current 45 A
VGS =10V
DYNAMIC
Symbol Parameter Test Conditions Min. Typ. Max. Unit
VDS > ID(on) x RDS(on)max,
gfs (1) Forward Transconductance 24 S
ID =19 A
Ciss Input Capacitance VDS = 25V, f = 1 MHz, VGS = 0 1730 pF
Coss Output Capacitance 215 pF
Crss Reverse Transfer 63 pF
Capacitance
2/6
STB45NF06
ELECTRICAL CHARACTERISTICS (CONTINUED)
SWITCHING ON
Symbol Parameter Test Conditions Min. Typ. Max. Unit
td(on) Turn-on Delay Time VDD = 30V, ID = 19A 20 ns
RG = 4.7&! VGS = 10V
tr Rise Time 100 ns
(see test circuit, Figure 3)
VDD = 48V, ID = 38A,
Qg Total Gate Charge 43 58 nC
VGS = 10V
Qgs Gate-Source Charge 9 nC
Qgd Gate-Drain Charge 15 nC
SWITCHING OFF
Symbol Parameter Test Conditions Min. Typ. Max. Unit
VDD = 30V, ID = 19A,
td(off) Turn-off-Delay Time RG =4.7&!, VGS = 10V 50 ns
(see test circuit, Figure 3)
tf Fall Time 20 ns
Vclamp =48V, ID =38A
td(off) Off-voltage Rise Time 45 ns
RG =4.7&!, VGS = 10V
tf Fall Time (see test circuit, Figure 5) 42 ns
tc Cross-over Time 60 ns
SOURCE DRAIN DIODE
Symbol Parameter Test Conditions Min. Typ. Max. Unit
ISD Source-drain Current 38 A
ISDM (1) Source-drain Current (pulsed) 152 A
VSD (2) Forward On Voltage ISD = 38A, VGS = 0 1.5 V
ISD = 38A, di/dt = 100A/µs,
trr Reverse Recovery Time VDD = 100V, Tj = 150°C 95 ns
(see test circuit, Figure 5)
Qrr Reverse Recovery Charge 260 nC
IRRM Reverse Recovery Current 5.5 A
Note: 1. Pulsed: Pulse duration = 300 µs, duty cycle 1.5 %.
2. Pulse width limited by safe operating area.
3/6
STB45NF06
Fig. 1: Unclamped Inductive Load Test Circuit Fig. 2: Unclamped Inductive Waveform
Fig. 3: Switching Times Test Circuit For Fig. 4: Gate Charge test Circuit
Resistive Load
Fig. 5: Test Circuit For Inductive Load Switching
And Diode Recovery Times
4/6
STB45NF06
TO-263 (D2PAK) MECHANICAL DATA
mm inch
DIM.
MIN. TYP. MAX. MIN. TYP. MAX.
A 4.4 4.6 0.173 0.181
A1 2.49 2.69 0.098 0.106
B 0.7 0.93 0.027 0.036
B2 1.14 1.7 0.044 0.067
C 0.45 0.6 0.017 0.023
C2 1.21 1.36 0.047 0.053
D 8.95 9.35 0.352 0.368
E 10 10.4 0.393 0.409
G 4.88 5.28 0.192 0.208
L 15 15.85 0.590 0.624
L2 1.27 1.4 0.050 0.055
L3 1.4 1.75 0.055 0.068
D
A
C
C2 DETAIL "A"
DETAIL "A"
A1
B2 B
E G
L3
L2
L
P011P6/E
5/6
A2
STB45NF06
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences
of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is
granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specification mentioned in this publication are
subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products
are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.
The ST logo is a trademark of STMicroelectronics
© 2000 STMicroelectronics  Printed in Italy  All Rights Reserved
STMicroelectronics GROUP OF COMPANIES
Australia - Brazil - China - Finland - France - Germany - Hong Kong - India - Italy - Japan - Malaysia - Malta - Morocco -
Singapore - Spain - Sweden - Switzerland - United Kingdom - U.S.A.
http://www.st.com
6/6
This datasheet has been download from:
www.datasheetcatalog.com
Datasheets for electronics components.


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