INTEGRATED CIRCUITS
DATA SHEET
TDA1519C
22 W BTL or 2 × 11 W stereo power
amplifier
1998 Oct 16
Product specification
File under Integrated Circuits, IC01
Philips Semiconductors Product specification
22 W BTL or 2 × 11 W stereo power
TDA1519C
amplifier
FEATURES GENERAL DESCRIPTION
" Requires very few external components for Bridge-Tied The TDA1519C is an integrated class-B dual output
Load (BTL) amplifier in a 9-lead plastic single in-line (SIL) power or
20-lead heatsink small outline package.
" Stereo or BTL application
" High output power
" Low offset voltage at output (important for BTL)
" Fixed gain
" Good ripple rejection
" Mute/standby switch
" Load dump protection
" AC and DC short-circuit-safe to ground and VP
" Thermally protected
" Reverse polarity safe
" Capability to handle high energy on outputs (VP =0V)
" No switch-on/switch-off plop
" Protected against electrostatic discharge
" Low thermal resistance
" Identical inputs (inverting and non-inverting)
" Pin compatible with TDA1519B (TDA1519C and
TDA1519CSP).
ORDERING INFORMATION
PACKAGE
TYPE NUMBER
NAME DESCRIPTION VERSION
TDA1519C SIL9P plastic single in-line power package; 9 leads SOT131-2
TDA1519CSP SMS9P plastic surface mounted single in-line power package; 9 leads SOT354-1
TDA1519CTH HSOP20 heatsink small outline package; 20 leads; low stand-off SOT418-2
1998 Oct 16 2
Philips Semiconductors Product specification
22 W BTL or 2 × 11 W stereo power
TDA1519C
amplifier
QUICK REFERENCE DATA
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Supplies
VP supply voltage operating 6.0 14.4 17.5 V
non-operating - - 30 V
load dump protected - - 45 V
IORM repetitive peak output current - - 4 A
Iq(tot) total quiescent current - 40 80 mA
Istb standby current - 0.1 100 µA
Isw(on) switch-on current - - 40 µA
Inputs
ôÅ‚ZiôÅ‚ input impedance BTL 25 - - k&!
stereo 50 - - k&!
Stereo application
Po output power THD = 10%
RL =4&!- 6 - W
RL =2&!- 11 - W
Ä…cs channel separation 40 - - dB
Vn(o)(rms) noise output voltage (RMS value) - 150 - µV
BTL application
Po output power THD = 10%; RL =4 &! - 22 - W
SVRR supply voltage ripple rejection RS =0 &!
f = 100 Hz 34 - - dB
f = 1 to 10 kHz 48 - - dB
ôÅ‚"VOOôÅ‚ DC output offset voltage - - 250 mV
Tj junction temperature - - 150 °C
1998 Oct 16 3
Philips Semiconductors Product specification
22 W BTL or 2 × 11 W stereo power
TDA1519C
amplifier
BLOCK DIAGRAM
handbook, full pagewidth
mute switch
1
NINV
Cm
60
k&!
VA
4
OUT1
183
&!
power stage
18.1 k&!
VP
8
+ M/SS
standby
switch
-
standby
VA reference
voltage
15 k&!
× 1 +
mute
+
3
switch
-
RR
15 k&!
mute
reference
voltage
TDA1519C
18.1 k&!
power stage
183
&!
6
OUT2
VA
9
INV
Cm
60
k&!
mute switch
input
reference
power
signal
voltage
ground
ground
(substrate)
2 7 5
MGL491
GND1 VP GND2
The pin numbers refer to the TDA1519C and TDA1519CSP.
Fig.1 Block diagram.
1998 Oct 16 4
Philips Semiconductors Product specification
22 W BTL or 2 × 11 W stereo power
TDA1519C
amplifier
PINNING
PIN
SYMBOL DESCRIPTION
TDA1519C;
TDA1519CTH
TDA1519CSP
NINV 1 19 non-inverting input
GND1 2 20 ground 1 (signal)
RR 3 1 supply voltage ripple rejection
OUT1 4 3 output 1
GND2 5 5 ground 2 (substrate)
OUT2 6 8 output 2
VP 7 10 positive supply voltage
M/SS 8 11 mute/standby switch input
INV 9 12 inverting input
n.c. - 2, 4, 6, 7, 9 not connected
and 13 to 18
handbook, halfpage
handbook, halfpage RR 1 20 GND1
NINV 1
19
n.c. 2 NINV
GND1 2
OUT1 3 18 n.c.
RR 3
17
n.c. 4 n.c.
OUT1 4
GND2 5 16 n.c.
TDA1519C
GND2 5
TDA1519CTH
TDA1519CSP
n.c. 6 15 n.c.
OUT2 6
n.c. 7 14 n.c.
VP 7
OUT2 8 13 n.c.
M/SS 8
n.c. 9 12 INV
INV 9
VP 10 11 M/SS
MGR561
MGR562
Fig.2 Pin configuration (SOT131-2 and SOT354-1). Fig.3 Pin configuration (SOT418-2).
1998 Oct 16 5
Philips Semiconductors Product specification
22 W BTL or 2 × 11 W stereo power
TDA1519C
amplifier
FUNCTIONAL DESCRIPTION
The TDA1519C contains two identical amplifiers with differential input stages. The gain of each amplifier is fixed at 40 dB.
A special feature of this device is the mute/standby switch which has the following features:
" Low standby current (<100 µA)
" Low mute/standby switching current (low cost supply switch)
" Mute condition.
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
VP supply voltage operating - 17.5 V
non-operating - 30 V
load dump protected; - 45 V
during 50 ms; tr e" 2.5 ms
Vsc AC and DC short-circuit-safe voltage - 17.5 V
Vrp reverse polarity voltage - 6V
energy handling capability at outputs VP =0V - 200 mJ
IOSM non-repetitive peak output current - 6A
IORM repetitive peak output current - 4A
Ptot total power dissipation see Fig.4 - 25 W
Tj junction temperature - 150 °C
Tstg storage temperature -55 +150 °C
MGL492
30
handbook, halfpage
Ptot (1)
(W)
20
(2)
10
(3)
0
-25 0 50 100 150
Tamb (°C)
(1) Infinite heatsink.
(2) Rth(c-a) = 5 K/W.
(3) Rth(c-a) = 13 K/W.
Fig.4 Power derating curve for SIL9P.
1998 Oct 16 6
Philips Semiconductors Product specification
22 W BTL or 2 × 11 W stereo power
TDA1519C
amplifier
THERMAL CHARACTERISTICS
SYMBOL PARAMETER CONDITIONS VALUE UNIT
Rth(j-a) thermal resistance from junction to ambient in free air
TDA1519C 40 K/W
TDA1519CTH 40 K/W
Rth(j-c) thermal resistance from junction to case
TDA1519C 3 K/W
TDA1519CTH 3 K/W
DC CHARACTERISTICS
VP = 14.4 V; Tamb =25 °C; measurements taken using Fig.5; unless otherwise specified.
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Supplies
VP supply voltage note 1 6.0 14.4 17.5 V
Iq(tot) total quiescent current - 40 80 mA
VO DC output voltage note 2 - 6.95 - V
ôÅ‚"VOOôÅ‚ DC output offset voltage - - 250 mV
Mute/standby switch
Vsw(on) Switch-on voltage level 8.5 - - V
Mute condition
Vmute mute voltage 3.3 - 6.4 V
VO output signal in mute position VI = 1 V (max.); f = 20 Hz to 15 kHz - - 20 mV
ôÅ‚"VOOôÅ‚ DC output offset voltage - - 250 mV
Standby condition
Vstb standby voltage standby mode 0 - 2 V
Istb standby current standby mode - - 100 µA
Isw(on) switch-on current - 12 40 µA
Notes
1. The circuit is DC adjusted at VP = 6 to 17.5 V and AC operating at VP = 8.5 to 17.5 V.
2. At VP = 17.5 to 30 V, the DC output voltage d"0.5VP.
1998 Oct 16 7
Philips Semiconductors Product specification
22 W BTL or 2 × 11 W stereo power
TDA1519C
amplifier
AC CHARACTERISTICS
VP = 14.4 V; RL =4&!; f = 1 kHz; Tamb =25 °C; unless otherwise specified.
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Stereo application (see Fig.5)
Po output power note 1
THD = 0.5% 4 5 - W
THD = 10% 5.5 6.0 - W
RL =2 &!; note 1
THD = 0.5% 7.5 8.5 - W
THD = 10% 10 11 - W
THD total harmonic distortion Po =1W - 0.1 - %
fro(l) low frequency roll-off -3 dB; note 2 - 45 - Hz
fro(h) high frequency roll-off -1dB 20 --kHz
Gv(cl) closed-loop voltage gain 39 40 41 dB
SVRR supply voltage ripple rejection on; notes 3 and 4 40 --dB
on; notes 3 and 5 45 --dB
mute; notes 3 and 6 45 --dB
standby; 80 --dB
notes 3 and 6
ôÅ‚ZiôÅ‚ input impedance 50 60 75 k&!
Vn(o)(rms) noise output voltage (RMS value) note 7
on; RS =0 &!- 150 -µV
on; RS =10k&! - 250 500 µV
mute; note 8 - 120 -µV
Ä…cs channel separation RS =10k&! 40 --dB
ôÅ‚"Gv(ub)ôÅ‚ channel unbalance - 0.1 1 dB
BTL application (see Fig.6)
Po output power note 1
THD = 0.5% 15 17 - W
THD = 10% 20 22 - W
output power at VP = 13.2 V note 1
THD = 0.5% - 13 - W
THD = 10% - 17.5 - W
THD total harmonic distortion Po =1W - 0.1 - %
Bp power bandwidth THD = 0.5%; - 35 to - Hz
Po = -1 dB; with 15000
respect to 15 W
fro(l) low frequency roll-off -1 dB; note 2 - 45 - Hz
fro(h) high frequency roll-off -1dB 20 --kHz
Gv(cl) closed-loop voltage gain 45 46 47 dB
1998 Oct 16 8
Philips Semiconductors Product specification
22 W BTL or 2 × 11 W stereo power
TDA1519C
amplifier
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
SVRR supply voltage ripple rejection on; notes 3 and 4 34 --dB
on; notes 3 and 5 48 --dB
mute; notes 3 and 6 48 --dB
standby; 80 --dB
notes 3 and 6
ôÅ‚ZiôÅ‚ input impedance 25 30 38 k&!
Vn(o)(rms) noise output voltage (RMS value) note 7
on; RS =0 &!- 200 -µV
on; RS =10k&! - 350 700 µV
mute; note 8 - 180 -µV
Notes
1. Output power is measured directly at the output pins of the IC.
2. Frequency response externally fixed.
3. Ripple rejection measured at the output with a source impedance of 0 &! (maximum ripple amplitude of 2 V).
4. Frequency f = 100 Hz.
5. Frequency between 1 and 10 kHz.
6. Frequency between 100 Hz and 10 kHz.
7. Noise voltage measured in a bandwidth of 20 Hz to 20 kHz.
8. Noise output voltage independent of RS (Vi = 0 V).
1998 Oct 16 9
Philips Semiconductors Product specification
22 W BTL or 2 × 11 W stereo power
TDA1519C
amplifier
APPLICATION INFORMATION
handbook, full pagewidth
standby switch
100 µF VP
2200
100
µF
nF
38 7
input
reference
internal
voltage
1/2 VP
TDA1519C
- +
60 k&! 40 dB 40 dB 60 k&!
220 nF + - 220 nF
1 9
non-inverting input inverting input
2 54 6
MGL493
signal power
ground ground
1000
µF
Fig.5 Stereo application diagram (SOT131-2 and SOT354-1).
standby switch
handbook, full pagewidth
VP
2200
100
µF
nF
38 7
input
reference
internal
voltage
1/2 VP
TDA1519C
- +
60 k&! 40 dB 40 dB 60 k&!
220 nF + -
1 9
non-inverting input
to pin 9 to pin 1
2 54 6
MGL494
signal power
RL = 4 &!
ground ground
Fig.6 BTL application diagram (SOT131-2 and SOT354-1).
1998 Oct 16 10
Philips Semiconductors Product specification
22 W BTL or 2 × 11 W stereo power
TDA1519C
amplifier
MGR539
60
handbook, halfpage
Iq(tot)
(mA)
50
40
30
0 4 8 12 16 20
VP (V)
Fig.7 Total quiescent current (Iq(tot)) as a function of supply voltage (VP).
MGR540
30
handbook, halfpage
Po
(W)
20
THD = 10%
10
0.5%
0
0 4 8 12 16 20
VP (V)
Fig.8 Output power (Po) as a function of supply voltage (VP) for BTL application at RL = 4 &!; f = 1 kHz.
1998 Oct 16 11
Philips Semiconductors Product specification
22 W BTL or 2 × 11 W stereo power
TDA1519C
amplifier
MGR541
12
handbook, halfpage
THD
(%)
8
4
0
10-1 110 102
Po (W)
Fig.9 Total harmonic distortion (THD) as a function of output power (Po) for BTL application at RL =4 &!;
f = 1 kHz.
MGR542
0.6
handbook, halfpage
THD
(%)
0.4
0.2
0
10 102 103 104
f (Hz)
Fig.10 Total harmonic distortion (THD) as a function of operating frequency (f) for BTL application at RL =4 &!;
Po =1W.
1998 Oct 16 12
Philips Semiconductors Product specification
22 W BTL or 2 × 11 W stereo power
TDA1519C
amplifier
PACKAGE OUTLINES
SIL9P: plastic single in-line power package; 9 leads SOT131-2
non-concave
Dh
x
D
Eh
view B: mounting base side
d
A2
B
j E
A1
b
L
c
19
e w M Q
Z
bp
0 5 10 mm
scale
DIMENSIONS (mm are the original dimensions)
A1 b
(1)
UNIT A2 max. bp c D(1) d Dh E(1) e Eh j L Q w x Z
max.
4.6 0.75 0.48 24.0 20.0 12.2 3.4 17.2 2.1 2.00
mm 2.0 1.1 10 2.54 6
0.25 0.03
4.2 0.60 0.38 23.6 19.6 11.8 3.1 16.5 1.8 1.45
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE EUROPEAN
ISSUE DATE
VERSION PROJECTION
IEC JEDEC EIAJ
92-11-17
SOT131-2
95-03-11
1998 Oct 16 13
seating plane
Philips Semiconductors Product specification
22 W BTL or 2 × 11 W stereo power
TDA1519C
amplifier
SMS9P: plastic surface mounted single in-line power package; 9 leads SOT354-1
D
y
d
non-concave
heatsink
A2
Dh
x
heatsink
,,
Eh
j
E
,,
Q
A1
L
Lp c
91
¸
e w M
Z
bp
(A3)
A
0 5 10 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT A A1 A2 A3 bp c D(1) d Dh E(1) e Eh L Lp Q w x y Z(1) ¸
j
4.9 0.35 4.6 0.75 0.48 24.0 20.0 12.2 3.4 7.4 3.4 2.1 2.00 3°
mm 10 2.54 6
0.25 0.25 0.03 0.15
4.2 0.05 4.2 0.60 0.38 23.6 19.6 11.8 3.1 6.6 2.8 1.9 1.45 0°
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE EUROPEAN
ISSUE DATE
VERSION PROJECTION
IEC JEDEC EIAJ
98-10-08
SOT354-1
1998 Oct 16 14
Philips Semiconductors Product specification
22 W BTL or 2 × 11 W stereo power
TDA1519C
amplifier
HSOP20: heatsink small outline package; 20 leads; low stand-off SOT418-2
E A
D
x
X
c
y E2
HE v M A
D1
D2
1 10
pin 1 index
Q
A
A2
(A3)
E1
A4
¸
Lp
detail X
20 11
Z w M
bp
e
0 5 10 mm
scale
DIMENSIONS (mm are the original dimensions)
A
UNIT A2 A3 A4(1) bp c D(2) D1 D2 E(2) E1 E2 e HE Lp Q v w x y Z ¸
max.
+0.12 0.53 0.32 16.0 13.0 1.1 11.1 6.2 2.9 14.5 1.1 1.7 2.5 8°
3.5
mm 3.5 0.35 1.27 0.25 0.25 0.03 0.07
3.2 -0.02 0.40 0.23 15.8 12.6 0.9 10.9 5.8 2.5 13.9 0.8 1.5 2.0 0°
Note
1. Limits per individual lead.
2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE EUROPEAN
ISSUE DATE
VERSION PROJECTION
IEC JEDEC EIAJ
97-10-29
SOT418-2
98-02-25
1998 Oct 16 15
Philips Semiconductors Product specification
22 W BTL or 2 × 11 W stereo power
TDA1519C
amplifier
SOLDERING HSOP and SMS
Introduction REFLOW SOLDERING
There is no soldering method that is ideal for all IC Reflow soldering methods are suitable for HSOP and SMS
packages. Wave soldering is often preferred when packages.
through-hole and surface mounted components are mixed
Reflow soldering requires solder paste (a suspension of
on one printed-circuit board. However, wave soldering is
fine solder particles, flux and binding agent) to be applied
not always suitable for surface mounted ICs, or for
to the printed-circuit board by screen printing, stencilling or
printed-circuits with high population densities. In these
pressure-syringe dispensing before package placement.
situations reflow soldering is often used.
Several methods exist for reflowing; for example,
This text gives a very brief insight to a complex technology.
infrared/convection heating in a conveyor type oven.
A more in-depth account of soldering ICs can be found in
Throughput times (preheating, soldering and cooling) vary
our  Data Handbook IC26; Integrated Circuit Packages
between 50 and 300 seconds depending on heating
(order code 9398 652 90011).
method. Typical reflow peak temperatures range from
215 to 250 °C.
SIL
WAVE SOLDERING
SOLDERING BY DIPPING OR BY WAVE
Wave soldering should not be applied to HSOP and SMS
The maximum permissible temperature of the solder is
packages because no solder joint between printed-circuit
260 °C; solder at this temperature must not be in contact
board and heatsink (heatsink at bottom version) can be
with the joint for more than 5 seconds. The total contact
achieved, or to avoid solder sticking to the heatsink
time of successive solder waves must not exceed
(heatsink on top version).
5 seconds.
The device may be mounted up to the seating plane, but
MANUAL SOLDERING
the temperature of the plastic body must not exceed the
specified maximum storage temperature (Tstg max). If the Fix the component by first soldering two diagonally-
printed-circuit board has been pre-heated, forced cooling opposite end leads. Use only a low voltage soldering iron
may be necessary immediately after soldering to keep the (less than 24 V) applied to the flat part of the lead. Contact
temperature within the permissible limit. time must be limited to 10 seconds at up to 300 °C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
REPAIRING SOLDERED JOINTS
270 and 320 °C.
Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300 °C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400 °C, contact may be up to 5 seconds.
1998 Oct 16 16
Philips Semiconductors Product specification
22 W BTL or 2 × 11 W stereo power
TDA1519C
amplifier
DEFINITIONS
Data sheet status
Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
1998 Oct 16 17
Philips Semiconductors Product specification
22 W BTL or 2 × 11 W stereo power
TDA1519C
amplifier
NOTES
1998 Oct 16 18
Philips Semiconductors Product specification
22 W BTL or 2 × 11 W stereo power
TDA1519C
amplifier
NOTES
1998 Oct 16 19
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For all other countries apply to: Philips Semiconductors, Internet: http://www.semiconductors.philips.com
International Marketing & Sales Communications, Building BE-p, P.O. Box 218,
5600 MD EINDHOVEN, The Netherlands, Fax. [phone]
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Printed in The Netherlands 545102/25/01/pp20 Date of release: 1998 Oct 16 Document order number: 9397 750 04303