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Photonic Integrated Circuits: Design, Applications and Futurę Challenges

Photonic integrated Circuit (PIC) technologies have developed tremendously in recent years. The mainstream technologies (InP, SOI and SiN) have reached a phase in which they have become generic platforms. This entails access to the technology for other users (e.g., SMEs, smaller universities) that are not able to develop PIC technology by themselves. Furthermore, generic technologies and pre-defined libraries of integrated photonic components have opened up new ways of PIC development by assembling these existing components in morę sophisticated circuits offering new functionalities (in a similar way to electronic integrated circuits, which are assembled from already-developed transistors).

Simultaneously, the development of new optical sub-components is also continuing, aiming both at novel structures (e.g., introduction of new types of modulators or light sources) and novel application areas (e.g., widening the operation wavelength rangę to both VIS and longer IR regions).

Finally, a lot of niche, non-mainstream PIC technologies are being developed, including glasses, polymers or oxides (e.g., TiO or TaO), offering new capabilities for low-volume fabrication of non-standard PICs.

The objective of this Special Issue is to present some of these extraordinary developments of photonic integrated circuits with a special emphasis on non-standard Solutions both in the field of non-standard materiał platforms or sub-components as well as in the field of new PIC architectures using generic technologies. Therefore, all researchers working on PICs, regardless of whether they are working on technology development or working on new architectures basing on generic sub-components, are invited to submit their manuscripts to this Special Issue and contribute with their device concepts, original studies or reviews.

Manuscripts Preparation and Submission:

•    Check carefully the style of the journal described in the guidelines "Information for Authors" in the Electronics website https://www.mdpi.com/journal/electronics/instructions

•    Please submit your manuscript at http://susy.mdpi.com

•    One the submitting page, in pop-up menu of manuscript type, select: "Electronics" "Photonic Integrated Circuits: Design, Applications and Futurę Challenges", then upload all your manuscript files following the instructions given on the screen.

Important Dates:

•    Fuli Paper Submission Deadline: 31 January 2021

•    All papers accepted for publication will be immediately published and gathered together on the Special Issue website.

Guest Editors:

Dr. Andrzej Kaźmierczak, Warsaw University of Technology, Poland ([e-mail])