SC11 PACKAGES 1998 2

background image

PACKAGE OUTLINES

Page

SOD57

994

SOD59

995

SOD61A

996

SOD61H2

996

SOD61AB to AK

997

SOD61AB2

998

SOD61AC2

998

SOD61AD2

999

SOD64

1000

SOD81

1000

SOD83A

1001

SOD87

1001

SOD88A

1002

SOD88B

1002

SOD100

1003

SOD106

1004

SOD106A

1005

SOD107A

1006

SOD107B

1006

SOD113

1007

SOD115

1008

SOD117

1009

SOD118A

1010

SOD118B

1010

SOD119AB

1011

SOD120

1011

SOT78

1012

SOT163-1 (SO20)

1013

SOT186

1014

SOT186A

1015

SOT223

1016

SOT339-1 (SSOP20)

1017

SOT404

1018

SOT428

1019

SOT429

1020

SOT457

1021

background image

1998 Dec 07

994

Philips Semiconductors

Power diodes

Package outlines

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

EIAJ

Note

1. The marking band indicates the cathode.

SOD57

97-10-14

Hermetically sealed glass package; axial leaded; 2 leads

SOD57

UNIT

b

max.

mm

0.81

D

max.

G

max.

28

4.57

3.81

L

min.

DIMENSIONS (mm are the original dimensions)

G

L

D

L

b

0

2.5

5 mm

scale

k

a

(1)

background image

1998 Dec 07

995

Philips Semiconductors

Power diodes

Package outlines

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

EIAJ

SOD59

97-06-11

2-lead TO-220

D

D1

q

P

L

1

2

L2

(1)

b1

e

Q

b

0

5

10 mm

scale

Plastic single-ended package; heatsink mounted; 1 mounting hole; 2-lead TO-220

SOD59

UNIT

A1

b1

D1

e

P

mm

5.08

q

Q

DIMENSIONS (mm are the original dimensions)

A

b

D

c

L2

(1)

3.0

3.8
3.6

15.0
13.5

3.30
2.79

3.0
2.7

2.6
2.2

0.7
0.4

15.8
15.2

0.9
0.7

1.3
1.0

4.5
4.1

1.39
1.27

6.4
5.9

10.3

9.7

L1

E

L

A

E

A1

c

L1

Note

1. Terminals in this zone are not tinned.

background image

1998 Dec 07

996

Philips Semiconductors

Power diodes

Package outlines

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

EIAJ

Note

1. The marking band indicates the cathode.

SOD61A

97-06-09

Hermetically sealed glass package; axial leaded; 2 leads

SOD61A

UNIT

b

mm

0.6

D

max.

G

max.

32.5

4.9

2.5

L

min.

3

L1

max.

DIMENSIONS (mm are the original dimensions)

G

L

L1

L

b

(1)

0

2.5

5 mm

scale

k

a

D

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

EIAJ

Note

1. The marking band indicates the cathode.

SOD61H2

97-06-09

Miniature hermetically sealed glass package; axial leaded; 2 leads

SOD61H2

UNIT

b

mm

0.6

D

max.

G

max.

32.5

3

2.2

L

min.

3

L1

max.

DIMENSIONS (mm are the original dimensions)

G

L

D

L1

L

b

(1)

0

2.5

5 mm

scale

k

a

background image

1998 Dec 07

997

Philips Semiconductors

Power diodes

Package outlines

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

EIAJ

Note

1. The marking bands indicate the cathode.

SOD61AB to AK

97-06-20

Hermetically sealed glass package; axial leaded; 2 leads

SOD61AB to AK

G

L

L1

L2

L

b

(1)

k

a

D

OUTLINE

VERSION

UNIT

b

D

max.

G

max.

L

min.

L1

max.

SOD61AB

mm

0.6

31.8

5.5

2.5

3

5

L2

max.

DIMENSIONS (mm are the original dimensions)

SOD61AC

mm

0.6

30.4

8.3

2.5

3

5

SOD61AD

mm

0.6

30.2

8.7

2.5

3

5

SOD61AE

mm

0.6

30.0

9.1

2.5

3

5

SOD61AF

mm

0.6

29.8

9.5

2.5

3

5

SOD61AG

mm

0.6

29.6

9.9

2.5

3

5

SOD61AH

mm

0.6

29.3

10.5

2.5

3

5

SOD61AI

mm

0.6

28.8

11.5

2.5

3

5

SOD61AJ

mm

0.6

28.3

12.5

2.5

3

5

SOD61AK

mm

0.6

27.8

13.5

2.5

3

n.a

background image

1998 Dec 07

998

Philips Semiconductors

Power diodes

Package outlines

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

EIAJ

SOD61AB2

98-12-04

Hermetically sealed glass package; axial leaded; 2 leads

SOD61AB2

UNIT

b

mm

0.6

D

max.

G

max.

31.8

5.5

2.5

L

min.

DIMENSIONS (mm are the original dimensions)

G

L

D

L

b

0

2.5

5 mm

scale

Note

1. The marking band indicates the cathode.

(1)

k

a

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

EIAJ

SOD61AC2

98-12-04

Hermetically sealed glass package; axial leaded; 2 leads

SOD61AC2

UNIT

b

mm

0.6

D

max.

G

max.

30.4

8.3

2.5

L

min.

DIMENSIONS (mm are the original dimensions)

G

L

D

L

b

0

2.5

5 mm

scale

Note

1. The marking band indicates the cathode.

(1)

k

a

background image

1998 Dec 07

999

Philips Semiconductors

Power diodes

Package outlines

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

EIAJ

SOD61AD2

97-12-04

Hermetically sealed glass package; axial leaded; 2 leads

SOD61AD2

UNIT

b

mm

0.6

D

max.

G

max.

30.2

8.7

2.5

L

min.

DIMENSIONS (mm are the original dimensions)

G

L

D

L

b

0

2.5

5 mm

scale

Note

1. The marking band indicates the cathode.

(1)

k

a

background image

1998 Dec 07

1000

Philips Semiconductors

Power diodes

Package outlines

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

EIAJ

Note

1. The marking band indicates the cathode.

SOD64

97-10-14

Hermetically sealed glass package; axial leaded; 2 leads

SOD64

UNIT

b

max.

mm

1.35

D

max.

G

max.

28

5.0

4.5

L

min.

DIMENSIONS (mm are the original dimensions)

G

L

D

L

b

(1)

0

2.5

5 mm

scale

k

a

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

EIAJ

Notes

1. Implotec is a trademark of Philips.

2. The marking band indicates the cathode.

SOD81

97-06-20

Hermetically sealed glass package;
Implotec

TM(1)

technology; axial leaded; 2 leads

SOD81

UNIT

b

max.

mm

0.81

D

max.

G1

max.

5

28

G

3.8

2.15

G

max.

L

min.

DIMENSIONS (mm are the original dimensions)

G1

L

D

L

b

(2)

0

1

2 mm

scale

k

a

background image

1998 Dec 07

1001

Philips Semiconductors

Power diodes

Package outlines

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

EIAJ

SOD83A

97-06-11

Hermetically sealed glass package; axial leaded; 2 leads

SOD83A

UNIT

b

max.

mm

1.35

D

max.

G

max.

30.7

7.5

4.5

L

min.

DIMENSIONS (mm are the original dimensions)

G

L

D

L

b

0

2.5

5 mm

scale

Note

1. The marking band indicates the cathode.

(1)

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

EIAJ

SOD87

100H03

98-11-25

Hermetically sealed glass surface mounted package; 2 connectors;
Implotec

TM(1)

technology

SOD87

UNIT

D

mm

2.1
2.0

2.0
1.8

3.7
3.3

0.3

D1

H

L

DIMENSIONS (mm are the original dimensions)

H

D

D1

L

L

(2)

0

1

2 mm

scale

Notes

1. Implotec is a trademark of Philips.

2. The marking band indicates the cathode.

k

a

background image

1998 Dec 07

1002

Philips Semiconductors

Power diodes

Package outlines

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

EIAJ

SOD88A

97-06-20

Hermetically sealed glass package; axial leaded; 2 leads

SOD88A

UNIT

b

max.

mm

0.81

D

max.

G

max.

30.5

8

3.8

L

min.

DIMENSIONS (mm are the original dimensions)

G

L

D

L

b

0

2.5

5 mm

scale

Note

1. The marking band indicates the cathode.

(1)

k

a

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

EIAJ

SOD88B

97-06-20

Hermetically sealed glass package; axial leaded; 2 leads

SOD88B

UNIT

b

max.

mm

0.81

D

max.

G

max.

29

11

3.8

L

min.

DIMENSIONS (mm are the original dimensions)

G

L

D

L

b

0

2.5

5 mm

scale

Note

1. The marking band indicates the cathode.

(1)

k

a

background image

1998 Dec 07

1003

Philips Semiconductors

Power diodes

Package outlines

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

EIAJ

SOD100

97-06-11

2-lead TO-220F

0

5

10 mm

scale

Plastic single-ended package; isolated heatsink mounted;
1 mounting hole; 2-lead TO-220F exposed tabs

SOD100

A

A1

Q

c

Note

1. Terminal dimensions within this zone are uncontrolled. Terminals in this zone are not tinned.

D

D1

L

L1

m

q

e

b

w

M

1

2

E1

E

P

b1

UNIT

D

b1

D1

e

q

Q

P

L

c

A

mm

4.4
4.0

A1

2.9
2.5

b

0.9
0.7

1.5
1.3

0.55
0.38

17.0
16.4

7.9
7.5

E

10.2

9.6

5.7
5.3

E1

5.08

14.3
13.5

0.4

L1

(1)

4.8
4.0

1.4
1.2

4.4
4.0

w

3.2
3.0

m

0.9
0.5

DIMENSIONS (mm are the original dimensions)

background image

1998 Dec 07

1004

Philips Semiconductors

Power diodes

Package outlines

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

EIAJ

SOD106

97-06-09

DO-214AC

0

2.5

5 mm

scale

Transfer-moulded thermo-setting plastic small rectangular surface mounted package;
2 connectors

SOD106

UNIT

b

A1

c

D

E

Q

mm

1.6
1.4

0.2

0.05

2.8
2.4

4.5
4.3

H

5.5
5.1

3.3
2.7

DIMENSIONS (mm are the original dimensions)

A

2.3
2.0

D

H

A

E

b

(1)

A1

Q

c

Note

1. The marking band indicates the cathode.

background image

1998 Dec 07

1005

Philips Semiconductors

Power diodes

Package outlines

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

EIAJ

SOD106A

97-06-09

DO-214AC

0

2.5

5 mm

scale

Transfer-moulded thermo-setting plastic small rectangular surface mounted package;
2 connectors

SOD106A

UNIT

b

A1

c

D

max.

E

mm

b1

1.5
1.2

0.2

4.57

2.5

0.1

1.5

H

5.5
5.1

DIMENSIONS (mm are the original dimensions)

A

max.

2.65

D

H

A

E

b

(1)

A1

b1

c

Note

1. The marking band indicates the cathode.

background image

1998 Dec 07

1006

Philips Semiconductors

Power diodes

Package outlines

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

EIAJ

SOD107A

98-08-04

Hermetically sealed plastic package; axial leaded; 2 leads

SOD107A

DIMENSIONS (mm are the original dimensions)

G

L

D

L

b

0

2.5

5 mm

scale

UNIT

b

mm

0.6

D

G

30

8.5
7.5

3.1
2.9

L

min.

Note

1. The marking band indicates the cathode.

(1)

k

a

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

EIAJ

SOD107B

98-08-05

Hermetically sealed plastic package; axial leaded; 2 leads

SOD107B

DIMENSIONS (mm are the original dimensions)

G

L

D

L

b

0

2.5

5 mm

scale

UNIT

b

mm

0.6

D

G

29

10.5

9.5

3.1
2.9

L

min.

Note

1. The marking bands indicate the cathode.

(1)

k

a

background image

1998 Dec 07

1007

Philips Semiconductors

Power diodes

Package outlines

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

EIAJ

SOD113

2-lead TO-220

0

10

20 mm

scale

Plastic single-ended package; isolated heatsink mounted;
1 mounting hole; 2-leads TO-220 'full pack'

SOD113

w

M

1

2

b

E

P

e

A

A1

b1

c

Q

k

j

q

D

T

HE

L

L1

(1)

m

z

Notes

1. Terminals are uncontrolled within zone L1.
2. z is depth of T.

UNIT

A1

D

b

E

e

w

T

q

Q

P

m

L

j

k

z

(2)

b1

c

L1

(1)

HE

max.

DIMENSIONS (mm are the original dimensions)

A

mm

0.8

0.4

4.6
4.0

2.9
2.5

1.1
0.9

0.9
0.7

0.7
0.4

15.8
15.2

10.3

9.7

5.08

19.0

14.4
13.5

3.3
2.8

6.5
6.3

2.6
2.3

2.6

2.55

2.7
2.3

0.6
0.4

3.2
3.0

97-06-11

background image

1998 Dec 07

1008

Philips Semiconductors

Power diodes

Package outlines

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

EIAJ

SOD115

97-10-14

Hermetically sealed glass package; axial leaded; 2 leads

SOD115

UNIT

b

max.

mm

1.35

D

max.

G

max.

27

6.0

5.5

L

min.

DIMENSIONS (mm are the original dimensions)

G

L

D

L

b

Note

1. The marking band indicates the cathode.

(1)

k

a

0

2.5

5 mm

scale

background image

1998 Dec 07

1009

Philips Semiconductors

Power diodes

Package outlines

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

EIAJ

SOD117

D

m

L

b1

L1

0

5

10 mm

scale

Plastic single-ended through-hole package; mountable to heatsink; 1 mounting hole;
3 in-line leads (one lead cropped)

SOD117

α

27

°

23

°

A

A1

Q

c

k

Note

1. Tinning of terminals are uncontrolled within zone L1.

e

e

b

w

M

1

2

3

P

q

q1

D2

D1

E

α

UNIT

D1

e

q

Q

P

L

c

A

mm

5.8
4.8

A1

3.3
2.7

k

2.2
1.8

b

1.2
0.9

b1

2.2
1.8

b2

4.7
4.2

0.9
0.6

22.5
21.5

D2

10.2

9.9

D

27
26

E

16
15

5.45

19.1
18.1

0.4

L1

(1)

5.4
4.8

L2

3.0
1.0

3.4
3.2

m

0.8
0.6

4.7
4.3

q1

25.7
25.1

w

3.4
3.1

DIMENSIONS (mm are the original dimensions)

L2

b2

98-11-06

background image

1998 Dec 07

1010

Philips Semiconductors

Power diodes

Package outlines

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

EIAJ

SOD118A

98-05-28

Hermetically sealed plastic package; axial leaded; 2 leads

SOD118A

UNIT

b

mm

0.5

D

G

31

6.7
6.3

2.6
2.4

L

min.

DIMENSIONS (mm are the original dimensions)

G

L

D

L

b

0

2.5

5 mm

scale

Note

1. The marking bands indicate the cathode.

(1)

k

a

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

EIAJ

SOD118B

98-05-28

Hermetically sealed plastic package; axial leaded; 2 leads

SOD118B

DIMENSIONS (mm are the original dimensions)

G

L

D

L

b

0

2.5

5 mm

scale

UNIT

b

mm

0.5

D

G

29

10.5

9.5

2.6
2.4

L

min.

Note

1. The marking bands indicate the cathode.

(1)

k

a

background image

1998 Dec 07

1011

Philips Semiconductors

Power diodes

Package outlines

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

EIAJ

SOD119AB

98-12-04

Hermetically sealed glass package; axial leaded; 2 leads

SOD119AB

UNIT

b

mm

0.8

D

max.

G

max.

31.8

5.5

2.5

L

min.

DIMENSIONS (mm are the original dimensions)

G

L

D

L

b

0

2.5

5 mm

scale

Note

1. The marking band indicates the cathode.

(1)

k

a

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

EIAJ

Note

1. The marking band indicates the cathode.

SOD120

98-05-25

Hermetically sealed glass package; axial leaded; 2 leads

SOD120

UNIT

b

mm

0.6

D

max.

G1

max.

28

3.0

2.15

L

min.

DIMENSIONS (mm are the original dimensions)

G1

L

D

L

b

(1)

0

2

4 mm

scale

background image

1998 Dec 07

1012

Philips Semiconductors

Power diodes

Package outlines

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

EIAJ

SOT78

TO-220AB

D

D1

q

P

L

1

2

3

L2

(1)

b1

e

e

b

0

5

10 mm

scale

Plastic single-ended package; heatsink mounted; 1 mounting hole; 3-lead TO-220AB

SOT78

DIMENSIONS (mm are the original dimensions)

A

E

A1

c

Note

1. Terminals in this zone are not tinned.

Q

L1

UNIT

A1

b1

D1

e

P

mm

2.54

q

Q

A

b

D

c

L2

(1)

max.

3.0

3.8
3.6

15.0
13.5

3.30
2.79

3.0
2.7

2.6
2.2

0.7
0.4

15.8
15.2

0.9
0.7

1.3
1.0

4.5
4.1

1.39
1.27

6.4
5.9

10.3

9.7

L1

E

L

97-06-11

background image

1998 Dec 07

1013

Philips Semiconductors

Power diodes

Package outlines

UNIT

A

max.

A

1

A

2

A

3

b

p

c

D

(1)

E

(1)

(1)

e

H

E

L

L

p

Q

Z

y

w

v

θ

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

EIAJ

mm

inches

2.65

0.30
0.10

2.45
2.25

0.49
0.36

0.32
0.23

13.0
12.6

7.6
7.4

1.27

10.65
10.00

1.1
1.0

0.9
0.4

8
0

o

o

0.25

0.1

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

Note

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

1.1
0.4

SOT163-1

10

20

w

M

b

p

detail X

Z

e

11

1

D

y

0.25

075E04

MS-013AC

pin 1 index

0.10

0.012
0.004

0.096
0.089

0.019
0.014

0.013
0.009

0.51
0.49

0.30
0.29

0.050

1.4

0.055

0.419
0.394

0.043
0.039

0.035
0.016

0.01

0.25

0.01

0.004

0.043
0.016

0.01

0

5

10 mm

scale

X

θ

A

A

1

A

2

H

E

L

p

Q

E

c

L

v

M

A

(A )

3

A

SO20: plastic small outline package; 20 leads; body width 7.5 mm

SOT163-1

95-01-24
97-05-22

background image

1998 Dec 07

1014

Philips Semiconductors

Power diodes

Package outlines

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

EIAJ

SOT186

TO-220

0

5

10 mm

scale

Plastic single-ended package; isolated heatsink mounted;
1 mounting hole; 3 lead TO-220 exposed tabs

SOT186

A

A1

Q

c

Note

1. Terminal dimensions within this zone are uncontrolled. Terminals in this zone are not tinned.

D

D1

L

L2

L1

m

q

e1

e

b

w

M

1

2

3

E1

E

P

b1

UNIT

D

b1

D1

e

q

Q

P

L

c

L2

e1

A

5.08

mm

4.4
4.0

A1

2.9
2.5

b

0.9
0.7

1.5
1.3

0.55
0.38

17.0
16.4

7.9
7.5

E

10.2

9.6

5.7
5.3

E1

2.54

14.3
13.5

10

0.4

L1

(1)

4.8
4.0

1.4
1.2

4.4
4.0

w

3.2
3.0

m

0.9
0.5

DIMENSIONS (mm are the original dimensions)

97-06-11

background image

1998 Dec 07

1015

Philips Semiconductors

Power diodes

Package outlines

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

EIAJ

SOT186A

TO-220

0

5

10 mm

scale

Plastic single-ended package; isolated heatsink mounted; 1 mounting hole; 3 lead TO-220

SOT186A

A

A1

Q

c

K

j

Notes

1. Terminal dimensions within this zone are uncontrolled. Terminals in this zone are not tinned.

2. Both recesses are

2.5

×

0.8 max. depth

D

D1

L

L2

L1

b1

b2

e1

e

b

w

M

1

2

3

q

E

P

T

UNIT

D

b1

D1

e

q

Q

P

L

c

L2

(1)

max.

e1

A

5.08

3

mm

4.6
4.0

A1

2.9
2.5

b

0.9
0.7

1.1
0.9

b2

1.4
1.2

0.7
0.4

15.8
15.2

6.5
6.3

E

10.3

9.7

2.54

14.4
13.5

T

(2)

2.5

0.4

L1

3.30
2.79

j

2.7
2.3

K

0.6
0.4

2.6
2.3

3.0
2.6

w

3.2
3.0

DIMENSIONS (mm are the original dimensions)

97-06-11

background image

1998 Dec 07

1016

Philips Semiconductors

Power diodes

Package outlines

UNIT

A

1

b

p

c

D

E

e

1

H

E

L

p

Q

y

w

v

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

EIAJ

mm

0.10
0.01

1.8
1.5

0.80
0.60

b

1

3.1
2.9

0.32
0.22

6.7
6.3

3.7
3.3

2.3

e

4.6

7.3
6.7

1.1
0.7

0.95
0.85

0.1

0.1

0.2

DIMENSIONS (mm are the original dimensions)

SOT223

96-11-11
97-02-28

w

M

b

p

D

b

1

e

1

e

A

A

1

L

p

Q

detail X

H

E

E

v

M

A

A

B

B

c

y

0

2

4 mm

scale

A

X

1

3

2

4

Plastic surface mounted package; collector pad for good heat transfer; 4 leads

SOT223

background image

1998 Dec 07

1017

Philips Semiconductors

Power diodes

Package outlines

UNIT

A

1

A

2

A

3

b

p

c

D

(1)

E

(1)

e

H

E

L

L

p

Q

(1)

Z

y

w

v

θ

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

EIAJ

mm

0.21
0.05

1.80
1.65

0.38
0.25

0.20
0.09

7.4
7.0

5.4
5.2

0.65

7.9
7.6

0.9
0.7

0.9
0.5

8
0

o

o

0.13

1.25

0.2

0.1

DIMENSIONS (mm are the original dimensions)

Note

1. Plastic or metal protrusions of 0.20 mm maximum per side are not included.

1.03
0.63

SOT339-1

MO-150AE

93-09-08
95-02-04

X

w

M

θ

A

A

1

A

2

b

p

D

H

E

L

p

Q

detail X

E

Z

e

c

L

v

M

A

(A )

3

A

1

10

20

11

y

0.25

pin 1 index

0

2.5

5 mm

scale

SSOP20: plastic shrink small outline package; 20 leads; body width 5.3 mm

SOT339-1

A

max.

2.0

background image

1998 Dec 07

1018

Philips Semiconductors

Power diodes

Package outlines

UNIT

A

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

EIAJ

mm

A1

D1

D

E

e

Lp

HD

Q

c

2.54

2.60
2.20

15.4
14.8

2.9
2.1

9.65
8.65

1.6
1.2

10.3

9.7

4.5
4.1

1.40
1.27

0.85
0.60

0.64
0.46

b

DIMENSIONS (mm are the original dimensions)

SOT404

98-11-23

0

2.5

5 mm

scale

Plastic single-ended surface mounted package (Philips version of D

2

-PAK); 3 leads

(one lead cropped)

SOT404

e

e

E

b

D1

HD

D

Q

Lp

c

A1

A

1

3

2

mounting

base

background image

1998 Dec 07

1019

Philips Semiconductors

Power diodes

Package outlines

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

EIAJ

SOT428

98-04-07

0

10

20 mm

scale

Plastic single-ended surface mounted package (Philips version of D-PAK); 3 leads
(one lead cropped)

SOT428

E

b2

D1

w

A

M

b

c

b1

L1

L

1

3

2

D

E1

HE

L2

Note

1. Measured from heatsink back to lead.

e1

e

A

A2

A

A1

y

seating plane

mounting

base

A1

(1)

D

max.

b

D1

max.

E

max.

HE

max.

w

y

max.

A2

b2

b1

max.

c

E1

min.

e

e1

L1

min.

L2

L

A

max.

UNIT

DIMENSIONS (mm are the original dimensions)

0.2

0.2

mm

2.38
2.22

0.65
0.45

0.89
0.71

0.89
0.71

1.1
0.9

5.36
5.26

0.4
0.2

6.22
5.98

4.81
4.45

2.285

4.57

10.4

9.6

0.5

0.7
0.5

6.73
6.47

4.0

2.95
2.55

background image

1998 Dec 07

1020

Philips Semiconductors

Power diodes

Package outlines

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

EIAJ

SOT429

TO-247

98-04-07

0

10

20 mm

scale

Plastic single-ended through-hole package; heatsink mounted; 1 mounting hole; 3-lead TO-247

SOT429

E

P

A

A1

β

w

M

b

1

2

3

e

e

b1

b2

c

Q

q

L

Y

R

D

S

L1

(1)

α

UNIT

A1

D

b

E

e

w

S

R

q

Q

P

L

Y

b2

b1

c

L1

(1)

DIMENSIONS (mm are the original dimensions)

A

β

α

mm

17

°

13

°

6

°

4

°

5.3
4.7

1.9
1.7

2.2
1.8

1.2
0.9

3.2
2.8

0.9
0.6

21
20

16
15

5.45

3.7
3.3

2.6
2.4

5.3

7.5
7.1

0.4

15.7
15.3

16
15

4.0
3.6

3.5
3.3

Note

1. Tinning of terminals are uncontrolled within zone L1.

background image

1998 Dec 07

1021

Philips Semiconductors

Power diodes

Package outlines

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

EIAJ

SOT457

SC-74

w

B

M

bp

D

e

pin 1
index

A

A1

Lp

Q

detail X

HE

E

v

M

A

A

B

y

0

1

2 mm

scale

c

X

1

3

2

4

5

6

Plastic surface mounted package; 6 leads

SOT457

UNIT

A1

bp

c

D

E

HE

Lp

Q

y

w

v

mm

0.1

0.013

0.40
0.25

3.1
2.7

0.26
0.10

1.7
1.3

e

0.95

3.0
2.5

0.2

0.1

0.2

DIMENSIONS (mm are the original dimensions)

0.6
0.2

0.33
0.23

A

1.1
0.9

97-02-28


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