FEATURES
D TrenchFETr Power MOSFETS
D 175_C Junction Temperature
D New Low Thermal Resistance Package
APPLICATIONS
D Industrial
SUP40N25-60
Vishay Siliconix
New Product
Document Number: 73132
S-42076—Rev. A, 15-Nov-04
www.vishay.com
1
N-Channel 250-V (D-S) 175
_
C MOSFET
PRODUCT SUMMARY
V
(BR)DSS
(V)
r
DS(on)
(
W
)
I
D
(A)
Q
g
(Typ)
250
0.060 @ V
GS
= 10 V
40
95
250
0.064 @ V
GS
= 6 V
38.7
95
TO-220AB
Top View
G D S
Ordering Information: SUP40N25-60—E3
N-Channel MOSFET
G
D
S
ABSOLUTE MAXIMUM RATINGS (T
C
= 25_C UNLESS OTHERWISE NOTED)
Parameter
Symbol
Limit
Unit
Drain-Source Voltage
V
DS
250
Gate-Source Voltage
V
GS
"30
V
Continuous Drain Current
(T
J
= 175_C)
T
C
= 25_C
I
D
40
Continuous Drain Current
(T
J
= 175_C)
T
C
= 125_C
I
D
23
A
Pulsed Drain Current
I
DM
70
A
Avalanche Current
I
AR
35
Repetitive Avalanche Energy
a
L = 0.1 mH
E
AR
61
mJ
Maximum Power Dissipation
a
T
C
= 25_C
P
D
300
b
W
Maximum Power Dissipation
a
T
A
= 25_C
c
P
D
3.75
W
Operating Junction and Storage Temperature Range
T
J
, T
stg
−55 to 175
_C
THERMAL RESISTANCE RATINGS
Parameter
Symbol
Limit
Unit
Junction-to-Ambient (PCB Mount)
c
R
thJA
40
_C/W
Junction-to-Case (Drain)
R
thJC
0.5
_C/W
Notes
a.
Duty cycle v 1%.
b.
See SOA curve for voltage derating.
c.
When mounted on 1” square PCB (FR-4 material).
SUP40N25-60
Vishay Siliconix
New Product
www.vishay.com
2
Document Number: 73132
S-42076—Rev. A, 15-Nov-04
SPECIFICATIONS (T
J
=25_C UNLESS OTHERWISE NOTED)
Parameter
Symbol
Test Condition
Min
Typ
Max
Unit
Static
Drain-Source Breakdown Voltage
V
(BR)DSS
V
DS
= 0 V, I
D
= 250 mA
250
V
Gate-Threshold Voltage
V
GS(th)
V
DS
= V
GS
, I
D
= 250 mA
2
4
V
Gate-Body Leakage
I
GSS
V
DS
= 0 V, V
GS
= "30 V
"250
nA
V
DS
= 250 V, V
GS
= 0 V
1
Zero Gate Voltage Drain Current
I
DSS
V
DS
= 250 V, V
GS
= 0 V, T
J
= 125_C
50
mA
g
DSS
V
DS
= 250 V, V
GS
= 0 V, T
J
= 175_C
250
m
On-State Drain Current
a
I
D(on)
V
DS
w 5 V, V
GS
= 10 V
70
A
V
GS
= 10 V, I
D
= 20 A
0.049
0.060
Drain Source On State Resistance
a
r
DS( )
V
GS
= 10 V, I
D
= 20 A, T
J
= 125_C
0.121
W
Drain-Source On-State Resistance
a
r
DS(on)
V
GS
= 10 V, I
D
= 20 A, T
J
= 175_C
0.163
W
V
GS
= 6 V, I
D
= 15 A,
0.051
0.064
Forward Transconductance
a
g
fs
V
DS
= 15 V, I
D
= 20 A
70
S
Dynamic
b
Input Capacitance
C
iss
5000
Output Capacitance
C
oss
V
GS
= 0 V, V
DS
= 25 V, f = 1 MHz
300
pF
Reverse Transfer Capacitance
C
rss
170
Total Gate Charge
c
Q
g
95
140
Gate-Source Charge
c
Q
gs
V
DS
= 125 V,
V
GS
= 10 V, I
D
= 45 A
28
nC
Gate-Drain Charge
c
Q
gd
DS
,
GS
,
D
34
Gate Resistance
R
g
f = 1 MHz
1.6
W
Turn-On Delay Time
c
t
d(on)
22
35
Rise Time
c
t
r
V
DD
= 100 V, R
L
= 2.78 W
220
330
ns
Turn-Off Delay Time
c
t
d(off)
V
DD
= 100 V, R
L
= 2.78 W
I
D
^ 45 A, V
GEN
= 10 V, R
g
= 2.5 W
40
60
ns
Fall Time
c
t
f
145
220
Source-Drain Diode Ratings and Characteristics (T
C
= 25
_
C)
b
Continuous Current
I
S
45
A
Pulsed Current
I
SM
70
A
Forward Voltage
a
V
SD
I
F
= 45 A, V
GS
= 0 V
1.0
1.5
V
Reverse Recovery Time
t
rr
150
225
ns
Peak Reverse Recovery Current
I
RM(REC)
I
F
= 45 A, di/dt = 100 A/ms
12
18
A
Reverse Recovery Charge
Q
rr
0.9
2
mC
Notes
a.
Pulse test; pulse width v 300 ms, duty cycle v 2%.
b.
Guaranteed by design, not subject to production testing.
c.
Independent of operating temperature.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
SUP40N25-60
Vishay Siliconix
New Product
Document Number: 73132
S-42076—Rev. A, 15-Nov-04
www.vishay.com
3
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
0
1000
2000
3000
4000
5000
6000
7000
0
40
80
120
160
200
0
4
8
12
16
20
0
30
60
90
120
150
180
0
30
60
90
120
150
0
10
20
30
40
50
60
0.00
0.02
0.04
0.06
0.08
0.10
0
20
40
60
80
100
0
20
40
60
80
100
0
1
2
3
4
5
6
0
20
40
60
80
100
0
2
4
6
8
10
Output Characteristics
Transfer Characteristics
Capacitance
Gate Charge
Transconductance
On-Resistance vs. Drain Current
V
DS
− Drain-to-Source Voltage (V)
V
GS
− Gate-to-Source Voltage (V)
− Drain Current (A)
I
D
− Gate-to-Source V
oltage (V)
Q
g
− Total Gate Charge (nC)
I
D
− Drain Current (A)
V
DS
− Drain-to-Source Voltage (V)
C
− Capacitance (pF)
V
GS
− T
ransconductance
(S)
g
fs
25_C
−55_C
T
C
= 125_C
V
DS
= 125 V
I
D
= 45 A
V
GS
= 10 thru 7 V
V
GS
= 6 V
C
iss
C
oss
T
C
= −55_C
25_C
125_C
4 V
− On-Resistance (
r
DS(on)
W
)
− Drain Current (A)
I
D
I
D
− Drain Current (A)
6 V
C
rss
5 V
V
GS
= 10 V
SUP40N25-60
Vishay Siliconix
New Product
www.vishay.com
4
Document Number: 73132
S-42076—Rev. A, 15-Nov-04
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Drain Source Breakdown vs.
Junction Temperature
Avalanche Current vs. Time
0.4
0.8
1.2
1.6
2.0
2.4
2.8
−50 −25
0
25
50
75
100 125 150 175
On-Resistance vs. Junction Temperature
Source-Drain Diode Forward Voltage
T
J
− Junction Temperature (_C)
V
SD
− Source-to-Drain Voltage (V)
− Source Current (A)
I
S
100
10
1
0.3
0.6
0.9
1.2
V
GS
= 10 V
I
D
= 20 A
T
J
= 25_C
T
J
= 150_C
0
230
240
250
260
270
280
290
300
−50 −25
0
25
50
75
100 125 150 175
T
J
− Junction Temperature (_C)
t
in
(Sec)
100
10
0.00001
0.001
0.1
1
0.1
(a)
I
Dav
0.01
I
AV
(A) @ T
A
= 150_C
(V)
V
(BR)DSS
I
D
= 1.0 mA
1
0.0001
I
AV
(A) @ T
A
= 25_C
r
DS
(on)
−
On-Resiistance
(Normalized)
SUP40N25-60
Vishay Siliconix
New Product
Document Number: 73132
S-42076—Rev. A, 15-Nov-04
www.vishay.com
5
THERMAL RATINGS
0
10
20
30
40
50
0
25
50
75
100
125
150
175
Safe Operating Area, Case Temperature
100
10
0.1
1
10
1000
*Limited
by r
DS(on)
0.001
T
C
= 25_C
Single Pulse
Maximum Avalanche and Drain Current
vs. Case Temperature
T
C
− Ambient Temperature (_C)
− Drain Current (A)
I
D
Normalized Thermal Transient Impedance, Junction-to-Case
Square Wave Pulse Duration (sec)
2
1
0.1
0.01
10
−4
10
−3
10
−2
10
−1
1
Normalized Ef
fective
Transient
Thermal Impedance
0.2
0.1
Duty Cycle = 0.5
− Drain Current (A)
I
D
1 ms
10 ms, 100 ms, dc
10 ms
100 ms
Single Pulse
0.05
0.02
1
100
0.1
0.01
V
DS
− Drain-to-Source Voltage (V)
*V
GS
u minimum V
GS
at which r
DS(on)
is
specified
Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon Technology and
Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and reliability data, see
http://www.vishay.com/ppg?73132
.
Legal Disclaimer Notice
Vishay
Document Number: 91000
www.vishay.com
Revision: 08-Apr-05
1
Notice
Specifications of the products displayed herein are subject to change without notice. Vishay Intertechnology, Inc.,
or anyone on its behalf, assumes no responsibility or liability for any errors or inaccuracies.
Information contained herein is intended to provide a product description only. No license, express or implied, by
estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Vishay's
terms and conditions of sale for such products, Vishay assumes no liability whatsoever, and disclaims any express
or implied warranty, relating to sale and/or use of Vishay products including liability or warranties relating to fitness
for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right.
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications.
Customers using or selling these products for use in such applications do so at their own risk and agree to fully
indemnify Vishay for any damages resulting from such improper use or sale.