TP3064 3067(1)

background image

TL/H/5070

TP3064,

TP3067

‘‘Enhanced’’

Serial

Interface

CMOS

CODEC/Filter

COMBO

October 1991

TP3064, TP3067
‘‘Enhanced’’ Serial Interface
CMOS CODEC/Filter COMBO

É

General Description

The TP3064 (m-law) and TP3067 (A-law) are monolithic
PCM CODEC/Filters utilizing the A/D and D/A conversion
architecture shown in

Figure 1 , and a serial PCM interface.

The devices are fabricated using National’s advanced dou-
ble-poly CMOS process (microCMOS).

Similar to the TP305X family, these devices feature an addi-
tional Receive Power Amplifier to provide push-pull bal-
anced output drive capability. The receive gain can be ad-
justed by means of two external resistors for an output level
of up to

g

6.6V across a balanced 600X load.

Also included is an Analog Loopback switch and a TS

X

out-

put.

See also AN-370, ‘‘Techniques for Designing with CODEC/
Filter COMBO Circuits.’’

COMBO

É

and TRI-STATE

É

are registered trademarks of National Semiconductor Corpora-

tion.

Features

Y

Complete CODEC and filtering system including:
Ð Transmit high-pass and low-pass filtering
Ð Receive low-pass filter with sin x/x correction
Ð Active RC noise filters
Ð m-law or A-law compatible COder and DECoder
Ð Internal precision voltage reference
Ð Serial I/O interface
Ð Internal auto-zero circuitry
Ð Receive push-pull power amplifiers

Y

m

-lawÐTP3064

Y

A-lawÐTP3067

Y

Designed for D3/D4 and CCITT applications

Y

g

5V operation

Y

Low operating powerÐtypically 70 mW

Y

Power-down standby modeÐtypically 3 mW

Y

Automatic power-down

Y

TTL or CMOS compatible digital interfaces

Y

Maximizes line interface card circuit density

Block Diagram

TL/H/5070 – 1

FIGURE 1

C1995 National Semiconductor Corporation

RRD-B30M115/Printed in U. S. A.

background image

Connection Diagrams

Dual-In-Line Package

TL/H/5070 – 2

Top View

Plastic Chip Carrier

TL/H/5070 – 6

Top View

Order Number TP3064J or TP3067J

See NS Package J20A

Order Number TP3064WM or TP3067WM

See NS Package M20B

Order Number TP3064N or TP3067N

See NS Package N20A

Order Number TP3064V or TP3067V

See NS Package V20A

Pin Description

Symbol

Function

VPO

a

The non-inverted output of the receive power
amplifier.

GNDA

Analog ground. All signals are referenced to
this pin.

VPO

b

The inverted output of the receive power
amplifier.

VPI

Inverting input to the receive power amplifier.

VF

R

O

Analog output of the receive filter.

V

CC

Positive power supply pin. V

CC

e a

5V

g

5%.

FS

R

Receive frame sync pulse which enables
BCLK

R

to shift PCM data into D

R

. FS

R

is an

8 kHz pulse train. See

Figures 2 and 3 for

timing details.

D

R

Receive data input. PCM data is shifted into
D

R

following the FS

R

leading edge.

BCLK

R

/

The bit clock which shifts data into D

R

after

the FS

R

leading edge. May vary from 64 kHz

CLKSEL

to 2.048 MHz. Alternatively, may be a logic
input which selects either
1.536 MHz/1.544 MHz or 2.048 MHz for
master clock in synchronous mode and
BCLK

X

is used for both transmit and receive

directions (see Table I).

MCLK

R

/

Receive master clock. Must be 1.536 MHz,
1.544 MHz or 2.048 MHz. May be

PDN

asynchronous with MCLK

X

, but should be

synchronous with MCLK

X

for best

performance. When MCLK

R

is connected

continuously low, MCLK

X

is selected for all

internal timing. When MCLK

R

is connected

continuously high, the device is powered
down.

Symbol

Function

MCLK

X

Transmit master clock. Must be 1.536 MHz,
1.544 MHz or 2.048 MHz. May be
asynchronous with MCLK

R

. Best

performance is realized from synchronous
operation.

BCLK

X

The bit clock which shifts out the PCM data
on D

X

. May vary from 64 kHz to 2.048 MHz,

but must be synchronous with MCLK

X

.

D

X

The TRI-STATE

É

PCM data output which is

enabled by FS

X

.

FS

X

Transmit frame sync pulse input which
enables BCLK

X

to shift out the PCM data on

D

X

. FS

X

is an 8 kHz pulse train, see

Figures 2

and

3 for timing details.

TS

X

Open drain output which pulses low during
the encoder time slot.

ANLB

Analog Loopback control input. Must be set
to logic ‘0’ for normal operation. When pulled
to logic ‘1’, the transmit filter input is
disconnected from the output of the transmit
preamplifier and connected to the VPO

a

output of the receive power amplifier.

GS

X

Analog output of the transmit input amplifier.
Used to externally set gain.

VF

X

I

b

Inverting input of the transmit input amplifier.

VF

X

I

a

Non-inverting input of the transmit input
amplifier.

V

BB

Negative power supply pin. V

BB

e b

5V

g

5%.

2

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Functional Description

POWER-UP

When power is first applied, power-on reset circuitry initializ-
es the COMBO

TM

and places it into a power-down state. All

non-essential circuits are deactivated and the D

X

, VF

R

O,

VPO

b

and VPO

a

outputs are put in high impedance states.

To power-up the device, a logical low level or clock must be
applied to the MCLK

R

/PDN pin

and FS

X

and/or FS

R

pulses

must be present. Thus, 2 power-down control modes are
available. The first is to pull the MCLK

R

/PDN pin high; the

alternative is to hold both FS

X

and FS

R

inputs continuously

lowÐthe device will power-down approximately 2 ms after
the last FS

X

or FS

R

pulse. Power-up will occur on the first

FS

X

or FS

R

pulse. The TRI-STATE PCM data output, D

X

,

will remain in the high impedance state until the second FS

X

pulse.

SYNCHRONOUS OPERATION

For synchronous operation, the same master clock and bit
clock should be used for both the transmit and receive di-
rections. In this mode, a clock must be applied to MCLK

X

and the MCLK

R

/PDN pin can be used as a power-down

control. A low level on MCLK

R

/PDN powers up the device

and a high level powers down the device. In either case,
MCLK

X

will be selected as the master clock for both the

transmit and receive circuits. A bit clock must also be ap-
plied to BCLK

X

and the BCLK

R

/CLKSEL can be used to

select the proper internal divider for a master clock of 1.536
MHz, 1.544 MHz or 2.048 MHz. For 1.544 MHz operation,
the device automatically compensates for the 193rd clock
pulse each frame.

With a fixed level on the BCLK

R

/CLKSEL pin, BLCK

X

will be

selected as the bit clock for both the transmit and receive
directions. Table I indicates the frequencies of operation
which can be selected, depending on the state of BCLK

R

/

CLKSEL. In this synchronous mode, the bit clock, BCLK

X

,

may be from 64 kHz to 2.048 MHz, but must be synchro-
nous with MCLK

X

.

Each FS

X

pulse begins the encoding cycle and the PCM

data from the previous encode cycle is shifted out of the
enabled D

X

output on the positive edge of BCLK

X

. After 8

bit clock periods, the TRI-STATE D

X

output is returned to a

high impedance state. With an FS

R

pulse, PCM data is

latched via the D

R

input on the negative edge of BCLK

X

(or

BCLK

R

if running). FS

X

and FS

R

must be synchronous with

MCLK

X/R

.

TABLE I. Selection of Master Clock Frequencies

Master Clock

BCLK

R

/CLKSEL

Frequency Selected

TP3067

TP3064

Clocked

2.048 MHz

1.536 MHz or

1.544 MHz

0

1.536 MHz or

2.048 MHz

1.544 MHz

1

2.048 MHz

1.536 MHz or

1.544 MHz

ASYNCHRONOUS OPERATION

For asynchronous operation, separate transmit and receive
clocks may be applied. MCLK

X

and MCLK

R

must be 2.048

MHz for the TP3067, or 1.536 MHZ, 1.544 MHz for the
TP3064, and need not be synchronous. For best transmis-

sion performance, however, MCLK

R

should be synchronous

with MCLK

X

, which is easily achieved by applying only static

logic levels to the MCLK

R

/PDN pin. This will automatically

connect MCLK

X

to all internal MCLK

R

functions (see Pin

Description). For 1.544 MHz operation, the device automati-
cally compensates for the 193rd clock pulse each frame.
FS

X

starts each encoding cycle and must be synchronous

with MCLK

X

and BCLK

X

. FS

R

starts each decoding cycle

and must be synchronous with BCLK

R

. BCLK

R

must be a

clock, the logic levels shown in Table I are not valid in asyn-
chronous mode. BCLK

X

and BCLK

R

may operate from 64

kHz to 2.048 MHz.

SHORT FRAME SYNC OPERATION

The COMBO can utilize either a short frame sync pulse (the
same as the TP3020/21 CODECs) or a long frame sync
pulse. Upon power initialization, the device assumes a short
frame mode. In this mode, both frame sync pulses, FS

X

and

FS

R

, must be one bit clock period long, with timing relation-

ships specified in

Figure 2 . With FS

X

high during a falling

edge of BCLK

X

, the next rising edge of BCLK

X

enables the

D

X

TRI-STATE output buffer, which will output the sign bit.

The following seven rising edges clock out the remaining
seven bits, and the next falling edge disables the D

X

output.

With FS

R

high during a falling edge of BCLK

R

(BCLK

X

in

synchronous mode), the next falling edge of BCLK

R

latches

in the sign bit. The following seven falling edges latch in the
seven remaining bits. All devices may utilize the short frame
sync pulse in synchronous or asynchronous operating
mode.

LONG FRAME SYNC OPERATION

To use the long (TP5116A/56 CODECs) frame mode, both
the frame sync pulses, FS

X

and FS

R

, must be three or more

bit clock periods long, with timing relationships specified in

Figure 3 . Based on the transmit frame sync, FS

X

, the COM-

BO will sense whether short or long frame sync pulses are
being used. For 64 kHz operation, the frame sync pulse
must be kept low for a minimum of 160 ns. The D

X

TRI-

STATE output buffer is enabled with the rising edge of FS

X

or the rising edge of BCLK

X

, whichever comes later, and the

first bit clocked out is the sign bit. The following seven
BCLK

X

rising edges clock out the remaining seven bits. The

D

X

output is disabled by the falling BCLK

X

edge following

the eighth rising edge, or by FS

X

going low, whichever

comes later. A rising edge on the receive frame sync pulse,
FS

R

, will cause the PCM data at D

R

to be latched in on the

next eight falling edges of BCLK

R

(BCLK

X

in synchronous

mode). All devices may utilize the long frame sync pulse in
synchronous or asynchronous mode.

TRANSMIT SECTION

The transmit section input is an operational amplifier with
provision for gain adjustment using two external resistors,
see

Figure 4 . The low noise and wide bandwidth allow gains

in excess of 20 dB across the audio passband to be real-
ized. The op amp drives a unity-gain filter consisting of RC
active pre-filter, followed by an eighth order switched-ca-
pacitor bandpass filter clocked at 256 kHz. The output of
this filter directly drives the encoder sample-and-hold circuit.
The A/D is of companding type according to m-law
(TP3064) or A-law (TP3067) coding conventions. A preci-
sion voltage reference is trimmed in manufacturing to pro-
vide an input overload (t

MAX

) of nominally 2.5V peak (see

3

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Functional Description

(Continued)

table of Transmission Characteristics). The FS

X

frame sync

pulse controls the sampling of the filter output, and then the
successive-approximation encoding cycle begins. The 8-bit
code is then loaded into a buffer and shifted out through D

X

at the next FS

X

pulse. The total encoding delay will be ap-

proximately 165 ms (due to the transmit filter) plus 125 ms
(due to encoding delay), which totals 290 ms. Any offset
voltage due to the filters or comparator is cancelled by sign
bit integration.

RECEIVE SECTION

The receive section consists of an expanding DAC which
drives a fifth order switched-capacitor low pass filter
clocked at 256 kHz. The decoder is A-law (TP3067) or
m

-law (TP3064) and the 5th order low pass filter corrects for

the sin x/x attenuation due to the 8 kHz sample/hold. The
filter is then followed by a 2nd order RC active post-filter
with its output at VF

R

O. The receive section is unity-gain,

but gain can be added by using the power amplifiers. Upon
the occurrence of FS

R

, the data at the D

R

input is clocked in

on the falling edge of the next eight BCLK

R

(BCLK

X

) peri-

ods. At the end of the decoder time slot, the decoding cycle
begins, and 10 ms later the decoder DAC output is updated.
The total decoder delay is E10 ms (decoder update) plus
110 ms (filter delay) plus 62.5 ms (

(/2 frame), which gives

approximately 180 ms.

RECEIVE POWER AMPLIFIERS

Two inverting mode power amplifiers are provided for direct-
ly driving a matched line interface transformer. The gain of
the first power amplifier can be adjusted to boost the

g

2.5V

peak output signal from the receive filter up to

g

3.3V peak

into an unbalanced 300X load, or

g

4.0V into an unbal-

anced 15 kX load. The second power amplifier is internally
connected in unity-gain inverting mode to give 6 dB of signal
gain for balanced loads.

Maximum power transfer to a 600X subscriber line termina-
tion is obtained by differentially driving a balanced trans-
former with a

S

2:1 turns ratio, as shown in

Figure 4 . A total

peak power of 15.6 dBm can be delivered to the load plus
termination.

ENCODING FORMAT AT D

X

OUTPUT

TP3064

TP3067

m-Law

A-Law

(Includes Even Bit Inversion)

V

IN

e a

Full-Scale

1

0

0

0

0

0

0

0

1

0

1

0

1

0

1

0

V

IN

e

0V

1

1

1

1

1

1

1

1

1

1

0

1

0

1

0

1

Ð

0

1

1

1

1

1

1

1

0

1

0

1

0

1

0

1

V

IN

e b

Full-Scale

0

0

0

0

0

0

0

0

0

0

1

0

1

0

1

0

4

background image

Absolute Maximum Ratings

If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales
Office/Distributors for availability and specifications.

V

CC

to GNDA

7V

V

BB

to GNDA

b

7V

Voltage at any Analog Input

or Output

V

CC

a

0.3V to V

BB

b

0.3V

Voltage at any Digital Input

or Output

V

CC

a

0.3V to GNDA

b

0.3V

Operating Temperature Range

b

25

§

C to

a

125

§

C

Storage Temperature Range

b

65

§

C to

a

150

§

C

Lead Temp. (Soldering, 10 sec.)

300

§

C

ESD (Human Body Model) J

1000V

ESD (Human Body Model) N

1500V

Latch-Up Immunity

100 mA on Any Pin

Electrical Characteristics

Unless otherwise noted, limits printed in BOLD characters are guaranteed for V

CC

e

a

5.0V

g

5%, V

BB

e b

5.0V

g

5%; T

A

e

0

§

C to 70

§

C by correlation with 100% electrical testing at T

A

e

25

§

C. All other limits

are assured by correlation with other production tests and/or product design and characterization. All signals referenced to
GNDA. Typicals specified at V

CC

e a

5.0V, V

BB

e b

5.0V, T

A

e

25

§

C.

Symbol

Parameter

Conditions

Min

Typ

Max

Units

POWER DISSIPATION (ALL DEVICES)

I

CC

0

Power-Down Current

(Note)

0.5

1.5

mA

I

BB

0

Power-Down Current

(Note)

0.05

0.3

mA

I

CC

1

Active Current

VPI

e

0V; VF

R

O, VPO

a

and VPO

b

unloaded

7.0

10.0

mA

I

BB

1

Active Current

VPI

e

0V; VF

R

O, VPO

a

and VPO

b

unloaded

7.0

10.0

mA

DIGITAL INTERFACE

V

IL

Input Low Voltage

0.6

V

V

IH

Input High Voltage

2.2

V

V

OL

Output Low Voltage

D

X

, I

L

e

3.2 mA

0.4

V

TS

X

, I

L

e

3.2 mA, Open Drain

0.4

V

V

OH

Output High Voltage

D

X

, I

H

e b

3.2 mA

2.4

V

I

IL

Input Low Current

GNDA

s

V

IN

s

V

IL

, All Digital Inputs

b

10

10

m

A

I

IH

Input High Current

V

IH

s

V

IN

s

V

CC

b

10

10

m

A

I

OZ

Output Current in High Impedance

D

X

, GNDA

s

V

O

s

V

CC

b

10

10

m

A

State (TRI-STATE)

Note:

I

CC0

and I

BB0

are measured after first achieving a power-up state.

5

background image

Electrical Characteristics

(Continued)

Unless otherwise noted, limits printed in BOLD characters are guaranteed for V

CC

e a

5.0V

g

5%, V

BB

e b

5.0V

g

5%; T

A

e

0

§

C to 70

§

C by correlation with 100% electrical testing at T

A

e

25

§

C. All other limits are assured by correlation with other

production tests and/or product design and characterization. All signals referenced to GNDA. Typicals specified at V

CC

e

a

5.0V, V

BB

e b

5.0V, T

A

e

25

§

C.

Symbol

Parameter

Conditions

Min

Typ

Max

Units

ANALOG INTERFACE WITH TRANSMIT INPUT AMPLIFIER (ALL DEVICES)

I

I

XA

Input Leakage Current

b

2.5V

s

V

s

a

2.5V, VF

X

I

a

or VF

X

I

b

b

200

200

nA

R

I

XA

Input Resistance

b

2.5V

s

V

s

a

2.5V, VF

X

I

a

or VF

X

I

b

10

MX

R

O

XA

Output Resistance

Closed Loop, Unity Gain

1

3

X

R

L

XA

Load Resistance

GS

X

10

kX

C

L

XA

Load Capacitance

GS

X

50

pF

V

O

XA

Output Dynamic Range

GS

X

, R

L

t

10 kX

b

2.8

a

2.8

V

A

V

XA

Voltage Gain

VF

X

I

a

to GS

X

5000

V/V

F

U

XA

Unity-Gain Bandwidth

1

2

MHz

V

OS

XA

Offset Voltage

b

20

20

mV

V

CM

XA

Common-Mode Voltage

CMRRXA

l

60 dB

b

2.5

2.5

V

CMRRXA

Common-Mode Rejection Ratio

DC Test

60

dB

PSRRXA

Power Supply Rejection Ratio

DC Test

60

dB

ANALOG INTERFACE WITH RECEIVE FILTER (ALL DEVICES)

R

O

RF

Output Resistance

Pin VF

R

O

1

3

X

R

L

RF

Load Resistance

VF

R

O

e

g

2.5V

10

kX

C

L

RF

Load Capacitance

Connect from VF

R

O to GNDA

25

pF

VOS

R

O

Output DC Offset Voltage

Measure from VF

R

O to GNDA

b

200

200

mV

ANALOG INTERFACE WITH POWER AMPLIFIERS (ALL DEVICES)

IPI

Input Leakage Current

b

1.0V

s

VPI

s

1.0V

b

100

100

nA

RIPI

Input Resistance

b

1.0V

s

VPI

s

1.0V

10

MX

VIOS

Input Offset Voltage

b

25

25

mV

ROP

Output Resistance

Inverting Unity-Gain at

1

X

VPO

a

or VPO

b

F

C

Unity-Gain Bandwidth

Open Loop (VPO

b

)

400

kHz

C

L

P

Load Capacitance

100

pF

GA

P

a

Gain from VPO

b

to VPO

a

R

L

e

600X VPO

a

to VPO

b

b

1

V/V

Level at VPO

b

e

1.77 Vrms

PSRR

P

Power Supply Rejection of

VPO

b

Connected to VPI

V

CC

or V

BB

0 kHz

b

4 kHz

60

dB

4 kHz

b

50 kHz

36

dB

R

L

P

Load Resistance

Connect from VPO

a

to VPO

b

600

X

6

background image

Timing Specifications

Unless otherwise noted, limits printed in BOLD characters are guaranteed for V

CC

e a

5.0V

g

5%, V

BB

e b

5.0V

g

5%, T

A

e

0

§

C to 70

§

C by correlation with 100% electrical testing at T

A

e

25

§

C. All other limits are assured by correlation with other

production tests and/or product design and characterization. All signals are referenced to GNDA. Typicals specified at V

CC

e

a

5.0V, V

BB

e b

5.0V, T

A

e

25

§

C. All timing parameters are measured at V

OH

e

2.0V and V

OL

e

0.7V.

See Definitions and Timing Conventions section for test methods information.

Symbol

Parameter

Conditions

Min

Typ

Max

Units

1/t

PM

Frequency of Master Clock

1.536

MHz

1.544

MHz

MCLK

X

and MCLK

R

2.048

MHz

t

RM

Rise Time of Master Clock

MCLK

X

and MCLK

R

50

ns

t

FM

Fall Time of Master Clock

MCLK

X

and MCLK

R

50

ns

t

PB

Period Bit of Clock

485

488

15725

ns

t

RB

Rise Time of Bit Clock

BCLK

X

and BCLK

R

50

ns

t

FB

Fall Time of Bit Clock

BCLK

X

and BCLK

R

50

ns

t

WMH

Width of Master Clock High

MCLK

X

and MCLK

R

160

ns

t

WML

Width of Master Clock Low

MCLK

X

and MCLK

R

160

ns

t

SBFM

Set-Up Time from BCLK

X

High

100

ns

to MCLK

X

Falling Edge

t

SFFM

Set-Up Time from FS

X

High

Long Frame Only

100

ns

to MCLK

X

Falling Edge

t

WBH

Width of Bit Clock High

160

ns

t

WBL

Width of Bit Clock Low

160

ns

t

HBFL

Holding Time from Bit Clock

Long Frame Only

0

ns

Low to Frame Sync

t

HBFS

Holding Time from Bit Clock

Short Frame Only

0

ns

High to Frame Sync

t

SFB

Set-Up Time for Frame Sync

Long Frame Only

80

ns

to Bit Clock Low

t

DBD

Delay Time from BCLK

X

High

Load

e

150 pF plus 2 LSTTL Loads

0

180

ns

to Data Valid

t

DBTS

Delay Time to TS

X

Low

Load

e

150 pF plus 2 LSTTL Loads

140

ns

t

DZC

Delay Time from BCLK

X

Low to

50

165

ns

Data Output Disabled

t

DZF

Delay Time to Valid Data from

C

L

e

0 pF to 150 pF

20

165

ns

FS

X

or BCLK

X

, Whichever

Comes Later

t

SDB

Set-Up Time from D

R

Valid to

50

ns

BCLK

R/X

Low

t

HBD

Hold Time from BCLK

R/X

Low to

50

ns

D

R

Invalid

t

SF

Set-Up Time from FS

X/R

to

Short Frame Sync Pulse (1 Bit Clock

50

ns

BCLK

X/R

Low

Period Long)

t

HF

Hold Time from BCLK

X/R

Low

Short Frame Sync Pulse (1 Bit Clock

100

ns

to FS

X/R

Low

Period Long)

t

HBFI

Hold Time from 3rd Period of

Long Frame Sync Pulse (from 3 to 8 Bit

100

ns

Bit Clock Low to Frame Sync

Clock Periods Long)

(FS

X

or FS

R

)

t

WFL

Minimum Width of the Frame

64k Bit/s Operating Mode

160

ns

Sync Pulse (Low Level)

7

background image

Timing Diagrams

TL/H/5070

3

FIGURE

2.

Short

Frame

Sync

Timing

8

background image

Timing Diagrams

(Continued)

TL/H/5070

4

FIGURE

3.

Long

Frame

Sync

Timing

9

background image

Transmission Characteristics

Unless otherwise noted, limits printed in BOLD characters are guaranteed for V

CC

e a

5.0V

g

5%, V

BB

e b

5.0V

g

5%; T

A

e

0

§

C to 70

§

C by correlation with 100% electrical testing at T

A

e

25

§

C. All other limits are assured by correlation with other

production tests and/or product design and characterization. GNDA

e

0V, f

e

1.02 kHz, V

IN

e

0 dbm0, transmit input amplifier

connected for unity gain non-inverting. Typicals specified at V

CC

e a

5.0V, V

BB

e b

5.0V, T

A

e

25

§

C.

Symbol

Parameter

Conditions

Min

Typ

Max

Units

AMPLITUDE RESPONSE

Absolute Levels

Nominal 0 dBm0 Level is 4 dBm

(Definition of

(600X)

nominal gain)

0 dBm0

1.2276

Vrms

t

MAX

Virtual Decision Value Defined

Max Transmit Overload Level

per CCITT Rec. G711

TP3064 (3.17 dBm0)

2.501

V

PK

TP3067 (3.14 dBm0)

2.492

V

PK

G

XA

Transmit Gain, Absolute

T

A

e

25

§

C, V

CC

e

5V, V

BB

e b

5V

b

0.15

0.15

dB

G

XR

Transmit Gain, Relative to G

XA

f

e

16 Hz

b

40

dB

f

e

50 Hz

b

30

dB

f

e

60 Hz

b

26

dB

f

e

200 Hz

b

1.8

b

0.1

dB

f

e

300 Hz-3000 Hz

b

0.15

0.15

dB

f

e

3300 Hz

b

0.35

0.05

dB

f

e

3400 Hz

b

0.7

0

dB

f

e

4000 Hz

b

14

dB

f

e

4600 Hz and Up, Measure

b

32

dB

Response from 0 Hz to 4000 Hz

G

XAT

Absolute Transmit Gain Variation

Relative to G

XA

b

0.1

0.1

dB

with Temperature

G

XAV

Absolute Transmit Gain Variation

Relative to G

XA

b

0.05

0.05

dB

with Supply Voltage

G

XRL

Transmit Gain Variations with

Sinusoidal Test Method

Level

Reference Level

e b

10 dBm0

VF

X

I

a

e b

40 dBm0 to

a

3 dBm0

b

0.2

0.2

dB

VF

X

I

a

e b

50 dBm0 to

b

40 dBm0

b

0.4

0.4

dB

VF

X

I

a

e b

55 dBm0 to

b

50 dBm0

b

1.2

1.2

dB

G

RA

Receive Gain, Absolute

T

A

e

25

§

C, V

CC

e

5V, V

BB

e b

5V

b

0.15

0.15

dB

Input

e

Digital Code Sequence

for 0 dBm0 Signal

G

RR

Receive Gain, Relative to G

RA

f

e

0 Hz to 3000 Hz

b

0.15

0.15

dB

f

e

3300 Hz

b

0.35

0.05

dB

f

e

3400 Hz

b

0.7

0

dB

f

e

4000 Hz

b

14

dB

G

RAT

Absolute Receive Gain Variation

Relative to G

RA

b

0.1

0.1

dB

with Temperature

G

RAV

Absolute Receive Gain Variation

Relative to G

RA

b

0.05

0.05

dB

with Supply Voltage

G

RRL

Receive Gain Variations with

Sinusoidal Test Method; Reference

Level

Input PCM Code Corresponds to an
Ideally Encoded

b

10 dBm0 Signal

PCM Level

e b

40 dBm0 to

a

3 dBm0

b

0.2

0.2

dB

PCM Level

e b

50 dBm0 to

b

40 dBm0

b

0.4

0.4

dB

PCM Level

e b

55 dBm0 to

b

50 dBm0

b

1.2

1.2

dB

V

RO

Receive Filter Output at VF

R

O

RL

e

10 kX

b

2.5

2.5

V

10

background image

Transmission Characteristics

(Continued)

Unless otherwise noted, limits printed in BOLD characters are guaranteed for V

CC

e a

5.0V

g

5%, V

BB

e b

5.0V

g

5%; T

A

e

0

§

C to 70

§

C by correlation with 100% electrical testing at T

A

e

25

§

C. All other limits are assured by correlation with other

production tests and/or product design and characterization. GNDA

e

0V, f

e

1.02 kHz, V

IN

e

0 dbm0, transmit input amplifier

connected for unity gain non-inverting. Typicals specified at V

CC

e a

5.0V, V

BB

e b

5.0V, T

A

e

25

§

C.

Symbol

Parameter

Conditions

Min

Typ

Max

Units

ENVELOPE DELAY DISTORTION WITH FREQUENCY

D

XA

Transmit Delay, Absolute

f

e

1600 Hz

290

315

m

s

D

XR

Transmit Delay, Relative to D

XA

f

e

500 Hz

b

600 Hz

195

220

m

s

f

e

600 Hz

b

800 Hz

120

145

m

s

f

e

800 Hz

b

1000 Hz

50

75

m

s

f

e

1000 Hz

b

1600 Hz

20

40

m

s

f

e

1600 Hz

b

2600 Hz

55

75

m

s

f

e

2600 Hz

b

2800 Hz

80

105

m

s

f

e

2800 Hz

b

3000 Hz

130

155

m

s

D

RA

Receive Delay, Absolute

f

e

1600 Hz

180

200

m

s

D

RR

Receive Delay, Relative to D

RA

f

e

500 Hz

b

1000 Hz

b

40

b

25

m

s

f

e

1000 Hz

b

1600 Hz

b

30

b

20

m

s

f

e

1600 Hz

b

2600 Hz

70

90

m

s

f

e

2600 Hz

b

2800 Hz

100

125

m

s

f

e

2800 Hz

b

3000 Hz

145

175

m

s

NOISE

N

XC

Transmit Noise, C Message

TP3064 (Note 1)

12

15

dBrnC0

Weighted

N

XP

Transmit Noise, Psophometric

TP3067 (Note 1)

b

74

b

67

dBm0p

Weighted

N

RC

Receive Noise, C Message

PCM Code Equals Alternating

Weighted

Positive and Negative Zero
TP3064

8

11

dBrnCO

N

RP

Receive Noise, Psophometric

PCM Code Equals Positive

Weighted

Zero
TP3067

b

82

b

79

dBm0p

N

RS

Noise, Single Frequency

f

e

0 kHz to 100 kHz, Loop Around

b

53

dBm0

Measurement, VF

X

I

a

e

0 Vrms

PPSR

X

Positive Power Supply Rejection,

V

CC

e

5.0 V

DC

a

100 mVrms

Transmit

f

e

0 kHz

b

50 kHz (Note 2)

40

dBC

NPSR

X

Negative Power Supply Rejection,

V

BB

e b

5.0 V

DC

a

100 mVrms

Transmit

f

e

0 kHz

b

50 kHz (Note 2)

40

dBC

PPSR

R

Positive Power Supply Rejection,

PCM Code Equals Positive Zero

Receive

V

CC

e

5.0 V

DC

a

100 mVrms

Measure VF

R

O

f

e

0 Hz

b

4000 Hz

38

dBC

f

e

4 kHz

b

50 kHz

25

dB

NPSR

R

Negative Power Supply Rejection,

PCM Code Equals Positive Zero

Receive

V

BB

e b

5.0 V

DC

a

100 mVrms

Measure VF

R

O

f

e

0 Hz

b

4000 Hz

40

dBC

f

e

4 kHz

b

25 kHz

40

dB

f

e

25 kHz

b

50 kHz

36

dB

SOS

Spurious Out-of-Band Signals

0 dBm0, 300 Hz

b

3400 Hz Input

at the Channel Output

PCM Code Applied at DR
Measure Individual Image Signals at
VF

R

O

4600 Hz – 7600 Hz

b

32

dB

7600 Hz – 8400 Hz

b

40

dB

8400 Hz – 100,000 Hz

b

32

dB

11

background image

Transmission Characteristics

(Continued)

Unless otherwise noted, limits printed in BOLD characters are guaranteed for V

CC

e a

5.0V

g

5%, V

BB

e b

5.0V

g

5%; T

A

e

0

§

C to 70

§

C by correlation with 100% electrical testing at T

A

e

25

§

C. All other limits are assured by correlation with other

production tests and/or product design and characterization. GNDA

e

0V, f

e

1.02 kHz, V

IN

e

0 dbm0, transmit input amplifier

connected for unity gain non-inverting. Typicals specified at V

CC

e a

5.0V, V

BB

e b

5.0V, T

A

e

25

§

C.

Symbol

Parameter

Conditions

Min

Typ

Max

Units

DISTORTION

STD

X,

Signal to Total Distortion

Sinusoidal Test Method (Note 3)

STD

R

Transmit or Receive

Level

e

3.0 dBm0

33

dBC

Half-Channel

e

0 dBm0 to

b

30 dBm0

36

dBC

e b

40 dBm0

XMT

29

dBC

RCV

30

dBC

e b

55 dBm0

XMT

14

dBC

RCV

15

dBC

SFD

X

Single Frequency Distortion,

b

46

dB

Transmit

SFD

R

Single Frequency Distortion,

b

46

dB

Receive

IMD

Intermodulation Distortion

Loop Around Measurement,

b

41

dB

VF

X

I

a

e b

4 dBm0 to

b

21 dBm0, Two

Frequencies in the Range
300 Hz

b

3400 Hz

CROSSTALK

CT

X-R

Transmit to Receive Crosstalk

f

e

300 Hz

b

3000 Hz

D

R

e

Quiet PCM Code

b

90

b

75

dB

CT

R-X

Receive to Transmit Crosstalk

f

e

300 Hz

b

3000 Hz, VF

X

I

e

0V

b

90

b

70

dB

(Note 2)

POWER AMPLIFIERS

V

O

PA

Maximum 0 dBm0 Level

Balanced Load, R

L

Connected Between

(Better than

g

0.1 dB Linearity over

VPO

a

and VPO

b

.

the Range

b

10 dBm0 to

a

3 dBm0)

R

L

e

600X

3.3

Vrms

R

L

e

1200X

3.5

Vrms

S/D

P

Signal/Distortion

R

L

e

600X

50

dB

Note 1:

Measured by extrapolation from the distortion test result at

b

50 dBm0.

Note 2:

PPSR

X

, NPSR

X

, and CT

R

b

X

are measured with a

b

50 dBm0 activation signal applied to VF

X

I

a

.

Note 3:

TP3064 is measured using C message weighted filter. TP3067 is measured using psophometric weighted filter.

12

background image

Applications Information

POWER SUPPLIES

While the pins of the TP3060 family are well protected
against electrical misuse, it is recommended that the stan-
dard CMOS practice be followed, ensuring that ground is
connected to the device before any other connections are
made. In applications where the printed circuit board may be
plugged into a ‘‘hot’’ socket with power and clocks already
present, an extra long ground pin in the connector should
be used.

All ground connections to each device should meet at a
common point as close as possible to the GNDA pin. This

minimizes the interaction of ground return currents flowing
through a common bus impedance. 0.1 mF supply decou-
pling capacitors should be connected from this common
ground point to V

CC

and V

BB

, as close to the device as

possible.

For best performance, the ground point of each CODEC/
FILTER on a card should be connected to a common card
ground in ‘‘STAR’’ formation, rather than via a ground bus.
This common ground point should be decoupled to V

CC

and

V

BB

with 10 mF capacitors.

Note:

See Application Note 370 for further details

Typical Asynchronous Application

TL/H/5070 – 5

Note 1:

Transmit gain

e

20

c

log

#

R1

a

R2

R2

J

,(R1

a

R2)

t

10 kX

Note 2:

Receive gain

e

20

c

log

#

2

c

R3

R4

J

,R4

t

10 kX

FIGURE 4

13

background image

Definitions and Timing Conventions

DEFINITIONS

V

IH

V

IH

is the d.c. input level above which

an input level is guaranteed to appear
as a logical one. This parameter is to
be measured by performing a
functional test at reduced clock
speeds and nominal timing, (i.e. not
minimum setup and hold times or
output strobes), with the high level of
all driving signals set to V

IH

and

maximum supply voltages applied to
the device

V

IL

V

IL

is the d.c. input level below which

an input level is guaranteed to appear
as a logical zero to the device. This
parameter is measured in the same
manner as V

IH

but with all driving

signal low levels set to V

IL

and

minimum supply voltages applied to
the device.

V

OH

V

OH

is the minimum d.c. output level

to which an output placed in a logical
one state will converge when loaded
at the maximum specified load current.

V

OL

V

OL

is the maximum d.c. output level

to which an output placed in a logical
zero state will converge when loaded
at the maximum specified load current.

Threshold Region The threshold region is the range of

input voltages between V

IL

and V

IH

.

Valid Signal

A signal is Valid if it is in one of the
valid logic states, (i.e. above V

IH

or

below V

IL

). In timing specifiations, a

signal is deemed valid at the instant it
enters a valid state.

Invalid Signal

A signal is Invalid if it is not in a valid
logic state, i.e. when it is in in the
threshold region between V

IL

and V

IH

.

In timing specifications, a signal is
deemed Invalid at the instant it enters
the threshold region.

TIMING CONVENTIONS

For the purposes of this timing specification, the following
conventions apply:

Input Signals

All input signals may be characterized
as: V

L

e

0.4V, V

H

e

2.4V, t

R

k

10 ns,

t

F

k

10 ns.

Period

The period of clock signal is
designated as t

Pxx

where xx

represents the mnemonic of the clock
signal being specified.

Rise Time

Rise times are designated as t

Ryy

,

where yy represents a mnemonic of
the signal whose rise time is being
specified. t

Ryy

is measured from V

IL

to

V

IH

.

Fall Time

Fall times are designated as t

Fyy

,

where yy represents a mnemonic of
the signal whose fall time is being
specified. t

Fyy

is measured from V

IH

to

V

IL

.

Pulse Width High

The high pulse width is designated as
t

WzzH

, where zz represents the

mnemonic of the input or output signal
whose pulse width is being specified.
High pulse widths are measured from
V

IH

to V

IH

.

Pulse Width Low

The low pulse width is designated as
t

WzzL

, where zz represents the

mnemonic of the input or output signal
whose pulse width is being specified.
Low pulse widths are measured from
V

IL

to V

IL

.

Setup Time

Setup times are designated as t

Swwxx

,

where ww represents the mnemonic of
the input signal whose setup time is
being specified relative to a clock or
strobe input represented by mnemonic
xx. Setup times are measured from the
ww Valid to xx Invalid.

Hold Time

Hold times are designated as t

Hxxww

,

where ww represents the mnemonic of
the input signal whose hold time is
being specified relative to a clock or
strobe input represented by mnemonic
xx. Hold times are measured from xx
Valid to ww Invalid.

Delay Time

Delay times are designated as t

Dxxyy

Hi to Low, where xx represents the
mnemonic of the input reference
signal and yy represents the
mnemonic of the output signal whose
timing is being specified relative to xx.
The mnemonic may optionally be
terminated by an H or L to specify the
high going or low going transition of
the output signal. Maximum delay
times are measured from xx Valid to yy
Valid. Minimum delay times are
measured from xx Valid to yy Invalid.
This parameter is tested under the
load conditions specified in the
Conditions column of the Timing
Specifications section of this data
sheet.

14

background image

15

background image

Physical Dimensions

inches (millimeters)

Cavity Dual-In-Line Package (J)

Order Number TP3064J or TP3067J

NS Package Number J20A

Molded Small Outline Package (WM)

Order Number TP3064WM or TP3067WM

NS Package Number M20B

16

background image

Physical Dimensions

inches (millimeters) (Continued)

Molded Dual-In-Line Package (N)

Order Number TP3064N or TP3067N

NS Package Number N20A

17

background image

TP3064,

TP3067

‘‘Enhanced’’

Serial

Interface

CMOS

CODEC/Filter

COMBO

Physical Dimensions

inches (millimeters) (Continued)

Lit.

Ý

113975

Plastic Chip Carrier (V)

Order Number TP3064V or TP3067V

NS Package Number V20A

LIFE SUPPORT POLICY

NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL
SEMICONDUCTOR CORPORATION. As used herein:

1. Life support devices or systems are devices or

2. A critical component is any component of a life

systems which, (a) are intended for surgical implant

support device or system whose failure to perform can

into the body, or (b) support or sustain life, and whose

be reasonably expected to cause the failure of the life

failure to perform, when properly used in accordance

support device or system, or to affect its safety or

with instructions for use provided in the labeling, can

effectiveness.

be reasonably expected to result in a significant injury
to the user.

National Semiconductor

National Semiconductor

National Semiconductor

National Semiconductor

Corporation

Europe

Hong Kong Ltd.

Japan Ltd.

1111 West Bardin Road

Fax: (a49) 0-180-530 85 86

13th Floor, Straight Block,

Tel: 81-043-299-2309

Arlington, TX 76017

Email: cnjwge

@

tevm2.nsc.com

Ocean Centre, 5 Canton Rd.

Fax: 81-043-299-2408

Tel: 1(800) 272-9959

Deutsch Tel: (a49) 0-180-530 85 85

Tsimshatsui, Kowloon

Fax: 1(800) 737-7018

English

Tel: (a49) 0-180-532 78 32

Hong Kong

Fran

3ais Tel: (a49) 0-180-532 93 58

Tel: (852) 2737-1600

Italiano

Tel: (a49) 0-180-534 16 80

Fax: (852) 2736-9960

National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications.


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