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E365 Theory of Operation 

 
 

 

 

Service Manual

 

 

 

 

 

Compal Communications, Inc.

 

 

 

 

 

 

 

 

 

 

 

 

 

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Baseband function Descriptions   

1. Introduction 

Baby Garnet use TI’s chipset (Calypso c035 and IOTA) as base-band 
solution. Calypso c035 is a GSM digital base-band logic included 
microprocessor , DSP , and peripheral. IOTA is GSM analog/codec solution. 
It contains the base-band codec, voice-band codec, several voltage 
regulators and SIM level shifter etc. The baby garnet add some features such 
as digital camera , photo sensor , TFT display , sixteen tone melody etc.   

2. Base-band 

block 

3. Theory 

3.1 CALYPSO 

    Calypso is a chip implement the digital base-band processes of a GSM/GPRS 
mobile phone. The chip combines a DSP sub-chip (LEAD2 CPU) with its 
program and data memories, a micro-controller core with emulation 
facilities(ARMTDMIE), internal 8Kb of boot ROM memory , 4M bit SRAM 
memory , a clock squarer cell, several compiled single-port or 2 ports RAM and 
CMOS gates.   

UART_MODERN  

UART_IRDA  

NCS

0

NC

S3

PWL 

KBR 

KBC 

Ncs

2

 

ARM SERIAL PORT 

HSO

AUX

DAC 

VCC4 

VBACKUP 

VCHG 

TPU SERIAL 

TPU PARALLEL 

Power Management 

Voice Band Interface 

32.768kHz 

Base band Interface 

SIM interface Interface 

EARN 

MIC

Melody 
Speaker 

Tx & Rx I/Q 

uWIR

E

n

SC

S0

EARP 

NCS

4

NC

S1

NCS

1

I/O 

32.768kHz 

13MHz 

DA

T

A

 B

U

S

 

AD

DR

E

S

S

 

BUS

 

 

 
 
 

 

 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
      
    
      

 

 

 

 
 
 
 
 
 
 
 
 
 

 

 

 

 

 

 

U15 

 

Digital baseband processor 

 

 

 

U1 

 

GSM/DCS Baseband and Voice A/D and 

D/A RF Interface Circuit With Power 

Supply Management 

TFT 
Color  
Display 

KEYPAD 

BACKLIGHT 

KEYPAD 

MATRIX 

MAIN 

BATTERY

128M bits FLASH 

U6

 

16M bits SRAN 

U7 

 

DIGITAL CAMERA 

 

SIM 

Regulator  

& Shifter 

 

RF- Base_Band Interface ( RIF )

(BBC, APC, AFC,ADAC) 

BACKUP

BATTERY

Melody 

IC 

VIBRATOR 

13MHz 

Miscellaneous 

PHONE 

JACK

Monitoring 

ADC 

(MADC) 

JTAG(TAP) 

ADPATOR IN 

(DC Power Input) 

Charging function

LCD BACKLIGHT 

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3.1.1 Real Time Clock (RTC) 

3.1.2 Pulse Width Tones (PWT) 

          The PWT generates a modulated frequency signal for the external buzzer. 
Frequency is programmable between 349Hz and 5276Hz with 12 half tone 
frequencies per octave. 

3.1.3 Pulse Width Light (PWL) 

        The PWL allows the control of the backlight of LCD and keypad by 

employing a 4096bit random sequence. The block used a switchable clock of 
32kHz . 

3.1.4 Modem-Uart 

3.1.5 I2c master serial interface (I2C) 

3.1.6 General purposes I/O (GPIO) 
    Calypso provides 16 GPIOs in read or write mode by internal registers. In 

Baby garnet we use 9 of them as follows. 

GPIO PIN 

Used As.. 

Description 

IO0 / TPU_WAIT 

IO0 

DTR_MODEM Output ; RS232 DTR output signal 

IO1 / TPU_IDLE 

IO1 

disable  

IO2 / IRQ4 

IO2 

LEDLCM_EN: LCM backlight=1 active   

IO3 / SIM_RnW 

IO3 

LCDA0 ; LCD Data or Command Control signal 

IO4 / TSPDI 

IO4 

nIRQ_melody:Melody IC interrupt, active=0     

IO5 / SIM_PWCTRL 

SIM_PWCTRL  For SIM Card Power Control   

IO6 / BCLKX 

IO6 

EAR_DETECT ; input 

IO7 / NRESET_OUT 

nRESET_OUT ? LCD Peripherals reset 

IO8 / MCUEN1 

IO8 

nIO_PWR_EN: Accessary power control : active=1 

IO9 / MCSI_TXD 

MCSI_TXD 

DAI interface ,reserved; disable 

IO10 / MCSI_RXD 

IO10 

COMS_LDO_EN ; active=1 

IO11 / MCSI_CLK 

IO11 

COMS_ASK ; input 

IO12/    MCSI_FSYNCH IO12 

IO_PWR_EN: Accessary power control : active=1

IO13 / MCUEN2 

IO13 

LCD_ID; input 

IO14 / nBHE 

nBHE 

nBHE 

IO15 / nBLE 

nBLE 

nBLE 

3.1.7 Serial Port Interface (SPI) 
    The SPI is a full-duplex serial port configurable from 1 to 32 bits and 

provides 3 enable signals programmable either as positive or negative edge or 
level sensitive. We use SPI to control the melody IC.   

nSCS0 :Chip select 0 
SDO: Data out. 
SDI: Data in 

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SCLK: Serial clock 

3.1.8 Memory interface and internal static RAM 
  A 4Mbit SRAM is embedded on the die and memory mapped on the 

chip-select CS6 of the memory interface. 

3.1.9 SIM interface   

3.1.10 JTAG 

3.1.11 Time Serial Port (TSP) 

3.1.12 TSP Parallel interface (ACT) 

Herculse Pin no   Pin Name   

Used As..

Description/Net 

M12 TSPACT0 

TP5 X 

M14 

TSPACT1 

TSPACT1 PAENA (Chip enable for 

Power Amp IC) 

L12 

TSPACT2 

TSPACT2 PDNB (RF IC power down 

control) 

L13 TSPACT3 

TSPACT3 X 

J10 TSPACT4 

TSPACT4 X 

K11 TSPACT5 

TSPACT5 X 

K13 TSPACT6/nCS6 TSPACT6 TRENA 

(T/R 

switch 

enable) 

K12 TSPACT7/CLKX_SPI 

NC  X 

K14 

TSPACT8/Nmreq 

TSPACT8 GSM_TXEN (Used both 

within the RF switch and 

the Power Amp to select the 

GSM Frequency Band) 

J11 TSPACT9/MAS1 

TSPACT9 X 

J12 TSPACT10/nWAIT 

NC X 

J13 TSPACT11/MCLK 

NC X 

3.1.13 Radio Interface (RIF) 

3.2 IOTA 

        IOTA is an analog base-band device which a digital base-band device is 

part of a TI DSP solution intended for digital cellular telephone applications. 
This includes the GSM 900, DCS 1800, PCS 1900 standards. 

        IOTA includes a complete set of base-band functions that perform the 

interface and processing of the following voice signals, the base-band in 
phase(I) and quadrature (Q) signals. Which support both the single-slot and 
multislot modes. IOTA also includes associated auxiliary RF control features 
supply voltage regulation, battery charging controls , and switch on/off 
system analysis.   

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        IOTA interfaces with the CALYPSO through a digital base-band port and a 

voicebad serial port. The signal ports communicate with a DSP core. A 
microcontroller serial port communicates with the microcontoller core and a 
time serial port communicates with the time processing unit for real-time 
control. 

         

3.2.1 Base-band Codec (BBC) 

3.2.2 Automatic Frequency Control ( AFC) 

3.2.3 Automatic Power Control ( APC) 

3.2.4 Time serial port (TSP) 

3.2.5 Voice band Codec (VBC) 

3.2.6 SIM card shifters (SIMS) 

3.2.7 Voltage Regulation (VREG) 

Several low-dropout(LDO) linear voltage regulation supply power to 

internal analog and digital circuits to the DBB processor and to external 
memory 

  a. VRDBB is a programmable regulator that generates the supply 

voltages( 1.8V , 1.5V , and 1.3V) for the core of the CALYPSO. In baby 
garnet , it is programmed to 1.5V. During all modes, the main battery directly 
supplies VRDBB.   

    b. VRIO is a programmable regulator that generates the supply voltages(2.8V) 

for I/Os of the CALYPSO and IOTA. During all modes, the main battery 
directly supplies VRIO. 

c. VRMEM is a programmable regulator that generates the supply 
voltages(2.8V and 1.8V) for external memories (typically flash memories) 
and CALYPSO memory interface I/Os. In baby garnet , it is programmed to 
2.8V. During all modes, the main battery directly supplies VRMEM. 

d. VRRAM is a programmable regulator that generates the supply 
voltages(2.8V and 1.8V) for external memories (typically SRAM memories) 
and CALYPSO memory interface I/Os. In baby garnet , it is programmed to 
2.8V. During all modes, the main battery directly supplies VRRAM. 

    e. VRABB is a programmable regulator that generates the supply voltages 

(2.8V ) for the analog functions of the IOTA. During all modes, the main 
battery directly supplies VRRAM. 

    f. VRSIM is a programmable regulator that generates the supply voltages 

(2.9V and 1.8V )for SIM card and SIM card drivers. During all modes, the 
main battery directly supplies VRRAM. 

    g. VRRTC is programmable regulator that generates the supply voltages 

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(1.3V, 1.5V ,and 1.8V) for CALYPSO’s backup RTC. It is switched on the 
main or backup battery, depending on the phone state. 

  3.2.8 Base-band Serial Port (BSP) 

  3.2.9 Battery charger interface (BCI) 

  3.2.10 Monitoring ADC (MADC) 

  3.2.11 Reference Voltage / Power on control (VRPC) 

3.2.12 Internal bus and interrupt controller( IBIC) 

 

3.3power supply circuit 

   

 
 
 
 
 
 

IO TA  

G S M /D C S  B aseband 
and Voice A /D   and 
D /A R F Interface 
C ircuit W ith P ow er 
Supply M anagem ent 
 

E x ternal 1.8v 
150m A  

E x ternal 2.8v 
300m A  

C A LY P SO  

D ig ita l 

b a seb a n d  

p ro cesso r

 

V R SIM   1.8V /2.9V

V R S A M  2.8V  
V R M E M   2.8V  

V R D B B  1.5V  
V R IO  2.8V  
V R A B B  2.8V  

V R RT C  1.5V

Flash core 128M B it
Flash I/O  

S R A M  16M B it 

LC M   

S IM  card

Light sensor   

E x ternal 2.5v 
150m A  

E x ternal 3.3v 
150m A  

B ackend core 
I/O  

C m os sensor   

 

The phone is mainly supplied from the main battery. The main battery supply 

the two parts : RF block, base-band block. 
The input power to IOTA is divided into 4 blocks. 
VCRAM: to provide power for VRRAM 
VCMEM: to provide power for VRMEM 
VCIO1,VCIO2: to provide power for VRIO and VRSIM 
VCABB: to provide power for VRABB 
VCDBB: to provide power for VRDBB 
The IOTA provides seven low drop-out voltage regulators. 
VRRAM:2.8V@50mA, to supply SRAM   
VRMEM:2.8V@60mA, to supply flash I/O and CALYPSO memory interface 
I/Os. 
VRDBB;1.5V@120mA. to supply the core of the CALYPSO 
VRIO:2.8V@100mA, to supply I/Os of the CALYPSO and IOTA   

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VRABB;2.8V@50mA to supply the analog functions of the IOTA 
VRRTC:1.5V@10uA, to supply the CALYPSO’s backup RTC. 
VRSIM:1.8V or 2.9V@10mA , to supply the SIM. 
 
 

3.4 memory circuit 

 

CALYPSO 

         
 
 
                               
 
                         

NCS0 
NCS3 
NFOE 
FDP 
RNW 
NCS1 
NBHE 
NBLE 

        FLASH 
 
 
 
 
 
 
 
/CE 
/OE 
/RST 
/WE 

SRAM 

 
 
 
 
 
 
/CE 
/OE 
/HB 
/LB 
/WE

 

Address bus

Data bus

 

 

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Description 

Flash is a 128Mbit device, supported by external LDO and VRMEM. The 

access time of flash is 90ns. The total 128Mbit are divided into two sections: 
112Mbit is used for software program code and 16Mbit is used for user’s data. 

SRAM is a 16Mbit device supported by VRRAM. The access time of flash is 

70ns. 

 

3.5 display circuit 

LCD_RD

DGND

DGND

DGND

DGND

DGND

DGND

DGND

DGND

DGND

DGND

DGND

DGND

DGND

DGND

DGND

DGND

DGND

DGND

DGND

LED_Anode

DGND

DGND

VBAT

VDDS-MIF_2.8V

DGND

DGND

Up

Down

VDDS-MIF_2.8V

nRESET

LCD_ID

nCS2

LCDA0

RNW

LED_Cathode

C81

22P

F

 0402

C720

22P

F

 0402

C76

22P

F

 0402

C85

22P

F

 0402

C83

22P

F

 0402

C74

22P

F

 0402

C82

22P

F

 0402

 R75 200 0402

 R77 100 0402

R71

200 0408

1

8

2

7

3

6

4

5

R70

200 0408

1

8

2

7

3

6

4

5

R69

200 0408

1

8

2

7

3

6

4

5

C722

100PF 0402

R68

200 0408

1

8

2

7

3

6

4

5

C94

22P

F

 0402

 R76 200 0402

C91

22P

F

 0402

C92

22P

F

 0402

C93

22P

F

 0402

C89

22P

F

 0402

C90

22P

F

 0402

C87

22P

F

 0402

C721

22P

F

 0402

C84

22P

F

 0402

C79

22P

F

 0402

C80

22P

F

 0402

C77

22P

F

 0402

C78

22P

F

 0402

J5

CON30

Cathode

30

Anode

29

D13

28

D14

27

D15

26

/RESET

25

VCC

24

VCC

23

D12

22

D11

21

D9

19

D10

20

D8

18

D7

17

D6

16

D5

15

D4

14

D3

13

D2

12

D1

11

D0

10

/RD

9

/WR

8

RS

7

/CS

6

GND

5

GND

4

LCD_ID

3

NC

2

NC

1

C88

22P

F

 0402

VDDS-MIF_2.8V

VBAT

D[0..15]

 

Description 

    The display area is a 128*160 resolution LCD module. The power of LCDM 
is supplied from external LDO (2.8V). It is controlled by CALYPSO via parallel 
interface : data bus and chip select .The Ncs2 is low active to enable the LCDM 
data bus. Resistance and capacitance is used for radiation suppression.   

 

 

 

 

 

 

 

 

 

 

 

 

 

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3.6vibrater circuit 

VBAT

3930408801W

0.95mm

DAC

No. G3240010

BQ1

2SC5592 SC59

2

1

3

M1

MOTOR 4.0*8.8-1.5V-KHN4NZ1D

D4

1SS400 SC79

2

1

R43

10K 0402

R42

33 0402 

1

2

F1

SGM20F1E104-2A 2012

I/O1

1

I/O2

2

G

3

G

4

DGND

DGND

DGND

DGND

 

DAC of the IOTA is used to control the vibrational level. D4 is used to 

protection the vibrater. In the 3.8V, the DAC output voltage is 1.9V and drain 
current is around 90mA .   

 

3.7 speaker circuit 

 

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Description 

The Melody IC MA2 works as follows.   
First, the CPU (G2) fetch melody data from flash and fed them into MA2 

by serial interface. After receiving these data, MA2 will start decode its content 
and start its sequencer for processing. After completing this process, the MA2 
will generate the tones we want according to the melody data. Then, these data 
will run through MA2’s DAC, which inside it. Then, the converted signal is fed 
into an equalizer, and then followed by an amplifier, which they are inside MA2. 
Then this signal will be outputted from SPOUT1 and SPOUT2 to drive the 
speaker. 

Here, the R44 and R46 provide optimal gain control for MA2. To ensure 

the speaker not to be overdrove. 

 

3.8  DSC (Digital Still Camera) function block diagram and circuit 

description 

 

 

 

 

 

3.8.1  Function block diagram 

 

 

 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 

 

Backend 

(W99688) 

 
 

Host 

(Calypso 035)

 
 

LCM 

Toppoly 

 

SRAM 

(a)

(b)

(c)

(d)

CMOS 

SENSOR

SCCB 

CF 

Data path 

Control path

Interface 

Memory 

interface

Fig. 1 Imbedded DSC block diagram 

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Imbedded DSC included two portions, one is front-end sensor module and 
another is backend DSP chip. There are including two interfaces which are 
SCCB (Serial Camera Control Bus) and CF (Compact Flash). The function 
block diagram is shown in Fig.1. The SCCB is used in sensor to backend 
interface, and the backend to host (G2) is used CF interface. 

3.8.1. Sensor to Backend Interface 

 

 
 
 
 
 
 
 
 
 
 

RESET: (default 0) chip reset with active high 

PWDN: (default 0) power down mode selection 

“0” normal mode, “1” power down mode 

SIO_C: SCCB (Single Chip Camera Bridge) serial interface clock input   

SIO_D: SCCB (Single Chip Camera Bridge) serial interface data input and 
output 

XCLK: Clock input 

PCLK: Pixel clock output 

VSYNC: Vertical sync output 

HSYNC: Horizontal sync output 

Data Bus: 8 bits 

 

Backend 

(W99688) 

 

CMOS SENSOR 

DATA BUS 

HSYNC 

VSYNC 

PCLK 

XCLK 

SIO_D 

SIO_C 

PWDN 

RESET

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3.8.1.2 Backend to Sensor 

Interface

 

 

A0..A3: Compact Flash: Address-0~3 for command 

D15..D0: Data bus connect to Host 

RD#: Read data or command 

WR#: Write data or command 

CS#: Chip select 
 
 
 
 
 
 
 
 
 
 
 
 
 
 

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3.8.2 Circuit 

description 

3.8.2.1 Main circuit 

DGND

DGND

TP26

TP

T

1

TP25

TP

T

1

TP27

TP

T

1

TP28

TP

T

1

TP29

TP

T

1

J6

CMOS_CON

GND

1

HREF

2

VSYNC

3

PWDN

4

PCLK

5

AVDD

6

DVDD

7

SIO_D

8

XCLK

9

SIO_C

10

Y0

11

Y1

12

Y2

13

Y3

14

GND

15

Y4

16

Y5

17

Y6

18

Y7

19

RESET

20

RR16

10K

DD0

DD[0..7]

PWDN

DD0

DD7

A2

S22

CAMERA

SCK

DD[0..7]

DD2

DD4

D2

DD6

DD25V

CLOSED TO 

D4

COL4

DGND

DGND

R80

4.7K 0402

DGND

R81

4.7K 0402

DD5

DD7

DD4

DD3

D[0..7]

ROW4

DD25V

A

V

DDP

C96
1u 0603

D5

AVSSP

DGND

DD3

D1

DD1

A3

DGND

D7

S25V

DGND

DD6

D0

SCK
SDA

R79

47 0402

DD2

D3

A1

DD1

RNW

nF
O

E

SDA

nC
S4

A[1..3]

688 ASAP

C

L

K13M_D

SC

CMOS SENSOR MODULE I/F

R80:

U12

688CBM3

VD

3-

1

C1

0

F

IR

Q

/F

SR

B#/F

WP

A10

FI

O

RD#

/F

S

R

E

#

/X

CM

D

B10

F

IOWR

#

/F

SWE#/F

C

M

D

B9

F

C

E2#/F

S

C

L

E/XC

LK

C8

F

C

E1#/F

SALE

C9

FRE

G

#

/FS

W

P

#

/FCL

K

A9

G

ND-1

C1

1

FD0

/FDA

T

0

H3

FD1

/FDA

T

1

C7

FD2

/FDA

T

2

B8

FD3

/FDA

T

3

J2

F

D

4/XD

AT

0

A8

F

D

5/XD

AT

1

C6

F

D

6/XD

AT

2

B7

F

D

7/XD

AT

3

D4

GPIO0

B6

VD

3-

2

A7

XIN

C4

XOU

T

A6

G

ND-2

C5

GPIO1

A5

AVSSP

A4

A

V

DDP

B4

VD

3-

3

A3

GND-3

A2

RESET

B3

GPIO10

C3

GPIO11

A1

GPIO12

D3

GPIO13

B2

GPIO14

C2

GPIO15

B1

VD3-4

C1

GND-4

D2

USBVSS

D1

DP

E3

DM

E2

USBVDD

E1

P30

F2

P31

F1

VD3-5

G2

VSSI-1

H2

VDDI-1

G1

GND-5

H1

VD3-6

J1

GND-6

L1

VD3-7

L2

GND-7

L3

VSSI-2

K1

MD

1

L4

V

DDI

-2

L5

GPIO3

L6

G

ND-8

L7

DD0

L9

DD1

K5

DD2

L8

DD3

K7

DD4

J7

DD5

K8

DD6

K9

DD7

J8

VD

3-

8

J6

DFUL

L

L10

D

VALID

J9

DO

CL

K

K10

DHS

K11

DV

S

L11

G

ND-9

J1

0

SD

0

H9

SD

1

J5

SD

2

H1

1

SD

3

H1

0

VSSI-

3

H8

SD5

G9

VDDI-3

J11

SD6

G11

SD7

K4

SD8

F9

SD9

F11

GND-10

E11

SPCLK

F10

SVS

J4

SHS

K3

SCLK

E10

SCK

H4

SDA

E9

SDO

D9

VD3-9

D11

FWAIT#

J3

FCD#

K2

FRST

D10

FA0

B11

FA1

D8

FA2

A11

SD

4

G1

0

VD3-D

G3

GND-F

B5

VD3-F

K6

GND-D

F3

DD5

FRST

RR4
100K 0402

D33V

DGND

CC8

33nF 0402

FPC 0.5mm PITCH

OV7645FB/TASC

D6

PWDN

RR22

0 0402 (OV)

SDO

RR20

0 0402 NM(Tasc)

DD25V

RR25

4.7k 0402 NM(Tacs)

RR23

0 0402 NM(Tasc)

RR24

0 0402 NM(Tasc)

DGND

DGND

RR5
10K 0402(OV)

SDO

D25V

C?
47nF 0402(Tasc)]

C726

100nF 0402

C725

100nF 0402

 

D33V: Power supply for I/O pads 

+3.3 V

 

DD25V: Power supply for CMOS sensor digital part 

+2.5 V

 

S25V: Power supply for CMOS sensor analog part 

+2.5 V

 

D25V: Internal core logic power supply. 

+2.5 V

.

 

AVDPP: Power supply for PLL analog 

2.5V

 

AVSSP: Ground for PLL analog 
FSRT: Compact flash: RESET/RESET# signal (High enable 

2.8V

Vsync & HREF relation: 
 
 
 
 
 
 
 

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The backend power on reset is 100ms that generated by 

C96

 (1uF) and 

RR4

 

(100k ohms). The backend clock 

CLK13M_DSC

 is 

13MHz (Vp-p 3.0V)

, and 

XCLK is 

24MHz ( Vp-p 3.35V) 

that is generated from backend to sensor. Then 

sensor will base on XCLK to generate PCLK for image data clock that is 
12MHz 

(Vp-p 2.3V)

 
 

3.8.2.2 DSC DC power 

C99

100nF 0402

DGND

RR9

100K 0402 nm

C97

2.2uF/6V 

C700

10nF 0402

DGND

DGND

DD25V

AVSSP

DGND

L6

100nH 0402

2.5V FOR OV7645FB

AVDDP

D33V

D25V

VBAT

DGND

COMS_EN

C98

1uF/6V 

L7

100nH 0402

U13

MIC2211-2.5/3.3BML

Vin

1

EN1

2

EN2

3

BYP

4

NC

7

NC

8

VOUT3.0

9

VOUT2.5

10

NC

5

GND

6

RR26

0 0603

L8

100nH 0402

S25V

RR26

1SS400 SC-79(W99685)

 

 

CMOS_EN

 is used to control DSC power enable. It is high active 

(2.8V)

. L6, 

L7 and L8 are formed low pass filter with C97 in order to suppress low 
frequency noise. 
 
 
 
 
 
 
 
 
 
 
 

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3.8.2.3 DSC system clock   

DGND

RR14

10

C724

100pF

X7R
0402
10%
50V

RR15

1M

DGND

U18

KIC7S04FU

SOT23-5

NC

1

IN

2

GND

3

VCC

5

OUT

4

C723

100pF

0402
10%
50V
NPO

CLK13M_DSC

D33V

CLK13M_OUT

 

Add buffer to avoid 

CLK13M_OUT

 over load causing system hang. 

 
3.8.3  Function flow chart 

3.8.3.1 Preview: 

 

 

Video Preview Path

W99688

Host

LCM

Preview Data Source

SRAM

Data Memory

2

3.CDM42 (Get Preview Data)

1

1.CDM40 (Set Single Capture Mode)
2.CDM41 (Set Preview Size 128x96)

RGB Data

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3.8.3.2 Capture: 

 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 

3.8.3.3 Playback: 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Capture Image Path

 

W99688

 

Host

LCM

 

Preview Data Source

 

SRAM

 

Data Memory

2

1

4.CDM2 (Get Jpeg Bitstream)

 

1.CDM40 (Set Single Capture Mode)

 

2.CDM41 (Set Image Format 640x480)

 

3.CDM43 (Snapshot)

Flash

 

Jpeg Data

 

Play Picture Path

W99688

 

Host

 

LCM

 

Preview Data Source

Preview Data

SRAM

Data Memory

 

1

Put Image

 

Transformation

 

2

3

4.CDM45 (Decode Jpeg Bitstream)

1.CDM40 (Set Playback Mode)

2.CDM48 (Set Decode Size 640x480)

3.CDM44 (Send Jpeg Bitstream)

Flash ROM

 

Jpeg Data

 

4

4.CDM47 (Get Decode Image Data)

RGB Data

 

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3.9 led 

circuit 

keypad backlight 

VBAT

DGND

D2

LED 

D3

LED 

D4

LED 

D5

LED 

D6

LED 

D7

LED 

R3

RS2N39 0404

R1

4

R1

1

R2

2

R2

3

R4

RS2N39 0404

R1

4

R1

1

R2

2

R2

3

VR1

14V 0402

D8

LED 

D9

LED 

R5

RS2N39 0404

R1

4

R1

1

R2

2

R2

3

R2

RS2N39 0404

R1

4

R1

1

R2

2

R2

3

C7

NM 47nF 0402

LEDB

DGND

KeyLed_En

R65

1.5K 0402

R64

0 0402 NM

BQ3

2SC5585 EMT3

2

1

3

C73

33nF 0402

R67

1K 0402

R66

4.7 0402

 

LCD module backlight 

U11

MP1523

SW

1

GND

2

FB

3

EN

4

BIAS

5

FL1

22uH

CC2

1uF 0603

R36

0 0402

R40

0 0402 NM

VDDS-MIF_2.8V

LED_Cathode

LEDLCM_EN

LED_Anode

VBAT

DGND

DGND

DGND

DGND

RR1

56 0402

D6

RB551V-30

2

3

CC1

0.22uF 0603

 

description 
The baby garnet employ three LEDs for LCD module backlight and six LEDs 
for keypad backlight. The keypad backlight is controlled by PWL (Pulse with 
light). The LCD module backlight is controlled by GPIO of the CALYPSO. The 
CALYPSO is used to enable BQ3 and U11. The total current of LCD backlight 
LED’s and keypad backlight LED’s is about 70mA during all LED work.   

 

 

 

 

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3.10 audio circuit 
Uplink: 

 

Downlink: 

 

Description 

The acoustic circuit can be divided into two parts, Uplink and Downlink 

path. 

For the Uplink path, the analog signal, or Voice, is fed into IOTA (MICIP 

and MICIN) by the microphone’s differential input. This signal is then sampled 
and transmitted into G2 DSP via the VSP (Voice-Band Serial Port) interface. 
After being modulated, the signal goes through the uplink I/Q path to the RF 
transceiver and then being transmitted by the antenna. 

The microphone is biased by the IOTA MICBIAS pin (2.5V). Where the 

bias circuit R58, R59, R60, R61 provide optimal operation point for the 
microphone. 

For the Downlink path, the signal is received from antenna. Then it is 

down-converted to I/Q signal and then send into G2 DSP. After being 
demodulated, the signal is then transmitted into IOTA via VSP interface. After 
re-construct this signal, this signal is then amplified and drove the receiver. 

 
 

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3.11 charging circuit 

3.11.1Function Block 

 

 

 

Ad

apter

 

AC

/DC

 

Cha

rgin

g Con

tr

ol 

OVP

(2

M

icr

o co

nt

ro

(IOT

A

Detect voltage

Detect current

Battery pack 

OCP 

 

3.11.2 function description 

When the charging device is plugged in, the charging scheme for the Li-ion 

battery is constant current first (MAX current is 

400

mA) then followed by 

constant voltage charging. When battery voltage has been detected full, the BCI 
of IOTA will be turned off till a Low voltage threshold has been detected. At 
charger plug OUT, the charger status bit CHG_STS is driven from “1” to “0” 
and an interrupt of the INT2 type is generated making the uC aware of the 
charging device unplug. When over-discharging (battery voltage is less than 
3.2V), the BCI of the IOTA will be the pre-charge state (charging current equal 
to 30mA). Until battery voltage bigger than 3.2V, it returns to normal charge. 
When ICHG bigger than 1 A, the OCP (over current protection) will be enabled. 
When the battery voltage is higher then 4.35V, the OVP (over voltage protection) 
will be enabled. 

 

 

 

 

 

 

 

 

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3.12 Earphone block diagram and circuit description 

3.12.1 Function block diagram   

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Fig. 1 Earphone block diagram 

 
The earphone circuit included audio jack, protect circuit, EMI circuit and 
Send-End key controller. The all design based on external earphone which 
characteristic is shown below. 
 

3.12.1.1 Outward appearance: 

 

 MIC  AUXO  GND 
 
 
 
 

CONNECT TO CELLPHONE 

 

3.12.1.2 Impedance: 
The status of send-end 
key 

Relaxed Pressed 

MIC TO GND 

1.7kΩ 

OPEN 

AUXO TO GND 

35Ω 35Ω 

Audio Jack

Protect

circuit 

EMI circuit

Send-End 

key 

controller 

Audio signal

Use r

o

w0 to 

 detect 

Power manager
(IOTA) 

Host 

Send-End key 

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3.12.2 

 Circuit description 

 

10k 0402 (EAR_BIAS)

EAR_BIAS

DGND

R53

4.7K 0402 (HSMICBIAS)

C56

10uF 0805

R52

100 0402

DGND

HSMICBIAS

VR11

varistor 5.5V  0402

VR12

varistor 5.5V  0402

DGND

DGND

47K

47K

0.7MM

BQ4

PDTA144EE SC-75

E

1

B

2

C

3

VR13

varistor 5.5V  0402

J4

Jack

Mic

4

AU

XO

3

A

DCI

D

2

Mic2

5

DGND

1

DGND

HSO

DGND

DGND

DGND

VRIO_2.8V

DGND

Auxi2

EAR_DETECT

EF1

EMIF01-10005W5 SOT323-5L

I1

1

I2

3

O2

4

O1

5

GND

2

C59

33pF 0402

R51

2.2K 0402

C57

10uF 0805

L3

100nH 0402

VR6

varistor 5.5V  0402

R49

220K 0402

C730

33pF 0402

R72

NM 100 0402

 

R54

39K 0402

DGND

HSMICIP

Vmicbias(2.5V)

ROW0

Auxi2

C58

1uF / 0603

22K

22K

BQ2

DTC124EE EMT3

2

1

3

 

 
BQ4: It is used to avoid error function on earphone plug in/out. 
J4: Audio jack 

 

EF1: Filter audio and circuit noise. 

 

BQ2: Send-end key detected. When BQ2 turned on, the send-end function 

work. 
 

3.12.2.1. EMI Filter including ESD protection 

EF1

EMIF01-10005W5 SOT323-5L

I1

1

I2

3

O2

4

O1

5

GND

2

 

Rd=Rd1=Rd2=100Ω 
Rd1 is the dynamic impedance between I1 and O1. 
Rd2 is the dynamic impedance between I2 and O2. 

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3.12.2.2. Digital transistors (built-in resistors)   

47K

47K

0.7MM

BQ4

PDTA144EE SC-75

E

1

B

2

C

3

 

Vi(off) input-off voltage Vi>1.2V, (V

O

=0V) 

Vi(on) input-on voltage Vi<1.6V, (V

CE

 = 300 mV) 

R1 (input resistor) =47k Resistor ratio

 

=1 

 

3.12.2.3 Digital transistors (built-in resistors) 

BQ2

DTC124EE EMT3

22K

22K

2

1

3

 

Vi (off) input-off voltage<0.9V, (V

O

=0V)

 

Vi (on) input-on voltage>1.1V, (0.1V<V

CE

0.3V) 

R1 (input resistor) =22k Resistor ratio

 

=1 

 
We could base on 

EAR_DETECT, HSMIBIAS and ROW0

 to function. 

EAR_DETECT

 used to detect “earphone plugging” and it is high active. 

HSMIBIAS

 is high active that is used to switch internal path or external 

earphone path. Send-end function is based on 

ROW0 

which is low active. The 

three signals high/low level are shown to below. 
 

EAR_DETECT

 

HSMIBIAS

 

ROW0

 

High level (V) 

2.8 2.5 2.8 

Low level (V) 

0 0 0 

 
The function status is following below: 

3.12.2.4 Status1:  
Insert the headset plug when the phone holds over idle mode without the 
headset plug in the jack. 
 

EAR_DETECT

 

HSMIBIAS

 

ROW0

 

Status 

L H 

 

 

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3.12.2.5 Status2
Receive an incoming call and the phone rings 
 

EAR_DETECT

 

HSMIBIAS

 

ROW0

 

Status 

L H 

 

3.12.2.6 Status3
Press the send-end key to answer the call. 
 

EAR_DETECT

 

HSMIBIAS

 

ROW0

 

Status 

L H 

H to

 L

 (falling 

edge) 

 
 

 

3.13sim circuit 

 
 
 
 
 
 
 
 
 

                                                                                                           

DGND

 

 

CALYPSO 

 
SIM_IO 

SIM_CLK 
SIM_RST 

VRSIM

IOTA 

 
SIO3                          SIO5
SCLK3                  SCLK5
SRST3                  SRST5

VCC/VPP 

SIM 

SOCKET

 

I/O 
CLK 
RST 
GND 

Description 

The IOTA SIM interface is composed by a dedicated LDO and I/O level 

shifters. It is able to support 3V and 1.8V SIM cards. 
SIM_IO: DATA 
SIM_RST :Reset signal 
SIM_CLK: Clock 
For that reason correct enabling sequence is the following : 

a.  Selection of the SIM voltage and enable of the SIM LDO 
b.  Wait for the SIM LDO output voltage set up. 
c.  Enable SIM level shifter when SIMRSU=1. 

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3.14keypad circuit 

DGND

DGND

C5

10nF 0402

COL3

ROW0

PWON

ROW3

ROW1

COL1

COL2

ROW4

COL0

ROW2

DGND

DGND

DGND

DGND

DGND

S8

Menu

S12

Soft-KeyR

S2

Soft-KeyL

S9

0

S3

*

S4

7

S7

8

S19

down

S13

#

S17

RIGHT

S14

9

C1

33nF 0402

C2

NM 33nF 0402

C3

33nF 0402

C4

47nF 0402

S18

LEFT

S1

Power / End

S11

2

S21

SEND

S6

1

S16

3

S20

UP

S10

5

S15

6

S5

4

DGND

C8

47nF 0402

DGND

C9

47nF 0402

DGND

 

Description 
3.14.1 The keypad is made of a 5Column * 5 Row matrixes. 
3.14.2 The keypad matrix is as follows: 
Function key  Col 0   Col 1  Col 2 Col 3 Row 0 Row1 Row 2 Row 3  Row 4 
No/PW
R  

S1   

 

 

 

 

 

 

 

MEDIR 

S2 

   0     0 

*  S3 

   0    0  

7  S4 

   0   0   

4  S5 

   0  0    

1  S6 

   0 0     

MENU 

S7 

  0      0 

0  S8 

  0     0  

8  S9 

  0    0   

5  S10 

  0   0    

2  S11 

  0  0     

STYLE 

S12 

 0       0 

#  S13 

 0      0  

9  S14 

 0     0   

6  S15 

 0    0    

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3  S16 

 0   0     

RIGHT 

S17 

0        0 

LEFT 

S18 

0       0  

DOWN 

S19 

0      0   

UP S20 

0     0    

SEND 

S21 

0    0     

 

3.15 photo sensor circuit   

DGND

LIGHTSENSER_EN

VDDS-MIF_2.8V

R1

10k

Q1

Photo-Transistor

DGND

C6

?nF 0402 NM

 

Description 
  The phototransistor is used to switch the backlight of keypad according to the 
R1 voltage level. This saves energy and add to stand by time .We use analog 
digital converter (ADC) to detect the voltage variation in the R1. The Q1 is a 
phototransistor. The light affect the current variation. The lightsenser_en is from 
the IOTA’S ADC. So we know the voltage variation, and control the backlight 
of keypad. If the brightness is too strong, we will turn off the LED of keypad. 
 
 
 
 
 
 
 
 
 
 
 

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△ Radio Frequency function Descriptions   

Top Side 

 

 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 

Bot

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tom Side 

 

 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 

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Receiver Block Diagram

 

 

 
 
 
 
 
 
 
 
 
 
  Transmitter Block Diagram 
 
 
 
 
 
 
 
 
 
 

   

Frequency Synthesizer Block Diagram   
 
 
 
 
 
 
 
 
 
 
 
 
 

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1.

T/R Switch: 

U101 is a front-end switch device for GSM/DCS. The below table shows the 
three operating mode. 

 

These four control signals are generated from U103, which controlled by T/R 
Switch. 

2.Power Amplifier: 
PA (U401) is control by signal PAENA, BS, and APC. The power controlloop is 
a voltage sensor. 

3.Transceiver: 
U201 is the transceiver. 

A. Receiver Operation 
Received signals from the antenna are passed to the T/R switch U101.This T/R 
switch contains a diplexer which filters the signal to the required receiver path 
(E-GSM900 or GSM1800).Pin diode switches within U101 route the signal path 
from the transmitter or to the receiver as required. Output signals from U101 are 
then applied via the SAW filter F101 or F102 to the balanced Low Noise 
Amplifiers (LNA) onboard U201.Output from LNAs are applied to a pair of 
Gilbert Cell mixers within U201.An image-reject mixer downconverts the RF 
signal to a 100kHz intermediate frequency (IF) with the RFLO from the U301 
frequency synthesizer. The RFLO frequency is between 1737.8 to 1089.9MHz, 
and is divided by to in the Si4200 (U201) for GSM 850 and E-GSM 900 modes. 
The mixer output is amplified with an analog programmable gain amplifier 
(PGA), which is controlled with the internal register. The quadrature IF signal is 
digitized with high resolution A/D converters. The signal is then down 
converted by a demodulator to I and Q. The Si4201 (U203) downconverts the 
ADC output to baseband with a digital 100kHz quadrature LO signal.

 

B. Transmitter Operation 
The transmitter chain converts differential IQ baseband signals to a suitable 
format for transmission by a power amplifier. A quadrature mixer upconverts 
the differential in-phase (TXIP, TXIN) and quadrature (TXQP, TXQN) signals 
with the IFLO to generate a SSB IF signal which is filtered and used as the 
reference input to the OPLL. The Si4133 (U301) generates the IFLO & RFLO 
frequency.

 

Mode  

      V

C

1 (pin2) 

    V

C

2 (pin11) 

      GSM TX 

            L 

            H 

      DCS TX 

            H 

            L 

GSM/DCS RX 

            L 

            L 

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4.Synthesizer: 

U301 is a dual frequency synthesizer that performs IF and RF synthesis. Two 
complete PLLs are integrated including VCOs, varactors, loop filters, reference 
and VCO dividers, and phase detectors. Differential outputs for the IF and RF 
PLLs are provided for direct connection to the Si4200 (U201) transceiver. The 
RF PLL uses two multiplexed VCOs. The RF1 VCO is used for receive mode, 
and RF2 VCO is used for transmit mode. The IF PLL is used only during 
transmit mode and uses a single VCO.