CD CiDeCo E365 A4 C L3 1[1] 0 030610085958

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E365 Theory of Operation


Service Manual

Compal Communications, Inc.

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Baseband function Descriptions

1. Introduction

Baby Garnet use TI’s chipset (Calypso c035 and IOTA) as base-band
solution. Calypso c035 is a GSM digital base-band logic included
microprocessor , DSP , and peripheral. IOTA is GSM analog/codec solution.
It contains the base-band codec, voice-band codec, several voltage
regulators and SIM level shifter etc. The baby garnet add some features such
as digital camera , photo sensor , TFT display , sixteen tone melody etc.

2. Base-band

block

3. Theory

3.1 CALYPSO

Calypso is a chip implement the digital base-band processes of a GSM/GPRS
mobile phone. The chip combines a DSP sub-chip (LEAD2 CPU) with its
program and data memories, a micro-controller core with emulation
facilities(ARMTDMIE), internal 8Kb of boot ROM memory , 4M bit SRAM
memory , a clock squarer cell, several compiled single-port or 2 ports RAM and
CMOS gates.

UART_MODERN

UART_IRDA

NCS

0

NC

S3

PWL

KBR

KBC

Ncs

2

ARM SERIAL PORT

HSO

AUX

I

DAC

VCC4

VBACKUP

VCHG

TPU SERIAL

TPU PARALLEL

Power Management

Voice Band Interface

32.768kHz

Base band Interface

SIM interface Interface

EARN

MIC

Melody
Speaker

Tx & Rx I/Q

uWIR

E

n

SC

S0

EARP

NCS

4

NC

S1

NCS

1

I/O

32.768kHz

13MHz

DA

T

A

B

U

S

AD

DR

E

S

S

BUS
































U15

Digital baseband processor

U1

GSM/DCS Baseband and Voice A/D and

D/A RF Interface Circuit With Power

Supply Management

TFT
Color
Display

KEYPAD

BACKLIGHT

KEYPAD

MATRIX

MAIN

BATTERY

128M bits FLASH

U6

16M bits SRAN

U7

DIGITAL CAMERA

SIM

Regulator

& Shifter

RF- Base_Band Interface ( RIF )

(BBC, APC, AFC,ADAC)

BACKUP

BATTERY

Melody

IC

VIBRATOR

13MHz

Miscellaneous

PHONE

JACK

Monitoring

ADC

(MADC)

JTAG(TAP)

ADPATOR IN

(DC Power Input)

Charging function

LCD BACKLIGHT

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3.1.1 Real Time Clock (RTC)

3.1.2 Pulse Width Tones (PWT)

The PWT generates a modulated frequency signal for the external buzzer.
Frequency is programmable between 349Hz and 5276Hz with 12 half tone
frequencies per octave.

3.1.3 Pulse Width Light (PWL)

The PWL allows the control of the backlight of LCD and keypad by

employing a 4096bit random sequence. The block used a switchable clock of
32kHz .

3.1.4 Modem-Uart

3.1.5 I2c master serial interface (I2C)

3.1.6 General purposes I/O (GPIO)
Calypso provides 16 GPIOs in read or write mode by internal registers. In

Baby garnet we use 9 of them as follows.

GPIO PIN

Used As..

Description

IO0 / TPU_WAIT

IO0

DTR_MODEM Output ; RS232 DTR output signal

IO1 / TPU_IDLE

IO1

disable

IO2 / IRQ4

IO2

LEDLCM_EN: LCM backlight=1 active

IO3 / SIM_RnW

IO3

LCDA0 ; LCD Data or Command Control signal

IO4 / TSPDI

IO4

nIRQ_melody:Melody IC interrupt, active=0

IO5 / SIM_PWCTRL

SIM_PWCTRL For SIM Card Power Control

IO6 / BCLKX

IO6

EAR_DETECT ; input

IO7 / NRESET_OUT

nRESET_OUT ? LCD Peripherals reset

IO8 / MCUEN1

IO8

nIO_PWR_EN: Accessary power control : active=1

IO9 / MCSI_TXD

MCSI_TXD

DAI interface ,reserved; disable

IO10 / MCSI_RXD

IO10

COMS_LDO_EN ; active=1

IO11 / MCSI_CLK

IO11

COMS_ASK ; input

IO12/ MCSI_FSYNCH IO12

IO_PWR_EN: Accessary power control : active=1

IO13 / MCUEN2

IO13

LCD_ID; input

IO14 / nBHE

nBHE

nBHE

IO15 / nBLE

nBLE

nBLE

3.1.7 Serial Port Interface (SPI)
The SPI is a full-duplex serial port configurable from 1 to 32 bits and

provides 3 enable signals programmable either as positive or negative edge or
level sensitive. We use SPI to control the melody IC.

nSCS0 :Chip select 0
SDO: Data out.
SDI: Data in

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SCLK: Serial clock

3.1.8 Memory interface and internal static RAM
A 4Mbit SRAM is embedded on the die and memory mapped on the

chip-select CS6 of the memory interface.

3.1.9 SIM interface

3.1.10 JTAG

3.1.11 Time Serial Port (TSP)

3.1.12 TSP Parallel interface (ACT)

Herculse Pin no Pin Name

Used As..

Description/Net

M12 TSPACT0

TP5 X

M14

TSPACT1

TSPACT1 PAENA (Chip enable for

Power Amp IC)

L12

TSPACT2

TSPACT2 PDNB (RF IC power down

control)

L13 TSPACT3

TSPACT3 X

J10 TSPACT4

TSPACT4 X

K11 TSPACT5

TSPACT5 X

K13 TSPACT6/nCS6 TSPACT6 TRENA

(T/R

switch

enable)

K12 TSPACT7/CLKX_SPI

NC X

K14

TSPACT8/Nmreq

TSPACT8 GSM_TXEN (Used both

within the RF switch and

the Power Amp to select the

GSM Frequency Band)

J11 TSPACT9/MAS1

TSPACT9 X

J12 TSPACT10/nWAIT

NC X

J13 TSPACT11/MCLK

NC X

3.1.13 Radio Interface (RIF)

3.2 IOTA

IOTA is an analog base-band device which a digital base-band device is

part of a TI DSP solution intended for digital cellular telephone applications.
This includes the GSM 900, DCS 1800, PCS 1900 standards.

IOTA includes a complete set of base-band functions that perform the

interface and processing of the following voice signals, the base-band in
phase(I) and quadrature (Q) signals. Which support both the single-slot and
multislot modes. IOTA also includes associated auxiliary RF control features
supply voltage regulation, battery charging controls , and switch on/off
system analysis.

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IOTA interfaces with the CALYPSO through a digital base-band port and a

voicebad serial port. The signal ports communicate with a DSP core. A
microcontroller serial port communicates with the microcontoller core and a
time serial port communicates with the time processing unit for real-time
control.

3.2.1 Base-band Codec (BBC)

3.2.2 Automatic Frequency Control ( AFC)

3.2.3 Automatic Power Control ( APC)

3.2.4 Time serial port (TSP)

3.2.5 Voice band Codec (VBC)

3.2.6 SIM card shifters (SIMS)

3.2.7 Voltage Regulation (VREG)

Several low-dropout(LDO) linear voltage regulation supply power to

internal analog and digital circuits to the DBB processor and to external
memory

a. VRDBB is a programmable regulator that generates the supply

voltages( 1.8V , 1.5V , and 1.3V) for the core of the CALYPSO. In baby
garnet , it is programmed to 1.5V. During all modes, the main battery directly
supplies VRDBB.

b. VRIO is a programmable regulator that generates the supply voltages(2.8V)

for I/Os of the CALYPSO and IOTA. During all modes, the main battery
directly supplies VRIO.

c. VRMEM is a programmable regulator that generates the supply
voltages(2.8V and 1.8V) for external memories (typically flash memories)
and CALYPSO memory interface I/Os. In baby garnet , it is programmed to
2.8V. During all modes, the main battery directly supplies VRMEM.

d. VRRAM is a programmable regulator that generates the supply
voltages(2.8V and 1.8V) for external memories (typically SRAM memories)
and CALYPSO memory interface I/Os. In baby garnet , it is programmed to
2.8V. During all modes, the main battery directly supplies VRRAM.

e. VRABB is a programmable regulator that generates the supply voltages

(2.8V ) for the analog functions of the IOTA. During all modes, the main
battery directly supplies VRRAM.

f. VRSIM is a programmable regulator that generates the supply voltages

(2.9V and 1.8V )for SIM card and SIM card drivers. During all modes, the
main battery directly supplies VRRAM.

g. VRRTC is programmable regulator that generates the supply voltages

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(1.3V, 1.5V ,and 1.8V) for CALYPSO’s backup RTC. It is switched on the
main or backup battery, depending on the phone state.

3.2.8 Base-band Serial Port (BSP)

3.2.9 Battery charger interface (BCI)

3.2.10 Monitoring ADC (MADC)

3.2.11 Reference Voltage / Power on control (VRPC)

3.2.12 Internal bus and interrupt controller( IBIC)

3.3power supply circuit






IO TA

G S M /D C S B aseband
and Voice A /D and
D /A R F Interface
C ircuit W ith P ow er
Supply M anagem ent

E x ternal 1.8v
150m A

E x ternal 2.8v
300m A

C A LY P SO

D ig ita l

b a seb a n d

p ro cesso r

V R SIM 1.8V /2.9V

V R S A M 2.8V
V R M E M 2.8V

V R D B B 1.5V
V R IO 2.8V
V R A B B 2.8V

V R RT C 1.5V

Flash core 128M B it
Flash I/O

S R A M 16M B it

LC M

S IM card

Light sensor

E x ternal 2.5v
150m A

E x ternal 3.3v
150m A

B ackend core
I/O

C m os sensor

The phone is mainly supplied from the main battery. The main battery supply

the two parts : RF block, base-band block.
The input power to IOTA is divided into 4 blocks.
VCRAM: to provide power for VRRAM
VCMEM: to provide power for VRMEM
VCIO1,VCIO2: to provide power for VRIO and VRSIM
VCABB: to provide power for VRABB
VCDBB: to provide power for VRDBB
The IOTA provides seven low drop-out voltage regulators.
VRRAM:2.8V@50mA, to supply SRAM
VRMEM:2.8V@60mA, to supply flash I/O and CALYPSO memory interface
I/Os.
VRDBB;1.5V@120mA. to supply the core of the CALYPSO
VRIO:2.8V@100mA, to supply I/Os of the CALYPSO and IOTA

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VRABB;2.8V@50mA to supply the analog functions of the IOTA
VRRTC:1.5V@10uA, to supply the CALYPSO’s backup RTC.
VRSIM:1.8V or 2.9V@10mA , to supply the SIM.

3.4 memory circuit

CALYPSO






NCS0
NCS3
NFOE
FDP
RNW
NCS1
NBHE
NBLE

FLASH







/CE
/OE
/RST
/WE

SRAM







/CE
/OE
/HB
/LB
/WE

Address bus

Data bus

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Description

Flash is a 128Mbit device, supported by external LDO and VRMEM. The

access time of flash is 90ns. The total 128Mbit are divided into two sections:
112Mbit is used for software program code and 16Mbit is used for user’s data.

SRAM is a 16Mbit device supported by VRRAM. The access time of flash is

70ns.

3.5 display circuit

LCD_RD

DGND

DGND

DGND

DGND

DGND

DGND

DGND

DGND

DGND

DGND

DGND

DGND

DGND

DGND

DGND

DGND

DGND

DGND

DGND

LED_Anode

DGND

DGND

VBAT

VDDS-MIF_2.8V

DGND

DGND

Up

Down

VDDS-MIF_2.8V

nRESET

LCD_ID

nCS2

LCDA0

RNW

LED_Cathode

C81

22P

F

0402

C720

22P

F

0402

C76

22P

F

0402

C85

22P

F

0402

C83

22P

F

0402

C74

22P

F

0402

C82

22P

F

0402

R75 200 0402

R77 100 0402

R71

200 0408

1

8

2

7

3

6

4

5

R70

200 0408

1

8

2

7

3

6

4

5

R69

200 0408

1

8

2

7

3

6

4

5

C722

100PF 0402

R68

200 0408

1

8

2

7

3

6

4

5

C94

22P

F

0402

R76 200 0402

C91

22P

F

0402

C92

22P

F

0402

C93

22P

F

0402

C89

22P

F

0402

C90

22P

F

0402

C87

22P

F

0402

C721

22P

F

0402

C84

22P

F

0402

C79

22P

F

0402

C80

22P

F

0402

C77

22P

F

0402

C78

22P

F

0402

J5

CON30

Cathode

30

Anode

29

D13

28

D14

27

D15

26

/RESET

25

VCC

24

VCC

23

D12

22

D11

21

D9

19

D10

20

D8

18

D7

17

D6

16

D5

15

D4

14

D3

13

D2

12

D1

11

D0

10

/RD

9

/WR

8

RS

7

/CS

6

GND

5

GND

4

LCD_ID

3

NC

2

NC

1

C88

22P

F

0402

VDDS-MIF_2.8V

VBAT

D[0..15]

Description

The display area is a 128*160 resolution LCD module. The power of LCDM
is supplied from external LDO (2.8V). It is controlled by CALYPSO via parallel
interface : data bus and chip select .The Ncs2 is low active to enable the LCDM
data bus. Resistance and capacitance is used for radiation suppression.

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3.6vibrater circuit

VBAT

3930408801W

0.95mm

DAC

No. G3240010

BQ1

2SC5592 SC59

2

1

3

M1

MOTOR 4.0*8.8-1.5V-KHN4NZ1D

D4

1SS400 SC79

2

1

R43

10K 0402

R42

33 0402

1

2

F1

SGM20F1E104-2A 2012

I/O1

1

I/O2

2

G

3

G

4

DGND

DGND

DGND

DGND

DAC of the IOTA is used to control the vibrational level. D4 is used to

protection the vibrater. In the 3.8V, the DAC output voltage is 1.9V and drain
current is around 90mA .

3.7 speaker circuit

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Description

The Melody IC MA2 works as follows.
First, the CPU (G2) fetch melody data from flash and fed them into MA2

by serial interface. After receiving these data, MA2 will start decode its content
and start its sequencer for processing. After completing this process, the MA2
will generate the tones we want according to the melody data. Then, these data
will run through MA2’s DAC, which inside it. Then, the converted signal is fed
into an equalizer, and then followed by an amplifier, which they are inside MA2.
Then this signal will be outputted from SPOUT1 and SPOUT2 to drive the
speaker.

Here, the R44 and R46 provide optimal gain control for MA2. To ensure

the speaker not to be overdrove.

3.8 DSC (Digital Still Camera) function block diagram and circuit

description

3.8.1 Function block diagram
















Backend

(W99688)


Host

(Calypso 035)


LCM

Toppoly

SRAM

(a)

(b)

(c)

(d)

CMOS

SENSOR

SCCB

CF

Data path

Control path

Interface

Memory

interface

Fig. 1 Imbedded DSC block diagram

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Imbedded DSC included two portions, one is front-end sensor module and
another is backend DSP chip. There are including two interfaces which are
SCCB (Serial Camera Control Bus) and CF (Compact Flash). The function
block diagram is shown in Fig.1. The SCCB is used in sensor to backend
interface, and the backend to host (G2) is used CF interface.

3.8.1. Sensor to Backend Interface










RESET: (default 0) chip reset with active high

PWDN: (default 0) power down mode selection

“0” normal mode, “1” power down mode

SIO_C: SCCB (Single Chip Camera Bridge) serial interface clock input

SIO_D: SCCB (Single Chip Camera Bridge) serial interface data input and
output

XCLK: Clock input

PCLK: Pixel clock output

VSYNC: Vertical sync output

HSYNC: Horizontal sync output

Data Bus: 8 bits

Backend

(W99688)

CMOS SENSOR

DATA BUS

HSYNC

VSYNC

PCLK

XCLK

SIO_D

SIO_C

PWDN

RESET

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3.8.1.2 Backend to Sensor

Interface

A0..A3: Compact Flash: Address-0~3 for command

D15..D0: Data bus connect to Host

RD#: Read data or command

WR#: Write data or command

CS#: Chip select













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3.8.2 Circuit

description

3.8.2.1 Main circuit

DGND

DGND

TP26

TP

T

1

TP25

TP

T

1

TP27

TP

T

1

TP28

TP

T

1

TP29

TP

T

1

J6

CMOS_CON

GND

1

HREF

2

VSYNC

3

PWDN

4

PCLK

5

AVDD

6

DVDD

7

SIO_D

8

XCLK

9

SIO_C

10

Y0

11

Y1

12

Y2

13

Y3

14

GND

15

Y4

16

Y5

17

Y6

18

Y7

19

RESET

20

RR16

10K

DD0

DD[0..7]

PWDN

DD0

DD7

A2

S22

CAMERA

SCK

DD[0..7]

DD2

DD4

D2

DD6

DD25V

CLOSED TO

D4

COL4

DGND

DGND

R80

4.7K 0402

DGND

R81

4.7K 0402

DD5

DD7

DD4

DD3

D[0..7]

ROW4

DD25V

A

V

DDP

C96
1u 0603

D5

AVSSP

DGND

DD3

D1

DD1

A3

DGND

D7

S25V

DGND

DD6

D0

SCK
SDA

R79

47 0402

DD2

D3

A1

DD1

RNW

nF
O

E

SDA

nC
S4

A[1..3]

688 ASAP

C

L

K13M_D

SC

CMOS SENSOR MODULE I/F

R80:

U12

688CBM3

VD

3-

1

C1

0

F

IR

Q

/F

SR

B#/F

WP

A10

FI

O

RD#

/F

S

R

E

#

/X

CM

D

B10

F

IOWR

#

/F

SWE#/F

C

M

D

B9

F

C

E2#/F

S

C

L

E/XC

LK

C8

F

C

E1#/F

SALE

C9

FRE

G

#

/FS

W

P

#

/FCL

K

A9

G

ND-1

C1

1

FD0

/FDA

T

0

H3

FD1

/FDA

T

1

C7

FD2

/FDA

T

2

B8

FD3

/FDA

T

3

J2

F

D

4/XD

AT

0

A8

F

D

5/XD

AT

1

C6

F

D

6/XD

AT

2

B7

F

D

7/XD

AT

3

D4

GPIO0

B6

VD

3-

2

A7

XIN

C4

XOU

T

A6

G

ND-2

C5

GPIO1

A5

AVSSP

A4

A

V

DDP

B4

VD

3-

3

A3

GND-3

A2

RESET

B3

GPIO10

C3

GPIO11

A1

GPIO12

D3

GPIO13

B2

GPIO14

C2

GPIO15

B1

VD3-4

C1

GND-4

D2

USBVSS

D1

DP

E3

DM

E2

USBVDD

E1

P30

F2

P31

F1

VD3-5

G2

VSSI-1

H2

VDDI-1

G1

GND-5

H1

VD3-6

J1

GND-6

L1

VD3-7

L2

GND-7

L3

VSSI-2

K1

MD

1

L4

V

DDI

-2

L5

GPIO3

L6

G

ND-8

L7

DD0

L9

DD1

K5

DD2

L8

DD3

K7

DD4

J7

DD5

K8

DD6

K9

DD7

J8

VD

3-

8

J6

DFUL

L

L10

D

VALID

J9

DO

CL

K

K10

DHS

K11

DV

S

L11

G

ND-9

J1

0

SD

0

H9

SD

1

J5

SD

2

H1

1

SD

3

H1

0

VSSI-

3

H8

SD5

G9

VDDI-3

J11

SD6

G11

SD7

K4

SD8

F9

SD9

F11

GND-10

E11

SPCLK

F10

SVS

J4

SHS

K3

SCLK

E10

SCK

H4

SDA

E9

SDO

D9

VD3-9

D11

FWAIT#

J3

FCD#

K2

FRST

D10

FA0

B11

FA1

D8

FA2

A11

SD

4

G1

0

VD3-D

G3

GND-F

B5

VD3-F

K6

GND-D

F3

DD5

FRST

RR4
100K 0402

D33V

DGND

CC8

33nF 0402

FPC 0.5mm PITCH

OV7645FB/TASC

D6

PWDN

RR22

0 0402 (OV)

SDO

RR20

0 0402 NM(Tasc)

DD25V

RR25

4.7k 0402 NM(Tacs)

RR23

0 0402 NM(Tasc)

RR24

0 0402 NM(Tasc)

DGND

DGND

RR5
10K 0402(OV)

SDO

D25V

C?
47nF 0402(Tasc)]

C726

100nF 0402

C725

100nF 0402

D33V: Power supply for I/O pads

+3.3 V

DD25V: Power supply for CMOS sensor digital part

+2.5 V

S25V: Power supply for CMOS sensor analog part

+2.5 V

D25V: Internal core logic power supply.

+2.5 V

.

AVDPP: Power supply for PLL analog

2.5V

AVSSP: Ground for PLL analog
FSRT: Compact flash: RESET/RESET# signal (High enable

2.8V

)

Vsync & HREF relation:






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The backend power on reset is 100ms that generated by

C96

(1uF) and

RR4

(100k ohms). The backend clock

CLK13M_DSC

is

13MHz (Vp-p 3.0V)

, and

XCLK is

24MHz ( Vp-p 3.35V)

that is generated from backend to sensor. Then

sensor will base on XCLK to generate PCLK for image data clock that is
12MHz

(Vp-p 2.3V)

.


3.8.2.2 DSC DC power

C99

100nF 0402

DGND

RR9

100K 0402 nm

C97

2.2uF/6V

C700

10nF 0402

DGND

DGND

DD25V

AVSSP

DGND

L6

100nH 0402

2.5V FOR OV7645FB

AVDDP

D33V

D25V

VBAT

DGND

COMS_EN

C98

1uF/6V

L7

100nH 0402

U13

MIC2211-2.5/3.3BML

Vin

1

EN1

2

EN2

3

BYP

4

NC

7

NC

8

VOUT3.0

9

VOUT2.5

10

NC

5

GND

6

RR26

0 0603

L8

100nH 0402

S25V

RR26

1SS400 SC-79(W99685)

CMOS_EN

is used to control DSC power enable. It is high active

(2.8V)

. L6,

L7 and L8 are formed low pass filter with C97 in order to suppress low
frequency noise.










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3.8.2.3 DSC system clock

DGND

RR14

10

C724

100pF

X7R
0402
10%
50V

RR15

1M

DGND

U18

KIC7S04FU

SOT23-5

NC

1

IN

2

GND

3

VCC

5

OUT

4

C723

100pF

0402
10%
50V
NPO

CLK13M_DSC

D33V

CLK13M_OUT

Add buffer to avoid

CLK13M_OUT

over load causing system hang.


3.8.3 Function flow chart

3.8.3.1 Preview:

Video Preview Path

W99688

Host

LCM

Preview Data Source

SRAM

Data Memory

2

3.CDM42 (Get Preview Data)

1

1.CDM40 (Set Single Capture Mode)
2.CDM41 (Set Preview Size 128x96)

RGB Data

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3.8.3.2 Capture:

















3.8.3.3 Playback:

Capture Image Path

W99688

Host

LCM

Preview Data Source

SRAM

Data Memory

2

1

4.CDM2 (Get Jpeg Bitstream)

1.CDM40 (Set Single Capture Mode)

2.CDM41 (Set Image Format 640x480)

3.CDM43 (Snapshot)

Flash

Jpeg Data

Play Picture Path

W99688

Host

LCM

Preview Data Source

Preview Data

SRAM

Data Memory

1

Put Image

Transformation

2

3

4.CDM45 (Decode Jpeg Bitstream)

1.CDM40 (Set Playback Mode)

2.CDM48 (Set Decode Size 640x480)

3.CDM44 (Send Jpeg Bitstream)

Flash ROM

Jpeg Data

4

4.CDM47 (Get Decode Image Data)

RGB Data

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3.9 led

circuit

keypad backlight

VBAT

DGND

D2

LED

D3

LED

D4

LED

D5

LED

D6

LED

D7

LED

R3

RS2N39 0404

R1

4

R1

1

R2

2

R2

3

R4

RS2N39 0404

R1

4

R1

1

R2

2

R2

3

VR1

14V 0402

D8

LED

D9

LED

R5

RS2N39 0404

R1

4

R1

1

R2

2

R2

3

R2

RS2N39 0404

R1

4

R1

1

R2

2

R2

3

C7

NM 47nF 0402

LEDB

DGND

KeyLed_En

R65

1.5K 0402

R64

0 0402 NM

BQ3

2SC5585 EMT3

2

1

3

C73

33nF 0402

R67

1K 0402

R66

4.7 0402

LCD module backlight

U11

MP1523

SW

1

GND

2

FB

3

EN

4

BIAS

5

FL1

22uH

CC2

1uF 0603

R36

0 0402

R40

0 0402 NM

VDDS-MIF_2.8V

LED_Cathode

LEDLCM_EN

LED_Anode

VBAT

DGND

DGND

DGND

DGND

RR1

56 0402

D6

RB551V-30

2

3

CC1

0.22uF 0603

description
The baby garnet employ three LEDs for LCD module backlight and six LEDs
for keypad backlight. The keypad backlight is controlled by PWL (Pulse with
light). The LCD module backlight is controlled by GPIO of the CALYPSO. The
CALYPSO is used to enable BQ3 and U11. The total current of LCD backlight
LED’s and keypad backlight LED’s is about 70mA during all LED work.

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3.10 audio circuit
Uplink:

Downlink:

Description

The acoustic circuit can be divided into two parts, Uplink and Downlink

path.

For the Uplink path, the analog signal, or Voice, is fed into IOTA (MICIP

and MICIN) by the microphone’s differential input. This signal is then sampled
and transmitted into G2 DSP via the VSP (Voice-Band Serial Port) interface.
After being modulated, the signal goes through the uplink I/Q path to the RF
transceiver and then being transmitted by the antenna.

The microphone is biased by the IOTA MICBIAS pin (2.5V). Where the

bias circuit R58, R59, R60, R61 provide optimal operation point for the
microphone.

For the Downlink path, the signal is received from antenna. Then it is

down-converted to I/Q signal and then send into G2 DSP. After being
demodulated, the signal is then transmitted into IOTA via VSP interface. After
re-construct this signal, this signal is then amplified and drove the receiver.


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3.11 charging circuit

3.11.1Function Block

Ad

apter

AC

/DC

Cha

rgin

g Con

tr

ol

OVP

(2

)

M

icr

o co

nt

ro

l

(IOT

A

)

Detect voltage

Detect current

Battery pack

OCP

3.11.2 function description

When the charging device is plugged in, the charging scheme for the Li-ion

battery is constant current first (MAX current is

400

mA) then followed by

constant voltage charging. When battery voltage has been detected full, the BCI
of IOTA will be turned off till a Low voltage threshold has been detected. At
charger plug OUT, the charger status bit CHG_STS is driven from “1” to “0”
and an interrupt of the INT2 type is generated making the uC aware of the
charging device unplug. When over-discharging (battery voltage is less than
3.2V), the BCI of the IOTA will be the pre-charge state (charging current equal
to 30mA). Until battery voltage bigger than 3.2V, it returns to normal charge.
When ICHG bigger than 1 A, the OCP (over current protection) will be enabled.
When the battery voltage is higher then 4.35V, the OVP (over voltage protection)
will be enabled.

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3.12 Earphone block diagram and circuit description

3.12.1 Function block diagram

Fig. 1 Earphone block diagram


The earphone circuit included audio jack, protect circuit, EMI circuit and
Send-End key controller. The all design based on external earphone which
characteristic is shown below.

3.12.1.1 Outward appearance:

MIC AUXO GND



CONNECT TO CELLPHONE

3.12.1.2 Impedance:
The status of send-end
key

Relaxed Pressed

MIC TO GND

1.7kΩ

OPEN

AUXO TO GND

35Ω 35Ω

Audio Jack

Protect

circuit

EMI circuit

Send-End

key

controller

Audio signal

Use r

o

w0 to

detect

Power manager
(IOTA)

Host

Send-End key

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3.12.2

Circuit description

10k 0402 (EAR_BIAS)

EAR_BIAS

DGND

R53

4.7K 0402 (HSMICBIAS)

C56

10uF 0805

R52

100 0402

DGND

HSMICBIAS

VR11

varistor 5.5V 0402

VR12

varistor 5.5V 0402

DGND

DGND

47K

47K

0.7MM

BQ4

PDTA144EE SC-75

E

1

B

2

C

3

VR13

varistor 5.5V 0402

J4

Jack

Mic

4

AU

XO

3

A

DCI

D

2

Mic2

5

DGND

1

DGND

HSO

DGND

DGND

DGND

VRIO_2.8V

DGND

Auxi2

EAR_DETECT

EF1

EMIF01-10005W5 SOT323-5L

I1

1

I2

3

O2

4

O1

5

GND

2

C59

33pF 0402

R51

2.2K 0402

C57

10uF 0805

L3

100nH 0402

VR6

varistor 5.5V 0402

R49

220K 0402

C730

33pF 0402

R72

NM 100 0402

R54

39K 0402

DGND

HSMICIP

Vmicbias(2.5V)

ROW0

Auxi2

C58

1uF / 0603

22K

22K

BQ2

DTC124EE EMT3

2

1

3


BQ4: It is used to avoid error function on earphone plug in/out.
J4: Audio jack

EF1: Filter audio and circuit noise.

BQ2: Send-end key detected. When BQ2 turned on, the send-end function

work.

3.12.2.1. EMI Filter including ESD protection

EF1

EMIF01-10005W5 SOT323-5L

I1

1

I2

3

O2

4

O1

5

GND

2

Rd=Rd1=Rd2=100Ω
Rd1 is the dynamic impedance between I1 and O1.
Rd2 is the dynamic impedance between I2 and O2.

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3.12.2.2. Digital transistors (built-in resistors)

47K

47K

0.7MM

BQ4

PDTA144EE SC-75

E

1

B

2

C

3

Vi(off) input-off voltage Vi>1.2V, (V

O

=0V)

Vi(on) input-on voltage Vi<1.6V, (V

CE

= 300 mV)

R1 (input resistor) =47k Resistor ratio

 

=1

3.12.2.3 Digital transistors (built-in resistors)

BQ2

DTC124EE EMT3

22K

22K

2

1

3

Vi (off) input-off voltage<0.9V, (V

O

=0V)

Vi (on) input-on voltage>1.1V, (0.1V<V

CE

0.3V)

R1 (input resistor) =22k Resistor ratio

 

=1


We could base on

EAR_DETECT, HSMIBIAS and ROW0

to function.

EAR_DETECT

used to detect “earphone plugging” and it is high active.

HSMIBIAS

is high active that is used to switch internal path or external

earphone path. Send-end function is based on

ROW0

which is low active. The

three signals high/low level are shown to below.

EAR_DETECT

HSMIBIAS

ROW0

High level (V)

2.8 2.5 2.8

Low level (V)

0 0 0


The function status is following below:

3.12.2.4 Status1:
Insert the headset plug when the phone holds over idle mode without the
headset plug in the jack.

EAR_DETECT

HSMIBIAS

ROW0

Status

L

L H

background image

3.12.2.5 Status2:
Receive an incoming call and the phone rings

EAR_DETECT

HSMIBIAS

ROW0

Status

L H

H

3.12.2.6 Status3:
Press the send-end key to answer the call.

EAR_DETECT

HSMIBIAS

ROW0

Status

L H

H to

L

(falling

edge)


3.13sim circuit









DGND

CALYPSO


SIM_IO

SIM_CLK
SIM_RST

VRSIM

IOTA


SIO3 SIO5
SCLK3 SCLK5
SRST3 SRST5

VCC/VPP

SIM

SOCKET

I/O
CLK
RST
GND

Description

The IOTA SIM interface is composed by a dedicated LDO and I/O level

shifters. It is able to support 3V and 1.8V SIM cards.
SIM_IO: DATA
SIM_RST :Reset signal
SIM_CLK: Clock
For that reason correct enabling sequence is the following :

a. Selection of the SIM voltage and enable of the SIM LDO
b. Wait for the SIM LDO output voltage set up.
c. Enable SIM level shifter when SIMRSU=1.

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3.14keypad circuit

DGND

DGND

C5

10nF 0402

COL3

ROW0

PWON

ROW3

ROW1

COL1

COL2

ROW4

COL0

ROW2

DGND

DGND

DGND

DGND

DGND

S8

Menu

S12

Soft-KeyR

S2

Soft-KeyL

S9

0

S3

*

S4

7

S7

8

S19

down

S13

#

S17

RIGHT

S14

9

C1

33nF 0402

C2

NM 33nF 0402

C3

33nF 0402

C4

47nF 0402

S18

LEFT

S1

Power / End

S11

2

S21

SEND

S6

1

S16

3

S20

UP

S10

5

S15

6

S5

4

DGND

C8

47nF 0402

DGND

C9

47nF 0402

DGND

Description
3.14.1 The keypad is made of a 5Column * 5 Row matrixes.
3.14.2 The keypad matrix is as follows:
Function key Col 0 Col 1 Col 2 Col 3 Row 0 Row1 Row 2 Row 3 Row 4
No/PW
R

S1

0

MEDIR

S2

0 0

* S3

0 0

7 S4

0 0

4 S5

0 0

1 S6

0 0

MENU

S7

0 0

0 S8

0 0

8 S9

0 0

5 S10

0 0

2 S11

0 0

STYLE

S12

0 0

# S13

0 0

9 S14

0 0

6 S15

0 0

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3 S16

0 0

RIGHT

S17

0 0

LEFT

S18

0 0

DOWN

S19

0 0

UP S20

0 0

SEND

S21

0 0

3.15 photo sensor circuit

DGND

LIGHTSENSER_EN

VDDS-MIF_2.8V

R1

10k

Q1

Photo-Transistor

DGND

C6

?nF 0402 NM

Description
The phototransistor is used to switch the backlight of keypad according to the
R1 voltage level. This saves energy and add to stand by time .We use analog
digital converter (ADC) to detect the voltage variation in the R1. The Q1 is a
phototransistor. The light affect the current variation. The lightsenser_en is from
the IOTA’S ADC. So we know the voltage variation, and control the backlight
of keypad. If the brightness is too strong, we will turn off the LED of keypad.










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Radio Frequency function Descriptions

Top Side

































Bot

background image

tom Side



































background image

Receiver Block Diagram











Transmitter Block Diagram









Frequency Synthesizer Block Diagram












background image

1.

T/R Switch:

U101 is a front-end switch device for GSM/DCS. The below table shows the
three operating mode.

These four control signals are generated from U103, which controlled by T/R
Switch.

2.Power Amplifier:
PA (U401) is control by signal PAENA, BS, and APC. The power controlloop is
a voltage sensor.

3.Transceiver:
U201 is the transceiver.

A. Receiver Operation
Received signals from the antenna are passed to the T/R switch U101.This T/R
switch contains a diplexer which filters the signal to the required receiver path
(E-GSM900 or GSM1800).Pin diode switches within U101 route the signal path
from the transmitter or to the receiver as required. Output signals from U101 are
then applied via the SAW filter F101 or F102 to the balanced Low Noise
Amplifiers (LNA) onboard U201.Output from LNAs are applied to a pair of
Gilbert Cell mixers within U201.An image-reject mixer downconverts the RF
signal to a 100kHz intermediate frequency (IF) with the RFLO from the U301
frequency synthesizer. The RFLO frequency is between 1737.8 to 1089.9MHz,
and is divided by to in the Si4200 (U201) for GSM 850 and E-GSM 900 modes.
The mixer output is amplified with an analog programmable gain amplifier
(PGA), which is controlled with the internal register. The quadrature IF signal is
digitized with high resolution A/D converters. The signal is then down
converted by a demodulator to I and Q. The Si4201 (U203) downconverts the
ADC output to baseband with a digital 100kHz quadrature LO signal.

B. Transmitter Operation
The transmitter chain converts differential IQ baseband signals to a suitable
format for transmission by a power amplifier. A quadrature mixer upconverts
the differential in-phase (TXIP, TXIN) and quadrature (TXQP, TXQN) signals
with the IFLO to generate a SSB IF signal which is filtered and used as the
reference input to the OPLL. The Si4133 (U301) generates the IFLO & RFLO
frequency.

Mode

V

C

1 (pin2)

V

C

2 (pin11)

GSM TX

L

H

DCS TX

H

L

GSM/DCS RX

L

L

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4.Synthesizer:

U301 is a dual frequency synthesizer that performs IF and RF synthesis. Two
complete PLLs are integrated including VCOs, varactors, loop filters, reference
and VCO dividers, and phase detectors. Differential outputs for the IF and RF
PLLs are provided for direct connection to the Si4200 (U201) transceiver. The
RF PLL uses two multiplexed VCOs. The RF1 VCO is used for receive mode,
and RF2 VCO is used for transmit mode. The IF PLL is used only during
transmit mode and uses a single VCO.































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