Name and formula

Reference code: 98-062-7113

Compound name: Copper

Common name: Copper

Chemical formula: Cu₁

Crystallographic parameters

Crystal system: Cubic

Space group: F m -3 m

Space group number: 225

a (A): 3.6140

b (A): 3.6140

c (A): 3.6140

Alpha (°): 90.0000

Beta (°): 90.0000

Gamma (°): 90.0000

Calculated density (g/cm^3): 8.94

Volume of cell (10^6 pm^3): 47.20

Z: 4.00

RIR: 9.57

Subfiles and quality

Subfiles: User Inorganic

User Metallic

Quality: User From Structure (=)

Comments

Creation Date: 01-Aug-08

Modification Date: 30-Dec-99

Original ICSD space group: FM3-M. At least one temperature factor missing in the paper.. No R value given in the paper.

Structure type: Cu

Temperature in Kelvin: 296. Standard deviation missing in cell constants

Metals Sdata Record: INT= film; APP= Unicam high-temp.

Metals formula record: Cu (z = 4) FM3-M. Cell and Type only determined by the author(s). Coordinates estimated by the editor in analogy to isotypic compounds.

Structure type: Cu

Recording date: 8/1/2008

ANX formula: N

Z: 4

Calculated density: 8.94

Pearson code: cF4

Wyckoff code: a

Publication title: X-ray studies on the thermal expansion of copper-nickel alloys

ICSD collection code: 627113

Structure: Cu

Chemical Name: Copper

Second Chemical Formula: Cu

References

Structure: Tokola, E.;Kantola, M., Annales Academiae Scientiarum Fennicae, Series A6: Physica, 223, 1 - 10, (1967)

Peak list

No. h k l d [A] 2Theta[deg] I [%]

1 1 1 1 2.08654 50.770 100.0

2 0 0 2 1.80700 59.342 45.3

3 0 2 2 1.27774 88.865 22.7

4 1 1 3 1.08966 110.350 24.4

Structure

No. Name Elem. X Y Z Biso sof Wyck.

1 CU1 Cu 0.00000 0.00000 0.00000 0.5000 1.0000 4a

Stick Pattern