SERVICE
SINGLE BAND Mobile
Cellular Phone
STH-N271
2
3
6
4
5
8
7
9
Manual
SINGLE BAND Mobile Cellular Phone
CONTENTS
1. Specification
2. Trouble Shooting
3. Test Procedure
4. Function of All Active Devices
5. Frequency Synthesizer Circuit
and Spurious Radiation
Suppression Circuit
6. Easy NAM Programming
7. Electrical Parts List
8. Exploded Views and Parts List
9. Block Diagram
10. PCB Diagrams
11. Circuit Description &
Circuit Diagrams
©Samsung Electronics Co.,Ltd. August. 2001
Pinted in Korea.
Code No.: GH68-02202A
BASIC.
ELECTRONICS
1. STH-N271 SPECIFICATION (REF TIA/EIA/IS-137-A-1)
1. Confirmation of Power level (Class IV)
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1-1
Level
Analog(dBm)
Digital(dBm)
0,1,2
26.5
26.5
3
23
23
4
20
20
5
16
16
6
12
12
7
8
8
8
-
3
9
-
-2
10
-
-7
2. Channel Numbering and Frequency
System
Channel Number
Transmitter
Receiver
(Not used)
990 CH
824.01 MHz
869.01 MHz
A”
991 CH ~ 1023 CH
824.04 ~ 825.00 MHz
869.04 ~ 870.00 MHz
A
1 CH ~ 333 CH
825.03 ~ 834.99 MHz
870.03 ~ 879.99 MHz
B
334 CH ~ 666 CH
835.02 ~ 844.98 MHz
880.02 ~ 889.98 MHz
A’
667 CH ~ 716 CH
845.01 ~ 846.48 MHz
890.01 ~891.48 MHz
B’
717 CH ~ 799 CH
846.51 ~ 848.97 MHz
891.51 ~ 893.97 MHz
#. Transmitter : 1 < N < 799 : 0.03N + 825.00 MHz
990 < N < 1023 : 0.03(N-1023) + 825.00 MHz
#. Receiver : 1 < N < 799 : 0.03N + 870.00 MHz
990 < N < 1023 : 0.03(N-1023) + 870.00 MHz
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1-2
STH-N271
Specification
3. General
Item
Analog mode
Digital mode
Frequency Range
Transmitter
824.04 ~ 848.97 MHz
Receiver
869.04 ~ 893.97 MHz
Channel Space
30 kHz
Numbers of Channel
1024
Duplexer Space
45 MHz
Frequency Stability
± 2.5 ppm
± 200 Hz
Operating Temperature
- 30
o
C ~ +60
o
C
Size and Weight
Including 900 mAh battery
108 (H) x 42 (W) x 17.2 (D) : 93 g
Including 1200 mAh battery
108 (H) x 42 (W) x 18.7 (D) : 100 g
Operating Time
Standby time
Including 900 mAh battery
35 ~ 45 hr
130 ~ 230 hr
Including 1200 mAh battery
45 ~ 55 hr
190 ~ 300 hr
Talk time
Including 900 mAh battery
60 ~ 90 min
2 ~ 3 hr
Including 1200 mAh battery
80 ~ 120 min
2.5 ~ 4.5 hr
N
Need to check
Q107, Q106
N
Replace dome S/W
N
Need to check
Q107, Q106
N
Need to replace
Memory(U202)
N
Need to check neighbor part
Need to check OSC320,
Y201 & neighbor part
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2-1
2. STH-N271 Trouble Shooting
1. Baseband Section
1-1. Program No Running
Press END Key
Y
Y
Y
Y
Y
Y
ON_SW=H
VBAT>3.2V
VCTCXO_IN=14.4MHz
32K_XIN=32.768 kHZ
Memory (U202)
control signal OK?
VCC=3.0V
V_VCTCXO=3.0V
RST=3.0V
IVCC=2.2V
BOOT=H
Program Running
VCC, ADD(0:21), DATA(0:15),
FLASH_CS, SRAM_CS, UBE,
MEMOEB, MEMWEB
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2-2
STH-N271
Trouble Shooting
N
Need to check
U103 & neighbor part
N
Need to check
R126, C148
1-2. Abnormal LCD display ,EL Back Light, Vibrator & Speaker Operation
START
Y
Y
LCD Control
Signal OK?
Y
Y
EL_EN=H
N
Need to check U104
& neighbor Part
Y
EL Back light
OK?
VCC, ADD(2), DATA(0:7),
DISPLAY_CS, RST
LCD Display Running
Send Command EL
enable(Test mode:176)
N
Need to check
R216, U205, D202
Y
Y
VIBRATOR=H
N
Need to check CN202
Y
Vibrator Run
OK?
LCD Display Running
EL Back lingt Running
Send Command Vibrator
enable(Test mode:180)
N
Need to check SPK101
& neighbor part
Y
Y
REC20+,- Signal
OK?
LCD EL Vibrator OK Send Command
Main Audio Receiver Path ON
(Test mode:031, 131, 134, 185)
Good
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2-3
STH-N271
Trouble Shooting
N
Need to check Dome
S/W & U103
N
Need to check MIC101
& neighbor part
1-3. Abnormal Key, Mic, LED’S operation
Press Keys
Y
Y
Key Dispaly
OK?
Y
Key Display Good
Send Command Main Audio Path ON
(Test mode:031, 131, 136, 187)
Talking Voice at MIC+
N
Need to check
D210, D211, Q204, Q206
Y
Y
Y
LED Operation
OK?
Key Display Good
Mic Path Good
Send Command ALT_LED_ON
Send Command SVC_LED_ON
Send Command LED_ON
(Test mode:178)
Audio signal output
at Speaker?
GOOD
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2-4
STH-N271
Trouble Shooting
1-4. Abnormal Buzzer Operation
START
Y
N
Need to check
U204, D201, CN202
Y
Y
Ringer Signal
OK?
Send Command Ringer Path ON
(Test mode:183)
N
Replace CN202
Y
Buzzer Sound Output
OK?
Buzzer Operation
Good
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2-5
STH-N271
Trouble Shooting
1-5. Abnormal external Ear_Mic Jack operation
START
Y
N
Need to check Q101,
CN101 & neighbor parts
Y
Y
HEADSET_SENSE=H
Hock Up Ear_Mic Phone in the Jack(CN101)
Send Command MIC_BIAS_EN enable Send
Command AMP_EN enable
Audio set Path=HS
(Test mode:187)
N
Need to check Q102,
CN101 & neighbor parts
Y
Y
SEND_END=H
Press Button on the Ear-Jack
Ear_Mic phone
Operation Good
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2-6
STH-N271
Trouble Shooting
2. RF Section
2-1. Call processing and Online Test
N
DONE
START
Y
Y
Normal SVC?
Check RX path
N
Y
Set up Call OK?
Check TX path
N
Y
Measure SINAD/BER
Good?
Check RX path
N
Y
Measure
Tx Power Good?
Check TX path
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2-7
STH-N271
Trouble Shooting
1
N
Need to check
U302
2-2. Receiver Section (Offline test)
Y
Y
Y
Y
F305 input=-55dBm
N
Need to check
F305
N
Need to check
U105, U106, U107
F305 output=-49dBm
Y
N
Need to check
F306
U301_8=-53dBm
N
Need to check
F304 & neighbor parts
Y
RF_BAND=L, RX_BAT=H
PLL_ON=H, PON_LC=H
VCTCXO_PC=H, IF_ON=H
PON_VRF3=H
set up 8920B basestation for RX test
Set Base station RX Lev=-50 dBm
Send Command RX path ON
Send Command channel selecton
(Test mode:134, 131)
START
N
Y
V_LNA_CELL=H
U107_1=H
U105_1=H
Need to check
U301 & neighbor parts
F304 input=-33dBm
2
U304_45=-33dBm
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2-8
STH-N271
Trouble Shooting
2
N
N
AMPS
TDMA
N
Replace U304
Replace
F302
Need to check OSC301,
neighbor parts & U304_1,2,3
Need to check
U105 & neighbor parts
N
Y
Y
Y
Y
Y
RF loal check
U304_48 Lev=-6dBm
Freq=adjusted freq?
1
U304_41 Lev=-23dBm
Freq=130.05MHz
U304_34 Lev=-33dBm
Freq=130.05MHz
N
Need to check
U304, L303, C308, L301, C307
U304_37 Lev=-1dBm
Freq=450kHz
Y
N
Replace F301 or
Need to check R302, R304, C301
U304_25 Lev=-7dBm
Freq=450kHz
MODE
U304_40, 42=3.0V
4
3
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2-9
STH-N271
Trouble Shooting
N
Replace U304
Case TDMA mode:
setup basestation for RX test
Amplitude:-50dBm
3
U304_9, 19, 11, 12
measure I/Q
Quarature wave
N
Need to check U304 &
Quad LC Tank circuit
(L310, C328, C330,
C329, R320)
PON_LD=H
Case AMPS mode:
setup basestation for RX test
Audio Freq gen : 1004Hz
FM deviation : 2.9kHz
4
Y
Y
Y
U304_16 DEMOD
(sinusoidal wave)
Vp-p=24mV
Freq=1004Hz
N
Need to check U304 &
R327, R323, C353, C107
U101_52 DEMOD
(sinusoidal wave)
MAX Vp-p=1.4V
Freq=1004Hz
N
Replace U203
Y
U101_40 BBCLK=
6.2208MHz or 4.96NHz or
5.12MHz
N
Replace U203
Y
U101_32RX_CLK=
BBCLK/2 or
BBCLK/8
N
Replace U203
Y
U101_31 RX_SYNC=
BBCLK/32 or
BBCLK/128
N
Replace U203
Y
U101_31 RX_DATA=
serial data
DONE
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2-10
STH-N271
Trouble Shooting
N
Replace U203
N
Replace U203
N
Replace U203
N
Replace U203
2-3.Transmitter Section (Offline test)
Y
Y
Y
U101_40 BBCLK=
6.2208MHz or 4.096MHz
or5.12MHz
Y
U101_34 TX_CLK=
BBCLK/32 or BBCLK/8
Y
U101_33 TX_SYNC=
BBCLK/512 or BBCLK/128
Y
U101_33 TX_DATA=
serial data
RF_BAND=L, TX_BAT=H
PLL_ON=H, VCYCXO_PC=H
IF_ON=H, PON_TX=H
PON_VRF3=H
setup 8920B as basestaion for
TX test audio signal?
Send command TX path ON
Send Command channel selection
(Test mode:136, 131)
START
AMPS
TDMA
2
1
MODE
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2-11
STH-N271
Trouble Shooting
1
3
Replace U101
Y
Y
Need to check
V_RF2=3.0V or
Replace U304
2
Y
U304_59(RF OUT)
Fc=Local_freq + 175.05
U101_61, 60, 58, 57
TX I/Q Quarature signal
AC Lev Vp_p=0.4V
DC bias Lev=1.5V
U101_63 MOD
(sinusoidal wave)
MAX Vp-p=1.4V
Freq=1004Hz
OSC303_1
(FM modulation out)
Freq=175.05MHz
Audio Freq=1004Hz
Need to check
OSC303,
V_IF_VCO=3.0V
N
Y
N
N
Y
Need to check
U304_66 or
Replace U304
U304_59(RF OUT)
measure Level
Send command PA_CNT
(Test mode:132)
Level is adjustable?
N
Y
Replace F310
U304_59(RF OUT)
Fc=Local_freq + 175.05
N
Y
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2-12
STH-N271
Trouble Shooting
3
Y
Need to check
V_DRV_CELL=3.0V,
neighbor part or
Replace U307
U307 Gain
around 27dB
N
Y
Replace F309
F309 Insertion loss
around 3dB
N
Y
Need to check
V_PA_BAIS_CELL(U305_5,6,7)=3.0V
VBATT(U305_14,15,16)=3.2~1V
or Replace U305
U305 Gain
around 30dB
N
Y
Need to check
F313 & neighbor parts
F306_1 around same power
with U305 output
N
Y
Need to check
F313 & neighbor parts
F306 insertion loss
under 3dB
N
DONE
3. STH-N271 TEST PROCEDURE
1. List of Equipment
•
8920B TDMA M/S TEST SET (HP CARD, modified by Samsung )
•
SIGNAL GENERATOR (2 SETS)
•
SPECTRUM ANALZER
•
DEVICE UNDER TEST (STH-N271)
•
TEST INTERFACE ADAPTER
•
COMBINNER
•
DC POWER SUPPLY
•
PC
•
Cables (RF CABLE, DATA CABLE, SERIAL CABLE, etc.)
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3-1
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3-2
STH-N271
Test Procedure
2. Configuration of Test
2-1. Test Configration-1
2
3
6
4
5
8
7
9
RF cable
DUT
Data cable
TEST I/F
ADAPTER
+ 3.8 V
A-OUT
T
O
PC
T
O
HP
A-IN
DC P/S
4 pin cable
RF IN/OUT
A-OUT A-IN
8920B TDMA M/S TEST SET
HP CARD
serial port
Signal
GEN2
Signal
GEN1
combinner
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3-3
STH-N271
Test Procedure
2-2. Test Configration-2
2
3
6
4
5
8
7
9
RF cable
coupler
DUT
Data cable
TEST I/F
ADAPTER
DC P/S
+ 3.8 V
A-OUT A-IN
RF IN/OUT
A-OUT A-IN
HP CARD
8920B TDMA M/S TEST SET
Spectrum Analyzer
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3-4
STH-N271
Test Procedure
2-3. Test Configration-3 (Hands Free Kit)
Ignition
Cable
DUT
Cradle
Data cable
Hands Free
Kit BOX
Power cable
DC Power
Supply
+13.7 V
Hands Free Mic
Hands Free Speaker
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3-5
STH-N271
Test Procedure
RF CABLE
DATA CABNLE
Table 3-Test Cable description
NAME
DESCRIPTION
1
RF CONNECTOR
Hook up to DUT RF switch
2
RF CABLE
Line loss 1.5dB cable
3
BNC CONNECTOR
Connect to TEST equipment
4
INTERFACE CONNECTOR
Hook up to DUT Button connector (Table 4)
5
DATA CABLE & PST CABLE
Normal data cable, PC Link
6
DSUB 25PIN CONNECTOR
Connect to TEST I/F ADAPTOR (Table 5)
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3-6
STH-N271
Test Procedure
Table 4- Interface Button Connector
CN201 Pin
Signal Name
Comment
1
GBOOT_DI
BOOT & Data IN (serial interface)
2
SCLK
Serial Interface clock
3
DSR
UART1 signal
4
SIN2
UART2 IN signal
5
DO
Data OUT (serial interface)
6
SOUT2
UART2 OUT signal
7
RX_AUDIO
HFK audio receiver signal
8
GND
9
C_FNSTRB
Battery interface & Strobe (serial interface)
10
GND
11
TX_AUDIO
HFK audio transmitter signal
12
GND
13
DP_RX_DATA
UART1 RX data
14
DP_TX_DATA
UART1 TX data
15
HP_PWR
External power on ( Test I/F Adapter / HFK)
16
RI
UART1 signal
17
CD
UART1 signal
18
V_F
Battery interface signal
19
GND
20
RTS
UART1 signal
21
BATT
22
BATT
23
CTS
UART1 signal
24
DTR
UART1 signal
25
GND
26
C_F
Battery interface & Strobe (serial interface)
27
V_F
Battery interface signal
28
BATT
Battery + Voltage
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3-7
STH-N271
Test Procedure
Table 5- DSUB 25pin Connector
DSUB 25Pin
Signal Name
Comment
1
GND
2
NC
3
NC
4
BATT
5
NC
6
BATT
7
HP_PWR
External power ( Test I/F Adapter / HFK)
8
NC
9
NC
10
TX_AUDIO
HFK audio transmitter signal
11
GND
12
RX_AUDIO
HFK audio receiver signal
13
GND
14
NC
15
GND
16
NC
17
NC
18
SIN2
UART2 OUT signal
19
SOUT2
UART2 IN signal
20
NC
21
DP_RX_DATA
UART1 RX data
22
DP_TX_DATA
UART1 TX data
23
BOOT
BOOT & Data IN (serial interface)
24
NC
25
NC
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3-8
STH-N271
Test Procedure
3. Auto test procedure (with HP CARD, modified by Samsung)
a). Set up all test equipment like as Test configuration-1
b). Insert HP Card on the HP8920B Test Set
c). Power ON phone
d). Run AUTO Test
e). Store data if required
f). TEST items (refer Chapter 1.Specification)
Items
TIA/EIA-137-270
RXA Electrical Audio Response
2.2.2.1
RXA Expander Output
2.2.2.3
RXA Hum and Noise
2.2.2.4
RXA Audio Harmonic Distortion
2.2.2.5
RXA RF Sensitivity
2.3.1.1
TXA RF Power Output
3.2.1.1
TXA Modulation Type & Stability
3.3.1.1
TXA Compressor Output
3.3.1.2.1
TXA Electrical Audio Response
3.3.1.2.2
TXA Modulation Deviation Limiting
3.3.1.2.3
TXA Wideband Data
3.3.1.3
TXA Hum and Noise
3.3.1.6
TXA Modulation Distortion and Noise
3.3.1.8
TXD RF Power Output
3.2.1.2
TXD Modulation Type and Accuracy
3.3.2.1
TXD Adjacent & Spurious Emission
3.4.2.2
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3-9
STH-N271
Test Procedure
4. Manual test procedure
4-1.RXA Audio Muting (Ref 2.2.2.2)
a). Set up all test equipment like as Test configuration-1
RF amplitude: -50dBm,
Setup channel: 383ch
SAT : 6000Hz
b). Power ON the phone
c). For entering the test mode, Press the key number “ # 2 4 2 6 4 # ”
d). Input the commands.
"0 3 1" : Suspend.
"1 3 1" : Set_atten '3 8 3' channel.
“1 7 3”:Compon
“0 3 2:”:HFK_on
“1 3 4”:RXUNMUTE
e). Measure AC level of audio in
AFGen: 1004Hz
FM: 8KHz dev
f). Send command RXMUTE (133)and Measure AC level of audio in
g). Compare value of e). and f).
4-2.RXA Adjacent and Alternate Channel Desensitization (Ref 2.3.1.2)
a). Set up all test equipment like as Test configuration-1
Setup channel, RF amplitude based on standard 2.3.1.2.2
b). Power ON the phone
c). For entering the test mode, Press the key number “ # 2 4 2 6 4 # ”
d). Input the commands.
"0 3 1" : Suspend.
"1 3 1" : Set_atten '3 8 3' channel.
“1 7 3”:Compoff
“0 3 2:”:HFK_on
“1 3 4”:RXUNMUTE
e). Measure Power of Adjacent channel (Signal Generator) to meet 12dB SINAD
based on standard 2.3.1.2.2
f). Measure Power of Alternate channel (Signal Generator) to meet 12dB SINAD
based on standard 2.3.1.2.2
4-3.RXA Inter-modulation Spurious Response Attenuation (Ref 2.3.1.3)
a). Set up all test equipment like as Test configuration-1
Setup channel, RF amplitude based on standard 2.3.1.3.2
b). Power ON the phone
c). For entering the test mode, Press the key number “ # 2 4 2 6 4 # ”
d). Input the commands.
"0 3 1" : Suspend.
"1 3 1" : Set_atten '3 8 3' channel.
“1 7 3”:Compoff
“0 3 2:”:HFK_on
“1 3 4”:RXUNMUTE
e). Measure Power of Intermodulation channel (2-Signal Generator) to meet 12dB SINAD
based on standard 2.3.1.3.2
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3-10
STH-N271
Test Procedure
4-4.RXA Protection Against Spurious Response Interference (Ref 2.3.1.4)
a). Set up all test equipment like as Test configuration-1
Setup channel, RF amplitude based on standard 2.3.1.4.2
b). Power ON the phone
c). For entering the test mode, Press the key number “ # 2 4 2 6 4 # ”
d). Input the commands.
"0 3 1" : Suspend.
"1 3 1" : Set_atten '3 8 3' channel.
“1 7 3”:Compoff
“0 3 2:”:HFK_on
“1 3 4”:RXUNMUTE
e). Measure Power of undesired input (Signal Generator) to meet 12dB SINAD
based on standard 2.3.1.4.2
4-5.RXA RSSI (Ref 2.6.1)
a). Set up all test equipment like as Test configuration-1
Setup channel, RF amplitude based on standard 2.6.1.2
b). Power ON the phone and Press the key number “ # 9 9 9 9 0 # ”
c). Make a call
d). Measure RSSI by test mode in the telephone based on standard 2.6.1.2
4-6.TXA Audio Muting (Ref 3.3.1.2.4)
a). Set up all test equipment like as Test configuration-1
RF amplitude: -50dBm, Setup channel: 383ch, SAT : 6000Hz
b). Power ON the phone
c). For entering the test mode, Press the key number “ # 2 4 2 6 4 # ”
d). Input the commands.
"0 3 1" : Suspend.
"1 3 1" : Set_atten '3 8 3' channel.
“1 7 2”:Compon
“0 3 2:”:HFK_on
“1 3 6”:TXUNMUTE
e). Measure FM deviation and Set Reference level
f). Send command TXMUTE (1 3 5)
g). Measure relative FM deviation based on standard 3.3.1.2.4.3
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3-11
STH-N271
Test Procedure
4-7.TXA Noise Suppression-Broadband (Ref 3.4.1.1)
a). Set up all test equipment like as Test configuration-2
Setup channel: 383ch
RF amplitude: -50dBm
Power Level: 0
SAT: 6000Hz
b). Power ON the phone
c). For entering the test mode, Press the key number “ # 2 4 2 6 4 # ”
d). Input the commands.
"0 3 1" : Suspend.
"1 3 1" : Set_atten '3 8 3' channel.
“0 3 2:”:HFK_on
“1 2 9”:Carrier_ON
“1 3 6”:TXUNMUTE
e). Setup Voise and SAT tone based on standard 3.4.1.1.2 and 3.4.1.1.3(1 6 1)SATOFF
f). Send command SATON(1 6 0)SATON
g). Send disable compressor(1 7 3)COMPOFF
h). Measure the Spurious based on standard 3.4.1.1.3
4-8.TXD Harmonic & Conducted Spurious Emission (Ref 3.4.2.2)
a). Set up all test equipment like as Test configuration-2
Setup channel: 383ch
RF amplitude: -50dBm
Power Level: 0
b). Power ON phone and Make a call
c). Measure the Spurious based on standard 3.4.2.2.3
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3-12
STH-N271
Test Procedure
5. Test Mode
Command
Purpose
Description
Usage
Note
31
IS-137 SUSPEND
32
Hands-Free Kit Path On
33
Hands-Free Kit Path Off
35
Get/Set DEMOD_AGCR
36
Get/Set DEMOD_DGCR
37
Get/Set DSP_RX_GAIN
38
Get/Set DGGSR
40
Get/Set TXAG
41
Get/Set TXDG
42
Get/Set AUDIO_TxGain
43
Get/Set MOD_GCR
44
Get/Set MOD_DGCR
45
Get/Set WBD_WBTx_GCR
46
Get/Set ST_WBTx_GCR
47
Get/Set SAT_Gain
49
Get/Set DTMF Volume
63
IS-137 RESTART
96
SetBand
0: Cell, 1: PCS
97
SetMode
0: Scan_mode
1: ACC
2: AVC
4: DTC
5: DCCH
6: TCH_DATA
98
Get/Set PA_Bias
99
Get/Set pa_cnt_val
100
Get/Set TX_I_DOCR
101
Get/Set TX_Q_DOCR
102
Get/Set TX_I_DGCR
103
Get/Set TX_Q_DGCR
128
IS-137 INIT
Analog or Digital
129
IS-137 CARRIER-ON
Analog Only
130
IS-137 CARRIER-OFF
Analog or Digital
131
IS-137 LOAD-SYNTH
Channel Setting
132
IS-137 SET-ATTN
Set Power Level
133
IS-137 RXMUTE
134
IS-137 RXUNMUTE
135
IS-137 TXMUTE
136
IS-137 TXUNMUTE
SAMSUNG Proprietary-Contents may change without notice
3-13
STH-N271
Test Procedure
Command
Purpose
Description
Usage
Note
137
IS-137 DCCH-DGTS
TDMA slot setting
DCCH Digital
138
IS-137 DCCH-ON
Transmitting on
DCCH Digital
139
IS-137 RSSI
RSSI reporting
Digital Only
140
IS-137 DIGITS
—-
Analog or Digital
141
IS-137 TDMAON
Loopback
0: Off, 1: On
142
IS-137-A LOAD-
SYNTH-HYPERBAND
143
IS-137 STON
144
IS-137 STOFF
148
IS-137 SEND-NAM
149
IS-137 VERSION
Software Version
150
IS-137 SEND-SN
Return the 32-bit
serial number (ESN)
152
IS-137 RCVSI
—-
154
IS-137 WSTS
—-
158
IS-137 TERMINATE
159
IS-137-A SEND-NAM-MSID
160
IS-137 SATON
161
IS-137 SATOFF
162
IS-137 CDATA
170
IS-137 DTMFON
171
IS-137 DTMFOFF
172
IS-137 COMPON
173
IS-137 COMPOFF
176
Backlight On
177
Backlight Off
178
Service/Alert LED On
179
Service/Alert LED Off
180
Vibrator On
181
Vibrator Off
182
LCD contrast
183
Buzzer On
184
Buzzer Off
185
Speaker On
186
Speaker Off
187
MIC On
188
MIC Off
189
ReadTemp
223
GetProductNumber
4. STH-N271 Function of All Active Devices
SAMSUNG Proprietary-Contents may change without notice
4-1
No
Reference
Vendor Code
Description
1
U203
D5205
Baseband Engine Chip: IS-137 TDMA /AMPS solution
2
U101
D5204-22
Interface Chip
3
U304
uPC8015
RF one chip module: RF/IF Synthesizer, 2-Mixers, AGC,
Q-DEMOD,UP converter
4
U305
RF2162
Power Amplifier: Cellular band linear amplifier
5
U307
RF2376TR73
Driver Amp: linear variable amplifier suitable for cellular band
6
OSC301
ENFVF1A2ST4
RF VCO: dual band RF voltage control oscillator (999MHz ~ 1025,
2060 ~2121MHz)
7
OSC303
ENFVH112SA5
IF VCO: dual band IF voltage control oscillator
(175.05MHz, 211MHz)
8
OSC302
TCO-9133F
TCXO: 14.4MHz for reference clock
9
U301
RF2363TR7
LNA: dual band Low Noise Amplifier
10
U102
LM4882
Audio Amp: external audio amplifier
SAMSUNG Proprietary-Contents may change without notice
5-1
5. STH-N271 Frequency Synthesizer Circuit and
Spurious Radiation Suppression Circuit
1. Frequency Synthesizer Circuit
The PLL (Phase Lock Loop) block consists of VC-TCXO (OSC302), PLL (belong to RF chip, U304), RF VCO
(OSC301), IF VCO (OSC303), and loop filter.
The VC_TCXO is a reference source of the frequency synthesizer. It provides 14.4MHz-reference frequency
to PLL part. It is a voltage controlled temperature compensated crystal oscillator having 14.4MHz-°æ
2.0ppm frequency stability over all useful temperature range. The control voltage makes a correct
frequency tuning.
The RF VCO generates the RF local signal having 998 ~ 1025MHz frequency range with the voltage control.
It has maximum -114dBc/1Hz C/N offset and -3 ± 3dBm output power.
The IF VCO generates the intermediate frequency having 175.05MHz frequency range with the voltage
control. It has maximum -102dBc/1Hz C/N offset and -3 ± 3dBm output power.
The PLL consist of PLL1 (RF section) and PLL2 (IF section) which interior decorated RF chipset (U304). The
reference divider in the PLL part divides the frequency of VC_TCXO. This reference frequency is supplied
to one of the inputs of phase detector. The signal generated at VCO goes into another stage of the phase
detector through a pre-scaler and a programmable divider. At this point the error proportional to the phase
difference of the two inputs occurs. This phase error is applied to the frequency control input stage of VCO
through the loop filter, which consists of resistor and capacitor.
SAMSUNG Proprietary-Contents may change without notice
5-2
STH-N271
Frequency Synthesizer Circuit and Spurious Radiation Suppression Circuit
2. Spurious Radiation Suppression Circuit
The spurious signal from antenna is suppressed at the duplexer. The duplexer has flat characteristics to the
receiving signal and high attenuation characteristics to the harmonic signals of transmission. Therefore, it
suppresses the spurious radiation
Item
TX-ANT
RX-ANT
Center Freq.
836.5 MHz
881.5 MHz
Bandwidth (BW)
± 12.5 MHz
± 12.5 MHz
Insertion Loss
2.8 dB Max at 25C
4 dB Max
3 dB Max at -30 ~ +85C
Ripple at BW
1.6 dB Max
2.0 dB Max
VSWR
1.8 Min
1.8 Min
Attenuation
43 dB Min at 869 ~ 894 MHz
56 dB Min at 824 ~ 849 MHz
Input Power
3 W Max
1 W Max
In/Out Impedance
50 Ohms
50 Ohms
Mechanical Size
15.65 (L) X 9.2 (W) X 3.3 (H) mm
SAMSUNG Proprietary-Contents may change without notice
6-1
6. STH-N271 E
Ea
as
sy
y N
NA
AM
M P
Prro
og
grra
am
mm
miin
ng
g
[Function outline]
Inputting #SID#*(SID: System Identity. 5 digits at a maximum(00000 to 32767))in Idle or during a voice call
and then pressing SEND key causes Easy NAM Setting Mode1/Easy NAME Setting Mode2(#SID#2#*).
In NAM Programming Setting Mode, received SMS/MWI/Incoming Call are rejected.
The reference of the set contents is possible during a call, but editing the contents is impossible and a
"Fail" is displayed.
About editing not in a call, a display saying "Please Wait" is displayed and then completing the entry to
NVM automatically moves to Reboot Mode leading to Power On.
Not Entry but only Reference is available during a call and whether to terminate or not is displayed.
In case of terminating, the display moves to Call Time Display.
In case of Terminating Conversation or Fade timer time Out during reference, Call End is displayed and
moves to Idle. In case of receiving Receive Flash with Information Message,
Call Waiting appears and the action of the transition is same as Waiting Section. (See 1.4.7.1)
[Mode]
[Action condition]
#SID# + SEND Key
[Cancel condition]
press END Key
Public
Private
Residential
SAMSUNG Proprietary-Contents may change without notice
6-2
STH-N271
Easy NAM Programming
[Detail]
References or Setting Items are as follows.
1). ESN
2). Authorization Code
3). Phone Number
1).ESN:(Electronic Serial Number)
ESN value is used in the process of certification. In case the value of S information element is set to
1, moving station(mobile side) sends ESN as a series of messages to BMI in System Access.
Reference only is available for ESN. It transits to Phone Number or Exit Save Change(Exit) by Up or
Down Scroll Key or *# key.
2). Reference of Authorization Code
Authorization Code is the Network certification access code. It is calculated using ESN, RANDO,
MIN, SSD_S by Auth_Signature Algorithm.
3). Reference and Edition of Phone Number.
Phone Number is Moving Station Entry Number like MIN(Mobile ID Number).
10 digits except *, # and Pause is inputted for editing Phone Number. Other than that, Reinput
Display is displayed with the original number, then the Screen moves to Edit Require Screen. In case
of normal input, the input number is displayed following the display of Change.
SAMSUNG Proprietary-Contents may change without notice
6-3
STH-N271
Easy NAM Programming
[Screen action]
Easy NAM Programming
(1)To set SID to NAM1 in English
(As an example, in case 23 should be set to HSID)
[Note#0] During Easy NAM Programming Mode, SMS/Incoming Call shall be rejected and MWI is NOT displayed.
[Note#1] The default data of each parameter based on SID&MIN is defines in ATT Req.(4047) Appendix L Section 9.3.
(“Primary Paging Channel=333 for odd SIDs otherwise 334 for even SIDs”,
“Secondary Paging Channel=708 for odd SIDs otherwise 737 for even SIDs”, “Access Method=1(active)”,
“Overload Class=0 follwed by last digit of MIN”, “SID Alpha Tag Control=disable”.)
[Note#3] During editing Phone#, it is not possible to enter “*”, “#” and “P(Pause)”.
[Note#4] If the seting value for SID is not in the valid range (from 0 to 32767), the normal origination procedure will be
executed when hitting SEND Key.
5/17/1999 Mon
1:28 AM
Menu Names
#23#*
Save
NAM-1
Phone
Programming
Yes No
ESN
ec965ad7
OK Exit
SAVE?
Yes No
Enter Own Number
5251111111
OK Exit
Saved
Idle Screen
SAMSUNG Proprietary-Contents may change without notice
6-4
STH-N271
Easy NAM Programming
(2)To set SID to NAM2 in English
(As an example, 12723 should be set to HSID)
[Note#0] During Easy NAM Programming Mode, SMS/Incoming Call shall be rejected and MWI is NOT
displayed.
[Note#1] The default data of each parameter based on SID&MIN is defines in ATT Req.(4047) Appendix L
Section 9.3.
(“Primary Paging Channel=333 for odd SIDs otherwise 334 for even SIDs”,
“Secondary Paging Channel=708 for odd SIDs otherwise 737 for even SIDs”, “Access
Method=1(active)”, “Overload Class=0 follwed by last digit of MIN”, “SID Alpha Tag
Control=disable”, NAM2 Validity=1.)
[Note#2] If the NAM Number is set to 1, the NAM1 is programmed as same as (1) part.
[Note#3] During editing Phone#, it is not possible to enter “*”, “#” and “P(Pause)”.
[Note#4] If the seting value for SID is not in the valid range (from 0 to 32767), the normal origination
procedure will be executed when hitting SEND Key.
5/17/1999 Mon
1:28 AM
Menu Names
#12723#2#*
Save
NAM-2
Phone
Programming
Yes No
ESN
ec965ad7
OK Exit
SAVE?
Yes No
Enter Own Number
1234567890
OK Exit
SAMSUNG Proprietary-Contents may change without notice
7-1
7. STH-N271 MAIN Electrical Parts List
0
STH-N271D/COM
2
4201-000151
AN301
ANTENNA-WHIP 824-894MHz, -, 1.8, -,
1
4302-001081
BATT.
BATTERY-LI(2ND) -, .25MAH, COIN, 0.03MA, -, -
2
4302-001081
BT201
BATTERY-LI(2ND) -, .25MAH, COIN, 0.03MA, -, -
2
2203-005061
C101
C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
2
2203-000330
C102
C-CERAMIC, CHIP 0.012 nF, 5 %, 50 V, NP0, TP, 1005
2
2203-005061
C104
C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
2
2203-005061
C105
C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
2
2203-000679
C106
C-CERAMIC, CHIP 0.027 nF, 5 %, 50 V, NP0, TP, 1005
2
2404-001105
C107
C-TA, CHIP 10 uF, 20 %, 6.3 V, GP, TP, 2012
2
2203-005061
C108
C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
2
2203-005061
C109
C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
2
2203-005061
C110
C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
2
2203-000278
C111
C-CERAMIC, CHIP 0.01 nF, 0.5pF, 50 V, NP0, TP, 1005
2
2203-005061
C112
C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
2
2203-005061
C115
C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
2
2404-001151
C116
C-TA, CHIP 33 uF, 20 %, 6.3 V, LZ, TP, 3216
2
2203-005061
C117
C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
2
2203-005061
C118
C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
2
2203-005061
C119
C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
2
2203-005061
C120
C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
2
2203-000679
C121
C-CERAMIC, CHIP 0.027 nF, 5 %, 50 V, NP0, TP, 1005
2
2203-005065
C122
C-CERAMIC, CHIP 1000 nF, +80-20 %, 10 V, Y5 V, TP, 1608
2
2203-005061
C124
C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
2
2203-005496
C125
C-CERAMIC, CHIP 220 nF, +80-20 %, 10 V, Y5 V, TP, 1005
2
2203-000233
C126
C-CERAMIC, CHIP 0.1 nF, 5 %, 50 V, NP0, TP, 1005
2
2203-000885
C127
C-CERAMIC, CHIP 4.7 nF, 10 %, 25 V, X7R, TP, 1005, -
2
2203-005061
C128
C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
2
2203-000254
C129
C-CERAMIC, CHIP 10 nF, 10 %, 16 V, X7R, TP, 1005, -
2
2203-005061
C130
C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
2
2203-000628
C131
C-CERAMIC, CHIP 0.022 nF, 5 %, 50 V, NP0, TP, 1005
2
2203-001153
C134
C-CERAMIC, CHIP 0.068 nF, 5 %, 50 V, NP0, TP, 1005
2
2203-001153
C136
C-CERAMIC, CHIP 0.068 nF, 5 %, 50 V, NP0, TP, 1005
2
2203-005061
C137
C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
2
2203-000438
C138
C-CERAMIC, CHIP 1 nF, 10 %, 50 V, X7R, TP, 1005, -
2
2203-001101
C139
C-CERAMIC, CHIP 6.8 nF, 10 %, 25 V, X7R, TP, 1005, -
2
2203-000476
C140
C-CERAMIC, CHIP 1000 nF, +80-20 %, 16 V, Y5 V, TP, 2012
2
2203-005061
C141
C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
Level
SEC CODE
Design LOC
DESCRIPTIONS
SAMSUNG Proprietary-Contents may change without notice
7-2
STH-N271 Electrical Parts List
2
2203-005061
C142
C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
2
2203-005061
C143
C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
2
2203-000254
C144
C-CERAMIC, CHIP 10 nF, 10 %, 16 V, X7R, TP, 1005, -
2
2203-005061
C145
C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
2
2203-000476
C146
C-CERAMIC, CHIP 1000 nF, +80-20 %, 16 V, Y5 V, TP, 2012
2
2203-000476
C147
C-CERAMIC, CHIP 1000 nF, +80-20 %, 16 V, Y5 V, TP, 2012
2
2203-005061
C148
C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
2
2203-000476
C149
C-CERAMIC, CHIP 1000 nF, +80-20 %, 16 V, Y5 V, TP, 2012
2
2203-005708
C150
C-CERAMIC, CHIP 100 nF, 10 %, 100 V, Y5P, TP, 3225
2
2203-000476
C151
C-CERAMIC, CHIP 1000 nF, +80-20 %, 16 V, Y5 V, TP, 2012
2
2404-000167
C155
C-TA, CHIP 2.2 uF, 20 %, 16 V, -, TP, 3216, -
2
2404-001105
C156
C-TA, CHIP 10 uF, 20 %, 6.3 V, GP, TP, 2012
2
2404-000167
C157
C-TA, CHIP 2.2 uF, 20 %, 16 V, -, TP, 3216, -
2
2404-001105
C158
C-TA, CHIP 10 uF, 20 %, 6.3 V, GP, TP, 2012
2
2404-001105
C159
C-TA, CHIP 10 uF, 20 %, 6.3 V, GP, TP, 2012
2
2404-001105
C160
C-TA, CHIP 10 uF, 20 %, 6.3 V, GP, TP, 2012
2
2203-005065
C161
C-CERAMIC, CHIP 1000 nF, +80-20 %, 10 V, Y5 V, TP, 1608
2
2404-000167
C162
C-TA, CHIP 2.2 uF, 20 %, 16 V, -, TP, 3216, -
2
2404-001105
C163
C-TA, CHIP 10 uF, 20 %, 6.3 V, GP, TP, 2012
2
2404-001105
C164
C-TA, CHIP 10 uF, 20 %, 6.3 V, GP, TP, 2012
2
2404-001105
C165
C-TA, CHIP 10 uF, 20 %, 6.3 V, GP, TP, 2012
2
2203-005065
C166
C-CERAMIC, CHIP 1000 nF, +80-20 %, 10 V, Y5 V, TP, 1608
2
2404-001105
C167
C-TA, CHIP 10 uF, 20 %, 6.3 V, GP, TP, 2012
2
2203-005061
C168
C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
2
2404-001105
C169
C-TA, CHIP 10 uF, 20 %, 6.3 V, GP, TP, 2012
2
2203-005061
C170
C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
2
2404-000167
C171
C-TA, CHIP 2.2 uF, 20 %, 16 V, -, TP, 3216, -
2
2404-001105
C172
C-TA, CHIP 10 uF, 20 %, 6.3 V, GP, TP, 2012
2
2404-001105
C173
C-TA, CHIP 10 uF, 20 %, 6.3 V, GP, TP, 2012
2
2203-005061
C174
C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
2
2203-005061
C175
C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
2
2203-005061
C176
C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
2
2203-005061
C177
C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
2
2404-000167
C178
C-TA, CHIP 2.2 uF, 20 %, 16 V, -, TP, 3216, -
2
2203-005061
C179
C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
2
2203-000940
C181
C-CERAMIC, CHIP 470pF, 10 %, 50 V, X7R, TP, 1005, -
2
2203-000940
C182
C-CERAMIC, CHIP 470pF, 10 %, 50 V, X7R, TP, 1005, -
2
2203-000438
C183
C-CERAMIC, CHIP 1 nF, 10 %, 50 V, X7R, TP, 1005, -
2
2203-000233
C184
C-CERAMIC, CHIP 0.1 nF, 5 %, 50 V, NP0, TP, 1005
Level
SEC CODE
Design LOC
DESCRIPTIONS
SAMSUNG Proprietary-Contents may change without notice
7-3
STH-N271 Electrical Parts List
2
2203-000679
C186
C-CERAMIC, CHIP 0.027 nF, 5 %, 50 V, NP0, TP, 1005
2
2203-000278
C187
C-CERAMIC, CHIP 0.01 nF, 0.5pF, 50 V, NP0, TP, 1005
2
2203-000438
C188
C-CERAMIC, CHIP 1 nF, 10 %, 50 V, X7R, TP, 1005, -
2
2203-000679
C189
C-CERAMIC, CHIP 0.027 nF, 5 %, 50 V, NP0, TP, 1005
2
2203-005061
C201
C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
2
2203-000278
C203
C-CERAMIC, CHIP 0.01 nF, 0.5pF, 50 V, NP0, TP, 1005
2
2203-005061
C205
C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
2
2203-005061
C206
C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
2
2203-000386
C207
C-CERAMIC, CHIP 0.015 nF, 5 %, 50 V, NP0, TP, 1005
2
2203-000386
C208
C-CERAMIC, CHIP 0.015 nF, 5 %, 50 V, NP0, TP, 1005
2
2203-005061
C209
C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
2
2203-005061
C210
C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
2
2203-005061
C211
C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
2
2203-005061
C212
C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
2
2203-005061
C213
C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
2
2203-005065
C214
C-CERAMIC, CHIP 1000 nF, +80-20 %, 10 V, Y5 V, TP, 1608
2
2203-005061
C215
C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
2
2203-005061
C216
C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
2
2203-005061
C220
C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
2
2203-000995
C221
C-CERAMIC, CHIP 0.047 nF, 5 %, 50 V, NP0, TP, 1005
2
2203-000995
C222
C-CERAMIC, CHIP 0.047 nF, 5 %, 50 V, NP0, TP, 1005
2
2203-000254
C223
C-CERAMIC, CHIP 10 nF, 10 %, 16 V, X7R, TP, 1005, -
2
2203-005061
C230
C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
2
2203-005061
C233
C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
2
2203-005061
C234
C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
2
2203-005061
C301
C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
2
2203-005061
C302
C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
2
2203-000233
C303
C-CERAMIC, CHIP 0.1 nF, 5 %, 50 V, NP0, TP, 1005
2
2203-001072
C304
C-CERAMIC, CHIP 0.056 nF, 5 %, 50 V, NP0, TP, 1005
2
2203-001201
C305
C-CERAMIC, CHIP 0.007 nF, 0.5pF, 50 V, NP0, TP, 1005
2
2203-000438
C306
C-CERAMIC, CHIP 1 nF, 10 %, 50 V, X7R, TP, 1005, -
2
2203-001153
C307
C-CERAMIC, CHIP 0.068 nF, 5 %, 50 V, NP0, TP, 1005
2
2203-001259
C308
C-CERAMIC, CHIP 0.008 nF, 0.5pF, 50 V, NP0, TP, 1005
2
2203-000278
C309
C-CERAMIC, CHIP 0.01 nF, 0.5pF, 50 V, NP0, TP, 1005
2
2203-005061
C310
C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
2
2203-005061
C311
C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
2
2203-000870
C312
C-CERAMIC, CHIP 0.003 nF, 0.25pF, 50 V, NP0, TP, 1005
2
2203-000254
C313
C-CERAMIC, CHIP 10 nF, 10 %, 16 V, X7R, TP, 1005, -
2
2203-000278
C314
C-CERAMIC, CHIP 0.01 nF, 0.5pF, 50 V, NP0, TP, 1005
Level
SEC CODE
Design LOC
DESCRIPTIONS
SAMSUNG Proprietary-Contents may change without notice
7-4
STH-N271 Electrical Parts List
2
2203-005061
C315
C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
2
2203-005281
C316
C-CERAMIC, CHIP 0.0015 nF, 0.1pF, 50 V, NP0, TP, 1005
2
2203-000885
C317
C-CERAMIC, CHIP 4.7 nF, 10 %, 25 V, X7R, TP, 1005, -
2
2203-000885
C318
C-CERAMIC, CHIP 4.7 nF, 10 %, 25 V, X7R, TP, 1005, -
2
2203-000233
C321
C-CERAMIC, CHIP 0.1 nF, 5 %, 50 V, NP0, TP, 1005
2
2203-005061
C322
C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
2
2203-005393
C323
C-CERAMIC, CHIP 0.005 nF, 0.1pF, 50 V, NP0, TP, 1005
2
2203-000386
C325
C-CERAMIC, CHIP 0.015 nF, 5 %, 50 V, NP0, TP, 1005
2
2203-005061
C326
C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
2
2203-000233
C327
C-CERAMIC, CHIP 0.1 nF, 5 %, 50 V, NP0, TP, 1005
2
2203-000278
C328
C-CERAMIC, CHIP 0.01 nF, 0.5pF, 50 V, NP0, TP, 1005
2
2203-000812
C329
C-CERAMIC, CHIP 0.033 nF, 5 %, 50 V, NP0, TP, 1005
2
2203-000838
C330
C-CERAMIC, CHIP 0.39 nF, 5 %, 50 V, NP0, TP, 1608
2
2203-005061
C331
C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
2
2203-005061
C332
C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
2
2203-005158
C333
C-CERAMIC, CHIP 0.0022 nF, 0.25pF, 50 V, NP0, TP, 1005
2
2203-005057
C334
C-CERAMIC, CHIP 0.0082 nF, 0.25pF, 50 V, NP0, TP, 1005
2
2203-000233
C335
C-CERAMIC, CHIP 0.1 nF, 5 %, 50 V, NP0, TP, 1005
2
2203-005061
C336
C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
2
2203-000233
C337
C-CERAMIC, CHIP 0.1 nF, 5 %, 50 V, NP0, TP, 1005
2
2203-000254
C338
C-CERAMIC, CHIP 10 nF, 10 %, 16 V, X7R, TP, 1005, -
2
2203-000233
C339
C-CERAMIC, CHIP 0.1 nF, 5 %, 50 V, NP0, TP, 1005
2
2203-001259
C340
C-CERAMIC, CHIP 0.008 nF, 0.5pF, 50 V, NP0, TP, 1005
2
2203-000438
C341
C-CERAMIC, CHIP 1 nF, 10 %, 50 V, X7R, TP, 1005, -
2
2203-005061
C342
C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
2
2203-005061
C343
C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
2
2203-000233
C344
C-CERAMIC, CHIP 0.1 nF, 5 %, 50 V, NP0, TP, 1005
2
2203-000466
C345
C-CERAMIC, CHIP 0.001 nF, 0.25pF, 50 V, NP0, TP, 1005
2
2203-000530
C346
C-CERAMIC, CHIP 2.7 nF, 10 %, 50 V, X7R, TP, 1005, -
2
2203-005061
C348
C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
2
2203-000386
C350
C-CERAMIC, CHIP 0.015 nF, 5 %, 50 V, NP0, TP, 1005
2
2203-000233
C352
C-CERAMIC, CHIP 0.1 nF, 5 %, 50 V, NP0, TP, 1005
2
2203-000489
C353
C-CERAMIC, CHIP 2.2 nF, 10 %, 50 V, X7R, TP, 1005, -
2
2203-000386
C354
C-CERAMIC, CHIP 0.015 nF, 5 %, 50 V, NP0, TP, 1005
2
2203-000233
C355
C-CERAMIC, CHIP 0.1 nF, 5 %, 50 V, NP0, TP, 1005
2
2203-005494
C356
C-CERAMIC, CHIP 220 nF, 10 %, 10 V, X7R, TP, 1608, -
2
2203-005061
C357
C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
2
2203-000386
C358
C-CERAMIC, CHIP 0.015 nF, 5 %, 50 V, NP0, TP, 1005
2
2203-005061
C359
C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
Level
SEC CODE
Design LOC
DESCRIPTIONS
SAMSUNG Proprietary-Contents may change without notice
7-5
STH-N271 Electrical Parts List
2
2404-001105
C360
C-TA, CHIP 10 uF, 20 %, 6.3 V, GP, TP, 2012
2
2203-000278
C362
C-CERAMIC, CHIP 0.01 nF, 0.5pF, 50 V, NP0, TP, 1005
2
2203-000254
C363
C-CERAMIC, CHIP 10 nF, 10 %, 16 V, X7R, TP, 1005, -
2
2404-001105
C364
C-TA, CHIP 10 uF, 20 %, 6.3 V, GP, TP, 2012
2
2203-000233
C365
C-CERAMIC, CHIP 0.1 nF, 5 %, 50 V, NP0, TP, 1005
2
2203-000386
C366
C-CERAMIC, CHIP 0.015 nF, 5 %, 50 V, NP0, TP, 1005
2
2203-005061
C367
C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
2
2203-000233
C368
C-CERAMIC, CHIP 0.1 nF, 5 %, 50 V, NP0, TP, 1005
2
2203-005061
C369
C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
2
2203-005061
C370
C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
2
2203-001033
C374
C-CERAMIC, CHIP 5.6 nF, 10 %, 25 V, X7R, TP, 1005, -
2
2203-000489
C375
C-CERAMIC, CHIP 2.2 nF, 10 %, 50 V, X7R, TP, 1005, -
2
2203-005480
C376
C-CERAMIC, CHIP 33 nF, 10 %, 10 V, X7R, TP, 1005, -
2
2203-000530
C377
C-CERAMIC, CHIP 2.7 nF, 10 %, 50 V, X7R, TP, 1005, -
2
2404-001105
C380
C-TA, CHIP 10 uF, 20 %, 6.3 V, GP, TP, 2012
2
2203-000254
C381
C-CERAMIC, CHIP 10 nF, 10 %, 16 V, X7R, TP, 1005, -
2
2203-000254
C383
C-CERAMIC, CHIP 10 nF, 10 %, 16 V, X7R, TP, 1005, -
2
2203-000254
C384
C-CERAMIC, CHIP 10 nF, 10 %, 16 V, X7R, TP, 1005, -
2
2203-000233
C386
C-CERAMIC, CHIP 0.1 nF, 5 %, 50 V, NP0, TP, 1005
2
2203-005393
C387
C-CERAMIC, CHIP 0.005 nF, 0.1pF, 50 V, NP0, TP, 1005
2
2203-005061
C388
C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
2
2203-001259
C389
C-CERAMIC, CHIP 0.008 nF, 0.5pF, 50 V, NP0, TP, 1005
2
2203-000696
C390
C-CERAMIC, CHIP 0.002 nF, 0.25pF, 50 V, NP0, TP, 1005
2
2203-000696
C392
C-CERAMIC, CHIP 0.002 nF, 0.25pF, 50 V, NP0, TP, 1005
2
2203-000233
C393
C-CERAMIC, CHIP 0.1 nF, 5 %, 50 V, NP0, TP, 1005
2
2203-000233
C394
C-CERAMIC, CHIP 0.1 nF, 5 %, 50 V, NP0, TP, 1005
2
2203-000233
C395
C-CERAMIC, CHIP 0.1 nF, 5 %, 50 V, NP0, TP, 1005
2
2203-000233
C396
C-CERAMIC, CHIP 0.1 nF, 5 %, 50 V, NP0, TP, 1005
2
2203-000278
C397
C-CERAMIC, CHIP 0.01 nF, 0.5pF, 50 V, NP0, TP, 1005
2
2203-000233
C398
C-CERAMIC, CHIP 0.1 nF, 5 %, 50 V, NP0, TP, 1005
2
2203-000233
C399
C-CERAMIC, CHIP 0.1 nF, 5 %, 50 V, NP0, TP, 1005
2
2203-000438
C400
C-CERAMIC, CHIP 1 nF, 10 %, 50 V, X7R, TP, 1005, -
2
2203-005393
C401
C-CERAMIC, CHIP 0.005 nF, 0.1pF, 50 V, NP0, TP, 1005
2
2203-000330
C402
C-CERAMIC, CHIP 0.012 nF, 5 %, 50 V, NP0, TP, 1005
2
2203-000438
C403
C-CERAMIC, CHIP 1 nF, 10 %, 50 V, X7R, TP, 1005, -
2
2203-000233
C404
C-CERAMIC, CHIP 0.1 nF, 5 %, 50 V, NP0, TP, 1005
2
2203-005061
C405
C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
2
2203-000696
C406
C-CERAMIC, CHIP 0.002 nF, 0.25pF, 50 V, NP0, TP, 1005
2
2203-005057
C407
C-CERAMIC, CHIP 0.0082 nF, 0.25pF, 50 V, NP0, TP, 1005
Level
SEC CODE
Design LOC
DESCRIPTIONS
SAMSUNG Proprietary-Contents may change without notice
7-6
STH-N271 Electrical Parts List
2
2203-005056
C408
C-CERAMIC, CHIP 0.0068 nF, 0.25pF, 50 V, NP0, TP, 1005
2
2203-005061
C409
C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
2
2203-000233
C410
C-CERAMIC, CHIP 0.1 nF, 5 %, 50 V, NP0, TP, 1005
2
2203-000438
C411
C-CERAMIC, CHIP 1 nF, 10 %, 50 V, X7R, TP, 1005, -
2
2203-000438
C412
C-CERAMIC, CHIP 1 nF, 10 %, 50 V, X7R, TP, 1005, -
2
2203-000438
C413
C-CERAMIC, CHIP 1 nF, 10 %, 50 V, X7R, TP, 1005, -
2
2203-005054
C414
C-CERAMIC, CHIP 0.0047 nF, 0.25pF, 50 V, NP0, TP, 1005
2
2203-000233
C415
C-CERAMIC, CHIP 0.1 nF, 5 %, 50 V, NP0, TP, 1005
2
2203-000696
C416
C-CERAMIC, CHIP 0.002 nF, 0.25pF, 50 V, NP0, TP, 1005
2
2203-000233
C417
C-CERAMIC, CHIP 0.1 nF, 5 %, 50 V, NP0, TP, 1005
2
2203-000254
C418
C-CERAMIC, CHIP 10 nF, 10 %, 16 V, X7R, TP, 1005, -
2
2203-005061
C419
C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
2
2203-000254
C420
C-CERAMIC, CHIP 10 nF, 10 %, 16 V, X7R, TP, 1005, -
2
2203-000233
C421
C-CERAMIC, CHIP 0.1 nF, 5 %, 50 V, NP0, TP, 1005
2
2203-000254
C424
C-CERAMIC, CHIP 10 nF, 10 %, 16 V, X7R, TP, 1005, -
2
2203-000233
C425
C-CERAMIC, CHIP 0.1 nF, 5 %, 50 V, NP0, TP, 1005
2
2203-000438
C427
C-CERAMIC, CHIP 1 nF, 10 %, 50 V, X7R, TP, 1005, -
2
2404-001105
C428
C-TA, CHIP 10 uF, 20 %, 6.3 V, GP, TP, 2012
2
2203-005061
C429
C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
2
2203-005061
C430
C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
2
2203-000885
C433
C-CERAMIC, CHIP 4.7 nF, 10 %, 25 V, X7R, TP, 1005, -
2
2404-001240
C434
C-TA, CHIP 1 uF, 20 %, 10 V, -, TP, 1608
2
2203-000254
C435
C-CERAMIC, CHIP 10 nF, 10 %, 16 V, X7R, TP, 1005, -
2
2203-001210
C442
C-CERAMIC, CHIP 8.2 nF, 10 %, 16 V, X7R, TP, 1005, -
2
2203-000254
C445
C-CERAMIC, CHIP 10 nF, 10 %, 16 V, X7R, TP, 1005, -
2
2203-000233
C453
C-CERAMIC, CHIP 0.1 nF, 5 %, 50 V, NP0, TP, 1005
2
2203-000696
C455
C-CERAMIC, CHIP 0.002 nF, 0.25pF, 50 V, NP0, TP, 1005
2
2203-000386
C456
C-CERAMIC, CHIP 0.015 nF, 5 %, 50 V, NP0, TP, 1005
2
2203-000233
C458
C-CERAMIC, CHIP 0.1 nF, 5 %, 50 V, NP0, TP, 1005
2
2203-005393
C460
C-CERAMIC, CHIP 0.005 nF, 0.1pF, 50 V, NP0, TP, 1005
2
2203-000254
C461
C-CERAMIC, CHIP 10 nF, 10 %, 16 V, X7R, TP, 1005, -
2
2203-001072
C462
C-CERAMIC, CHIP 0.056 nF, 5 %, 50 V, NP0, TP, 1005
2
2203-001072
C463
C-CERAMIC, CHIP 0.056 nF, 5 %, 50 V, NP0, TP, 1005
2
2203-005281
C464
C-CERAMIC, CHIP 0.0015 nF, 0.1pF, 50 V, NP0, TP, 1005
2
2203-005061
C465
C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
2
2203-001383
C467
C-CERAMIC, CHIP 0.0005 nF, 0.25pF, 50 V, NP0, TP, 1005
2
2203-005065
C468
C-CERAMIC, CHIP 1000 nF, +80-20 %, 10 V, Y5 V, TP, 1608
2
2203-000438
C469
C-CERAMIC, CHIP 1 nF, 10 %, 50 V, X7R, TP, 1005, -
2
2203-005061
C473
C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
Level
SEC CODE
Design LOC
DESCRIPTIONS
SAMSUNG Proprietary-Contents may change without notice
7-7
STH-N271 Electrical Parts List
2
2203-000438
C474
C-CERAMIC, CHIP 1 nF, 10 %, 50 V, X7R, TP, 1005, -
2
2203-001124
C475
C-CERAMIC, CHIP 680pF, 10 %, 50 V, X7R, TP, 1005, -
2
2203-000489
C476
C-CERAMIC, CHIP 2.2 nF, 10 %, 50 V, X7R, TP, 1005, -
2
3722-001456
CN101
JACK-PHONE 2P, 2.6PI, A uF, BLK, -
2
3710-001634
CN201
CONNECTOR-SOCKET24P, 1R, 0.5mm, SMD-A, A UF
2
0401-001091
D101
DIODE-SWITCHING 1SS376, 250 V, -, SOD-323, TP
2
0407-000115
D201
DIODE-ARRAY DAN202U, 80 V, 100 mA, CA2-3, SC-70,
2
0407-000115
D202
DIODE-ARRAY DAN202U, 80 V, 100 mA, CA2-3, SC-70,
2
0601-000273
D204
LED CHIP, Y/GRN, 0.8x1.2mm, 570nm
2
0601-000273
D205
LED CHIP, Y/GRN, 0.8x1.2mm, 570nm
2
0601-000273
D206
LED CHIP, Y/GRN, 0.8x1.2mm, 570nm
2
0601-000273
D207
LED CHIP, Y/GRN, 0.8x1.2mm, 570nm
2
0601-000273
D208
LED CHIP, Y/GRN, 0.8x1.2mm, 570nm
2
0601-000273
D209
LED CHIP, Y/GRN, 0.8x1.2mm, 570nm
2
0601-001226
D210
LED CHIP, RED, 1.2x0.8mm, 660nm
2
0601-001094
D211
LED CHIP, Y-GRN, 0.8x1.1mm, 570nm
2
0404-001093
D301
DIODE-SCHOTTKY HSMS-282C, 1 V, 30mA, SOT-323, TP
2
2903-001235
F301
FILTER-CERAMIC BP, 0.45MHz, -, 6dB, 0.5dB, TP, -
2
2904-001270
F302
FILTER-SAW 130.05MHz, 0.024MHz, +-10.5KHz/0.5dB, TP, +-
2
2904-001173
F304
FILTER-SAW 881.5MHz, 25MHz, +-12.5MHz/2dB, TP, +-12.5MHz/3.5dB, DC-
2
4709-001216
F305
FREQ-ISOLATOR 824-894/1850-1990MHz, 12dB, 0.5dB, -
2
2909-001119
F306
FILTER-DUPLEXER 881.5MHz, 836.5MHz, 4/3dB, TP, 56dB, 40dB
2
2904-001172
F309
FILTER-SAW 836.5MHz, 25MHz, +-12.5MHz/1.5, TP, +-12.5MHz/2.5dB, DC-
2
2904-001172
F310
FILTER-SAW 836.5MHz, 25MHz, +-12.5MHz/1.5, TP, +-12.5MHz/2.5dB, DC-
2
4709-001226
F313
COUPLER-DIRECTION 800-850MHz, 15.5dB, 24dB, 2x1.25x1mm, TP
2
2703-001293
L101
INDUCTOR-SMD 82nH, 5 %, 1.6x0.8x0.8mm
2
2703-001293
L102
INDUCTOR-SMD 82nH, 5 %, 1.6x0.8x0.8mm
2
2703-002168
L103
INDUCTOR-SMD 220 uH, 10 %, 3.2x2.5x1.8mm
2
2703-001727
L301
INDUCTOR-SMD 22nH, 5 %, 1x0.5x0.5mm
2
2703-001881
L302
INDUCTOR-SMD 220nH, 5 %, 1.6x0.8x0.8mm
2
2703-001860
L303
INDUCTOR-SMD 150 nH, 5 %, 1.6X0.8X0.8MM
2
2703-001954
L304
INDUCTOR-SMD 2.7nH, 0.3nH, 1.0x0.5x0.5mm
2
2703-001860
L305
INDUCTOR-SMD 150 nH, 5 %, 1.6X0.8X0.8MM
2
2703-002112
L306
INDUCTOR-SMD 15 uH, 5 %, 3.2x1.6x1.8mm
2
2007-001298
L307
R-CHIP 51 ohm, 5 %, 1/16 W, DA, TP, 1005
2
2703-001751
L308
INDUCTOR-SMD 3.9nH, 0.3nH, 1.0x0.5x0.5mm
2
2703-002036
L310
INDUCTOR-SMD 330 uH, 5 %, 3.2x2.5x2mm
2
2703-001733
L311
INDUCTOR-SMD 8.2nH, 5 %, 1x0.5x0.5mm
2
2703-001747
L312
INDUCTOR-SMD 4.7nH, 0.3nH, 1.0x0.5x0.5mm
Level
SEC CODE
Design LOC
DESCRIPTIONS
SAMSUNG Proprietary-Contents may change without notice
7-8
STH-N271 Electrical Parts List
2
2703-001734
L313
INDUCTOR-SMD 6.8nH, 5 %, 1x0.5x0.5mm
2
2703-001733
L314
INDUCTOR-SMD 8.2nH, 5 %, 1x0.5x0.5mm
2
2703-001786
L315
INDUCTOR-SMD 10 nH, 5 %, 1.0X0.5X0.5MM
2
2703-001708
L317
INDUCTOR-SMD 5.6nH, 10 %, 1.0x0.5x0.5mm
2
2703-001988
L318
INDUCTOR-SMD 82nH, 5 %, 1.0x0.5x0.5mm
2
2703-001708
L321
INDUCTOR-SMD 5.6nH, 10 %, 1.0x0.5x0.5mm
2
2703-001992
L322
INDUCTOR-SMD 1nH, 0.3nH, 1.0x0.5x0.5mm
2
2703-001734
L323
INDUCTOR-SMD 6.8nH, 5 %, 1x0.5x0.5mm
2
2703-001733
L324
INDUCTOR-SMD 8.2nH, 5 %, 1x0.5x0.5mm
2
2703-002039
L325
INDUCTOR-SMD 16 nH, 5 %, 2.29x1.73x1.52mm
2
2703-002028
L326
INDUCTOR-SMD 12nH, 5 %, 1.0x0.5x0.5mm
2
2703-001988
L327
INDUCTOR-SMD 82nH, 5 %, 1.0x0.5x0.5mm
2
2703-001734
L334
INDUCTOR-SMD 6.8nH, 5 %, 1x0.5x0.5mm
2
2703-001786
L336
INDUCTOR-SMD 10 nH, 5 %, 1.0X0.5X0.5MM
2
2703-001242
L338
INDUCTOR-SMD 4.7 uH, 10 %, 1.6x0.8x0.8mm
2
2703-001229
L339
INDUCTOR-SMD 2.2 uH, 10 %, 1.6x0.8x0.8mm
2
2703-001734
L340
INDUCTOR-SMD 6.8nH, 5 %, 1x0.5x0.5mm
2
2007-001298
L502
R-CHIP 51 ohm, 5 %, 1/16 W, DA, TP, 1005
2
2806-001242
OSC301
OSCILLATOR-VCO 998-1025/2059-2121M, -, -, TP, 2.7 V, 10mA
2
2809-001242
OSC302
OSCILLATOR-VCTCXO 14.4MHz, 2ppm, 0.2ppm, TP, 2.8 V, -
2
2806-001243
OSC303
OSCILLATOR-VCO 175.05/210.09MHz, -, -, TP, 2.7 V, 5mA
2
GH41-00118A
PCB
PCB-STHN270 STH-N270, FR-4, 6, -, 0.8T, 118x140, -, -, -, -
2
0504-000172
Q101
TR-DIGITAL RN2104, PNP, 100 mW, 47K/47K, SSM, TP
2
0501-002318
Q102
TR-SMALL SIGNAL UMW8N, NPN, 150 mW, UMT6, TP, 27-270
2
0504-000172
Q103
TR-DIGITAL RN2104, PNP, 100 mW, 47K/47K, SSM, TP
2
0505-001464
Q104
FET-SILICON SI1305DL, P, 8 V, 0.86A, 0.28 ohm, 0.26 W, SOT-323
2
0504-000172
Q105
TR-DIGITAL RN2104, PNP, 100 mW, 47K/47K, SSM, TP
2
0505-001165
Q106
FET-SILICON SI3443D V, P, -20 V, +-3.5mA, 65 Mohm
2
0501-000225
Q107
TR-SMALL SIGNAL 2SC4617, NPN, 200 mW, EM3, TP, 120-5
2
0504-000168
Q108
TR-DIGITAL RN1104, NPN, 100 mW, 47K/47K, SSM, TP
2
0501-000225
Q202
TR-SMALL SIGNAL 2SC4617, NPN, 200 mW, EM3, TP, 120-5
2
0504-000168
Q203
TR-DIGITAL RN1104, NPN, 100 mW, 47K/47K, SSM, TP
2
0504-000167
Q204
TR-DIGITAL RN1102, NPN, 100 mW, 10K/10K, SSM, TP
2
0504-000167
Q206
TR-DIGITAL RN1102, NPN, 100 mW, 10K/10K, SSM, TP
2
0504-000172
Q301
TR-DIGITAL RN2104, PNP, 100 mW, 47K/47K, SSM, TP
2
2007-000148
R101
R-CHIP 10 kohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-001320
R102
R-CHIP 1.8 kohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000141
R103
R-CHIP 2.2 kohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000151
R104
R-CHIP 15 kohm, 5 %, 1/16 W, DA, TP, 1005
Level
SEC CODE
Design LOC
DESCRIPTIONS
SAMSUNG Proprietary-Contents may change without notice
7-9
STH-N271 Electrical Parts List
2
2007-000148
R105
R-CHIP 10 kohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000151
R106
R-CHIP 15 kohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-001320
R107
R-CHIP 1.8 kohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-007771
R108
R-CHIP 0 ohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-007771
R109
R-CHIP 0 ohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-007771
R110
R-CHIP 0 ohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-008037
R111
R-CHIP 57.6 kohm, 1 %, 1/16 W, DA, TP, 1005
2
2007-001341
R112
R-CHIP 680 kohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000157
R113
R-CHIP 47 kohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000148
R114
R-CHIP 10 kohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-007943
R115
R-CHIP 560 kohm, 1 %, 1/16 W, DA, TP, 1005
2
2007-007771
R116
R-CHIP 0 ohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000151
R117
R-CHIP 15 kohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000758
R118
R-CHIP 330 kohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000636
R119
R-CHIP 270 kohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-007135
R120
R-CHIP 18 kohm, 1 %, 1/16 W, DA, TP, 1005
2
2007-000142
R121
R-CHIP 2.7 kohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-001335
R122
R-CHIP 36 kohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000636
R123
R-CHIP 270 kohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000148
R124
R-CHIP 10 kohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-008163
R125
R-CHIP 86.6 kohm, 1 %, 1/16 W, DA, TP, 1005
2
2007-000148
R126
R-CHIP 10 kohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000148
R127
R-CHIP 10 kohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000140
R128
R-CHIP 1 kohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000148
R129
R-CHIP 10 kohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000162
R130
R-CHIP 100 kohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000162
R131
R-CHIP 100 kohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000162
R132
R-CHIP 100 kohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000172
R133
R-CHIP 10 ohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000167
R134
R-CHIP 390 kohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000162
R135
R-CHIP 100 kohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000162
R136
R-CHIP 100 kohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-007573
R138
R-CHIP 330 kohm, 1 %, 1/16 W, DA, TP, 1005
2
2007-000148
R139
R-CHIP 10 kohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000157
R140
R-CHIP 47 kohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000758
R141
R-CHIP 330 kohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000172
R142
R-CHIP 10 ohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000146
R143
R-CHIP 6.8 kohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000162
R144
R-CHIP 100 kohm, 5 %, 1/16 W, DA, TP, 1005
Level
SEC CODE
Design LOC
DESCRIPTIONS
SAMSUNG Proprietary-Contents may change without notice
7-10
STH-N271 Electrical Parts List
2
2007-000162
R145
R-CHIP 100 kohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000162
R146
R-CHIP 100 kohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-003112
R147
R-CHIP 27 ohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000162
R148
R-CHIP 100 kohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000162
R149
R-CHIP 100 kohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000162
R150
R-CHIP 100 kohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000140
R151
R-CHIP 1 kohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000153
R152
R-CHIP 22 kohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000162
R153
R-CHIP 100 kohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-001335
R154
R-CHIP 36 kohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000566
R155
R-CHIP 220 kohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000162
R156
R-CHIP 100 kohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000172
R157
R-CHIP 10 ohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-007529
R159
R-CHIP 91 kohm, 1 %, 1/16 W, DA, TP, 1005
2
2007-007771
R160
R-CHIP 0 ohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000148
R201
R-CHIP 10 kohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000636
R204
R-CHIP 270 kohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000170
R205
R-CHIP 1 Mohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000162
R206
R-CHIP 100 kohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000162
R207
R-CHIP 100 kohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000157
R208
R-CHIP 47 kohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000162
R209
R-CHIP 100 kohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000162
R211
R-CHIP 100 kohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000758
R212
R-CHIP 330 kohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000162
R213
R-CHIP 100 kohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000162
R214
R-CHIP 100 kohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000162
R216
R-CHIP 100 kohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000148
R217
R-CHIP 10 kohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000152
R218
R-CHIP 20 kohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000173
R220
R-CHIP 22 ohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000173
R221
R-CHIP 22 ohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000173
R223
R-CHIP 22 ohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000173
R224
R-CHIP 22 ohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000173
R225
R-CHIP 22 ohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000173
R226
R-CHIP 22 ohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000173
R227
R-CHIP 22 ohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000173
R228
R-CHIP 22 ohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000173
R229
R-CHIP 22 ohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-001298
R230
R-CHIP 51 ohm, 5 %, 1/16 W, DA, TP, 1005
Level
SEC CODE
Design LOC
DESCRIPTIONS
SAMSUNG Proprietary-Contents may change without notice
7-11
STH-N271 Electrical Parts List
2
2007-001298
R231
R-CHIP 51 ohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-001298
R232
R-CHIP 51 ohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000141
R233
R-CHIP 2.2 kohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000173
R234
R-CHIP 22 ohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000173
R235
R-CHIP 22 ohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000162
R236
R-CHIP 100 kohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000172
R237
R-CHIP 10 ohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000982
R238
R-CHIP 5.6 kohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000157
R239
R-CHIP 47 kohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000144
R240
R-CHIP 5.1 kohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000144
R241
R-CHIP 5.1 kohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-007771
R244
R-CHIP 0 ohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-007771
R245
R-CHIP 0 ohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000138
R247
R-CHIP 100 ohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000162
R248
R-CHIP 100 kohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000932
R301
R-CHIP 470 ohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-001316
R302
R-CHIP 820 ohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-003112
R303
R-CHIP 27 ohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-003013
R304
R-CHIP 2.4 kohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-002797
R305
R-CHIP 560 ohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000172
R306
R-CHIP 10 ohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000172
R307
R-CHIP 10 ohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-007771
R308
R-CHIP 0 ohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-001311
R309
R-CHIP 270 ohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-002797
R310
R-CHIP 560 ohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000932
R312
R-CHIP 470 ohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000140
R313
R-CHIP 1 kohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-003112
R314
R-CHIP 27 ohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000172
R315
R-CHIP 10 ohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-001311
R316
R-CHIP 270 ohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-003112
R318
R-CHIP 27 ohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-003112
R319
R-CHIP 27 ohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000143
R320
R-CHIP 4.7 kohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000148
R321
R-CHIP 10 kohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000932
R322
R-CHIP 470 ohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000242
R323
R-CHIP 1.5 kohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000148
R324
R-CHIP 10 kohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-003112
R325
R-CHIP 27 ohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-003112
R326
R-CHIP 27 ohm, 5 %, 1/16 W, DA, TP, 1005
Level
SEC CODE
Design LOC
DESCRIPTIONS
SAMSUNG Proprietary-Contents may change without notice
7-12
STH-N271 Electrical Parts List
2
2007-000164
R327
R-CHIP 150 kohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-003112
R328
R-CHIP 27 ohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-003112
R329
R-CHIP 27 ohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-003112
R330
R-CHIP 27 ohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000172
R332
R-CHIP 10 ohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-001325
R333
R-CHIP 3.3 kohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000140
R334
R-CHIP 1 kohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000145
R336
R-CHIP 6.2 kohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000148
R337
R-CHIP 10 kohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-007771
R338
R-CHIP 0 ohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000140
R339
R-CHIP 1 kohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-003112
R340
R-CHIP 27 ohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-007200
R341
R-CHIP 2.4 ohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000143
R342
R-CHIP 4.7 kohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000143
R343
R-CHIP 4.7 kohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000172
R344
R-CHIP 10 ohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000144
R345
R-CHIP 5.1 kohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-001311
R346
R-CHIP 270 ohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000172
R347
R-CHIP 10 ohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000151
R348
R-CHIP 15 kohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000138
R349
R-CHIP 100 ohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000172
R350
R-CHIP 10 ohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000162
R351
R-CHIP 100 kohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000138
R354
R-CHIP 100 ohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000172
R356
R-CHIP 10 ohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000140
R357
R-CHIP 1 kohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-001333
R358
R-CHIP 18 kohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000159
R359
R-CHIP 56 kohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000162
R361
R-CHIP 100 kohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000155
R362
R-CHIP 27 kohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000141
R363
R-CHIP 2.2 kohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000775
R368
R-CHIP 33 kohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000141
R369
R-CHIP 2.2 kohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000172
R373
R-CHIP 10 ohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-007771
R374
R-CHIP 0 ohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000168
R375
R-CHIP 470 kohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000145
R378
R-CHIP 6.2 kohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000172
R379
R-CHIP 10 ohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000172
R380
R-CHIP 10 ohm, 5 %, 1/16 W, DA, TP, 1005
Level
SEC CODE
Design LOC
DESCRIPTIONS
SAMSUNG Proprietary-Contents may change without notice
7-13
STH-N271 Electrical Parts List
2
2007-001298
R381
R-CHIP 51 ohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000162
R382
R-CHIP 100 kohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000172
R383
R-CHIP 10 ohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000172
R384
R-CHIP 10 ohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000137
R387
R-CHIP 2 kohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-001305
R388
R-CHIP 120 ohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-007090
R389
R-CHIP 11 kohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-002797
R391
R-CHIP 560 ohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-003112
R393
R-CHIP 27 ohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-003112
R394
R-CHIP 27 ohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000145
R395
R-CHIP 6.2 kohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000831
R397
R-CHIP 39 kohm, 5 %, 1/16 W, DA, TP, 1005
2
1405-001082
RV201
VARISTOR 5.6 V, 20A, 1x0.5x0.6mm, TP
2
1405-001082
RV202
VARISTOR 5.6 V, 20A, 1x0.5x0.6mm, TP
2
1405-001082
RV203
VARISTOR 5.6 V, 20A, 1x0.5x0.6mm, TP
2
1405-001082
RV204
VARISTOR 5.6 V, 20A, 1x0.5x0.6mm, TP
2
1404-001165
TH101
THERMISTOR-NTC 10 kohm, 3 %, 4100K, 30MW/C, TP
2
1205-001826
U101
IC-TRANSCEIVER D5204-22, TQFP, 80P, 470MIL, PLASTIC, 3.6 V, -, -
2
1201-001639
U102
IC-AUDIO AMP 4882, SOP, 8P, 118MIL, -, -, PLASTIC, 5.5 V, -, -40to+85C, -,
1
GH07-00055A
U103
LCD-STHA270 LCD UG-12B74-FGHTX-A,
2
1003-001300
U104
IC-DRIVER SM8142BD-EL, SOJ, 8P, 110MIL, -, -, TP, PLASTIC, -, -
2
1203-001979
U105
IC-VOLTAGE REGULATOR 5320, SSOP, 8P, 110MIL, PLASTIC, 6.12 V,
2
0505-001462
U106
FET-SILICON 1905, P, -8 V, 0.6A, 0.51 ohm, 0.3 W, SOT-363
2
0506-001054
U107
TR-ARRAY IMD10A, NPN/PNP, 2, 300 mW, SMT6, TP, 68-/100-600
2
1203-001302
U108
IC-POSI.ADJUST REG. 5205, SOT-23, 5P, 119MIL, PLASTIC,
2
0505-001462
U109
FET-SILICON 1905, P, -8 V, 0.6A, 0.51 ohm, 0.3 W, SOT-363
2
1203-001979
U110
IC-VOLTAGE REGULATOR 5320, SSOP, 8P, 110MIL, PLASTIC, 6.12 V,
2
1203-002129
U111
IC-VOLTAGE REGULATOR 71622, SOT-23, 5P, 62MIL, PLASTIC, 2.14/2.26
2
1203-001979
U112
IC-VOLTAGE REGULATOR 5320, SSOP, 8P, 110MIL, PLASTIC, 6.12 V,
2
0505-001462
U113
FET-SILICON 1905, P, -8 V, 0.6A, 0.51 ohm, 0.3 W, SOT-363
2
1203-002095
U114
IC-VOLTAGE REGULATOR 71628, SOT-23-5, 5P, -, PLASTIC, 2.76/2.84 V,
2
1009-001006
U201
IC-HALL EFFECT S/W A3210ELH, SC-74A, 3P, -, TP, -, -, 5 V, 1MA, -
2
1107-001227
U202
IC-FLASH MEMORY 28F3204, 2Mx16Bit, CSP, 72P, 315MIL, 110nS, 3 V, 10
2
1205-001831
U203
IC-TRANSCEIVER D5205, BGA, 192P, 550MIL, PLASTIC, 3.6 V, -, -
2
0506-001054
U204
TR-ARRAY IMD10A, NPN/PNP, 2, 300 mW, SMT6, TP, 68-/100-600
2
0506-001054
U205
TR-ARRAY IMD10A, NPN/PNP, 2, 300 mW, SMT6, TP, 68-/100-600
2
1203-001835
U206
IC-RESET 3470, SOT23, 5P, -, PLASTIC, 0.99/1.01 V, 300 mW, -
2
1201-001609
U301
IC-RF AMP 2363, SOP, 8P, 62MIL, DUAL, 18dB, PLASTIC, 5 V, -, -40to+85
2
3705-001226
U302
CONNECTOR-COAXIAL -, JACK, 75 Mohm, 50 ohm, 0.45dB
Level
SEC CODE
Design LOC
DESCRIPTIONS
SAMSUNG Proprietary-Contents may change without notice
7-14
STH-N271 Electrical Parts List
2
1205-001986
U304
IC-MIXER UPC8015GK-9EU, TQFP, 80P, 472MIL, PLASTIC, 3 V, -,
2
1201-001634
U305
IC-POWER AMP 2162, LCC, 16P, 157MIL, -, 29dB, PLASTIC , 5.2 V, -, -
2
1201-001006
U306
IC-OP AMP 7101, SOT-23, 5P, -, SINGLE, -, PLAS
2
1201-001636
U307
IC-RF AMP 2376, SOT-23, 6P, 63MIL, SINGLE, 27dB, PLASTIC, 3.3 V, -, -
2
0505-001469
U310
FET-SILICON SI1902DL, N, 20 V, +-0.66A, 0.63 ohm, 0.27 W, SOT-363
2
2801-004025
Y201
CRYSTAL-UNIT 0.032768MHz, 20ppm, 28-ABK, 1.7fF, 65 kohm, TP
2
0406-001083
ZD101
DIODE-TVS -, 6.1/-/7.2 V, 150 W, SOT-323-5L
2
0406-001083
ZD201
DIODE-TVS -, 6.1/-/7.2 V, 150 W, SOT-323-5L
2
0406-001083
ZD202
DIODE-TVS -, 6.1/-/7.2 V, 150 W, SOT-323-5L
2
0406-001083
ZD203
DIODE-TVS -, 6.1/-/7.2 V, 150 W, SOT-323-5L
2
0406-001083
ZD204
DIODE-TVS -, 6.1/-/7.2 V, 150 W, SOT-323-5L
2
0406-001083
ZD205
DIODE-TVS -, 6.1/-/7.2 V, 150 W, SOT-323-5L
2
0406-001083
ZD206
DIODE-TVS -, 6.1/-/7.2 V, 150 W, SOT-323-5L
2
0406-001083
ZD207
DIODE-TVS -, 6.1/-/7.2 V, 150 W, SOT-323-5L
2
0406-001083
ZD208
DIODE-TVS -, 6.1/-/7.2 V, 150 W, SOT-323-5L
2
0404-001110
ZD209
DIODE-SCHOTTKY RB751S-40, 40 V, 30mA, SOD-523, TP
1
GH92-00863A
PBA MAIN-STHN270 STH-N270, -, BRAZ, MAIN PBA, -, -, -
1
6001-000464
SCREW-MACHINE PH, +, M1.4, L4, BLACK, SM10C, -
1
6001-001460
SCREW-MACHINE CH, +, M1.4, L2.3, BLK, SWRCH18A, FP
1
GH44-00145A
CHARGER-SCHN100 TC TCH020EBE, SCH-N100, AC/DC, -, -, -, -, 110/220
1
GH71-00325A
NPR-ANT DUMMY PLATE STH-N271, ZN, -, AU, -
1
GH72-01753A
PMO-KEY PAD STH-N271, -, EF TYPE, BLK, -, -, -
1
GH73-00064A
RMO-EAR JACK RUBBER SCH-900, RUBBER, 9X7X0.8, BLK, 70
1
GH73-00490A
RMO-ANT.CAP STH-N271, RUBBER, -, D/GRY, 50, -
1
GH73-00567A
RMO-I/F CONNECTOR STH-N271, RUBBER, -, D/GRY(G4358), 50, -
1
GH73-00715A
RMO-DUPLEX STH-N271, RUBBER, 15X8.5XT0.5, -, -, -
1
GH74-01274A
MPR-CHIP SHORT TAPE STH-N271, TAPE, 4X5XT0.05, -, -
1
GH74-01275A
MPR-FPCB SHORT TAPE STH-N271, TAPE, 4.3X17XT0.05, -, -
1
GH74-01276A
MPR-BATTERY SHORT TAPE STH-N271, TAPE, 7X5XT0.05, -, -
1
GH75-00223G
MEC-HANGER ROPE SGH-2300, -, D/GRY
1
GH75-01062A
MEC-METAR DOME ARRAY STH-N271, -, -, -, IVR, -, -
1
GH75-01105A
MEC-LCD BRACKET STH-N271, -, -, -, NI, -, -
2
GH71-00301A
NPR-LCD BRACKET STH-N271, ZN, -, -, -
2
GH73-00711A
RMO-LCD BRACKET RIGHT STH-N271, RUBBER, T0.3, -, -, -
2
GH73-00712A
RMO-LCD BRACKET LEFT STH-N271, RUBBER, T0.3, -, -, -
1
GH97-01769A
MEA FRONT-STHN270 STH-N271, -, USA, COLM, -, -, -
2
GH75-00773A
MEC-SUA.FRONT STH-N271, -, -, -, D/GRY, -, -
3
GH72-01745A
PMO-FRONT COVER STH-N271, -, PC, D/GRY, -, G4358, -
3
GH72-01748A
PMO-KEY DUMMY STH-N271, -, PC, BLK, -, K2261, -
Level
SEC CODE
Design LOC
DESCRIPTIONS
SAMSUNG Proprietary-Contents may change without notice
7-15
STH-N271 Electrical Parts List
3
GH72-01752A
PMO-LED CAP STH-N271, -, ACRYL, TR/TRP, -, -, -
3
GH73-00491A
RMO-EAR JACK HOLDER STH-N271, RUBBER, -, BLK, 50, -
3
GH73-00550A
RMO-HINGE RUBBER STH-N271, RUBBER, 6X4XT0.4, GRY, 50, -
3
GH74-00556A
MPR-FLIP BOHO SGH-2400, VINYL(3M 336), 46X48.5, TRP, -
3
GH74-00890A
MPR-KEY DUMMY TAPE STH-N271, TESA TAPE, 30.6X44.3XT0.2, -, -
3
GH74-40107A
MCT-WINDOW BOHO SH800, 3M336, -, -, -
3
GH75-00775A
MEC-SUA.FLIP STH-N271, -, -, -, D/GRY, -, -
4
GH68-01360A
LABEL(M)-LOGO BADGE STH-N271, 3M9448, T0.16, 17.7, 3.8, -, D/GRY, -,
4
GH68-31000P
LABEL(R)-FLIP SHEET STH-N271, PC SHEET, T0.2, 3, 30, -, D/GRY, -, -, -
4
GH72-01747A
PMO-FLIP COVER STH-N271, -, PC, D/GRY, -, G4358, -
3
GH75-00776A
MEC-SIDE KEY STH-N271, -, -, -, IVR, -, -
4
GH72-01750A
PMO-SIDE KEY TOP STH-N271, -, ABS, -, -, -, -
4
GH73-00488A
RMO-SIDE KEY RUBBER STH-N271, RUBBER, -, BLK, 50, -
3
GH75-00794A
MEC-LCD WINDOW STH-N271, -, -, -, TRP, -, -
4
GH72-01749A
PMO-LCD WINDOW STH-N271, -, ACRYL, TRP, -, -, -
4
GH74-00887A
MPR-LCD SPONGE STH-N271, PORON, 30X34.6XT0.5, BLK, -
4
GH74-00888A
MPR-LCD TAPE STH-N271, TESA TAPE, 34.9X32.7XT0.2, -, -
3
GH75-01030A
MEC-HINGE STH-N271, SEC, -, -, BLK, -, -
1
GH97-01770A
MEA REAR-STHN270 STH-N271, -, USA, COLM, -, -, -
2
GH75-00774A
MEC-SUA.REAR STH-N271, -, -, -, D/GRY, -, -
3
GH68-00973B
LABEL(R)-QUALCOMM SCH-A300, VINYL, T0.12, 10, 4, -, TRP, -, -, -
3
GH70-10633A
IPR-LOCKER SPRING SCH-750, STS304, T0.3, -
3
GH72-01746A
PMO-REAR COVER STH-N271, -, PC, D/GRY, -, G4358, -
3
GH72-01754A
PMO-BATTERY LOCKER STH-N271, -, PC, D/GRY, -, G4358, -
1
GH97-01777A
MEA ETC-SHIELD STH-N271, -, COLM, TRP, -, -, -
2
6001-000464
SCREW-MACHINE PH, +, M1.4, L4, BLACK, SM10C, -
2
GH59-00175A
UNIT-FPC VOL KEY ASS’Y STH-N270, YWTN270BMKF, -, FPC VOLUME
2
GH71-00307A
NPR-MOTOR BRACKET STH-N271, STS, T0.2, -, -
2
GH71-00435A
NDC-SHIELD CAN STH-N271, ZN, -
2
GH73-00492A
RMO-BUZZER HOLDER STH-N271, RUBBER, -, BLK, 50, -
2
GH73-00551A
RMO-MOTOR RUBBER STH-N271, SRS PORON, PI12XT0.8, -, -, -
2
GH73-00714A
RMO-MOTOR BRACKET STH-N271, RUBBER, PI8XT0.7, -, -, -
2
GH74-00973A
MPR-BUZZER SHEET STH-N271, PC SHEET, 8.6X8.6XT0.3, -, -
1
GH97-01925A
MEA ETC-MIC STH-N271, -, COLM, TRP, -, -, -
2
GH59-00176A
UNIT-STHN270 MIC ASS’Y STH-N270, -, -, MIC ASS’Y, -, -, -, -, -, -, -
2
GH73-00048A
RMO-MIC DUMMY SCH-900, RUBBER, 6X2.5X0.5, BLK, 50
2
GH73-00489A
RMO-MIC HOLDER STH-N271, RUBBER, -, BLK, 50, -
2
GH74-00889A
MPR-MIC TAPE STH-N271, TESA TAPE, 8X5XT0.4, -, -
1
GH99-02406A
PAA MAIN-STHN275 STH-N271, -, BRAZ, -, -, -
Level
SEC CODE
Design LOC
DESCRIPTIONS
SAMSUNG Proprietary-Contents may change without notice
7-16
STH-N271 Electrical Parts List
2
GG68-10705A
LABEL(P)-SEAL SP-R912, CRP, 65.0x95.0, -, ORG
2
GH68-00518B
LABEL(P)-SEAL SGH-A100, ART, 100G, 46, 34, -, WHT, -, -, -
2
GH68-00662B
LABEL(P)-BAR CODE SCH-3500, WHITE POLYESTER, 67X41, -, WHT
2
GH68-01807A
LABEL(R)-MAIN STH-N271, MAT, T0.05, 41.2, 27.2, -, SIL, -, -, -
2
GH68-11057A
LABEL(P)-MS BAR CODE SCH-1900, ART, 100X155, T0.1, WHT
2
GH69-00800A
BOX(P)-UNIT MAIN STH-N271, SC300G+E(KOL), -, -, -, -, 188X135X72, -
2
GH69-00815A
CUSHION-CASE STH-N271, HIPS(T1), -, -, -, -, -, -, 180X130X76
2
GH69-11279A
BOX(P)-MASTER(CH) CHINA, SGH-600, SW-3, 530X510X187
2
GH69-30503A
BAG-STD BATT. PE, T0.06, 70X170, SCH-1011
1
3001-001210
SPEAKER
1
GH42-00097A
ANTENNA-STHA271 1538-1LSSUE6, STH-A271, 824~849MHZ
1
GH43-00294A
BATTERY-900M, D/GRY 1LP473465B(STHN270)
1
GH44-00145G
CHARGER-SCHN105 TC TCH020ABN, SCH-N105, AC/DC, -, -, -, -, 110/220
1
GH96-00894A
ELA ETC-SGHA100 EAR-MIC SGH-A100, -, USA, EAR-MIC, -, -, -
Level
SEC CODE
Design LOC
DESCRIPTIONS
SAMSUNG Proprietary-Contents may change without notice
8-1
8. STH-N271 Exploded View and its Parts List
1. STH-N271 Cellular phone Exploded View
11
14
12
13
10-2
10-3
10-4 10-5
10-6
13-1
13-2
13-3
15
SA
M
SU
NG
1-2
1-8
1-3
1-4
1-5
1-6
3
4
5
1
6
8
7
9
10
1-1
2
1-7
10-1
SAMSUNG Proprietary-Contents may change without notice
8-2
STH-N271 Exploded view and its Part List
2. STH-N271 Cellular phone Parts List
1
1-1
1-2
1-3
1-4
1-5
1-6
1-7
1-8
2
3
4
5
6
7
8
9
10
10-1
10-2
10-3
10-4
10-5
10-6
11
12
13
13-1
13-2
13-3
14
15
Location
No.
FRONT COVER ASS’Y
FLIP COVER
KEY DUMMY
LED CAP
FRONT COVER
EAR PHONE COVER
SIDE KEY
WINDOW LCD
HINGE
SPEAKER
MAIN PBA
LCD
KEY PAD
MIC HOLDER
METAL DOME
MIC
INTERFACE COVER
SHIELD REAR ASS’Y
SHIELD CAN
BUZZER HOLDER
SCREW (M1.4 x L4)
MOTOR BRACKET
SCREW (M1.4 x L2.3)
FPCB ASS’Y
ANTENNA
ANTENNA CAP
SUA REAR ASS’Y
REAR COVER
BATTERY LOCKER SPRING
BATTERY LOCKER
SCREW (M1.4 x L4)
BATTERY
GH75-01169A
GH75-01170A
GH72-01748A
GH72-01752A
GH72-01745A
GH73-00491A
GH75-00776A
GH75-00794A
GH75-01030A
3001-001210
GH82-00074A
GH07-00055A
GH72-01753A
GH73-00489A
GH75-01062A
GH59-00176A
GH73-00567A
GH97-01777A
GH71-00435A
GH73-00492A
6001-000464
GH71-00307A
6001-001460
GH59-00175A
GH42-00097A
GH73-00490A
GH75-00774A
GH72-01746A
GH70-10633A
GH72-01754A
6001-000464
GH43-00294A
GH75-01169B
GH75-01170B
GH72-01748A
GH72-01752A
GH72-01745A
GH73-00491A
GH75-00776A
GH75-00794A
GH75-01030A
3001-001210
GH82-00074A
GH07-00055A
GH72-01753A
GH73-00489A
GH75-01062A
GH59-00176A
GH73-00567A
GH97-01777A
GH71-00435A
GH73-00492A
6001-000464
GH71-00307A
6001-001460
GH59-00175A
GH42-00097A
GH73-00490A
GH75-00774A
GH72-01746A
GH70-10633A
GH72-01754A
6001-000464
GH43-00294A
GH75-01169C
GH75-01170C
GH72-01748A
GH72-01752A
GH72-01745C
GH73-00491A
GH75-00776A
GH75-00794A
GH75-01030A
3001-001210
GH82-00074A
GH07-00055A
GH72-01753B
GH73-00489A
GH75-01062A
GH59-00176A
GH73-00567A
GH97-01777A
GH71-00435A
GH73-00492A
6001-000464
GH71-00307A
6001-001460
GH59-00175A
GH42-00097A
GH73-00490A
GH75-00774A
GH72-01746A
GH70-10633A
GH72-01754A
001-000464
GH43-00294A
Description
Remark
SEC CODE
SA
SA
SNA
SNA
SNA
SNA
SNA
SA
SNA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SNA
SA
SA
SA
SA
SA
SNA
SNA
SNA
SA
SA
Gray
Silver
Gold
STH-N271 Exploded view and its Part List
SAMSUNG Proprietary-Contents may change without notice
8-3
3. Test Jig
(GH80-00614A)
4. TC
(GH44-00145G) 220V
Israel
Serial Cable
Power Supply Cable
5. RF Test Cable
(GH39-00092A)
6. Cigarette Lighter Adaptor
(GH44-00091A)
7. Test Cable
(GH39-00090A)
SAMSUNG Proprietary-Contents may change without notice
9-1
9. STH-N271 Block Diagrams
1. STH-N271 Base Band Part
SAMSUNG Proprietary-Contents may change without notice
9-2
STH-N271 Block diagrams
2. STH-N271 Radio Part
SAMSUNG Proprietary-Contents may change without notice
9-3
MEMO
SAMSUNG Proprietary-Contents may change without notice
10-1
1. STH-N271 Main PCB Top Diagram
10. STH-N271 PCB Diagrams
STH-N271 PCB diagrams
SAMSUNG Proprietary-Contents may change without notice
10-2
2. STH-N271 Main PCB Bottom Diagram
SAMSUNG Proprietary-Contents may change without notice
11-1
11. STH-N271 Circuit Description & Circuit Diagrams
STH-N271 provides the AMPS and the Digital TDMA (cellular band only) of compliance with TIA/EIA-137.
The radio operation of the STH-N271 has been implemented with the receiver, the transmitter, and the local
oscillator controlled by the PLL. The circuit of the STH-N271 is described as followings.
1. Baseband Section
1-1. Power Supply
For the POWER ON, with the battery installed on the telephone and by pressing the END key, the BATT
and ON_SW signals will be connected, which it will turn on Q107. In addition, Q106 is turned on by Q107,
and thus the BATT is connected to VBAT. Consequently, VBAT is supplied to input of regulators U110 and
U111. The regulator U110 supplies all powers of baseband part (VCC, AVCC, V_VCTCXO). The regulator
U111 supplies IVCC (2.2 V) to Baseband Engine Chip (U203: BEC). The BEC (U203), which is supplied
power from VCC, IVCC and reference clock 14.4 MHz from TCXO (OSC302), will start to run. If BEC will
start to run normally, the BEC output POWER_HOLD signal (low active) which is connected to Q105.
Moreover, Q105, Q107 and Q106 are turned on in order. In consequence, BATT is connected to VBAT
continuously. Although END key is released (ON_SW disconnected BATT). The power from U110 and
U111 is used in all baseband part of BEC, IFC (Interface Chip U101).
For the POWER OFF, in this case main application program is running already. The main application
program is checking all GPIO inputs periodically. When press the END key during program is running, the
BATT and ON_SW signals will be connected. This turns on Q107. Therefore, ON_SW_SENSE that is
connected to GPIO_0_5 (U203_ C13) turned logic high to low. The BEC checks this signal, main application
program enter to POWER OFF mode.
1-2. BEC (U203) interface
The BEC (U203) is mainly consist of two parts HOST CPU and Baseband Engine (Figure2-1). This is an
important component of dual-mode (US-TDMA and AMPS mode) cellular phone. It has 1Kx 32 of internal
ROM and 2Kx32 of internal RAM. This is communicate with a lot of peripheral device, memory (Flash
ROM, SRAM), Key Pad and LCD. The BEC receives TCXO clock signals from the TCXO and controls the
phone during the operation. The BEC communicates with the IFC through several serial links. These
include CODEC, wideband data, receiver data, transmitter data, and auxiliary data interface Signals. A
master baseband clock (BBCLK: U203_H2) at either 6.2208 MHz or 5.12 MHz or 4.096 MHz, depending on
the operating mode, from the BEC drives the IFC. The major components are as follows:
Separate address and data buses provide a data path to external memory and memory mapped
peripherals. The 22-bit address bus provides a byte addressing range up to 8 MB in each of 4 spaces
decoded by the 4 select signals. The 16-bit data bus in conjunction with the UBE signal allows word or byte
transfers. Table2-1 shows the ARM memory map. An Intel 28F3204 Stacked Memory chip supplies 4M
Bytes of Flash memory and 512 KBytes of SRAM. Note that in the phone, the SRAM is located at the
CS_RES1 block of memory.
SAMSUNG Proprietary-Contents may change without notice
11-2
STH-N271
Circuit Description
Figure2-1.BEC interface and block diagram
SAMSUNG Proprietary-Contents may change without notice
11-3
STH-N271
Circuit Description
Table2-1. ARM Memory Map
ARM Memory Map
ARM Address Range
Data
Block Size
Device Name
Remarks
0000 0000
0000 0003
32
4 Byte
Internal ROM
R
0000 0004
0000 1FFF
32
8K Byte
Internal RAM
R/W
0002 0000
0002 0FFF
32
4K Byte
Internal ROM
R
0004 0000
0005 FFFF
32/16
NA
Internal Peripherals
R/W
0080 0000
00FF FFFF
8/16
Up to 8 M Byte
SRAM_CS
R/W
0100 0000
017F FFFF
8/16
Up to 8 M Byte
FLASH_CS
R/W
0180 0000
01FF FFFF
8/16
Up to 8 M Byte
CS_RES1
R/W
0200 0000
027F FFFF
8/16
Up to 8 M Byte
CS_RES2
R/W
HOST CPU (inside of BEC:U203)
ARM7TDMI 32-bit microprocessor is used for the main call processing. The CPU controls all the circuitry. The
reference clock 14.4 MHz, coming from the output of the TCXO (OSC302), is connected to VCTCXO_IN (pin
F3). Digital Only, additional crystal oscillator (Y201) of 32.768kHz is connected to pin B2 of the BEC. The
interface circuitry consists of reset circuit, address bus (A0-A21), data bus (AD0-AD15), control signals
(MEMWEB, MEMOEB, SRAM_CS, FLASH_CS, DISPLAY_CS, UBE etc), GPIOs, and the communication ports.
The communication ports includes the UART1 and 2, the JTAG, and the SCI. The UART1 supports HP
equipment interface, down loading, and data service. The UART2 and the JTAG are used for the software
debugging. The SCI supports the Diagnostic Monitor (DM) function.
FLASH ROM (inside of U202)
The 32Mbit FLASH ROM is used to store code of the application program. Using the down-loader program,
this application program can be changed even after the mobile is fully assembled.
SRAM (inside of U202)
The 4Mbit SRAM is used to store the internal flag information, call processing data, and timer data.
Key Pad
The Key Pad is belong to main board. For key-press recognition, the structure of key is consisted of 8 x 3
matrix, which is used GPIO input signal SCAN0-7 and GPIO output signal KEY0-2 of BEC.
LCD
LCD module is connected to main board directly by U103. This contains an LCD controller,. An LCD controller
controls the information of displaying from the BEC (parallel 8-bit data) to the LCD.
BASEBAND ENGIN (inside of U203)
This part mainly interface with IFC (U101) and RF part. As for interface of IFC, that will be explained detail in
next section. As important signals are PREAMP_G for receiver path, PA-GATE, ALC_EN for transmitter path,
PLL_DATA, PLL_CLK, PLL_STRB1 for PLL synthesizer, RX_BAT, TX_BAT for power management.
SAMSUNG Proprietary-Contents may change without notice
11-4
STH-N271
Circuit Description
1-3. IF INTERFACE CHIP (IFC :U101)
The IFC provides the radio IF and audio interfaces (Figure2-2). Differential Rx I/Q and Tx I/Q signal pairs
interface directly with the RF interface chip (RFIC : U304) device. MOD, AFC, AGC, RSSI, and PA_CNT signals
also directly control the radio circuitry. Three audio paths are implemented. The primary path utilizes the
microphone and speaker, located on board. Both microphone and speaker utilize the main differential circuits
in the IFC to minimize noise pickup. The speaker output is amplified internally to enable direct connection to
the speaker. The second audio path connects to the headset jack. The headset microphone and speaker are
passed to the IFC’s auxiliary input and output, respectively. The headset jack terminals indicate via the
HEADSET_SENSE line when the headset is present as well as when the headset button is pushed via the
SEND_END line. The third audio path to the HFK shares the auxiliary output with the headset for its speaker
and uses the second auxiliary input for its microphone. Since the auxiliary output is not internally amplified,
an external audio amplifier is applied before connection to the two headset and HFK.
Figure 2-2.IFC interface and block diagram
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11-5
STH-N271
Circuit Description
The IFC (U101) is mainly consist of IF interface part and AUDIO CODEC part. The IF interface part, witch is
between RF part (mainly U304) and BEC, translate RF data to baseband data for BEC. Mainly, IF interface part
is consist of receiver, transmitter, and some kind of RF control. The IFC also provides several A/D inputs to
monitor system parameters. Battery voltage is periodically measured after scaling via a resistor divider
(BAT_MON: U101_67). A thermistor located near the PA is monitored to obtain temperature status by
TMP_MON (U101_66). Finally, a voltage level from the battery case, identifying the type of battery, is measured
by AUX_MON (U101_65).
Receiver Interface
The U101 receive differential I/Q signals (RX_IN, RX_I, RX_QN, RX_Q: U101_48,49,50,51), or DEMOD signal
(U101_52) which come from RF demodulator (U304_11,12,9,10,16), and translate as digital data. These data is
synchronized by control signals (RX_SYNC, RX_CLK, and BBCLK: U101_31,32,40) is transported to BEC
through RX_DATA (pin U101_30). In addition, the U101 uses AGC_OUT (U101_72) for dynamic range of
receiver signal strength connected to U304_17, AFC_OUT (U101_71) for adjusting reference frequency exactly
connected to TXCO (OSC302_1).
Transmitter Interface
The U101 receives TX_DATA1 (U101_36) synchronized by control signals (TX_SYNC, TX_CLK: U101_33,34),
which come from BEC, and translate this data as differential I/Q signals (TX_IN, TX_I, TX_QN, TX_Q :
U101_61,60,58,57), or MOD signal (U101_63). It transport this data to RF modulation part. In addition, the U101
uses PA_CNT (U101_73),TX_PWR (U101_68) for controlling power of transmitter.
AUDIO CODEC
Three audio paths are implemented in IFC. The primary path utilizes the microphone (U101_11,12) and speaker
(U101_77,79), located on board. Both microphone and speaker utilize the main differential circuits in the IFC to
minimize noise pickup. The speaker output is amplified internally to enable direct connection to the speaker.
The second audio path connects to the headset jack. The headset microphone and speaker are passed to the
IFC’s auxiliary input (U101_5) and output (U101_2), respectively. The headset jack terminals indicate via the
HS_SENSE (U115_4) to GPIO of BEC (U203_C11) when the headset is present. As well as when the headset
button is pushed via the SEND_END (U115_6) to GPIO of BEC (U203_A13). The third audio path to the HFK
shares the auxiliary output with the headset for its speaker and uses the second auxiliary input for its
microphone. Since the auxiliary output is not internally amplified, an external audio amplifier (U102) is applied
before connection to the headset and HFK.
SAMSUNG Proprietary-Contents may change without notice
11-6
STH-N271
Circuit Description
2. RF Section
2-1.Introduction
From the starting point of developing the STH-N271, the cellular and the PCS band operations have been
intended. Therefore, the STH-N271 contains many dual-band components and rooms for PCS band
components, in order to widen the operating band for the next product. For playing essential role in the
radio part, The STH-N271 includes many active components. They are U301 (dual-band LNA), U305
(Cellular band power amplifier), U304 (transceiver including up/down converter, RF and IF PLLs, Rx and
Tx AGCs, IQ modulator and demodulator, limiter, and discriminator), OSC301 (dual-band RF VCO), and
OSC303 (dual-band IF VCO). In order to obtain good selectivity and sensitivity simultaneously, STH-N271
has dual IF conversion system. The 1st IF and 2nd IF are 130.05 MHz and 450 kHz, respectively.
2-2.Front-End part
RF signal from the air interface passes F305 (diplexer) and F306 (duplexer). The purpose of F305 is the
band selection in conjunction with U303 (SPDT switch) according to the band control signal from the
baseband chipset. F306 plays the role of Rx and Tx filtering and the isolation between Rx and Tx in the
cellular band (AMPS and Digital TDMA).
2-3.Receiver
The Rx signal from F306 goes into U301. U301 amplifies the very weak Rx signal with adding the
negligible thermal noise. U301 features 20 dB gain, 1.3 dB NF, and 7 mA current consumption. For the
wider dynamic Rx AGC (automatic gain controller) range, the gain of U301 is controlled by PREAMP_G
signal coming from U203, resulting in around 30-dB step gain change. By checking the RSSI, U203 decides
to whether turn on U301 or not. The amplified signal goes into F304 (RF SAW filter) in order to suppress
the unwanted band data.
The signal coming out from F304 inflows to the pin 45 (1st Rx mixer input) of U304, and it is
downconverted to the IF of 130.05 MHz. This 1st mixer has around 7 dB conversion gain, 6dB NF, and 5
dBm IIP3. For the downconversion, the local frequency source from OSC301 (dual RF VCO) is used. As for
the local frequency, the Rx frequency plus 1st IF (that is, high injection type local frequency) is used, and
this frequency is controlled by the RF PLL in U304 in conjunction with U203 (baseband IC).
The 1st mixer output is connected to F302 (130.05 MHz 1st IF SAW filter). The main role of F302 is
suppression of undesirable interferers. For the 2nd IF conversion, the output of F302 is connected to the
2nd Rx mixer of U304. The 2nd mixer has the typical characteristics of 13.5 dB gain, 12 dB NF, and -20 dBm
IIP3. The local frequency source for making 2nd downconversion is supplied from U304 internally by 9
times multiplying the fundamental frequency of OSC302 (14.4 MHz VC-TCXO). The downconverted signal
passes F301 (450 kHz Ceramic filter) in order to suppress the unwanted interferers and the image
frequency signals.
Until now, the Rx signal path is common for both of AMPS and Digital TDMA. From the filtered 450 kHz
signal output, AMPS path and TDMA path become separate for proper treating of the Rx signal. To begin
with, AMPS path will be described.
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11-7
STH-N271
Circuit Description
AMPS (Limiting and Discrimination)
The downconverted signal from the output of F301 enters to the limiter and discriminator of U304. For the
better suppression of the unwanted interferers, discrete LC filter is used in the limiter section. The signal
through the limiter goes into the discriminator (or quadrature detector) of U304 with incorporation of the
quadrature tank circuit (LC resonator) placed outside of U304, and thus the audio signal comes out from the
pin 16 of U304. This demodulated signal is connected to U101.
TDMA (Rx AGC and I, Q Demodulator)
The downconverted signal from the output of F301 enters to the Rx AGC and I, Q demodulator of U304. The
Rx AGC has the performance of 80-dB dynamic range, 10 dB NF, and -85 dBm IIP3. In the process of I, Q
demodulation, 450 kHz local signal, made by dividing 14.4 MHz reference clock, is used.
2-4.Transmitter
In the AMPS mode, Mod signal from U101 (interface IC) is applied to the tuning voltage terminal of
OSC303 (175.05 MHz IF VCO) with the internal IF PLL of U304. In the TDMA mode, Tx I, Q signals
coming from U101 are applied to the I,Q modulator.
The modulated signal goes into the Tx AGC of U304. The Tx AGC has the 65-dB dynamic range. The
output of the Tx AGC enters the upconverter of U304. For the upconversion, the local frequency source
from OSC301 (dual RF VCO) is used, as well. The typical output power of the upconverter is -10 dBm at
MAC: 0000. The ACPR of the upconverter is 32 dB at adjacent channel and 60 dB at alternate channel.
The upconverted signal passes through F310, U307, and F309. F309 and F310 are same RF Tx SAW filters.
U307 (Tx driver) performs the amplification of the input signal by 27 dB, in order to provide enough input
power into U305 (power amplifier). The ACPR of U307 is 33 dB at adjacent channel and 61 dB at alternate
channel.
U305 has 30-dB linear gain, and maximum output power of 31 dBm (AMPS) and 30 dBm (TDMA). The
ACPR of U305 is 29 dB at adjacent channel and 49 dB at alternate channel. This satisfies the TIA/EIA-136
specification. The output power of U305 is transmitted to F313 (Cellular band coupler) in order to help the
Tx power control by using the power detector diode. In result, the Tx power is transmitted to the air
interface via an antenna.
SAMSUNG Proprietary-Contents may change without notice
11-8
STH-N271
Circuit Description
2-5. Radio component control
U101 monitors the state of the radio part, and delivers the information to U203. Then, U203 sends the
proper control signals to radio relating regulators and AGCs. The radio interface signals are summarized in
the Table 2-2
Table 2-2. Radio Interface Signals
Signal Name
Source/Destination
Function
PON_LD
BEC/RFIC
Limiter/Discriminator power control
TX_RFBAND
BEC/IF VCO
Tx band control (0=PCS, 1=Cell)
VCTCXO_IN
TCXO/BEC
14.4 MHz clock
VCTCXO_PC
BEC/TCXO
14.4 MHz clock power control
PLL_DATA
BEC/RFIC
PLL serial data
PLL_CLK
BEC/RFIC
PLL serial clock
PLL_STRB1
BEC/RFIC
PLL serial strobe
RF_BAND
BEC/Various
Cell/PCS band select (0=Cell, 1=PCS)
PREAMP_G
BEC/Regulator
Rx AGC Gain step
RX_BAT
BEC/RFIC
Receiver power control
TX_BAT
BEC/RFIC
Transmitter power control
ANALOG_DIG
BEC/Oscillators
Band control (0=Analog, 1=Digital)
LOCK_DET
RFIC/BEC
PLL lock detect status
PLL_ON
BEC/Regulator
PLL power control(V_RF1:RFIC)
A_IF_IN
RFIC/IFC
IF comparator input
RX_Q, RX_QN
RFIC/IFC
Differential analog receive Q channel
RX_I, RX_IN
RFIC/IFC
Differential analog receive I channel
TX_Q, TX_QN
IFC/RFIC
Differential analog transmit Q channel
TX_I, TX_IN
IFC/RFIC
Differential analog transmit I channel
MOD
IFC/RFIC
Drive to modulator
TX_PWR
Detector/IFC
Tx power detector
RSSI
RFIC/IFC
Rx Signal Strength Indicator
AFC_OUT
IFC/VCTCXO
Auto Frequency Control voltage
AGC_OUT
IFC/RFIC
Auto Gain Control voltage
PA_CNT
IFC/RFIC
Power Amplifier control voltage
DEMOD
RFIC/IFC
Discriminator output
TXDA_REF
RFIC/IFC
Tx section common mode DC bias
PON_TX
BEC/Regulator
TX up converter power (V_RF2:RFIC)
PON_VRF3
BEC/Regulator
Local Amp power(V_RF3:RFIC)
SAMSUNG Proprietary-Contents may change without notice
11-9
CN101
NOTE: LAYOUT OF U104 IS CRITICAL
U114
Q108(123)
R161
NOTE: GPIO INTERNAL PULL-UP
L104
ZD101
NOTE: THE RESISTOR FOR OPT BEAD
NOTE:PLACE THESE CAP. AS CLOSE AS
C189
TH101
D101
POSSIBLE TO IFIC MIC+ AND MIC- PINS
STH-N271_IFIC
L103
220UH
220K
R155
R136
6.3V
10UF
C107
1
2
3
4
5
100K
1
2
3
4
5
Q102
CN101
100NF
C179
C158
10UF
6.3V
NC
C180
27PF
C186
NC
C185
C141
100NF
C104
100NF
1NF
100NF
C115
C183
R145
100K
100K
R148
C120
100NF
VCC
10
R157
C124
100NF
6.3V
10UF
C163
C111
R115
560K,1%
R135
100K
10PF
Q105
2
3
1
R132
100K
100NF
C175
220NF
C125
R121
C172
10UF
6.3V
0
2.7K
R108
R122
C119
100NF
36K
22PF
C131
330K
R118
8
7
GND
OUT
5
1
SHDN
VDD
6
U102
+IN
3
4
-IN
BYP
2
GND
C130
100NF
2
3
1
Q101
VBAT
R113
47K
4
BYP
CONT
3
2
GND
VIN
1
VOUT
5
U111
R124
10K
10K
100NF
C137
R101
C112
VAUX
330K,1%
R138
100NF
AVCC
R112
680K
1K
R151
G2
S1
1
4
S2
R160
0
U109
D1 6
3 D2
2 G1
5
R161
AVCC
NC
C164
10UF
6.3V
330K
R141
C166
1UF
R110
6.3V
10UF
C173
0
6.8NF
C139
VCC
R104
250V
100NF
C150
15K
91K,1%
C103
NC
100K
R149
R159
1UF
C122
C161
1UF
VBAT
C133
NC
36K
R154
10K
C110
100NF
R139
0
R116
390K
R134
VBAT
4.7NF
C127
37
VALID_STRB
43
WBORX
WBOTX
44
XAUXI-
5
4
XAUSI2
6
XAUSO
36
TX_DATA1
TX_DATA2
35
TX_I
60
TX_IN
61
68
TX_PWR
57
TX_Q
TX_QN
58
TX_SYNC
33
24
SI
23
SO
21
TIMER
17
TMP_MON
66
59
TXDA_REF
TX_BAT
38
34
TX_CLK
32
RX_DATA
30
RX_I
50
51
RX_IN
RX_Q
48
49
RX_QN
31
RX_SYNC
22
SCLK
SEN
79
77
REC20-
RINGER
1
RIT
O_COMI
56
RQTI_COMO
54
RSSI
69
41
RST
55
R
T
_COMO
RX_CLK
10
MICO
MIXI
9
MOD
63
MODE_STS
26
MOD_COMD
62
18
MSTR
73
PA_CNT
2
RAUXO-
REC20+
42
70
EXT_VREF
25
FSYNC
75
IREF
MCLK
19
20
MDA
T
12
MICI+
MICI-
11
47
A_IF_IN
67
BAT_MON
BBCLK
40
39
BIN
DEMOD
52
45
DGND1
DGND2
46
16
DVDD
D_IF_OUT
27
AUX_MON
65
28
AUX_STRB
53
A
VDD1
A
VDD2
13
14
A
VDD3
74
AVDD4
AVDD5
80
64
AGND2
7
78
AGND3
AGND4
15
AGND5
76
AUDCOMRD
3
8
AUDCOMT
O
29
AUX_CLK
AUX_DATA
U101
AFC_OUT
71
72
AGC_OUT
AGND1
270K
R123
1K
R128
R147
27ohm
10NF
C144
NC
C153
R153
100K
VBAT
100NF
C177
C170
V_VCTCXO
100NF
C118
100NF
R106
15K
C168
100NF
27PF
C189
R130
100K
AVCC
100K
R146
C129
10NF
6.3V
10UF
C159
NC
C135
VCC
R143
6.8K
C116
33UF
6.3V
L101
82nH
C114
NC
100K
R150
CE1
7
6
CE2
CE3
5
4
GND
8
VDD
1
VOUT1
VOUT2
2
3
VOUT3
U112
C182
470PF
R125
86.6K,1%
2.2UF
C171
C128
100NF
16V
Q107
2
3
1
D2
2 G1
5
G2
S1
1
4
S2
U106
D1 6
3
C174
2
VOUT2
VOUT3
3
100NF
7
CE1
CE2
6
5
CE3
GND
4
VDD
8
VOUT1
1
C148
100NF
U110
27PF
C106
VBAT
C147
1UF
NC
R158
100K
VCC
R103
VBAT
R144
VAUX
2.2K
C160
10UF
6.3V
100NF
C117
6.3V
10UF
C156
10
1
2
5
6
G
3
4
R142
ZD101
1
2
3
4
5
Q106
2.2UF
C157
16V
C181
470PF
2
R111
57.6K,1%
Q108
1
3
NC
C152
SPK101
SPKHA-13
10K
R127
VCC
R119
270K
R114
10K
U107
1
2
3
45
6
C134
68PF
MIC
MIC101
2
1
R152
22K
C121
27PF
C176
100NF
VCC
R126
10K
TH101
100NF
C142
1UF
C146
100NF
C145
3 D
1G
2 S
C143
100NF
2.2UF
C178
Q104
C149
AVCC
16V
1UF
R156
100K
C105
100NF
10
3
2
GND
1
IN
5
OUT
R133
U108
4
ADJ
EN
1UF
VCC
C151
82nH
L102
0
100PF
C126
R109
1
2
VOUT2
VOUT3
3
6.3V
10UF
C167
7
CE1
CE2
6
5
CE3
GND
4
VDD
8
VOUT1
12PF
C102
U105
1NF
10K
R129
AVCC
C188
C136
68PF
R105
NC
C162
2.2UF
16V
VOUT
5
U114
4
BYP
CONT
3
2
GND
VIN
1
D2
3
G1
2
G2 5
1 S1
S2
4
3
1
U113
6
D1
Q103
2
D101
1SS376-TE-17
VDD
VOUT
18
VR
17
VSS
C154
NC
4
RS
5
6
RW_WRB
V0
29
25
V1
V2
26
27
V3
V4
28
16
DB5
14
DB6
DB7
15
33
EL1
EL2
34
E_RDB
7
32
NC
NC
1
RESETB
C68
CS1B
2
3
CS2
8
DB0
DB1
9
DB2
10
11
DB3
DB4
12
13
22
C1+
C1-
21
23
C2+
C2-
24
20
C3+
C4+
19
31
U103
15K
R117
R107
1.8K
C108
100NF
VBAT
6.3V
10UF
C165
100NF
C101
1NF
C138
R120
IVCC
47K
R140
18K,1%
100NF
C109
VBAT
NC
C113
100K
R131
CHV
7
3
ENA
8
LDR
2
OSC
6
OUT1
OUT2
5
4
VDD
VSS
1
U104
C140
1UF
1.8K
R102
C187
C184
100PF
10PF
16V
2.2UF
C155
AMP_AUDIO_OUT
WBDTX
SEND_END
C169
10UF
6.3V
HS_SENSE
XAUXI-
AMP_AUDIO_OUT
XAUXI-
SI2
SCK
SEN
TXDA_REF
DEMOD
HEADSET_SENSE
PA_GATE
AUX_ON
V_LNA_PCS
V_LNA_CELL
VCTCXO_PC
V_VCTCXO
IF_ON
V_IF_VCO
TX_BAT
PON_TX
V_DRV_CELL
V_DRV_PCS
RF_BAND
V_DET
V_RF2
RF_BAND_PCS
BATT
ON_SW
HP_PWR
POWER_HOLD
RF_BAND_PCS
RF_BAND
PDM
V_PA_BIAS_PCS
V_PA_BIAS_CELL
VRX
BAT_MON
ON_SW_SENSE
DATA(7)
DISPLAY_CS
ADD(2)
MEMWEB
MEMOEB
DATA(0:15)
EL_EN
RST
TMP_MON
MIC+
MIC-
MIC-
PA_CNT
V_F_EN
V_F
RX_BAT
PLL_ON
PON_VRF3
V_RF3
V_RF1
PREAMP_G
RF_BAND
RF_BAND
RF_BAND_PCS
TX_DATA1
WBDRX
VALID_STRB
BIN
TX_BAT
IFIC_RESET
D_IF_OUT
A_IF_IN
RINGER
RX_I
RX_IN
RX_Q
RX_QN
TX_PWR
RSSI
MOD
TX_I
TX_Q
TX_QN
AFC_OUT
TX_AUDIO
XAUXI-
MIC+
DATA(0)
DATA(1)
DATA(2)
DATA(3)
DATA(4)
DATA(5)
DATA(6)
RX_AUDIO
HEADSET_SENSE
RX_AUDIO
HEADSET_SENSE
MIC_BIAS_EN
MIC-
MIC+
AMP_EN
RAUXO
REC20+
REC20-
AGC_OUT
RAUXO
REC20-
REC20+
TX_IN
STRB1
SCLK
DO
FSYNC
SO2
MODE_STS
RX_DATA
RX_SYNC
RX_CLK
AUX_CLK
AUX_STRB
AUX_DATA
BBCLK
TX_CLK
TX_SYNC
3. STH-N271 IFIC Circuit Diagram
STH-N271 Circuit diagrams
STH-N271 Circuit diagrams
SAMSUNG Proprietary-Contents may change without notice
11-10
2
#
C234(225,226,227,228,229)
6
AU201
NOTE: BOOT SHOULD BE PULLED LOW FOR CABLE DETECTION
NOTE: LAYOUT AND SHIELDING IRDA DEVICE IS CRITICAL
D212
5
8
CN202
CLR
SEND
1
ENTER
PWR_END
JTAG
9
RED
Y201
4
R248(R202,219)
0
Q206
BT201
TP220
ZD210
3
RV205
SCROLL
MENU
STH-N271_BASE
NOTE: TDMA EVENT -SPARE TIMMING SIGNALS
*
NOTE: WAITING FOR REPLAY FROM SAMSUNG ABOUT C_F PIN
U208(207)
7
GREEN
R240
22
5.1K
VAUX
R221
R229
22
ZD210
3
1
2
HPPWR
S20
1
2
D202
S14
1
2
R228
22
C205
100NF
1
2
22
R234
NC
C224
S5
100NF
C216
C206
RX
100NF
C210
100NF
BATT
VBAT
BOOT
S8
1
2
C221
47PF
C201
100NF
BVDD
VCC
VCC
D208
C220
100NF
E2
VCTCXO_PC
F4
F2
VCTCXO_VDD
G1
WBDRX
WBDTX
G2
F1
XIN
XOUT
E1
TX_BA
T
K2
TX_CLK
TX_DA
T
A_1
K4
K3
TX_DA
T
A_2
TX_SYNC
K1
T15
UBE
J1
VALID_STRB
F3
VCTCXO
VCTCXO_GND
D10
TBREAKPT
K14
TDMA_EVENT_1
G15
G16
TDMA_EVENT_2
TEST1
B4
C4
TEST2
TEST3
A3
B3
TESTER_MODE
J2
SLOT_T
SO2
P2
SOUT_1
L16
T10
SOUT_2
SRAM_CS
P16
B8
STROB0
STROB1
C8
C10
STROB2
STROB3
RX_DATA
RX_SYNC
L3
N1
SCK2
SCLK
D9
SEN2
N3
N2
SI2
M16
SIN_1
SIN_2
T11
D1
1
PWM_2
PWM_3
C9
A2
RESET
RF_BAND
J15
RI_N
T3
T6
R
TS_N
RX_BA
T
H13
RX_CLK
L4
L2
K16
J13
PLL_STRB_1
PLL_STRB_2
J14
C2
POWER_FAIL
POWER_HOLD
C3
J16
PREAMP_G
D13
PWM_0
PWM_1
A9
B9
A6
D7
P1
P
A_GA
TE
H16
PDM_0_N
D3
D2
PDM_0_P
D1
PDM_1_N
PDM_1_P
E4
K15
PLL_CLK
PLL_DA
T
A
MCLK
MEM8/16
M15
MEMOEB
T14
T13
MEMWEB
MODE_STS
M2
B12
NOPC
NR
W
C1
1
OSC_32K_GND
A1
P0
IRDA_TXD
R1
IVDD1
IVDD2
R16
A7
IVDD3
IVDD4
C7
G14
LOCK_DET
MAS0
A1
1
B1
1
MAS1
A12
GPIO_1_1
GPIO_1_2
C14
A13
GPIO_1_3
GPIO_1_4
B13
C13
GPIO_1_5
GP_OUT
F13
IFIC_RESET
H3
IRDA_RXD
T7
T9
GPIO_0_3
GPIO_0_4
E14
E15
GPIO_0_5
GPIO_0_6
E16
D14
GPIO_0_7
GPIO_0_8
D15
D16
GPIO_0_9
GPIO_1_0
A14
B14
GPIO_0_1
GPIO_0_10
C15
C16
GPIO_0_1
1
GPIO_0_12
B16
A16
GPIO_0_13
GPIO_0_14
A15
B15
GPIO_0_15
GPIO_0_2
F16
E13
EDD4
EDD5
D12
EX_TX_CLK
B6
C6
EX_TX_DA
T
A
FBURST
A10
N16
FLASH_CS
M1
FSYNC
GPIO_0_0
F14
F15
DSR_N
DTR_N
T5
H4
D_IF_OUT
B10
D_IN
D_OUT
A8
EDD1
D4
J4
EDD2
EDD3
R8
H15
DGND1
DGND2
P1
T8
DGND3
DGND4
T16
H14
DGND5
DGND6
C12
D8
DGND7
DGND8
B7
T2
N11
R12
D4
D5
P12
N12
D6
D7
R13
P13
D8
D9
R14
T4
DCD_N
H1
R11
R15
D10
D11
P14
P15
D12
D13
N13
N14
D14
D15
N15
P11
D2
D3
T12
C1
BVDD
G4
CLK_SEL_0
CLK_SEL_1
G3
CS_RES1
M13
M14
CS_RES2
CTS_N
T1
N10
D0
D1
BBCLK
A4
BB_JT
AG_RESET
B5
BB_TCK
BB_TDI
C5
D6
BB_TDO
BB_TICE
A5
BB_TMS
D5
BIN
J3
BOOT_MODE
ALC_EN
K13
ARM_TCK
L15
ARM_TDI
ARM_TDO
L14
ARM_TMS
L13
L1
AUX_CLK
M3
AUX_DA
T
A
AUX_STRB
M4
H2
N4
P4
A4
A5
R4
R5
A6
A7
N5
P5
A8
A9
R6
E3
AGND
G13
P8
N8
A16
A17
R9
P9
A18
A19
N9
R3
A2
R10
A20
A21
P10
A3
B1
R2
A0
A1
P3
P6
A10
A11
N6
R7
A12
A13
P7
N7
A14
A15
U203
B2
32K_XIN
32K_XOUT
G
G
9
D209
SIDE-KEY
1
1
2
2
3
3
4
4
5
5
6
6
7
7
8
CN202
51
R232
R248
100K
R223
22
1UF
10
R237
1
2
C214
S19
1
2
15PF
C207
TX
S6
D211
VCC
R225
22
P201
R
V202
NC
AVCC
1
VCC
P202
R210
2
3
4
5
U201
GND
3
2
OUT
GND
ZD203
1
VBATT
1
2
3
4
5
1
2
3
4
5
ZD207
10PF
ZD201
C203
R209
100K
47K
R239
ZD209
C233
100NF
3
1
2
C222
47PF
S15
1
2
D201
VCC
E4
VPP
VCC
G10
S-CS1#
S-CS2 D8
S-LB# F3
S-OE# F5
F4
S-UB#
S-VCC
D9
S-VSS
D3
S-WE# B8
A2
NC2
NC3
A11
A12
NC4
NC5
C4
H1
NC6
NC7
H2
H3
NC8
NC9
H10
F-VSS
H8
A9
F-VSS
F-WE#
C3
F-WP# E3
NC1
A1
H11
NC10
NC11
H12
B10
DQ7
DQ8
F8
F7
DQ9
F-CE# H7
F-OE# H9
D4
F-RP#
F-VCC
D10
F-VCCQ
A10
C7
DQ13
DQ14
B9
B7
DQ15
DQ2
E9
E10
DQ3
DQ4
C9
C10
DQ5
DQ6
C8
G5
A7
A8 B4
B6
A9
DQ0
F9
F10
DQ1
DQ10
E8
E6
DQ11
DQ12
D7
G4
A17
A18 G3
E5
A19
A2 G8
A3
A20
G7
A3
A4 H5
H4
A5
A6 G6
G9
A1
A10 B5
A4
A11
A12 A8
A7
A13
A14 A6
A5
A15
A16 B3
U202
A0 H6
2
S10
1
100NF
C213
C230
100NF
R206
100K
BVDD
S7
1
2
100K
1
2
3
4
5
R213
47K
ZD204
10K
R208
ZD208
1
2
3
4
5
R217
C204
NC
Q204
2
3
1
5
S16
1
2
C218
NC
ZD202
1
2
3
4
D206
C209
22
100NF
R233
2.2K
R227
NC
C219
1
2
VCC
R241
5.1K
S18
1
2
S22
R212
P204
S9
1
2
330K
R
V204
R220
S12
1
2
22
S17
1
2
C211
100NF
51
R230
VCC
VCC
S13
1
2
R
V203
10NF
C223
NC
R215
D207
3
45
6
Y201
U205
1
2
1
2
S21
22
R226
R
V201
NC
R246
D205
ZD206
1
2
3
4
5
3
VCC2
_RESET
5
S4
1
2
U206
2
GND
SRT
1
VCC1
4
NC
R222
VCC
R238
P205
5.6K
P203
100K
R207
100K
1
2
3
45
6
R236
U204
22
R224
2
Q203
1
3
20K
R201
10K
R218
270K
R204
100K
R211
1
2
3
4
5
22
ZD205
R235
D204
R231
51
100NF
C234
C215
100NF
0
R245
R247
D210
100
R214
R243
NC
100K
BT201
2
1
VCC
Q206
2
3
1
P206
100K
IVCC
VCC
R242
R216
VCC
NC
C208
15PF
0
R244
1M
R205
1
RESERVED0
RESERVED1
2
RI
16
RTS
20
RX_AUDIO
7
11
TX_AUDIO
GND2
10
GND3
12
19
GND4
25
GND5
CTS
23
C/F1
9
C/F2
26
13
DP_RX_DATA
14
DP_TX_DATA
3
DSR
DTR
24
8
GND1
VCC
CN201
17
CD
100NF
C212
Q202
2
3
1
VCC
ARM_TDO
ARM_TMS
SLOT_T
RST
ARM_TCK
KEY(0)
KEY(1)
KEY(2)
SCAN(0)
SCAN(0)
ON_SW
SO2
PLL_ON
C_F
BOOT
GBOOT
VCC
HP_PWR
SOUT_2
SIN_2
VCTCXO_IN
BATT
SOUT_2
AUX_ON
HP_PWR
SCLK
SIN_2
DO
RX_AUDIO
C_F
SIN_2
SCLK
SOUT_2
V_F
DO
C_F
BATT
BATT
SI2
DP_RX_DATA
ON_SW
ARM_TDI
DTR
CTS
DP_RX_DATA
DP_TX_DATA
DSR
CD
RI
SIN_2
PON_TX
LED_EN
PDM
VCTCXO_PC
SEND_END
ON_SW_SENSE
AMP_EN
BOOT
GBOOT
CARR_ON
TX_AUDIO
RX_AUDIO
ALT_LED
AL
T_LED
TRST
SVC_LED
SVC_LED
CARR_ON
PON_VRF3
SCAN(7)
SCAN(4)
SCAN(3)
SCAN(2)
KEY(0:2)
SCAN(0:7)
KEY(0)
SCAN(1)
SCAN(5)
BOOT
ANALOG_DIG
LED_EN
SLOT_T
TX_RFBAND
V_F_EN
STRB1
PON_LD
DATA(0:15)
CLK_FIL
RST
SCAN(7)
V_F
KEY(1)
KEY(2)
RX_SYNC
SCK
SEN
FSYNC
DISPLAY_CS
SRAM_CS
FLASH_CS
UBE
MEMOEB
MEMWEB
EL_EN
SCAN(1)
SCAN(7)
RINGER
VIBRATOR
REED_SW
KEY(2)
KEY(0)
KEY(1)
SCAN(2)
SCAN(3)
SCAN(5)
SCAN(4)
POWER_HOLD
SCLK
DO
DP_TX_DA
T
A
ARM_TDO
ARM_TMS
RF_BAND
ALC_EN
PREAMP_G
P
A_GA
TE
TX_BA
T
RX_BA
T
PLL_STRB1
PLL_CLK
PLL_DA
T
A
LOCK_DET
D_IF_OUT
IFIC_RESET
BIN
VALID_STRB
WBDTX
WBDRX
MODE_STS
TX_DA
T
A
1
TX_SYNC
TX_CLK
BBCLK
AUX_DA
T
A
AUX_STRB
AUX_CLK
RX_CLK
RX_DATA
DATA(5)
DATA(6)
DATA(7)
DATA(8)
DATA(9)
DATA(10)
DATA(11)
DATA(12)
DATA(13)
DATA(14)
DATA(15)
SCAN(0)
SCAN(1)
SCAN(2)
SCAN(3)
SCAN(5)
SCAN(4)
KEY(2)
KEY(1)
KEY(0)
IF_ON
VIBRA
T
O
R
MIC_BIAS_EN
HS_SENSE
FLASH_WP
CTS
DSR
RI
CD
DTR
RT
S
SOUT_2
ARM_TDI
REED_SW
ADD(1)
ADD(2)
ADD(3)
ADD(4)
ADD(5)
ADD(6)
ADD(7)
ADD(8)
ADD(9)
ADD(10)
ADD(11)
ADD(12)
ADD(13)
ADD(14)
ADD(15)
ADD(16)
ADD(17)
ADD(18)
ADD(19)
ADD(20)
ADD(21)
ADD(0:21)
ADD(0)
DATA(0)
DATA(1)
DATA(2)
DATA(3)
DATA(4)
DATA(11)
DATA(12)
DATA(13)
DATA(14)
DATA(15)
ADD(1)
ADD(2)
ADD(3)
ADD(4)
ADD(5)
ADD(6)
ADD(7)
ADD(8)
ADD(9)
ADD(10)
ADD(11)
ADD(12)
ADD(13)
ADD(14)
ADD(15)
ADD(16)
ADD(17)
ADD(18)
ADD(19)
ADD(20)
ADD(21)
ADD(0:21)
FLASH_WP
RST
MEMOEB
MEMWEB
UBE
DATA(0)
FLASH_CS
SRAM_CS
ADD(0)
BOOT
DSR
DP_TX_DATA
DP_RX_DATA
HP_PWR
RI
CD
RTS
CTS
DTR
RTS
HP_PWR
DATA(0:15)
DATA(1)
DATA(2)
DATA(3)
DATA(4)
DATA(5)
DATA(6)
DATA(7)
DATA(8)
DATA(9)
DATA(10)
4. STH-N271 BASE Circuit Diagram
SAMSUNG Proprietary-Contents may change without notice
11-11
STH-N271 Circuit diagrams
50
Z[OHM]
(N.C)
TL2
2.C401,C402,C443,C444 are High Q capacitors
L307: 6.8nH for PCS
L502: 10nH for PCS
1.L325,L332 are High Q inductor (Coilcraft 0805HQ series)
TL3
1.3
TL6
TL5
LC FILTER : C(470),L(340,334)
TL1
TL8
Will be connected
U310
TL4
AN301
in PCS Model
Note:
TL2
TL3
L341
TL6
C476(379)
1.19
65
0.5
2.6
50
TL9
TL5
D302
R397
50
1.5
TL10
3.9
50
TL8
Q301
50
(1608)
TL4
DUMMY PAD
0.3
50
3.5
0.25
L[mm]
TL7
GND:135
65
1.12
65
Transmission
OSC303
F313
STH-N271_RF
50
TL1
1UF
TL7
TL10
TL9
12
11
RFOUT
RFOUT
10
VCCB
14
VCC1
15
VCC1
16
GND
GND
3
9
GND
17
GND
4
RFIN
RFOUT
U305
2F0
13
BGND
8
1
GND
2
C309
R336
6.2K
10PF
100NF
C388
100NF
C315
2.4
100NF
C370
6.8nH
L313
R341
100NF
D302
C437
2.7NF
C346
C462
56PF
L302
220nH
AMPSOUT
4
1
G1
G2
3
5
G3
IN
2
6
PCSOUT
15
VCC2
16
7
VMODE
VPD1
6
VPD2
8
F305
2
5
GND1
17
GND
4
RFIN
10
RFOUT
1
VCC2
VCC1
3
14
VCC
VCC2
U309
2F0
13
9
BGND
GND2
C347
NC
R301
470
2PF
C390
RFOUT
6
VCC
33PF
C329
U307
GC
3
2
GND
GND 5
4
RFIN
1
2.2NF
C476
G3
G4
6
IN
2
5
OUT
R314
27ohm
F303
1
G1
G2
3
4
68PF
C307
1NF
3PF
C312
C340
C371
8PF
L323
6.8nH
820
C400
1NF
G
1
G
3
4
G
G
6
2
IN
5
OUT
R302
F310
10nH
L315
27ohm
R340
C331
100NF
C323
4.7PF
C440
5PF
6.2K
R395
100NF
C473
27ohm
R393
100NF
C465
C409
100NF
U310
D1
6
3
D2
2
G1
5
G2
S1
1
4
S2
C358
15PF
C320
NC
R315
C411
1NF
10
R364
0
3
OUT
NC
L320
F311
1
GND1
GND2
4
2
IN
100PF
C453
C375
2.2NF
10NF
C445
C354
15PF
R381
15PF
C325
100
51
R342
4.7K
R349
L327
82nH
R304
2.4K
C452
10NF
100PF
C425
C384
10NF
VCC
6.8nH
L340
GC
3
2
GND
GND 5
4
RFIN
1
RFOUT
6
U308
C463
56PF
R385
0
C324
NC
100PF
C327
10K
R337
R319
27ohm
R338
0
R326
4.7K
R320
4.7uH
L338
27ohm
R322
100NF
470
5
3
4
1
2
C336
L331
4.7nH
U306
R345
5.1K
R397
39K
10NF
C363
1K
R334
VCC
VT
3
11K
R389
5
G
G
6
7
G
G
8
1
RFOUT
4
SW
2
R383
10
OSC303
R323
1.5K
3
ISO
OUT
4
C306
1NF
F313
COUP
6
G1
2
5
G2
IN
1
C420
10NF
R382
100K
1NF
C403
10NF
C461
C394
100PF
680PF
1NF
C427
C475
4.7NF
C318
C330
390PF
C410
100PF
R330
2PF
27ohm
100K
C406
L324
8.2nH
R351
120
R388
C474
1NF
C467
0.5PF
100NF
C332
C439
5.6pF
C433
4.7NF
7PF
C305
6.3V
2
3
1
C364
10UF
Q301
5PF
C387
C366
15PF
C339
100PF
100NF
C450
C301
C428
10UF
100PF
R332
6.3V
3
2
1
10
D301
100PF
C395
C436
10PF
R328
27ohm
2K
R387
2.7NF
C377
L307
51
2.2PF
C333
2PF
C392
R358
18K
4.7PF
C361
L334
6.8nH
100PF
C458
100NF
C322
27ohm
R325
5.6nH
R310
560
L321
10
L332
12nH
C414
4.7PF
R344
100PF
C352
15PF
C438
C413
1NF
C393
100PF
C456
C365
100PF
15PF
16nH
C310
100NF
L325
1NF
C412
C343
100NF
R305
560
L336
10nH
C469
1NF
R366
1K
1
G1 G2
3
4
G3 G4
6
IN
5
2
OUT
C355
F302
R369
100PF
10
R373
2.2K
1.5PF
C316
100PF
R377
1K
C396
L311
8.2nH
L310
330uH
C460
5PF
8PF
C308
C319
1.8PF
C399
100PF
560
R391
R379
10
L322
1nH
10NF
C383
L335
2.7nH
100NF
C448
L328
NC
2
GND
GND
4
IN
3
OUT
1
C417
100PF
C466
U302
100PF
NC
C337
F307
3
GND1
GND2
4
1
IN
2
OUT
R390
R348
15K
5.6K
100PF
C335
10NF
C435
10PF
C314
100
R354
L329
15nH
100NF
C429
27ohm
R318
C464
1.5PF
L312
4.7nH
C378
NC
6.3V
10UF
C360
C362
10PF
C404
100PF
7
8
RFIN1
6
RFIN2
1
RFOUT1
RFOUT2
3
U301
4
EN1
EN2
5
GND
2
GND
R368
C369
100NF
33K
R327
150K
C419
100NF
NC
C443
270
R371
15
R346
R384
10
10PF
C459
4.7K
R343
R313
1K
5.6NF
C374
C373
27PF
2.2NF
C353
C376
33NF
NC
R392
C389
8PF
L304
2.7nH
C367
100NF
OUT1
1
3
OUT2
VC1
6
VC2
4
0
R365
U303
2
GND
5
IN
C431
100PF
C418
R378
6.2K
1K
10NF
27K
R357
R362
5PF
C401
RX
3
R312
470
28
29
G26
6
G3
G4
78
G5
G6
91
0
G7
11
G8
21
22
G19
G2
5
G20
23
G21
24
G22
25
26
G23
27
G24
G25
13
14
G11
G12
15
16
G13
17
G14
18
G15
G16
19
20
G17
G18
F306
ANT
2
4
G1
G10
L339
2.2uH
R339
1K
L306
15uH
C405
100NF
4.7PF
C444
C454
NC
3.9nH
L308
NC
C349
C357
100NF
3PF
C457
C447
L314
8.2nH
1PF
100PF
C321
270
10PF
C451
100NF
R316
C326
10K
R324
C311
100NF
1PF
C345
10UF
10V
C402
12PF
C449
C338
10NF
R350
10
R386
NC
R331
1nH
L333
L318
NC
82nH
10K
150
R370
R321
C424
10NF
C415
100PF
51
L502
L303
150nH
NC
C472
NC
C351
C442
8.2NF
100NF
C359
6
COUP
GND1
2
GND2
5
1
IN
3
OUT
4
TER
5.6nH
L317
F308
10NF
C432
C381
10NF
R308
0
3
G
G
4
6
G
IN
2
OUT
5
F309
1
G
GND2
IN
2
OUT
3
C302
100NF
F312
GND1
1
4
NC
C471
R333
3.3K
C455
2PF
C446
NC
R380
L326
12nH
10
27ohm
R303
15PF
C350
C385
100PF
G1
2
4
G2
G3
5
6
G4
1
IN
OUT
3
R367
0
F301
OSC302
2
GND
3
OUT
VC
1
VCC
4
10
R306
C416
2PF
C342
L301
22nH
100NF
C441
100PF
C348
100NF
10PF
C397
4.7NF
C317
C434
C344
100PF
AN301
-
NC
R396
R335
51
27ohm
R394
1NF
C341
10NF
C313
C356
220nF
100K
R307
10
R361
C407
8.2PF
10
R347
IN
5
OUT
10PF
C328
F304
1
G G
3 4
G G
6
2
C468
1UF
100PF
C398
8.2PF
C334
56PF
C304
1NF
C372
C426
NC
71
70
TX_QB
VCC
30
C380
10UF
6.3V
7
TCXO
TXGND
61
TXIF_GND
73
TXIF_VCC
67
TXVCC
60
TX_I
69
68
TX_IB
72
TX_I/Q_REF
TX_Q
12
11
RXIB
27
RXIF_GND1
RXIF_GND2
14
RXIF_VCC1
26
13
RXIF_VCC2
RXQ
10
9
RXQB
77
74
PLL2_IN
PLL2_VCC
75
78
PON_LD
80
PON_RX
PON_TX
79
QUAD
18
19
RSSI
RXI
62
PCS_IF_FLITER_2
43
PCS_IN
49
PCS_LO_AMP_IN
55
PLL1FLSW
PLL1GND
56
51
PLL1VCC
53
PLL1_CP
76
PLL2_CP
PLL2_GND
35
MIX2INB
37
MIX2OUT
MIX2VCC
36
MIXOUTB
40
MOSGND
4
MOS_VCC
6
57
PCSOUT
64
PCS_IF_FIL
TER_1
50
39
MIX1GND
MIX1GND
46
MIX1VCC
42
MIX1_INB
44
41
MIX1_OUT
MIX2GND
38
MIX2IN
34
33
GND
IOSGND
8
5
LD
23
LIM1OUT
25
LIM1/AGCIN
21
LIM2IN
LIMOUT
20
47
LOAMP_GND
LO_AMP_VCC
1
EN
15
FEEDBACK
31
FIL
TER1-A
FIL
TER1-B
32
FIL
TER2-A
28
29
FIL
TER2-B
FM_AUDIO
16
66
GCA_CONT
65
CELL_IF_FIL
TER_2
63
CELL_LO_AMP_IN
48
CLK
2
CP1_GND
54
CP1_VCC
52
3
DATA
DRV_GND
58
17
AGC
BYP
ASS
22
BYP
ASS
24
45
CELIN
59
CELLOUT
CELL_IF_FIL
TER_1
100PF
C303
U304
100NF
C430
R360
100PF
C368
10
R363
L337
5.6nH
2.2K
R329
27ohm
15
R372
R309
270
NC
L341
100PF
C386
6.8PF
C408
C421
100PF
L305
150nH
0
R374
R359
56K
R375
470K
82
R376
R356
10
L330
3.3nH
VCTCXO_IN
V_IF_VCO
V_RF2
MOD_FET
RX_BA
T
V_RF1
LOCK_DET
PON_LD
VBAT
RX_Q
RX_QN
TX_I
TX_IN
TXDA_REF
TX_Q
TX_QN
TX_PWR
MOD_FET
V_RF3
VBAT
V_RF1
PLL_CLK
PLL_DATA
PLL_STRB1
RX_BAT
ALC_EN
RX_I
RX_IN
VRX
VRX
V_RF1
DEMOD
AFC_OUT
V_VCTCXO
TX_RFBAND
PA_CNT
V_RF2
V_DRV_PCS
V_RF3
RF_BAND
V_PA_BIAS_CELL
TX_BAT
ANALOG_DIG
V_LNA_CELL
V_LNA_PCS
V_DRV_CELL
V_RF1
V_DET
V_IF_VCO
MOD
V_DRV_CELL
V_DRV_PCS
V_RF1
AGC_OUT
RSSI
A_IF_IN
VRX
5. STH-N271 RF Circuit Diagram
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