SERVICE
TDMA MOBILE
TELEPHONE
STH-N375
Manual
TDMA MOBILE TELEPHONE
CONTENTS
1. Trouble Shooting
2. Electrical Parts List
3. Exploded Views and Parts List
4. Block Diagrams
5. PCB Diagrams
6. Circuit Description &
Circuit Diagrams
© Samsung Electronics Co.,Ltd. May. 2002
Printed in Korea.
Code No.: GH68-02790A
BASIC.
ELECTRONICS
SAMSUNG Proprietary-Contents may change without notice
1-1
1. STH-N375 Trouble Shooting
1. Baseband Section
1-1. Program No Running
N
Need to check
Q107, Q106
N
N
Need to check
U110, U111, U206
N
Need to replace
Memory(U202)
N
Need to check TCXO OSC302
& neighbor part
Press END
Key
Y
Y
Y
Y
Y
Y
ON_SW=H
VBAT>3.2V
VCTCXO_IN=14.4 MHz
Memory (U202)
control signal
OK?
VCC=3.0V
V_VCTCXO=3.0V
RESET=3.0V
IVCC=2.2V
GBOOT_DI=H
Program Running
VCC, ADD(0:21), DATA(0:15),
FLASH_CS, SRAM_CS, UBE,
MEMOEB, MEMWEB
N
ON_SW=H
Need to check
Key Mat
Need to check
Battery
N
N
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1-2
STH-N375 Trouble Shooting
1-2. Abnormal LCD Module, Vibrator & Speaker Operation
Y
N
Need to check
CN202-1
Need to check
U312 & neighbor part
N
Need to check
R125, 126
Y
Y
LCD Control
Signal OK?
Y
Y
BACKLIGHT=H
Y
VCC, ADD(2), DATA(0:7),
DISPLAY_CS, RESET
LCD Display Running
Send Command Back Light enable
Y
N
Need to check
R216 & U205
Y
LCD Display Running
Back lingt Running
Send Command Vibrator enable
Need to check
Q109, R130, R162, R163, R164
START
Y
Y
N
Need to check
U101_77,79
Y
LCD Display Running
Back lingt Running
Vibrator Running
Send Command Main Audio Receiver Path ON
Send Command Audio tone generator ON
1
VIBRATOR=H
Vibrator Run
OK?
SPK+,SPK- Signal
OK?
LED Back light
OK?
Y
N
Replace U101
Good
Speaker Output
OK?
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1-3
STH-N375 Trouble Shooting
1-3. Abnormal Buzzer operation
N
Need to check
Q207, D201, U101
START
Y
Y
Send Command Ringer Path ON
Send Command tone generator ON
N
Replace AU201
Y
Y
Buzzer Sound Output
OK?
RINGER(U101_1)
Signal OK?
Buzzer Operation
Good
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1-4
STH-N375 Trouble Shooting
1-4. Abnormal external Ear_Mic Jack operation
START
Y
Y
Hock Up Ear_Mic Phone in the Jack(CN101)
Send Command MIC_BIAS_EN enable
Send Command AMP_EN enable
N
Need to check U106
neighbor parts
Y
HS_SENSE=H
N
Need to check U106
neighbor parts
Y
Y
SEND_END=H
Press Button on the Ear-Jack
Ear_Mic phone
Operation Good
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1-5
STH-N375 Trouble Shooting
2. RF Section
2-1. Call processing and Online Test
N
DONE
START
Y
Y
Normal SVC?
Check RX path
N
Y
Set up Call
OK?
Check TX path
N
Y
Measure
SINAD/BER
Good?
Check RX path
N
Y
Check TX path
Measure
Tx Power
Good?
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1-6
STH-N375 Trouble Shooting
2-2. Receiver Section (Offline test)
1
Y
Y
N
Need to check
U105, Q102
Y
N
Need to check
U306, C349
F303_2=-52dBm
N
Need to check
F302 & neighbor parts
Y
RF_BAND=L, RX_BAT=H
PLL_ON=H, PON_LC=H
VCTCXO_PC=H, IF_ON=H
PON_VRF3=H
set up 8920B basestation for RX test
Set Base station RX Lev=-50 dBm
Send Command Cell band selection
Send Command RX path ON
Send Command channel selecton
START
N
Y
V_LNA_CELL=H
U105_1=H
Q102_3=H
Need to check
U300 & neighbor parts
2
U301_45=-39.5dBm
N
Need to check
C324, F303
F303_3, U300_8
=-55dBm
F302_2=-36.0dBm
Y
SAMSUNG Proprietary-Contents may change without notice
1-7
STH-N375 Trouble Shooting
2
N
N
AMPS
TDMA
N
Replace U301
Replace
F301
Need to check
OSC301, neighbor parts
& U301_1,2,3
Need to check
U105 & neighbor parts
N
Y
Y
Y
Y
Y
RF local check
U301_48 Lev=-6dBm
Freq=adjusted freq?
1
U301_41 Lev=-24.5dBm
Freq=130.05MHz
U301_34 Lev=-28.0dBm
Freq=130.05MHz
Need to check
U301, L301, C304, C306, R301
Y
Replace F300 or
Need to check R302, R303, C303
U301_25 Lev=-18.0dBm
Freq=450kHz
MODE
U301_40, 42=3.0V
4
3
N
U301_37 Lev=-13.0dBm
Freq=450kHz
N
SAMSUNG Proprietary-Contents may change without notice
1-8
STH-N375 Trouble Shooting
N
Replace U301
Case TDMA mode:
setup basestation for RX test
Amplitude:-50dBm
3
U301_9, 10, 11, 12
measure I/Q
Quarature wave
N
Need to check U301 &
Quad LC Tank circuit
(L303, C315, C316,
C317, R307)
PON_LD=H
Case AMPS mode:
setup basestation for RX test
Audio Freq gen : 1004Hz
FM deviation : 2.9kHz
4
Y
Y
Y
U301_16 DEMOD
(sinusoidal wave)
Vp-p=240mV
Freq=1004Hz
N
Need to check U301 &
R326, R320, C352, C127
U101_52 DEMOD
(sinusoidal wave)
MAX Vp-p=1.4V
Freq=1004Hz
N
Replace U203
Y
U101_40 BBCLK=
6.2208MHz or 4.096NHz or
5.12MHz
N
Replace U203
Y
U101_32RX_CLK=
BBCLK/2 or
BBCLK/8
N
Replace U203
Y
U101_31 RX_SYNC=
BBCLK/32 or
BBCLK/128
N
Replace U203
Y
U101_31 RX_DATA=
serial data
DONE
SAMSUNG Proprietary-Contents may change without notice
1-9
STH-N375 Trouble Shooting
2-3.Transmitter Section (Offline test)
N
Replace U203
N
Replace U203
N
Replace U203
N
Replace U203
Y
Y
Y
U101_40 BBCLK=
6.2208MHz or 4.096MHz or
5.12MHz
Y
U101_34 TX_CLK=
BBCLK/32 or BBCLK/8
Y
U101_33 TX_SYNC=
BBCLK/512 or BBCLK/128
Y
U101_33 TX_DATA=
serial data
RF_BAND=L, TX_BAT=H
PLL_ON=H, VCYCXO_PC=H
IF_ON=H, PON_TX=H
PON_VRF3=H
setup 8920B as basestaion for
TX test audio signal?
Send command cell band selection
Send command TX path ON
Send Command channel selection
START
AMPS
TDMA
2
1
MODE
SAMSUNG Proprietary-Contents may change without notice
1-10
STH-N375 Trouble Shooting
1
3
Replace U101
Y
Y
Need to check
V_RF2=3.0V or
Replace U301
2
Y
U301_59(RF OUT)
Fc=Local_freq + 175.05
U101_61, 60, 58, 57
TX I/Q Quarature signal
AC Lev Vp_p=0.4V
DC bias Lev=1.5V
U101_63 MOD
(sinusoidal wave)
MAX Vp-p=1.4V
Freq=1004Hz
OSC303_1
(FM modulation out)
Freq=175.05MHz
Audio Freq=1004Hz
Need to check
OSC303,
V_IF_VCO=3.0V
N
N
N
N
Y
Need to check
U301_66 or
Replace U304
U301_59(RF OUT)
measure Level
Send command PA_CNT
Level is adjustable?
N
Y
Replace F306
U301_59(RF OUT)
Fc=Local_freq + 175.05
N
Y
SAMSUNG Proprietary-Contents may change without notice
1-11
STH-N375 Trouble Shooting
3
Y
Need to check
V_DRV_CELL=3.0V, U112 or
Replace U305
U305 Gain
around 27dB
N
Y
Replace F305
F305 Insertion loss
around 3dB
N
Y
Need to check
V_PA_BAIS_CELL(U302_5,6,7)=3.0V
VBATT(U302_14,15,16)=3.2~4V
or Replace U302
U302 Gain
around 30dB
N
Y
Need to check
F304 & neighbor parts
F304_1 around same power
with U302 output
N
Y
Need to check
F304 & neighbor parts
F303 insertion loss
under 3dB
N
DONE
SAMSUNG Proprietary-Contents may change without notice
3-1
3. STH-N375 Exploded View and its Parts List
1. Cellular phone Exploded View
1
3
4
5
7
6
8
9
11
13
13
15
12
10
2
4-1
SAMSUNG Proprietary-Contents may change without notice
3-2
STH-N375 Exploded view and its Part List
FRONT COVER
SPEAKER
KEY PAD
MAIN PBA
LCD
MIC HOLDER
MIC
SHIELD COVER
VIBRATOR
COVER CONNECT
ANTENNA
REAR COVER
SCREW DUMMY
SCREW (M1.7 x L3.5)
RF JACK COVER
BATTERY
2. Cellular phone Parts List
1
2
3
4
4-1
5
6
7
8
9
10
11
12
13
14
15
Description
Remark
SEC CODE
Silver
Location
No.
900mAh
GH75-01724A
3001-001210
GH75-01826A
GH82-00107A
GH07-00143A
GH73-01024A
GH59-00376A
GH75-01895A
GH31-00019A
GH73-01026A
GH42-00141G
GH72-03845A
GH73-01130A
6001-001319
GH73-01027A
GH43-00490A
STH-N375 Exploded view and its Part List
SAMSUNG Proprietary-Contents may change without notice
3-3
3. Test Jig
(GH80-00614A)
4. TC
(GH44-00145G) 110V
Mexico, Colombia, Brazil
Serial Cable
Power Supply Cable
5. RF Test Cable
(GH39-00090A)
6. Test Cable
(GH39-00092A)
SAMSUNG Proprietary-Contents may change without notice
4-1
4. STH-N375 Block Diagrams
1. Base Band Part Block Diagram
.
MO
D
PL
L
S
y
nt
hes
iz
er
Po
w
e
r
M
ana
gemen
t
PR
EA
MP_
G
Au
x
AD
DR
DA
TA
CNTL
EXT
ME
MO
R
Y
(U
20
6)
KEY
PAD
OS
C
3
01
TCXO
(1
4.
4M
H
z
)
EXT
SYST
EM
RF IF
AG
C_
OUX
RX_
I
RX_
IX
RX_
Q
RX_
Q
X
DEM
O
D
A_
IF
_
I
R
SSI
MO
D
TX
_
I
TX
_
IX
TX
_
Q
TX
_
Q
X
TX
_
P
W
R
PA_
CNT
AF
C
_
OUX
AU
DIO I
F
RE
C2O+
RE
C2O-
MI
C
+
MI
C
-
RA
UX
O
XA
UX
PA_GAT
E
AL
C_EN
RX
_
B
AT
TX
_
B
AT
PLL
_
CLX
PLL
_
D
A
T
A
PLL
_
S
T
R
B
PR
EAM
P
_
G
Digi
tal
Signa
lX
BB
C
L
K
RX_
CLK
RX_
DA
T
A
RX_
S
Y
N
C
TX
_
C
LK
TX
_
D
AT
A
TX
_
S
Y
N
C
RS
T
WBDRX
WBDT
X
SI2
SO
2
SC
K
2
BEC
IF
PAR
T
EX
T
AU
D
IO A
M
P
(U
1
02)
DISP
L
A
Y
GP
IO
s
TC
XO
_I
N
UA
R
T
AUX
rx
SAMSUNG Proprietary-Contents may change without notice
4-2
STH-N375 Block diagrams
2. Radio Part Block Diagram
RS
S
I
AGC
OUT
MO
D
D
520
4-22
/
D5
20
5
(U101
/
U2
03
)
PR
E
A
M
P
_G
AF
C
Rx
I
/Q
3
wir
e
B
us
DE
M
O
Gain
C
ont.
R
SSI
PL
L2
x9
PL
L1
BP
F
130.05
1/
32
BP
F
450k
LC
LC
BP
F
450k
LC
D
836MH
IL
=
3.0T
yp
3
.6
M
ax
SL
C-
S090S-A(
F
304)
IL
=0.25T
yp,
0.
5M
ax
C
P
L
=
15.5dB
Rx
869-
894 Tx
824-
849
D
F
Y0836H0881F
(F
303)
T
x
I
L
=2.6T
yp,
2
.8M
ax
A
tt.
at
T
x
=
56M
in,
58T
yp
IS
O
at
T
x
=
60M
in
R
x
I
L
=3.3T
yp,
4
.0M
ax
A
tt.
at
R
x
=
50M
in,
52T
yp
IS
O
at
R
x
=
53M
in
Im
age
re
jection
at
F
tx
-
45M
Hz
=
8M
in
LN
A
BP
F
824-
849
BP
F
869-
894
D
881L
H(
F
302)
IL=
3
.0
T
y
p
3
.5
M
ax
M
at
su
shit
a
:
ENF
VZ
4J39(OSC301)
Fr
eq.
ra
nge:
998~1025M
Hz,
2059~2121M
H
z
Vcont
:
0
.4
~
2.
2
PN
:
-114dBc@45kHz
(C
ell)
-102dBc@45kHz
(
PC
S)
Z
L
:
50
ohm
Pout
:
-3
+/-
3dB
m
(i
n
both
band)
C
u
rr
ent
cons
umption
:
8m
A
Mats
u
sh
it
a:
EN
F
VZ
5J41(
OSC303)
Fr
eq.
ra
nge:
170.
05M
Hz,
210.
09M
Hz
Vcont
:
0
.4
~
2.
2,
Switch
oper
at
io
n
PN
:
-102dB
c@60kHz
(C
ell)
-
102dB
c@60kHz
(P
C
S
)
Har
monics
:
-
10dB
c
max
Pout
:
-3
+/-
3dB
m
(i
n
both
band)
C
u
rr
ent
cons
umption
: 5m
A
RF
MD:
R
F
2162(
U302)
L
inear
G
ai
n
=
30T
yp,
28M
in
Po
(A
M
P
S
)
=
31.5T
yp,
30M
in
Po
(T
DM
A)
=
30T
yp,
29M
in
PAE
=
50(
analog)
,
35(
digital)
AC
PR
@30kHz
=
29T
yp,
28M
in
@60kHz
=
49T
yp,
48M
in
@90kHz
=
56T
yp,
55M
in
Nois
e
P
WR
=
-
90dB
m(
30kH
z
B
W
)
2nd
Harmoni
c
=
-30T
yp,
-
29M
in
3r
d
H
ar
m
onic
=
-40T
yp,
-
39M
in
Id
le
cur
rent
(mA)
=
135T
yp,
200M
ax
T
OKO:
S
F
130JS-
002(
F
301)
IL
=
3
.4T
yp,
4
.5M
ax
GD
(u
s)
=
1
.5T
yp,
8
M
ax
IS
O
at
60k
=
22T
yp,
12M
in
IS
O
at
120k
=
45T
yp,
35M
in
IS
O
at
240k
=
55T
yp,
50M
in
IS
O
at
480k
=
55T
yp,
50M
in
IS
O
at
Image
900k
=
75T
yp,
6
6
M
in
Z
L
=
500ohm//-
2.1pF
CF
UXC450B100H(
F
300)
IL
=
4
.5T
yp,
6
.0M
ax
GD
(u
s)
=
5T
yp,
15M
ax
Z
in/out
=
2k
VC
-
TC
X
O
14.4M
Hz
T
oyoc
om
:
T
C
O-
9133(
OSC302)
C
u
rr
ent
dr
ain
=
1.5mA
M
ax
Output
leve
l
=
0.8Vpp
min
L
o
ad
=
10kOhm//10pF
PN(
dB
c)
=
-
130@100Hz,
-
152@45kHz
129.6M
Hz
999.09~1024.
02M
Hz
2060.1~2120.
04M
Hz
450kH
z
BP
F
824-
849
RF
2376(
U
305)
G(
dB
)
=
24<27<30@
836M
Hz
C
u
rr
ent(
m
A
)
=
30T
yp
AC
P
L
eakage(
dBc)
=
-33@8dB
m
P
out,
30kHz
o
ff
se
t
-61@8dB
m
P
out,
60kHz
o
ff
se
t
NF
(d
B)
=
7
M
ax
Quad
Tx
I
/Q
DC
re
f
u
P
C
801
5
(U
304)
RF
MD:
RF
2363
G
(d
B)
=
1
8
T
y
p
NF(
dB
)
=
1.3T
yp,
1
.6M
ax
I
IP
3(
dB
m)
=
5
T
y
p
Step
AGC
=
26M
in,
38M
ax
C
ur
re
nt(mA)
=
5
T
y
p
Mixer1
(N
EC:
u
P
C
8015)
G
(d
B
)
=
5
M
in,
6.8T
yp,
9M
ax
NF(
dB
,
DSB)
=
12T
yp,
14M
ax
I
IP
3(
dB
m)
=
7
.8T
yp,
5
.5M
in
C
ur
rent(
mA)
=
17.6T
yp
Mixer2
(N
EC:
u
P
C8015)
G
(d
B
)
=
13.5M
in,
15.5T
yp,
18M
ax
NF(
dB
,
DSB
)
=
11.2T
yp,
13M
ax
I
IP3(
dB
m)
=
-
19.3T
yp,
-
21M
in
Cu
rr
en
t(m
A
)
=
3
T
y
p
AGC+
I/Q
De
m
od
(N
EC:
u
P
C8015)
VG(
dB
)
=
75M
in,
80T
yp,
85M
ax
N
F
(dB
,
D
S
B
)
=
10T
yp,
13M
ax
I
IP3(
dB
m)
=
-
85T
yp,
-
92M
in
AGC
R
ange
=
77M
in,
84T
yp
C
urr
ent(mA)
=
3T
yp
L
im
it
er
Dis
crim
inat
or
(NEC:
u
P
C8015)
Sens
a
t
12dB
S
INAD
(U
si
ng
dis
cr
ete
450kH
z
B
P
F)
=
7
5
M
in
,8
0
T
y
p
,8
5
M
ax
I
IP
3(
dB
m)
=
-
68.5T
yp,
-
70M
in
F
ilter
r
ejection
at
60kHz
=
10T
yp,
7
M
in
F
ilter
r
ejection
at
120kHz
=
15T
yp,
10M
in
F
ilter
r
ejection
at
330kHz
=
25T
yp,
20M
in
F
ilter
r
ejection
at
660kHz
=
35T
yp,
30M
in
C
ur
rent(
mA)
=
2
.8T
yp
RF
Out
(
NEC:
u
P
C8015)
)
Po
=
-10T
yp,
-
12M
in
AC
P
R
@30kHz
=
32T
yp,
30M
in
@60kHz
=
60T
yp,
58M
in
@90kHz
=
60T
yp,
58M
in
Nois
e
in
R
x
band@30kHz
=
-95dB
mT
yp,
-93M
in
Spur
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-FI
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Am
p(
NEC:
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and
Dynamic
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ange
(
dB
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=
6
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in
,6
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p
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ax
Gain
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ope
(
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=
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y
p
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ax
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ange
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ax
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ope
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=
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ax
D
836MH(
F
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IL
=
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D836MH(
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yp
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ax
SAMSUNG Proprietary-Contents may change without notice
5-1
5. STH-N375 PCB Diagrams
1. Main PCB Top Diagram
AU201
C104
C107
C109
C111
C130
C133
C134
C135
C136
C137
C138
C139
C140
C141
C142
C143
C145
C146
C147
C149
C151
C156
C170
C180
C183
C185
C186
C201
C203
C214
C221
C222
C229
C233
D201
D202
D203
D204
D205
D206
D207
D208
D209
D210
D211
D212
D213
G1
G2
G3
G4
G5
G6
G7
G8
L101
L102
L104
L105
MIC101
P201
P202
P203
P204
P205
P206
Q105
Q106
Q107
Q108
Q203
Q204 Q206
R102
R107
R111
R116
R121
R124
R128
R130
R132
R135
R143
R144
R145
R146
R147
R148
R149
R150
R151
R152
R153
R162
R163
R164
R208
R210
R215
R216
R219
R236
R240 R241
R244
R246
R247
R249
R250
R251
R252
R253
R254
RV204
S202
S203
S204
S205
S206
S207
S208
S209
S210
S211
S212
S213
S214
S215
S216
S217
S218
SPK101
SW201
U201
U205
U312
ZD202
ZD204
ZD205
ZD207
ZD208
ZD211
SAMSUNG Proprietary-Contents may change without notice
5-2
2. Main PCB Bottom Diagram
STH-N375 PCB diagrams
ANT301
BT201
C101
C102 C103
C105
C106
C108
C110
C112
C115
C116
C117
C118
C119
C120
C121
C122
C124
C125
C126
C127
C129
C131
C148
C152
C155
C157
C158
C159
C160
C161
C162
C163
C164
C165
C166
C167
C168
C169
C171
C172
C173
C174
C175
C176
C177
C178
C179
C181
C182
C184
C187
C188
C190
C191
C202
C205
C206
C207
C208
C209
C210
C211
C212
C213
C215
C216
C220
C223
C230
C234
C300
C301
C302
C303
C304
C305
C306
C307
C308
C309
C310
C311
C312
C313
C314
C315
C316
C317
C318
C319
C320
C321
C322
C323
C324
C325
C326
C327
C328
C329
C330
C331
C332
C333
C334
C335
C336
C337
C338
C339
C340
C341
C342
C343
C344
C345
C346
C347
C348
C349
C350
C351
C352
C353
C354
C355
C356
C357
C358
C359
C360
C361
C362
C363
C364
C365
C366
C367
C368
C369
C370
C371
C372
C373
C374
C375
C376
C377
C378
C379
C380
C381
C382
C383
C384
C385
C386
C387
C388
C389
C390
C391
C392
C393
C394
C395
C396
C397
C398
C399
C400
C401
C402
C403
C404
C405
C406
C407
C408
C409
C410
C411
C412
C413
C414
C415
C416
C417
C418
C419
C420
C421
C422
C423
C424
C425
C426
C427
C428
C429
C430
C431
CN101
CN201
CN202
D301
F300
F301
F302
F303
F304
F305
F306
L300
L301
L302
L303
L304
L305
L306
L307
L308
L309
L310
L311
L312
L313
L314
L315
L316
L317
L318
L319
L320
L321
L322
L323
L324
L325
L326
L327
OSC301
OSC302
OSC303
Q101
Q102
Q104
Q109
Q202
Q207
Q208
R101
R103
R104
R106
R108
R109
R110
R112
R113
R114
R115
R117
R118
R119
R120
R122
R123
R125
R126
R129
R131
R133
R134
R136
R137
R138
R139
R140
R141
R142
R154
R155
R156
R157
R158
R159
R160
R201
R202
R204
R205
R206
R207
R209
R211
R212
R213
R214
R217
R218
R221
R223
R224
R225
R233
R237
R238
R239
R242
R245
R248
R255
R256
R300
R301
R302
R303
R304
R305
R306
R307
R308
R309
R310
R311
R312
R313
R314
R315
R316
R317
R318
R319
R320
R321
R322
R323
R324
R325
R326
R327
R328
R329
R330
R331
R332
R333
R334
R335
R336
R337
R338
R339
R340
R341
R342
R343
R344
R345
R346
R347
R348
R349
R350
R351
R352
R353
R354
R355
R356
R357
R358
R359
R360
R361
R362
R363
R364
R365
R366
R367
R368
R369
R370
R371
R372
R373
R374
R375
R376
RV202
RV203
TH101
U101
U102
U105
U106
U107
U108
U110
U111
U112
U202
U203
U206
U300
U301
U302
U303
U304
U305
U306
Y201
ZD101
ZD201
ZD203
ZD206
ZD209
ZD210
SAMSUNG Proprietary-Contents may change without notice
6-1
6. STH-N375 Circuit Description & Circuit Diagrams
STH-N375/N371 provides the AMPS and the Digital TDMA (cellular band only) of compliance with
TIA/EIA/IS-136. The radio operation of the STH-N375N371 has been implemented with the receiver, the
transmitter, and the local oscillator controlled by the PLL. The circuit of the STH-N375/N371 is described as
followings.
1. Baseband Section
1-1. Power Supply
For the POWER ON, with the battery installed on the telephone and by pressing the END key, the BATT
and ON_SW signals will be connected, which it will turn on Q107. In addition, Q106 is turned on by Q107,
and thus the BATT is connected to VBAT. Consequently, VBAT is supplied to input of regulators U107,
U110 and U111. The regulator U110 supplies all powers of baseband part (VCC, AVCC, V_VCTCXO). The
regulator U111 supplies IVCC (2.2 V) to Baseband Engine Chip (U203: BEC). The regulator U107 supplies
VAUX (3.3V output power) to LED for back-light of U312. After the BEC (U203) is supplied power from
VCC, IVCC. The BEC use 14.4MHz as reference clock, 14.4MHz comes out from TCXO (OSC302). If the
powers (VCC,AVCC, V_VCTCXO) and reference clock are normal, the main application program will start
to run. In addition, the BEC starts to run and outputs OWER_HOLD signal (low active), which is
connected to Q105. Moreover, Q105, Q106 and Q107 are turned on in order. In consequence, BATT is
connected to VBAT continuously although END key is released (ON_SW disconnected BATT). The powers
from U110 and U111 are used in all baseband part of BEC, IFC (Interface Chip U101).
For the POWER OFF, in this case main application program is running already. The main application
program check all GPIO inputs periodically. The END key is pressed during program run, the BATT and
ON_SW signals will be connected. This turns on Q108. Therefore, ON_SW_SENSE that is connected to
GPIO_0_5 (U203_ C13) turned logic high to low. The BEC checks this signal, main application program
enter to POWER OFF mode.
1-2. BEC (U203) interface
BEC (U203) mainly consist of two parts HOST CPU and Baseband Engine (Figure2~1). This is the most
important component of dual-mode (US-TDMA and AMPS mode) cellular telephone. It has IKx32bits of
internal ROM and 2Kx32bits of internal RAM. This chip communicates with a lot of peripheral device,
memory (SRAM, ROM), Key-Matrix and display module. The BEC receives TCXO clock signals (reference
clock) from the TCXO and controls the telephone during the operation. The BEC communicates with the
IFC through several serial links. These include CODEC, wideband data, receiver data, transmitter data,
and auxiliary data interface. A master baseband clock (BBCLK: U203_H2) at either 6.2208 MHz or 5.12
MHz or 4.096 MHz, depending on the operating mode, from the BEC drives the IFC. The major
components are as follows:
Separate address and data buses provide a data path to external memory and memory-mapped
peripherals. The 22-bit address bus provides a byte addressing range up to 8 MB in each of 4 spaces
decoded by the 4 select signals. The 16-bit data bus in conjunction with the UBE signal allows word or byte
transfers. Table2-1 shows the ARM memory map. An Intel 28F3204 Stacked Memory chip supplies 4M
Bytes of Flash memory and 512K Bytes of SRAM. Note that in the telephone, the SRAM is located at the
CS_RES1 block of memory.
SAMSUNG Proprietary-Contents may change without notice
6-2
STH-N375
Circuit Description & Circuit Diagrams
Figure1. BEC interface and block diagram
SAMSUNG Proprietary-Contents may change without notice
6-3
STH-N375
Circuit Description & Circuit Diagrams
Table1. ARM Memory Map
ARM Memory Map
ARM Address Range
Data
Block Size Bytes
D5206_LIB Name
APP_PIN Name
Remarks
0000 0000 0000 0003
32
4 Byte
Internal ROM
-
R
0000 0004 0000 1FFF
32
8K Byte
Internal RAM
-
R/W
0002 0000 0002 0FFF
32
4K Byte
Internal ROM
-
R
0004 0000 0005 FFFF
32/16
NA
Internal Peripherals
-
R/W
0080 0000 00FF FFFF
8/16
Up to 8 M Byte
FLASH_CS
FLASH_CS
R/W
0100 0000 017F FFFF
8/16
Up to 8 M Byte
SRAM_CS
R/W
0180 0000 01FF FFFF
8/16
Up to 8 M Byte
CS_RES1
SRAM_CS
R/W
0200 0000 027F FFFF
8/16
Up to 8 M Byte
CS_RES2
DISPLAY_CS
R/W
HOST CPU (inside of BEC:U203)
ARM7TDM1 32-bit microprocessor is used for the main call processing. The CPU controls all the circuitry.
The reference clock 14.4 MHz, coming from the output of the TCXO (OSC302), is connected to
VCTCXO_IN (pin F3). For the sleep mode, additional crystal oscillator (Y201) of 32.768kHz is connected to
pin B2 of the BEC. The interface circuitry consists of reset circuit, address bus (A0-A21), data bus (AD0-
AD15), control signals (MEMWEB, MEMOEB, SRAM_CS, FLASH CS, DISPLAY_CS, UBE etc), GPIOs, and
the communication ports. The communication ports includes UARTI, UART2, JTAG, and SCI. The UARTI
supports HP equipment interface, down loading, and data service. The UART2 and the JTAG are used for
the software debugging. The SCI ports support the diagnostic monitor (DM) function.
FLASH ROM (inside of U202)
The 16Mbits FLASH ROM is used to store code of the application program. Using the down-loader
program, this application program can be changed even after the mobile is fully assembled.
SRAM (inside of U202)
The 4Mbits SRAM is used to store the internal flag information, call processing data, and timer data.
Key-Matrix
The Key-Matrix is consisted of 8 x 3 matrix, which use GPIO input signal SCAN0-7 and GPIO output
signal KEY0-2 of BEC.
LCD MODULE
LCD module is connected to main board directly. This contains 4-LEDs they are used as backlight. The
LCD controllers control the information of displaying from the BEC (parallel 8-bit data) to the LCD.
BASEBAND ENGIN (inside of U203)
This part mainly interfaces with IFC (U101) and RF part. As for interface of IFC, that will be explained
detail in next section. As important signals are PREAMP_G for receiver path, PAGATE, ALC_EN for
transmitter path, PLL DATA, PLL CLK, PLL STRBl for PLL synthesizer, RX BAT, TX BAT for power
management.
SAMSUNG Proprietary-Contents may change without notice
6-4
STH-N375
Circuit Description & Circuit Diagrams
1-3. IF INTERFACE CHIP (IFC: U101)
The IFC provides the radio IF and audio interfaces (Figure2-2). Differential Rx l/Q and Tx l/Q signal pairs
interface directly with the RF interface chip (RFIC: U301) device. MOD, AFC, AGC, RSSI, and PA CNT
signals also directly control the radio circuitry. Three audio paths are implemented. The primary path
utilizes the microphone and speaker, located on the main board. Both microphone and speaker utilize the
main differential circuits in the IFC to minimize noise pickup. The speaker output is amplified internally to
enable direct connection to the speaker. The second audio path connects to the headset jack. The headset
microphone and speaker are passed to the IFC’s auxiliary input and output, respectively. The headset jack
terminals indicate via the HEADSET SENSE line when the headset is present as well as when the headset
button is pushed via the SEND END line. The third audio path to the HFK shares the auxiliary output with
the headset for its speaker and uses the second auxiliary input for its microphone. Since the auxiliary
output is not internally amplified, an external audio amplifier is applied before connection to the headset
and HFK.
Figure 2. IFC interface and block diagram
SAMSUNG Proprietary-Contents may change without notice
6-5
STH-N375
Circuit Description & Circuit Diagrams
The IFC (Ul 01) is mainly consist of IF interface part and AUDIO CODEC part. The IF interface part, witch
is between RF part (mainly U301) and BEC, translate RF data to baseband data for BEC. Mainly, IF
interface part is consist of receiver, transmitter, and some kind of RF control. The IFC also provides several
A/D inputs to monitor system parameters. Battery voltage is periodically measured after scaling via a
resistor divider (BAT MON: U101_67). A thermistor located near the PA is monitored to obtain temperature
status by TMP MON (U101 66).
Receiver interface
The U101 receive differential 1/Q signals (RX_IN, RX_I, RX_QN, RX Q: U101 48,49,5O,51), or DEMOD
signal (U101_52) which come from RF demodulator (U301_11,12,9,10,16), and translate as digital data.
These data is synchronized by control signals (RX_SYNC, RX CLK, and BBCLK: U101 31,32,40) is
transported to BEC through RX DATA (pin U101_30). in addition, the U101 uses AGC_OUT (U101 72) for
dynamic range of receiver signal strength connected to U301_17, AFC_OUT (U101_71) for adjusting
reference frequency exactly connected to TXCO (OSC302 1).
Transmitter interface
The U101 receives TX DATAI (U101 36) synchronized by control signals (TX SYNC, TX_CLK: U101_33,34),
which come from BEC, and translate this data as differential l/Q signals (TX_IN, TX 1, TX_QN, TX Q:
U101_61,60,58,57), or MOD signal (U101_63). it transports these data to RF modulation part. In addition,
the U101 uses PA CNT (U101_73),TX PWR (U101 68) for controlling power of transmitter.
AUDIO CODEC
Three audio paths are implemented in IFC. The primary path utilizes the microphone (U101_11,12) and
speaker (U 101_77,79). Both microphone and speaker utilize the main differentiai circuits in the IFC to
minimize noise pickup. The speaker output is amplified internally to enable direct connection to the
speaker. The second audio path connects to the headset jack. The headset microphone and speaker are
passed to the IFC’s auxiliary input (U101_5) and output (U101_2), respectively. The headset jack terminals
indicate via the HS_SENSE (U106-2_7) to GPIO of BEC (U203_C11) when the headset is present. As well as
when the headset button is pushed via the SEND END (U106-1_1) to GPIO of BEC (U203 A13). The third
audio path to the HFK shares the auxiliary output with the headset for its speaker and uses the second
auxiliary input for its microphone. Since the auxiliary output is not internally amplified, an external audio
amplifier (U102) is applied before connection to the headset and HFK.
SAMSUNG Proprietary-Contents may change without notice
6-6
STH-N375
Circuit Description & Circuit Diagrams
2. RF Section
2-1.Introduction
For playing essential role in the radio part, STH-N375 N371 includes many active components. They are
U300 (LNA), U302 (Cellular band power amplifier), U301 (transceiver including up/down converter, RF
and IF PLLs, Rx and Tx AGCs, IQ modulator and demodulator, limiter, and discriminator), OSC301 (RF
VCO), and OSC303 (TXIF VCO). in order to obtain good RX selectivity and sensitivity simultaneously,
STH-N375 N371 has dual IF conversion system. The 1
st
IF and 2
nd
IF are 130.05 MHz and 450 kHz,
respectively.
2-2.Front-End part
RF signal from the air interface passes U306 (RF test switch) and F303 (duplexer). The purpose of U306 is
to couple the RF signal and test on the conduction line. F303 plays the role of Rx and Tx filtering and the
isolation between Rx and Tx in the cellular band (AMPS and Digital TDMA).
2-3.Reeeiver
The Rx signal from F306 goes into U300. U300 amplifies the very weak Rx signal with adding the
negligible thermal noise. U300 features 20dB gain, 1.3 dB NF, and 7mA current consumption. For the wider
dynamic Rx AGC (automatic gain controller) range, the gain of U300 is controlled by PREAMP_G signal
coming from U203, resulting in around 30-dB step gain change. By checking the RSSI through U101_69,
U203 decides to whether turn on U300 or not. The amplified signal goes into F302 (RF SAW filter) in order
to suppress the unwanted band data.
The signal coming out from F302 inflows to the pin 45 (I
st
Rx mixer input) of U301, and it is
downconverted to the IF of 130.05 MHz. This 1
st
mixer has around 7dB conversion gain, 6dB NF, and 5dBm
IIP3. For the downconversion, the local frequency source from OSC301 (dual RF VCO) is used. For the
local frequency, the Rx frequency plus 1
st
IF (that is, high injection type local frequency) is used, and this
frequency is controlled by the RF PLL in U301 in conjunction with U203 (baseband IC)
The 1
st
mixer output is connected to F301 (130.05 MHz 1
st
IF SAW filter). The main role of F301 is
suppression of undesirable interferers. For the 2
nd
IF conversion, the output of F301 is connected to the 2nd
Rx mixer of U301. The 2
nd
mixer has the typical characteristics of 13.5 dB gain, 12 dB NF, and -20dBm IIP3.
The local frequency source for making 2
nd
downconversion is supplied from U301 internally by 9 times
multiplying the fundamental frequency of OSC302 (14.4MHz VC-TCXO). The downconverted signal
passes F300 (450 kHz Ceramic filter) in order to suppress the unwanted interferers and the image
frequency signals.
Until now, the Rx signal path is common for both of AMPS and Digital TDMA. From the filtered 450 kHz
signal output, AMPS path and TDMA path come to separate for proper treating of the Rx signal. To begin
with, AMPS path will be described.
SAMSUNG Proprietary-Contents may change without notice
6-7
STH-N375
Circuit Description & Circuit Diagrams
AMPS (Limiting and Discrimination)
The downconverted signal from the output of F300 enters to the limiter and discriminator of U301. For the
better suppression of the unwanted interferers, discrete LC filter is used in the limiter section. The signal
through the limiter goes into the discriminator (or quadrature detector) of U301 with incorporation of the
quadrature tank circuit (LC resonator) placed outside of U301, and thus the audio signal comes out from
the pin 16 of U301. This demodulated signal is connected to U101.
TDMA (Rx AGC and 1, Q Demodulator)
The downconverted signal from the output of F300 enters to the Rx AGC and 1, Q demodulator of U301.
The Rx AGC has the performance of 80-dB dynamic range, 10 dB NF, and -85dBm IIP3. In the process of 1,
Q demodulation, 450 kHz local signal, made by dividing 14.4 MHz reference clock, is used.
SAMSUNG Proprietary-Contents may change without notice
6-8
STH-N375
Circuit Description & Circuit Diagrams
2-5. Radio component control
U101 monitors the state of the radio part, and delivers the information to U203. Then, U203 sends the
proper control signals to radio relating regulators and AGCs. The radio interface signals are summarized in
the Table 2-2.
Table 2-2. Radio Interface Signals
Signal Name
Source/Destination
Function
PON_LD
BEC/RFIC
Limiter/Discriminator power control
TX_RFBAND
BEC/IF VCO
Tx band control (0=PCS, 1=Cell)
VCTCXO_IN
TCXO/BEC
14.4 MHz clock
VCTCXO_PC
BEC/TCXO
14.4 MHz clock power control
PLL_DATA
BEC/RFIC
PLL serial data
PLL_CLK
BEC/RFIC
PLL serial clock
PLL_STRB1
BEC/RFIC
PLL serial strobe
RF_BAND
BEC/Various
Cell/PCS band select (0=Cell, 1=PCS)
PREAMP_G
BEC/Regulator
Rx AGC Gain step
RX_BAT
BEC/RFIC & Various
Receiver power control
TX_BAT
BEC/RFIC & Various
Transmitter power control
ANALOG_DIG
BEC/Various
Band control (0=Analog, 1=Digital)
LOCK_DET
RFIC/BEC
PLL lock detect status
PLL_ON
BEC/Regulator
PLL power control(V_RF1:RFIC)
A_IF_IN
RFIC/IFC
IF comparator input
RX_Q, RX_QN
RFIC/IFC
Differential analog receive Q channel
RX_I, RX_IN
RFIC/IFC
Differential analog receive I channel
TX_Q, TX_QN
IFC/RFIC
Differential analog transmit Q channel
TX_I, TX_IN
IFC/RFIC
Differential analog transmit I channel
MOD
IFC/RFIC
Drive to modulator
TX_PWR
Detector/IFC
Tx power detector
RSSI
RFIC/IFC
Rx Signal Strength Indicator
AFC_OUT
IFC/VCTCXO
Auto Frequency Control voltage
AGC_OUT
IFC/RFIC
Auto Gain Control voltage
PA_CNT
IFC/RFIC
Power Amplifier control voltage
DEMOD
RFIC/IFC
Discriminator output
TXDA_REF
RFIC/IFC
Tx section common mode DC bias
PON_TX
BEC/Regulator
TX up converter power (V_RF2:RFIC)
PON_VRF3
BEC/Regulator
Local Amp power(V_RF3:RFIC)
SAMSUNG Proprietary-Contents may change without notice
6-9
NOTE: THE RESISTOR FOR OPT BEAD
N375_IFIC
C124
100NF
C190
100NF
R162
20
R115
560K,1%
SPK101
SPKHA-13
1
2
VOUT2
VOUT3
3
R142
10
7
CE1
CE2
6
5
CE3
GND
4
VDD
8
VOUT1
100PF
C126
U110
4
5
AVCC
1
2
3
R104
CN101
15K
100NF
C142
100NF
C115
L105
C146
C107
6.3V
10UF
C179
1UF
IVCC
100NF
Q105
DTA144EE/TR
2
3
1
VCC
27PF
C186
NC
R132
4
XAUSI2
6
XAUSO
C105
100NF
68
TX_PWR
57
TX_Q
TX_QN
58
TX_SYNC
33
37
VALID_STRB
43
WBORX
WBOTX
44
XAUXI-
5
TMP_MON
66
59
TXDA_REF
TX_BAT
38
34
TX_CLK
36
TX_DATA1
TX_DATA2
35
TX_I
60
TX_IN
61
RX_IN
RX_Q
48
49
RX_QN
31
RX_SYNC
22
SCLK
SEN
24
SI
23
SO
21
TIMER
17
RQTI_COMO
54
RSSI
69
41
RST
55
RT_COMO
RX_CLK
32
RX_DATA
30
RX_I
50
51
MOD_COMD
62
18
MSTR
73
PA_CNT
2
RAUXO-
REC20+
79
77
REC20-
RINGER
1
RITO_COMI
56
IREF
MCLK
19
20
MDAT
12
MICI+
MICI-
11
10
MICO
MIXI
9
MOD
63
MODE_STS
26
BIN
DEMOD
52
45
DGND1
DGND2
46
16
DVDD
D_IF_OUT
42
70
EXT_VREF
25
FSYNC
75
AVDD1
AVDD2
13
14
AVDD3
74
AVDD4
AVDD5
80
47
A_IF_IN
67
BAT_MON
BBCLK
40
39
AGND5
76
AUDCOMRD
3
8
AUDCOMTO
29
AUX_CLK
AUX_DATA
27
AUX_MON
65
28
AUX_STRB
53
U101
AFC_OUT
71
72
AGC_OUT
AGND1
64
AGND2
7
78
AGND3
AGND4
15
100NF
C117
R113
47K
C181
470PF
R139
10K
R111
57.6K,1%
C172
10UF
6.3V
6.3V
10UF
C163
NC
C135
10PF
C111
VBAT
C188
1NF
0
R164
20
7
GND
OUT
5
1
SHDN
VDD
6
R109
U102
+IN
3
4
-IN
BYP
2
GND
8
2
3
1
Q107
R112
680K
C119
100NF
U106-1
R125
1K
C130
100NF
20
47K
R140
R163
100NF
C118
100NF
C177
C133
NC
100K
R134
R126
C120
100NF
390K
C166
1UF
R159
6.3V
10UF
C167
15K
47K
4
GND
8
VDD
1
VOUT1
VOUT2
2
3
VOUT3
R106
U112
CE1
7
6
CE2
CE3
5
4
BYP
CONT
3
2
GND
VIN
1
VOUT
5
U111
C162
2.2UF
16V
10K
R129
C136
68PF
VBAT
C110
100NF
18K,1%
R120
C184
100PF
TH101
10PF
C187
100K
R155
Q104
SI1305DL
3 D
1G
2 S
VCC
R153
100K
C112
100NF
C152
R137
100NF
100K
R114
10K
R124
10K
VBAT
VBAT
C161
1UF
100NF
C191
C176
100NF
20
R130
R119
270K
R131
1NF
C138
100K
6.8NF
C139
C141
100NF
R133
10
R138
1.8K
R107
330K,1%
VCC
2
3
1
C121
27PF
Q101
U106-2
L104
NC
C185
82nH
R116
16V
2.2UF
C171
VIN
1
5
VOUT
100NF
C145
U107
LP2985AIM5-3.3
4
BYPASS
GND
2
ON/OFF
3
4.7NF
C127
100K
6.3V
10UF
C165
VBAT
R144
R135
10K
1UF
6.3V
C151
15PF
C175
C160
10UF
1UF
C149
C108
100NF
Q102
100NF
C170
C168
100NF
VCC
6.3V
2.2K
R103
C159
C158
10UF
6.3V
10UF
C131
36K
R122
22PF
R143
6.8K
C148
47PF
C134
68PF
220K
R154
R145
100K
12PF
C102
C173
10
R157
R110
6.3V
10UF
2.2UF
C178
0
VCC
VCC
16V
VBAT
330K
R118
10NF
AVCC
C125
C129
10K
100NF
NC
R101
R117
C103
L101
82nH
15K
R152
22K
U108
4
ADJ
3
EN
2
GND
1
IN
5
OUT
1UF
C122
2.2UF
C157
R102
1.8K
16V
100NF
V_VCTCXO
VCC
C104
100NF
C109
R147
27ohm
C174
100NF
NC
R158
16V
2.2UF
C155
7
CE1
CE2
6
5
CE3
GND
4
VDD
8
VOUT1
1
2
VOUT2
VOUT3
3
U105
330K
R141
C140
1UF
270K
R123
C156
VAUX
C137
6.3V
10UF
NC
C180
100NF
2.7K
R121
BSE
MIC101
2
1
100NF
C106
6.3V
C116
33UF
C183
1UF
100K
R150
100K
R148
82nH
L102
2
5
6
G
3
4
C169
10UF
6.3V
ESDA6V1W5
1
2
3
4
5
SI3443DV-T1
Q106
1
ZD101
C182
470PF
100K
R146
R160
10K
100NF
C143
100K
AVCC
R108
0
R136
100NF
C101
100K
R149
R151
1K
VCC
100K
R156
1K
C147
1UF
1
3
2
R128
VBAT
Q108
VBAT
C164
10UF
6.3V
XAUXI-
BACKLIGHT
PREAMP_G
HEADSET_SENSE
DATA(0:7)
DISPLAY_CS
MEMOEB
ADD(2)
MEMWEB
DATA(0)
DATA(1)
DATA(2)
DATA(3)
DATA(4)
DATA(5)
DATA(6)
DATA(7)
VAUX
AMP_AUDIO_OUT
MIC_BIAS_EN
XAUXI-
SI2
SCK
SEN
TXDA_REF
DEMOD
AUX_ON
WBDTX
V_DRV_CELL
V_LNA_CELL
VRX
PDM
V_PA_BIAS_CELL
PA_GATE
SEND_END
HS_SENSE
PA_CNT
RX_BAT
PLL_ON
PON_VRF3
V_RF3
V_RF1
VCTCXO_PC
V_VCTCXO
IF_ON
V_IF_VCO
TX_BAT
PON_TX
V_RF2
BATT
ON_SW
HP_PWR
POWER_HOLD
BAT_MON
ON_SW_SENSE
AMP_AUDIO_OUT
VALID_STRB
BIN
TX_BAT
IFIC_RESET
D_IF_OUT
A_IF_IN
RINGER
RX_I
RX_IN
RX_Q
RX_QN
TX_PWR
RSSI
MOD
TX_I
TX_Q
TX_QN
AFC_OUT
TX_AUDIO
XAUXI-
MIC+
RST
TMP_MON
MIC-
RX_AUDIO
HEADSET_SENSE
RX_AUDIO
HEADSET_SENSE
MIC-
MIC+
AMP_EN
RAUXO
REC20+
REC20-
AGC_OUT
RAUXO
REC20-
REC20+
TX_IN
STRB1
SCLK
DO
FSYNC
SO2
MODE_STS
RX_DATA
RX_SYNC
RX_CLK
AUX_CLK
AUX_STRB
AUX_DATA
BBCLK
TX_CLK
TX_SYNC
TX_DATA1
WBDRX
3. IFIC Circuit Diagram
STH-N375 Circuit diagrams
STH-N375 Circuit diagrams
SAMSUNG Proprietary-Contents may change without notice
6-10
NOTE: BOOT SHOULD BE PULLED LOW FOR CABLE DETECTION
1
6
ENTER
BOARD_HOLE
PWR_END
UP = 2
RIGHT = 1
LEFT = 4
COMMON = 3
*
#
CLR
7
5
2
SEND
NOTE: TDMA EVENT -SPARE TIMMING SIGNALS
DOWN = 5
JTAG
GREEN
NOTE: WAITING FOR REPLAY FROM SAMSUNG ABOUT C_F PIN
0
4
8
MENU
9
3
CENTER = 6
1
2
N375_BASE
RED
D202
3
100NF
C233
R236
ZD209
RB751S-40
100K
15PF
R223
C207
FC-255
Y201
22
22
R225
R256
0
S203
S208
S207
V/F1
18
27
V/F2
S204
RESERVED1
2
16
RI
RTS
20
RX_AUDIO
7
11
TX_AUDIO
VBATT1
21
22
VBATT2
28
VBATT3
GND3
12
19
GND4
25
GND5
HP_PWR
15
NC
6
NC
29
30
NC
1
RESERVED0
C/F1
9
C/F2
26
13
DP_RX_DATA
14
DP_TX_DATA
3
DSR
DTR
24
8
GND1
GND2
10
CN201
17
CD
CHG+
4
5
CHG+
CTS
23
VCC
100K
R214
R209
100K
100NF
C230
R221
BVDD
VC040205X150R
22
C205
RV203
C208
100NF
OUT
1
VCC
15PF
U201
GND
3
2
1UF
C214
VCC
4
5
VCC
1
2
3
4
5
ZD203
1
2
3
22
ZD201
R208
R224
R216
47K
100NF
100K
47PF
C212
100
R247
C221
RV204
VAUX
45
6
VC040205X150R
U205
1
2
3
VBAT
100NF
100NF
C210
C211
BATT
VCC
4
5
NC
R242
5
ZD208
1
2
3
ZD206
1
2
3
4
C223
10NF
S202
C206
100NF
R241
R217
10K
5.1K
S211
S216
100NF
C201
P202
100NF
C213
F4
F2
VCTCXO_VDD
G1
WBDRX
WBDTX
G2
F1
XIN
XOUT
E1
TX_CLK
TX_DATA_1
K4
K3
TX_DATA_2
TX_SYNC
K1
T15
UBE
J1
VALID_STRB
F3
VCTCXO
VCTCXO_GND
E2
VCTCXO_PC
K14
TDMA_EVENT_1
G15
G16
TDMA_EVENT_2
B4
TEST1
C4
TEST2
TEST3
A3
B3
TESTER_MODE
J2
TX_BAT
K2
P2
SOUT_1
L16
T10
SOUT_2
SRAM_CS
P16
B8
STROB0
C8
STROB1
C10
STROB2
STROB3
D10
TBREAKPT
L3
N1
SCK2
SCLK
D9
SEN2
N3
N2
SI2
M16
SIN_1
SIN_2
T11
D11
SLOT_T
SO2
C9
A2
RESET
RF_BAND
J15
RI_N
T3
T6
RTS_N
RX_BAT
H13
RX_CLK
L4
L2
RX_DATA
RX_SYNC
PLL_STRB_1
PLL_STRB_2
J14
C2
POWER_FAIL
POWER_HOLD
C3
J16
PREAMP_G
D13
PWM_0
PWM_1
A9
B9
PWM_2
PWM_3
P1
PA_GATE
H16
PDM_0_N
D3
D2
PDM_0_P
D1
PDM_1_N
PDM_1_P
E4
K15
PLL_CLK
K16
PLL_DATA
J13
M15
T14
MEMOEB
T13
MEMWEB
MODE_STS
M2
B12
NOPC
NRW
C11
OSC_32K_GND
A1
P0
A6
D7
IVDD1
IVDD2
R16
A7
IVDD3
IVDD4
C7
G14
LOCK_DET
MAS0
A11
B11
MAS1
A12
MCLK
MEM8/16
C14
A13
GPIO_1_3
GPIO_1_4
B13
GPIO_1_5
C13
GP_OUT
F13
IFIC_RESET
H3
IRDA_RXD
T7
T9
IRDA_TXD
R1
E14
E15
GPIO_0_5
GPIO_0_6
E16
GPIO_0_7
D14
GPIO_0_8
D15
D16
GPIO_0_9
GPIO_1_0
A14
B14
GPIO_1_1
GPIO_1_2
C15
C16
GPIO_0_11
GPIO_0_12
B16
A16
GPIO_0_13
GPIO_0_14
A15
B15
GPIO_0_15
GPIO_0_2
F16
E13
GPIO_0_3
GPIO_0_4
D12
EX_TX_CLK
B6
C6
EX_TX_DATA
FBURST
A10
FLASH_CS
N16
M1
FSYNC
GPIO_0_0
F14
F15
GPIO_0_1
GPIO_0_10
T5
H4
D_IF_OUT
B10
D_IN
D_OUT
A8
EDD1
D4
EDD2
J4
EDD3
R8
H15
EDD4
EDD5
P1
T8
DGND3
DGND4
T16
H14
DGND5
DGND6
C12
D8
DGND7
DGND8
B7
T2
DSR_N
DTR_N
D4
D5
P12
N12
D6
D7
R13
P13
D8
D9
R14
T4
DCD_N
H1
DGND1
DGND2
D10
D11
P14
P15
D12
D13
N13
N14
D14
D15
N15
P11
D2
D3
N11
R12
BVDD
G4
CLK_SEL_0
CLK_SEL_1
G3
CS_RES1
M13
M14
CS_RES2
CTS_N
T1
N10
D0
D1
R11
R15
BB_JTAG_RESET
B5
BB_TCK
BB_TDI
C5
D6
BB_TDO
BB_TICE
A5
BB_TMS
D5
BIN
J3
BOOT_MODE
T12
C1
ARM_TCK
L15
ARM_TDI
ARM_TDO
L14
ARM_TMS
L13
L1
AUX_CLK
M3
AUX_DATA
AUX_STRB
M4
H2
BBCLK
A4
A4
A5
R4
R5
A6
A7
N5
P5
A8
A9
R6
E3
AGND
G13
ALC_EN
K13
A16
A17
R9
P9
A18
A19
N9
R3
A2
R10
A20
A21
P10
A3
N4
P4
A0
A1
P3
P6
A10
A11
N6
R7
A12
A13
P7
N7
A14
A15
P8
N8
U203
B2
32K_XIN
32K_XOUT
B1
R2
C229
S206
2
3
1
100NF
P204
Q204
6
SW201
1
5
4
3
2
7
8
R211
100K
5.1K
R240
U206
2
GND
SRT
1
VCC1
4
3
VCC2
_RESET
5
R212
330K
VCC
VCC
C209
100NF
S215
CN202-1
BIT-03S
AU201
ZD210
RB751S-40
100NF
R218
20K
C216
VC040205X150R
RV202
ZD207
1
2
3
4
5
IVCC
BVDD
RX
HPPWR
TX
P201
P206
C222
47PF
ZD204
1
2
3
4
5
R201
10K
1
2
3
4
5
S214
ZD202
1
2
3
4
5
ZD205
VCC
100NF
C220
S212
S210
100K
S205
VCC
R248
2
R204
270K
Q203
R
1
3
GND
100K
R206
2
3
1
BATT
Q206
BATT
P205
S209
S213
S218
1
2
R205
1M
22
R255
R207
100K
R213
VCC
4.7K
C215
100NF
VCC
D203
NC
R246
S217
AVCC
VCC
R245
4.7K
VCC
Q207
1
3
2
DAN222TL
D201
3
1
2
ZD211
C202
100NF
BOOT
S-WE# B8
E4
VPP
H10
G10
S-CS1#
S-CS2 D8
S-LB# F3
S-OE# F5
F4
S-UB#
S-VCC
D9
S-VSS
D3
H12
A2
NC2
NC3
A11
NC4
A12
NC5
C4
H1
NC6
NC7
H2
H3
NC8
NC9
D10
F-VCCQ
A10
F-VSS
H8
A9
F-VSS
F-WE#
C3
F-WP# E3
A1
NC1
H11
NC10
NC11
C10
DQ5
DQ6
C8
B10
DQ7
DQ8
F8
F7
DQ9
F-CE# H7
H9
F-OE#
D4
F-RP#
F-VCC
E6
DQ11
DQ12
D7
C7
DQ13
DQ14
B9
B7
DQ15
DQ2
E9
E10
DQ3
DQ4
C9
H4
A5
A6 G6
G5
A7
A8 B4
B6
A9
DQ0
F9
F10
DQ1
DQ10
E8
B3
G4
A17
A18 G3
E5
A19
A2 G8
A3
A20
G7
A3
A4 H5
H6
G9
A1
A10 B5
A4
A11
A12 A8
A7
A13
A6
A14
A5
A15
A16
U202
A0
R237
10
100NF
P203
C234
47K
R239
C203
10PF
ALT_LED
BATT
REED_SW
KEY(0)
HM_STROB
BATT
SOUT_2
HM_STROB
CD
HP_PWR
DSR
DP_TX_DATA
DP_RX_DATA
CTS
DTR
RTS
DTR
CTS
RTS
CD
RI
HP_PWR
DP_RX_DATA
DP_TX_DATA
DSR
BOOT
ADD(0)
SRAM_CS
FLASH_CS
RST
UBE
MEMWEB
MEMOEB
KEYLED_EN
BATT
SVC_LED
ADD(13)
ADD(12)
ADD(11)
ADD(10)
ADD(9)
ADD(8)
ADD(7)
ADD(6)
ADD(5)
ADD(4)
ADD(3)
ADD(2)
ADD(0:21)
ADD(1)
DATA(15)
DATA(14)
DATA(13)
DATA(12)
DATA(11)
DATA(10)
DATA(9)
DATA(8)
DATA(7)
DATA(6)
DATA(5)
DATA(4)
DATA(3)
DATA(2)
DATA(1)
DATA(0:15)
DATA(0)
RI
ADD(21)
ADD(20)
ADD(19)
ADD(18)
ADD(17)
ADD(16)
ADD(15)
ADD(14)
ADD(13)
ADD(12)
ADD(11)
ADD(10)
ADD(9)
ADD(8)
ADD(7)
ADD(6)
ADD(5)
ADD(4)
ADD(3)
ADD(2)
ADD(0:21)
ADD(1)
RST
FLASH_WP
ADD(21)
ADD(20)
ADD(19)
ADD(18)
ADD(17)
ADD(16)
ADD(15)
ADD(14)
FLASH_WP
HS_SENSE
AMP_EN
MIC_BIAS_EN
VIBRATOR
IF_ON
KEY(0)
KEY(1)
KEY(2)
SCAN(0)
SCAN(1)
SCAN(2)
SCAN(3)
SCAN(4)
SCAN(5)
DATA(15)
DATA(14)
DATA(13)
DATA(12)
DATA(11)
DATA(10)
DATA(9)
DATA(8)
DATA(7)
DATA(6)
DATA(5)
DATA(4)
DATA(3)
DATA(2)
DATA(1)
DATA(0)
ADD(0)
WBDTX
VALID_STRB
BIN
IFIC_RESET
D_IF_OUT
LOCK_DET
PLL_DATA
PLL_CLK
PLL_STRB1
RX_BAT
TX_BAT
PA_GATE
PREAMP_G
ALC_EN
ARM_TMS
ARM_TDO
ARM_TDI
PDM
DP_RX_DATA
DP_TX_DATA
DO
SCLK
VCTCXO_PC
POWER_HOLD
RST
SOUT_2
RTS
DTR
CD
RI
DSR
CTS
SCAN(7)
RINGER
BACKLIGHT
ON_SW
VIBRATOR
ARM_TMS
ARM_TDO
ARM_TDI
MEMWEB
MEMOEB
UBE
FLASH_CS
SRAM_CS
DISPLAY_CS
BOOT
FSYNC
SEN
SCK
SI2
SO2
RX_SYNC
RX_DATA
RX_CLK
AUX_CLK
AUX_STRB
AUX_DATA
BBCLK
TX_CLK
TX_SYNC
TX_DATA1
MODE_STS
WBDRX
PON_LD
PON_TX
STRB1
REED_SW
SLOT_T
KEYLED_EN
ANALOG_DIG
BOOT
CLK_FIL
SCAN(7)
SCAN(5)
SCAN(4)
SCAN(0)
SCAN(3)
SCAN(2)
SCAN(1)
KEY(2)
KEY(1)
SCAN(0:7)
KEY(0:2)
KEY(2)
KEY(1)
KEY(0)
SCAN(1)
SCAN(2)
SCAN(3)
SCAN(4)
SCAN(5)
SLOT_T
ON_SW
TRST
ARM_TCK
AUX_ON
RX_AUDIO
SIN_2
SCLK
DO
SIN_2
SOUT_2
HP_PWR
BATT
PON_VRF3
DO
SCLK
STROB2
SVC_LED
ALT_LED
RX_AUDIO
TX_AUDIO
SOUT_2
SIN_2
STROB2
PLL_ON
SIN_2
ON_SW_SENSE
SEND_END
VCTCXO_IN
DATA(0:15)
SCAN(7)
BOOT
4. BASE Circuit Diagram
SAMSUNG Proprietary-Contents may change without notice
6-11
STH-N375 Circuit diagrams
TL6
TL5
50
TL4
0.3
TL2
TL3
1.3
Z[OHM] L[mm]
TL4
50
65
TL3
(1608)
1.19
3.9
50
TL1
TL1
Transmission
TL2
65
TL6
TL5
1.12
N375_RF
65
2.6
7.5K
R359
C323
100NF
R318
10K
12PF
NC
C300
C353
L325
6.8nH
4.7K
R314
C321
680PF
C384
8PF
IN
1
3
ISO
OUT
4
L302
150nH
F304
COUP
6
G1
2
5
G2
100PF
C351
1PF
C347
100NF
100PF
C369
5PF
C390
L314
2.2uH
C376
R366
R356
3.3K,1%
680
100
R357
10nH
L321
NC
R335
3.3K
L313
C391
100PF
C350
100PF
100PF
C392
6.8nH
L305
2.7K
C374
2.2NF
R302
C421
2PF
100PF
C407
150K
5.6nH
R326
R313
27ohm
L318
R336
C423
10K
C380
NC
1UF
L312
10nH
NC
C340
7
VREG2
100K
R310
RFOUT
12
11
RFOUT
RFOUT
10
VCCB
14
VCC1
15
VCC1
16
VMODE
6
5
VREG1
13
BGND
8
1
GND
2
GND
GND
3
9
GND
17
GND
4
RFIN
U302
2F0
10
C416
2PF
100PF
C302
R347
6.2K
R337
470
R319
C400
3PF
TX_QB
VCC
30
3PF
C310
TXIF_GND
73
TXIF_VCC
67
TXVCC
60
TX_I
69
68
TX_IB
72
TX_I/Q_REF
TX_Q
71
70
RXIB
27
RXIF_GND1
RXIF_GND2
14
RXIF_VCC1
26
13
RXIF_VCC2
RXQ
10
9
RXQB
7
TCXO
TXGND
61
PLL2_IN
PLL2_VCC
75
78
PON_LD
80
PON_RX
PON_TX
79
QUAD
18
19
RSSI
RXI
12
11
PCS_IN
49
PCS_LO_AMP_IN
55
PLL1FLSW
PLL1GND
56
51
PLL1VCC
53
PLL1_CP
76
PLL2_CP
PLL2_GND
77
74
MIX2OUT
MIX2VCC
36
MIXOUTB
40
MOSGND
4
MOS_VCC
6
57
PCSOUT
64
PCS_IF_FILTER_1
62
PCS_IF_FLITER_2
43
MIX1GND
MIX1GND
46
MIX1VCC
42
MIX1_INB
44
41
MIX1_OUT
MIX2GND
38
MIX2IN
34
35
MIX2INB
37
5
LD
23
LIM1OUT
25
LIM1/AGCIN
21
LIM2IN
LIMOUT
20
47
LOAMP_GND
LO_AMP_VCC
50
39
FEEDBACK
31
FILTER1-A
FILTER1-B
32
FILTER2-A
28
29
FILTER2-B
FM_AUDIO
16
66
GCA_CONT
33
GND
IOSGND
8
CELL_LO_AMP_IN
48
CLK
2
CP1_GND
54
CP1_VCC
52
3
DATA
DRV_GND
58
1
EN
15
17
AGC
BYPASS
22
BYPASS
24
45
CELIN
59
CELLOUT
CELL_IF_FILTER_1
65
CELL_IF_FILTER_2
63
U301
2.7NF
C344
10
R303
2.4K
R315
5PF
C314
12PF
C346
R344
0
82nH
L316
C386
C424
4.7NF
10PF
C312
2PF
10PF
C387
C345
100NF
C316
4.7NF
100K
C327
390PF
L308
8.2nH
R363
8PF
C308
R355
100K
C320
5PF
10NF
C361
33K
R369
C411
100PF
C406
100PF
C385
5.6PF
R329
27ohm
C431
NC
C430
NC
7PF
C334
R361
18K
C397
12PF
12nH
L327
R374
6.2K
R372
470K
10NF
C311
100NF
C383
33PF
C305
C336
100NF
NC
R308
27ohm
R322
R304
1NF
C330
100K
C358
6.3V
10UF
100PF
4.7nH
L309
C337
R346
4.7K
L317
2.7nH
100NF
R301
0
C343
C366
L306
330uH
1PF
C370
10NF
R316
8PF
C304
5.6NF
C375
560
100NF
100K
R339
C394
RFOUT
6
VCC
L311
6.8nH
U305
GC
3
2
GND
GND 5
4
RFIN
1
GND
2
GND
7
8
RFIN1
6
RFIN2
1
RFOUT1
RFOUT2
3
U300
4
EN1
EN2
5
1
G G
3 4
G G
6
2
IN
5
OUT
F302
470
C349
100PF
R307
4.7uH
L315
27ohm
R324
1.8PF
C396
C359
56PF
R309
270
2.2NF
C352
5
3
4
1
2
U304
L304
120nH
R365
1K
82nH
C388
100PF
L326
C348
C301
100NF
2PF
L310
8.2nH
10NF
C379
6.8nH
L324
R364
10
12nH
L323
R323
C364
100PF
120
R317
27ohm
C363
1UF
10NF
C425
R341
100NF
NC
C303
C373
10UF
6.3V
C365
10PF
0
C315
1NF
R330
R321
27ohm
8.2PF
C333
100NF
C368
R375
10
100NF
C420
R352
L319
6.8nH
C415
1NF
10
27ohm
R343
4
G2
G3
5
6
G4
1
IN
OUT
3
3
2
1
F300
G1
2
D301
HSMS-282C-TR
R311
C398
2PF
100PF
C324
10
220nF
100PF
C414
C354
C367
C429
100PF
100PF
C372
33NF
C404
1NF
R373
100K
R306
1.5K,1%
R305
0
C426
100NF
L303
15uH
C331
100NF
C408
100NF
R331
0
R371
27ohm
C377
10NF
R328
27ohm
R350
270
R332
NC
10
100NF
C319
C428
R342
56K
51
R376
6.3V
C418
10UF
3
4
G3 G4
6
IN
5
2
OUT
F301
1
G1 G2
C409
1NF
33PF
C326
4
SW
2
VCC
VT
3
R345
1K
OSC303
5
G
G
6
7
G
G
8
1
RFOUT
ANT301
5PF
C378
100NF
C313
2.2NF
C355
OUT
100PF
C356
G
1
G
3
4
G
G
6
2
IN
5
6.8PF
C401
F306
D836MH
L320
16nH
C339
10NF
100NF
R320
1.5K
C309
C329
100NF
100NF
C381
2.7NF
C371
10
G7
11
G8
RX
3
26
G23
27
G24
G25
28
29
G26
6
G3
G4
78
G5
G6
9
G16
19
20
G17
G18
21
22
G19
G2
5
G20
23
G21
24
G22
25
ANT
2
4
G1
G10
13
14
G11
G12
15
16
G13
17
G14
18
G15
F303
2.2K
R370
L301
330nH
10PF
C328
R351
100K
56PF
C410
100PF
2
GND
GND
4
IN
3
OUT
1
C422
U306
27ohm
R327
C362
10UF
6.3V
100NF
C335
1NF
C395
C306
1NF
100NF
C322
R300
L322
1nH
27ohm
100NF
C325
D1
6
3
D2
2
G1
5
G2
S1
1
4
S2
6.2K
U303
SI1902DL
R334
1NF
C318
R340
2.4
100PF
C389
100PF
C427
8.2NF
8.2PF
C342
R348
C399
100PF
4.7K
100PF
C393
10NF
C412
C417
C307
R349
10
68PF
R358
10
R368
R354
100
2.2K
R338
39K
6
G
IN
2
OUT
5
C402
1NF
D836MH
F305
1
G
3
G
G
4
R367
27K
5.6nH
L307
R353
15K
R312 27ohm
C419
2.7PF
C332
1NF
100NF
C357
R360
NC
4.7NF
C317
C341
0.5PF
10NF
C413
10
R333
10K
R325
C405
10NF
22nH
L300
56K
C338
1.5PF
1NF
C403
R362
3
OUT
VC
1
VCC
4
C360
100NF
OSC302
)
2
GND
100PF
C382
VBAT
LOCK_DET
V_RF2
MOD_FET
VCTCXO_IN
MOD_FET
RX_BAT
V_RF1
PON_LD
V_RF3
V_RF1
PLL_CLK
PLL_DATA
PLL_STRB1
RX_BAT
ALC_EN
RX_I
RX_IN
RX_Q
RX_QN
TX_I
TX_IN
TXDA_REF
TX_Q
TX_QN
TX_PWR
V_DRV_CELL
VRX
VRX
V_RF1
DEMOD
AFC_OUT
V_VCTCXO
PA_CNT
V_RF2
V_RF3
V_PA_BIAS_CELL
ANALOG_DIG
V_LNA_CELL
V_IF_VCO
MOD
V_DRV_CELL
V_DRV_CELL
V_RF1
V_RF1
AGC_OUT
RSSI
A_IF_IN
VRX
5. RF Circuit Diagram
Wyszukiwarka
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