SERVICE
TDMA MOBILE
TELEPHONE
STH-A225
2
C
ABC
4
GHI
1
3
DEF
5
JKL
6
MNO
7
PQRS
8
TUV
0
9
WXYZ
Manual
TDMA MOBILE TELEPHONE
CONTENTS
1. Trouble Shooting
2. Electrical Parts List
3. Exploded Views and Parts List
4. Block Diagrams
5. PCB Diagrams
6. Circuit Description &
Circuit Diagrams
©Samsung Electronics Co.,Ltd. December. 2001
Pinted in Korea.
Code No.: GH68-01930A
BASIC.
ELECTRONICS
SAMSUNG Proprietary-Contents may change without notice
1-1
1. STH-A225 Trouble Shooting
1. Baseband Section
1-1. Program No Running
N
Need to check
Q204, U311
N
Replace dome S/W
N
Need to check
Q204, U311
N
Need to replace
Memory(U206)
N
Need to check neighbor part
Need to check OSC302,
U202 & neighbor part
Press END Key
Y
Y
Y
Y
Y
Y
ON_SW=H
VBAT>3.2V
VCTCXO_IN=14.4 MHz
32K_XIN=32.768 kHZ
Memory (U206)
control signal OK?
VCC=3.0V
V_VCTCXO=3.0V
RST=3.0V
IVCC=2.2V
BOOT=H
Program Running
VCC, ADD(0:21), DATA(0:15),
FLASH_CS, SRAM_CS, UBE,
MEMOEB, MEMWEB
SAMSUNG Proprietary-Contents may change without notice
1-2
STH-A225 Trouble Shooting
1-2. Abnormal LCD display ,EL Baob Light, Vibrator & Speaker Operation
Y
LCD module
Good
N
Replace LCD module
Y
Speaker Output OK?
N
Need to check
CN101 & neighbor part
N
Need to check
CN101
START
Y
Y
LCD Control
Signal OK?
Y
Y
EL_EN=H
N
Y
EL Back light
OK?
VCC, ADD(2), DATA(0:7),
DISPLAY_CS, RST
LCD Display Running
Send Command EL
enable(Test mode:176)
N
Need to check
CN101
Y
Y
VIBRATOR=H
N
Replace LCD module
Y
Vibrator Run
OK?
LCD Display Running
EL Back lingt Running
Send Command Vibrator
enable(Test mode:180)
N
Need to check CN101
& neighbor part
Y
SPK+,SPK-
Signal OK?
LCD EL Vibrator OK Send Command
Main Audio Receiver Path ON
(Test mode:031, 131, 134, 185)
Need to check U106 out pin5
2.8 V al control pin3 ‘H’
SAMSUNG Proprietary-Contents may change without notice
1-3
STH-A225 Trouble Shooting
1-3. Abnormal Key, Mic, LED’S operation
N
Need to check CN102-1
& neighbor part
N
Need to check CN102-1,
Q102 & neighbor part
Press Keys
Y
Y
Key Dispaly
OK?
Y
Key Display Good
Send Command Main Audio Path ON
(Test mode:031, 131, 136, 187)
Talking Voice at MIC+
N
Need to check
CN102-1 & neighbor part
Y
Y
Y
LED Operation
OK?
Key Display Good
Mic Path Good
Send Command ALT_LED_ON
Send Command SVC_LED_ON
Send Command LED_ON
(Test mode:178)
Audio signal output
at Speaker?
GOOD
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1-4
STH-A225 Trouble Shooting
1-4. Abnormal Buzzer Operation
START
Y
N
Need to check
U104 & AU101
Y
Y
Ringer Signal
OK?
Send Command Ringer Path ON
(Test mode:183)
N
Replace AU101
Y
Buzzer Sound Output
OK?
Buzzer Operation
Good
SAMSUNG Proprietary-Contents may change without notice
1-5
STH-A225 Trouble Shooting
1-5. Abnormal external Ear_Mic Jack operation
START
Y
N
Need to check Q103,
U102 & neighbor parts
Y
Y
HS_SENSE=H
Hock Up Ear_Mic Phone in the Jack(U313)
Send Command MIC_BIAS_EN enable Send
Command AMP_EN enable
Audio set Path=HS
(Test mode:187, 185, 032)
N
Need to check Q103,
U102 & neighbor parts
Y
Y
SEND_END=H
Press Button on the Ear-Jack
Ear_Mic phone
Operation Good
SAMSUNG Proprietary-Contents may change without notice
1-6
STH-A225 Trouble Shooting
2. RF Section
2-1. Call processing and Online Test
N
DONE
START
Y
Y
Normal SVC?
Check RX path
N
Y
Set up Call OK?
Check TX path
N
Y
Measure SINAD/BER
Good?
Check RX path
N
Y
Measure
Tx Power Good?
Check TX path
SAMSUNG Proprietary-Contents may change without notice
1-7
STH-A225 Trouble Shooting
2-2. Receiver Section (Offline test)
1
Y
Y
N
Need to check
U209, U208, U207
Y
N
Need to check
F306
U301_8=-54dBm
N
Need to check
F304 & neighbor parts
Y
RF_BAND=L, RX_BAT=H
PLL_ON=H, PON_LC=H
VCTCXO_PC=H, IF_ON=H
PON_VRF3=H
set up 8920B basestation for RX test
Set Base station RX Lev=-50 dBm
Send Command RX path ON
Send Command channel selecton
(Test mode:031)
START
N
Y
V_LNA_CELL=H
U208_1=H
U207_1=H
Need to check
U301 & neighbor parts
F304 input=-34dBm
2
U304_45=-35dBm
SAMSUNG Proprietary-Contents may change without notice
1-8
STH-A225 Trouble Shooting
2
N
N
AMPS
TDMA
N
Replace U304
Replace
F302
Need to check OSC301,
neighbor parts & U304_1,2,3
Need to check
U207 & neighbor parts
N
Y
Y
Y
Y
Y
RF loal check
U304_48 Lev=-5dBm
Freq=adjusted freq?
1
U304_41 Lev=-19dBm
Freq=130.05MHz
U304_34 Lev=-26dBm
Freq=130.05MHz
N
Need to check
U304, L303, C308, L301, C307
U304_37 Lev=4dBm
Freq=450kHz
Y
N
Replace F301 or
Need to check R302, R304, C301
U304_25 Lev=-2dBm
Freq=450kHz
MODE
U304_40, 42=3.0V
4
3
SAMSUNG Proprietary-Contents may change without notice
1-9
STH-A225 Trouble Shooting
N
Replace U304
Case TDMA mode:
setup basestation for RX test
Amplitude:-50dBm
3
U304_9, 19, 11, 12
measure I/Q
Quarature wave
N
Need to check U304 &
Quad LC Tank circuit
(L310, C328, C330,
C329, R320)
PON_LD=H
Case AMPS mode:
setup basestation for RX test
Audio Freq gen : 1004Hz
FM deviation : 2.9kHz
4
Y
Y
Y
U304_16 DEMOD
(sinusoidal wave)
Vp-p=350mV
Freq=1004Hz
N
Need to check U304 &
R327, R323, C353, C107
U101_52 DEMOD
(sinusoidal wave)
MAX Vp-p=1.4V
Freq=1004Hz
N
Replace U203
Y
U101_40 BBCLK=
6.2208MHz or 4.96NHz or
5.12MHz
N
Replace U203
Y
U101_32RX_CLK=
BBCLK/2 or
BBCLK/8
N
Replace U203
Y
U101_31 RX_SYNC=
BBCLK/32 or
BBCLK/128
N
Replace U203
Y
U101_31 RX_DATA=
serial data
DONE
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1-10
STH-A225 Trouble Shooting
2-3.Transmitter Section (Offline test)
N
Replace U203
N
Replace U203
N
Replace U203
N
Replace U203
Y
Y
Y
U101_40 BBCLK=
6.2208MHz or 4.096MHz
or5.12MHz
Y
U101_34 TX_CLK=
BBCLK/32 or BBCLK/8
Y
U101_33 TX_SYNC=
BBCLK/512 or BBCLK/128
Y
U101_33 TX_DATA=
serial data
RF_BAND=L, TX_BAT=H
PLL_ON=H, VCYCXO_PC=H
IF_ON=H, PON_TX=H
PON_VRF3=H
setup 8920B as basestaion for
TX test audio signal?
Send command TX path ON
Send Command channel selection
(Test mode:136, 131)
START
AMPS
TDMA
2
1
MODE
SAMSUNG Proprietary-Contents may change without notice
1-11
STH-A225 Trouble Shooting
1
3
Replace U101
Y
Y
Need to check
V_RF2=3.0V or
Replace U304
2
Y
U304_59(RF OUT)
Fc=Local_freq + 175.05
U101_61, 60, 58, 57
TX I/Q Quarature signal
AC Lev Vp_p=0.4V
DC bias Lev=1.5V
U101_63 MOD
(sinusoidal wave)
MAX Vp-p=1.4V
Freq=1004Hz
OSC303_1
(FM modulation out)
Freq=175.05MHz
Audio Freq=1004Hz
Need to check
OSC303,
V_IF_VCO=3.0V
N
Y
N
N
Y
Need to check
U304_66 or
Replace U304
U304_59(RF OUT)
measure Level
Send command PA_CNT
(Test mode:132)
Level is adjustable?
N
Y
Replace F310
U304_59(RF OUT)
Fc=Local_freq + 175.05
N
Y
SAMSUNG Proprietary-Contents may change without notice
1-12
STH-A225 Trouble Shooting
3
Y
Need to check
V_DRV_CELL=3.0V,
neighbor part or
Replace U307
U307 Gain
around 27dB
N
Y
Replace F309
F309 Insertion loss
around 3dB
N
Y
Need to check
V_PA_BAIS_CELL(U305_5,6,7)=3.0V
VBATT(U305_14,15,16)=3.2~1V
or Replace U305
U305 Gain
around 30dB
N
Y
Need to check
F313 & neighbor parts
F306_1 around same power
with U305 output
N
Y
Need to check
F313 & neighbor parts
F306 insertion loss
under 3dB
N
DONE
SAMSUNG Proprietary-Contents may change without notice
2-1
2. STH-A225 MAIN Electrical Parts List
0
STH-A225G/TCE
1
GH07-00092A
LCD-STHA225 MOTOR, SPK UG-18B75-FGHTX-A, STH-A225, -, 34.6 x
1
GH43-00360A
BATTERY-STHA205 LP473465B, STH-A205, LI-ION , 900 mAh, -, 4.2 V, -
1
GH44-00145G
CHARGER-SCHN105 TC TCH020ABN, SCH-N105, AC/DC, -, -, -, -,
1
GH59-00174A
UNIT-KEY PAD ASS’Y STH-A205, HUW9518-010010, -, KEY PAD ASS’Y, -,
1
GH92-00829A
PBA MAIN-STHA225 STH-A225, -, BRAZ, MAIN PBA, -, -, -, -, -
2
3002-001062
AU101
BUZZER-MAGNETIC 88dB, 3.6 V, 90 mA, 2.731KHz, TP
2
2203-005061
C101
C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
2
2203-005061
C102
C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
2
2203-000254
C103
C-CERAMIC, CHIP 10 nF, 10 %, 16 V, X7R, TP, 1005, -
2
2203-005061
C104
C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
2
2203-005061
C105
C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
2
2203-005061
C106
C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
2
2203-005061
C107
C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
2
2203-005061
C108
C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
2
2203-005061
C109
C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
2
2203-005061
C110
C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
2
2203-005061
C111
C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
2
2203-005061
C112
C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
2
2203-005061
C114
C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
2
2203-005061
C115
C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
2
2203-000233
C116
C-CERAMIC, CHIP 0.1 nF, 5 %, 50 V, NP0, TP, 1005
2
2203-000628
C117
C-CERAMIC, CHIP 0.022 nF, 5 %, 50 V, NP0, TP, 1005
2
2203-005061
C118
C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
2
2203-001153
C119
C-CERAMIC, CHIP 0.068 nF, 5 %, 50 V, NP0, TP, 1005
2
2203-001153
C120
C-CERAMIC, CHIP 0.068 nF, 5 %, 50 V, NP0, TP, 1005
2
2203-001153
C121
C-CERAMIC, CHIP 0.068 nF, 5 %, 50 V, NP0, TP, 1005
2
2203-001153
C122
C-CERAMIC, CHIP 0.068 nF, 5 %, 50 V, NP0, TP, 1005
2
2203-001153
C123
C-CERAMIC, CHIP 0.068 nF, 5 %, 50 V, NP0, TP, 1005
2
2203-001153
C124
C-CERAMIC, CHIP 0.068 nF, 5 %, 50 V, NP0, TP, 1005
2
2203-001153
C125
C-CERAMIC, CHIP 0.068 nF, 5 %, 50 V, NP0, TP, 1005
2
2203-001153
C126
C-CERAMIC, CHIP 0.068 nF, 5 %, 50 V, NP0, TP, 1005
2
2203-005061
C127
C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
2
2203-000278
C128
C-CERAMIC, CHIP 0.01 nF, 0.5 pF, 50 V, NP0, TP, 1005
Level
SEC CODE
Design LOC
DESCRIPTIONS
SAMSUNG Proprietary-Contents may change without notice
2-2
STH-A225 Electrical Parts List
2
2203-001153
C130
C-CERAMIC, CHIP 0.068 nF, 5 %, 50 V, NP0, TP, 1005
2
2203-001153
C131
C-CERAMIC, CHIP 0.068 nF, 5 %, 50 V, NP0, TP, 1005
2
2203-001153
C132
C-CERAMIC, CHIP 0.068 nF, 5 %, 50 V, NP0, TP, 1005
2
2203-001153
C133
C-CERAMIC, CHIP 0.068 nF, 5 %, 50 V, NP0, TP, 1005
2
2203-001153
C134
C-CERAMIC, CHIP 0.068 nF, 5 %, 50 V, NP0, TP, 1005
2
2203-001153
C135
C-CERAMIC, CHIP 0.068 nF, 5 %, 50 V, NP0, TP, 1005
2
2203-001153
C136
C-CERAMIC, CHIP 0.068 nF, 5 %, 50 V, NP0, TP, 1005
2
2404-001105
C141
C-TA, CHIP 10 uF, 20 %, 6.3 V, GP, TP, 2012
2
2203-005061
C142
C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
2
2203-005061
C143
C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
2
2203-000278
C144
C-CERAMIC, CHIP 0.01 nF, 0.5 pF, 50 V, NP0, TP, 1005
2
2203-005061
C145
C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
2
2203-005065
C148
C-CERAMIC, CHIP 1000 nF, +80-20 %, 10 V, Y5 V, TP, 1608
2
2404-001088
C149
C-TA, CHIP 2.2 uF, 20 %, 6.3 V, GP, TP, 2012, -
2
2404-001105
C150
C-TA, CHIP 10 uF, 20 %, 6.3 V, GP, TP, 2012
2
2404-001105
C151
C-TA, CHIP 10 uF, 20 %, 6.3 V, GP, TP, 2012
2
2203-000278
C152
C-CERAMIC, CHIP 0.01 nF, 0.5 pF, 50 V, NP0, TP, 1005
2
2203-000330
C153
C-CERAMIC, CHIP 0.012 nF, 5 %, 50 V, NP0, TP, 1005
2
2203-000278
C154
C-CERAMIC, CHIP 0.01 nF, 0.5 pF, 50 V, NP0, TP, 1005
2
2203-000330
C155
C-CERAMIC, CHIP 0.012 nF, 5 %, 50 V, NP0, TP, 1005
2
2203-000679
C156
C-CERAMIC, CHIP 0.027 nF, 5 %, 50 V, NP0, TP, 1005
2
2203-005061
C160
C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
2
2203-005061
C161
C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
2
2203-005065
C162
C-CERAMIC, CHIP 1000 nF, +80-20 %, 10 V, Y5 V, TP, 1608
2
2203-005061
C163
C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
2
2404-001151
C164
C-TA, CHIP 33 uF, 20 %, 6.3 V, LZ, TP, 3216
2
2203-005061
C165
C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
2
2203-001153
C166
C-CERAMIC, CHIP 0.068 nF, 5 %, 50 V, NP0, TP, 1005
2
2203-001153
C167
C-CERAMIC, CHIP 0.068 nF, 5 %, 50 V, NP0, TP, 1005
2
2203-001153
C168
C-CERAMIC, CHIP 0.068 nF, 5 %, 50 V, NP0, TP, 1005
2
2203-001153
C169
C-CERAMIC, CHIP 0.068 nF, 5 %, 50 V, NP0, TP, 1005
2
2203-001153
C170
C-CERAMIC, CHIP 0.068 nF, 5 %, 50 V, NP0, TP, 1005
2
2203-000233
C172
C-CERAMIC, CHIP 0.1 nF, 5 %, 50 V, NP0, TP, 1005
2
2203-000233
C173
C-CERAMIC, CHIP 0.1 nF, 5 %, 50 V, NP0, TP, 1005
Level
SEC CODE
Design LOC
DESCRIPTIONS
SAMSUNG Proprietary-Contents may change without notice
2-3
STH-A225 Electrical Parts List
2
2203-005061
C174
C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
2
2203-000278
C175
C-CERAMIC, CHIP 0.01 nF, 0.5 pF, 50 V, NP0, TP, 1005
2
2203-005065
C176
C-CERAMIC, CHIP 1000 nF, +80-20 %, 10 V, Y5 V, TP, 1608
2
2203-000278
C177
C-CERAMIC, CHIP 0.01 nF, 0.5 pF, 50 V, NP0, TP, 1005
2
2203-000233
C178
C-CERAMIC, CHIP 0.1 nF, 5 %, 50 V, NP0, TP, 1005
2
2203-000233
C179
C-CERAMIC, CHIP 0.1 nF, 5 %, 50 V, NP0, TP, 1005
2
2203-000679
C180
C-CERAMIC, CHIP 0.027 nF, 5 %, 50 V, NP0, TP, 1005
2
2203-005065
C181
C-CERAMIC, CHIP 1000 nF, +80-20 %, 10 V, Y5 V, TP, 1608
2
2203-000233
C201
C-CERAMIC, CHIP 0.1 nF, 5 %, 50 V, NP0, TP, 1005
2
2203-000233
C202
C-CERAMIC, CHIP 0.1 nF, 5 %, 50 V, NP0, TP, 1005
2
2203-000386
C203
C-CERAMIC, CHIP 0.015 nF, 5 %, 50 V, NP0, TP, 1005
2
2203-000386
C204
C-CERAMIC, CHIP 0.015 nF, 5 %, 50 V, NP0, TP, 1005
2
2203-005061
C205
C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
2
2203-005061
C206
C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
2
2203-005061
C207
C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
2
2203-005061
C208
C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
2
2203-005061
C209
C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
2
2203-005065
C210
C-CERAMIC, CHIP 1000 nF, +80-20 %, 10 V, Y5 V, TP, 1608
2
2203-005061
C211
C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
2
2203-005061
C218
C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
2
2203-005061
C219
C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
2
2404-001088
C220
C-TA, CHIP 2.2 uF, 20 %, 6.3 V, GP, TP, 2012, -
2
2404-001105
C221
C-TA, CHIP 10 uF, 20 %, 6.3 V, GP, TP, 2012
2
2404-001105
C222
C-TA, CHIP 10 uF, 20 %, 6.3 V, GP, TP, 2012
2
2203-005065
C223
C-CERAMIC, CHIP 1000 nF, +80-20 %, 10 V, Y5 V, TP, 1608
2
2203-005065
C224
C-CERAMIC, CHIP 1000 nF, +80-20 %, 10 V, Y5 V, TP, 1608
2
2203-000940
C225
C-CERAMIC, CHIP 470 pF, 10 %, 50 V, X7R, TP, 1005, -
2
2404-001105
C226
C-TA, CHIP 10 uF, 20 %, 6.3 V, GP, TP, 2012
2
2404-001088
C227
C-TA, CHIP 2.2 uF, 20 %, 6.3 V, GP, TP, 2012, -
2
2404-001088
C228
C-TA, CHIP 2.2 uF, 20 %, 6.3 V, GP, TP, 2012, -
2
2404-001105
C229
C-TA, CHIP 10 uF, 20 %, 6.3 V, GP, TP, 2012
2
2203-005061
C230
C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
2
2203-000438
C231
C-CERAMIC, CHIP 1 nF, 10 %, 50 V, X7R, TP, 1005, -
2
2203-005061
C232
C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
Level
SEC CODE
Design LOC
DESCRIPTIONS
SAMSUNG Proprietary-Contents may change without notice
2-4
STH-A225 Electrical Parts List
2
2203-005061
C233
C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
2
2404-001088
C234
C-TA, CHIP 2.2 uF, 20 %, 6.3 V, GP, TP, 2012, -
2
2404-001151
C235
C-TA, CHIP 33 uF, 20 %, 6.3 V, LZ, TP, 3216
2
2404-001088
C236
C-TA, CHIP 2.2 uF, 20 %, 6.3 V, GP, TP, 2012, -
2
2404-001088
C237
C-TA, CHIP 2.2 uF, 20 %, 6.3 V, GP, TP, 2012, -
2
2404-001151
C239
C-TA, CHIP 33 uF, 20 %, 6.3 V, LZ, TP, 3216
2
2203-005061
C240
C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
2
2203-000628
C241
C-CERAMIC, CHIP 0.022 nF, 5 %, 50 V, NP0, TP, 1005
2
2203-000254
C242
C-CERAMIC, CHIP 10 nF, 10 %, 16 V, X7R, TP, 1005, -
2
2404-001151
C243
C-TA, CHIP 33 uF, 20 %, 6.3 V, LZ, TP, 3216
2
2203-005061
C301
C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
2
2203-005061
C302
C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
2
2203-000233
C303
C-CERAMIC, CHIP 0.1 nF, 5 %, 50 V, NP0, TP, 1005
2
2203-000438
C304
C-CERAMIC, CHIP 1 nF, 10 %, 50 V, X7R, TP, 1005, -
2
2203-001259
C305
C-CERAMIC, CHIP 0.008 nF, 0.5 pF, 50 V, NP0, TP, 1005
2
2203-000438
C306
C-CERAMIC, CHIP 1 nF, 10 %, 50 V, X7R, TP, 1005, -
2
2203-001153
C307
C-CERAMIC, CHIP 0.068 nF, 5 %, 50 V, NP0, TP, 1005
2
2203-000278
C308
C-CERAMIC, CHIP 0.01 nF, 0.5 pF, 50 V, NP0, TP, 1005
2
2203-000278
C309
C-CERAMIC, CHIP 0.01 nF, 0.5 pF, 50 V, NP0, TP, 1005
2
2203-005061
C310
C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
2
2203-005061
C311
C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
2
2203-000438
C313
C-CERAMIC, CHIP 1 nF, 10 %, 50 V, X7R, TP, 1005, -
2
2203-000278
C314
C-CERAMIC, CHIP 0.01 nF, 0.5 pF, 50 V, NP0, TP, 1005
2
2203-005061
C315
C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
2
2203-005053
C316
C-CERAMIC, CHIP 0.0039 nF, 0.25 pF, 50 V, NP0, TP, 1005
2
2203-000233
C318
C-CERAMIC, CHIP 0.1 nF, 5 %, 50 V, NP0, TP, 1005
2
2203-000233
C321
C-CERAMIC, CHIP 0.1 nF, 5 %, 50 V, NP0, TP, 1005
2
2203-005393
C322
C-CERAMIC, CHIP 0.005 nF, 0.1 pF, 50 V, NP0, TP, 1005
2
2203-000438
C323
C-CERAMIC, CHIP 1 nF, 10 %, 50 V, X7R, TP, 1005, -
2
2203-000489
C324
C-CERAMIC, CHIP 2.2 nF, 10 %, 50 V, X7R, TP, 1005, -
2
2203-000386
C325
C-CERAMIC, CHIP 0.015 nF, 5 %, 50 V, NP0, TP, 1005
2
2203-005061
C326
C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
2
2203-000233
C327
C-CERAMIC, CHIP 0.1 nF, 5 %, 50 V, NP0, TP, 1005
2
2203-000278
C328
C-CERAMIC, CHIP 0.01 nF, 0.5 pF, 50 V, NP0, TP, 1005
Level
SEC CODE
Design LOC
DESCRIPTIONS
SAMSUNG Proprietary-Contents may change without notice
2-5
STH-A225 Electrical Parts List
2
2203-000783
C329
C-CERAMIC, CHIP 0.33 nF, 5 %, 50 V, NP0, TP, 1608
2
2203-000233
C330
C-CERAMIC, CHIP 0.1 nF, 5 %, 50 V, NP0, TP, 1005
2
2203-005061
C331
C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
2
2203-005061
C332
C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
2
2203-005281
C333
C-CERAMIC, CHIP 0.0015 nF, 0.1 pF, 50 V, NP0, TP, 1005
2
2203-005061
C336
C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
2
2203-000233
C337
C-CERAMIC, CHIP 0.1 nF, 5 %, 50 V, NP0, TP, 1005
2
2203-000254
C338
C-CERAMIC, CHIP 10 nF, 10 %, 16 V, X7R, TP, 1005, -
2
2203-000233
C340
C-CERAMIC, CHIP 0.1 nF, 5 %, 50 V, NP0, TP, 1005
2
2203-005061
C342
C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
2
2203-005061
C343
C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
2
2203-000233
C344
C-CERAMIC, CHIP 0.1 nF, 5 %, 50 V, NP0, TP, 1005
2
2203-005054
C345
C-CERAMIC, CHIP 0.0047 nF, 0.25 pF, 50 V, NP0, TP, 1005
2
2203-000530
C346
C-CERAMIC, CHIP 2.7 nF, 10 %, 50 V, X7R, TP, 1005, -
2
2203-005061
C348
C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
2
2203-000386
C350
C-CERAMIC, CHIP 0.015 nF, 5 %, 50 V, NP0, TP, 1005
2
2203-000233
C352
C-CERAMIC, CHIP 0.1 nF, 5 %, 50 V, NP0, TP, 1005
2
2203-000489
C353
C-CERAMIC, CHIP 2.2 nF, 10 %, 50 V, X7R, TP, 1005, -
2
2203-000386
C354
C-CERAMIC, CHIP 0.015 nF, 5 %, 50 V, NP0, TP, 1005
2
2203-000233
C355
C-CERAMIC, CHIP 0.1 nF, 5 %, 50 V, NP0, TP, 1005
2
2203-005494
C356
C-CERAMIC, CHIP 220 nF, 10 %, 10 V, X7R, TP, 1608, -
2
2203-005061
C357
C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
2
2203-005061
C358
C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
2
2404-001105
C360
C-TA, CHIP 10 uF, 20 %, 6.3 V, GP, TP, 2012
2
2203-000278
C362
C-CERAMIC, CHIP 0.01 nF, 0.5 pF, 50 V, NP0, TP, 1005
2
2203-001072
C363
C-CERAMIC, CHIP 0.056 nF, 5 %, 50 V, NP0, TP, 1005
2
2404-001105
C364
C-TA, CHIP 10 uF, 20 %, 6.3 V, GP, TP, 2012
2
2203-000233
C365
C-CERAMIC, CHIP 0.1 nF, 5 %, 50 V, NP0, TP, 1005
2
2203-005061
C366
C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
2
2203-005065
C367
C-CERAMIC, CHIP 1000 nF, +80-20 %, 10 V, Y5 V, TP, 1608
2
2203-000233
C368
C-CERAMIC, CHIP 0.1 nF, 5 %, 50 V, NP0, TP, 1005
2
2203-000254
C369
C-CERAMIC, CHIP 10 nF, 10 %, 16 V, X7R, TP, 1005, -
2
2203-005061
C370
C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
2
2203-000425
C373
C-CERAMIC, CHIP 0.018 nF, 5 %, 50 V, NP0, TP, 1005
Level
SEC CODE
Design LOC
DESCRIPTIONS
SAMSUNG Proprietary-Contents may change without notice
2-6
STH-A225 Electrical Parts List
2
2203-000278
C374
C-CERAMIC, CHIP 0.01 nF, 0.5 pF, 50 V, NP0, TP, 1005
2
2203-000940
C375
C-CERAMIC, CHIP 470 pF, 10 %, 50 V, X7R, TP, 1005, -
2
2203-005480
C376
C-CERAMIC, CHIP 33 nF, 10 %, 10 V, X7R, TP, 1005, -
2
2203-000138
C377
C-CERAMIC, CHIP 1.5 nF, 10 %, 50 V, X7R, TP, 1005, -
2
2203-000254
C378
C-CERAMIC, CHIP 10 nF, 10 %, 16 V, X7R, TP, 1005, -
2
2203-005061
C379
C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
2
2404-001105
C380
C-TA, CHIP 10 uF, 20 %, 6.3 V, GP, TP, 2012
2
2203-000254
C381
C-CERAMIC, CHIP 10 nF, 10 %, 16 V, X7R, TP, 1005, -
2
2203-000440
C382
C-CERAMIC, CHIP 1 nF, 10 %, 50 V, X7R, TP, 1608, -
2
2203-000254
C383
C-CERAMIC, CHIP 10 nF, 10 %, 16 V, X7R, TP, 1005, -
2
2203-000254
C384
C-CERAMIC, CHIP 10 nF, 10 %, 16 V, X7R, TP, 1005, -
2
2203-005050
C387
C-CERAMIC, CHIP 0.0018 nF, 0.25 pF, 50 V, NP0, TP, 1005
2
2203-005061
C388
C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
2
2203-005552
C390
C-CERAMIC, CHIP 0.0022 nF, 0.1 pF, 50 V, NP0, TP, 1005
2
2203-000233
C393
C-CERAMIC, CHIP 0.1 nF, 5 %, 50 V, NP0, TP, 1005
2
2203-000233
C394
C-CERAMIC, CHIP 0.1 nF, 5 %, 50 V, NP0, TP, 1005
2
2203-000233
C395
C-CERAMIC, CHIP 0.1 nF, 5 %, 50 V, NP0, TP, 1005
2
2203-000628
C396
C-CERAMIC, CHIP 0.022 nF, 5 %, 50 V, NP0, TP, 1005
2
2203-000278
C397
C-CERAMIC, CHIP 0.01 nF, 0.5 pF, 50 V, NP0, TP, 1005
2
2203-000628
C398
C-CERAMIC, CHIP 0.022 nF, 5 %, 50 V, NP0, TP, 1005
2
2203-000233
C399
C-CERAMIC, CHIP 0.1 nF, 5 %, 50 V, NP0, TP, 1005
2
2203-000438
C400
C-CERAMIC, CHIP 1 nF, 10 %, 50 V, X7R, TP, 1005, -
2
2203-005393
C401
C-CERAMIC, CHIP 0.005 nF, 0.1 pF, 50 V, NP0, TP, 1005
2
2203-000330
C402
C-CERAMIC, CHIP 0.012 nF, 5 %, 50 V, NP0, TP, 1005
2
2203-000438
C403
C-CERAMIC, CHIP 1 nF, 10 %, 50 V, X7R, TP, 1005, -
2
2203-000233
C404
C-CERAMIC, CHIP 0.1 nF, 5 %, 50 V, NP0, TP, 1005
2
2203-005061
C405
C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
2
2203-001259
C407
C-CERAMIC, CHIP 0.008 nF, 0.5 pF, 50 V, NP0, TP, 1005
2
2203-005053
C408
C-CERAMIC, CHIP 0.0039 nF, 0.25 pF, 50 V, NP0, TP, 1005
2
2203-005061
C409
C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
2
2203-000233
C410
C-CERAMIC, CHIP 0.1 nF, 5 %, 50 V, NP0, TP, 1005
2
2203-000438
C411
C-CERAMIC, CHIP 1 nF, 10 %, 50 V, X7R, TP, 1005, -
2
2203-000438
C412
C-CERAMIC, CHIP 1 nF, 10 %, 50 V, X7R, TP, 1005, -
2
2203-000438
C413
C-CERAMIC, CHIP 1 nF, 10 %, 50 V, X7R, TP, 1005, -
Level
SEC CODE
Design LOC
DESCRIPTIONS
SAMSUNG Proprietary-Contents may change without notice
2-7
STH-A225 Electrical Parts List
2
2203-000233
C415
C-CERAMIC, CHIP 0.1 nF, 5 %, 50 V, NP0, TP, 1005
2
2203-000696
C416
C-CERAMIC, CHIP 0.002 nF, 0.25 pF, 50 V, NP0, TP, 1005
2
2203-000254
C417
C-CERAMIC, CHIP 10 nF, 10 %, 16 V, X7R, TP, 1005, -
2
2203-001072
C418
C-CERAMIC, CHIP 0.056 nF, 5 %, 50 V, NP0, TP, 1005
2
2203-005061
C419
C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
2
2203-000254
C420
C-CERAMIC, CHIP 10 nF, 10 %, 16 V, X7R, TP, 1005, -
2
2203-000233
C421
C-CERAMIC, CHIP 0.1 nF, 5 %, 50 V, NP0, TP, 1005
2
2203-000254
C424
C-CERAMIC, CHIP 10 nF, 10 %, 16 V, X7R, TP, 1005, -
2
2203-000438
C427
C-CERAMIC, CHIP 1 nF, 10 %, 50 V, X7R, TP, 1005, -
2
2404-001105
C428
C-TA, CHIP 10 uF, 20 %, 6.3 V, GP, TP, 2012
2
2203-005481
C430
C-CERAMIC, CHIP 47 nF, 10 %, 10 V, X7R, TP, 1005, -
2
2203-000885
C433
C-CERAMIC, CHIP 4.7 nF, 10 %, 25 V, X7R, TP, 1005, -
2
2404-001240
C434
C-TA, CHIP 1 uF, 20 %, 10 V, -, TP, 1608
2
2203-000254
C435
C-CERAMIC, CHIP 10 nF, 10 %, 16 V, X7R, TP, 1005, -
2
2203-005050
C441
C-CERAMIC, CHIP 0.0018 nF, 0.25 pF, 50 V, NP0, TP, 1005
2
2203-001210
C442
C-CERAMIC, CHIP 8.2 nF, 10 %, 16 V, X7R, TP, 1005, -
2
2203-000254
C445
C-CERAMIC, CHIP 10 nF, 10 %, 16 V, X7R, TP, 1005, -
2
2404-001151
C449
C-TA, CHIP 33 uF, 20 %, 6.3 V, LZ, TP, 3216
2
2203-000696
C453
C-CERAMIC, CHIP 0.002 nF, 0.25 pF, 50 V, NP0, TP, 1005
2
2203-005061
C454
C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
2
2203-000233
C455
C-CERAMIC, CHIP 0.1 nF, 5 %, 50 V, NP0, TP, 1005
2
2203-000696
C456
C-CERAMIC, CHIP 0.002 nF, 0.25 pF, 50 V, NP0, TP, 1005
2
2203-000233
C463
C-CERAMIC, CHIP 0.1 nF, 5 %, 50 V, NP0, TP, 1005
2
2203-005481
C465
C-CERAMIC, CHIP 47 nF, 10 %, 10 V, X7R, TP, 1005, -
2
2203-005061
C466
C-CERAMIC, CHIP 100 nF, +80-20 %, 16 V, Y5 V, TP, 1005
2
2203-000254
C470
C-CERAMIC, CHIP 10 nF, 10 %, 16 V, X7R, TP, 1005, -
2
2203-005050
C471
C-CERAMIC, CHIP 0.0018 nF, 0.25 pF, 50 V, NP0, TP, 1005
2
2203-005393
C472
C-CERAMIC, CHIP 0.005 nF, 0.1 pF, 50 V, NP0, TP, 1005
2
2203-005050
C473
C-CERAMIC, CHIP 0.0018 nF, 0.25 pF, 50 V, NP0, TP, 1005
2
2203-001259
C474
C-CERAMIC, CHIP 0.008 nF, 0.5 pF, 50 V, NP0, TP, 1005
2
2203-000233
C475
C-CERAMIC, CHIP 0.1 nF, 5 %, 50 V, NP0, TP, 1005
2
2203-005065
C476
C-CERAMIC, CHIP 1000 nF, +80-20 %, 10 V, Y5 V, TP, 1608
2
2203-000278
C477
C-CERAMIC, CHIP 0.01 nF, 0.5 pF, 50 V, NP0, TP, 1005
2
2203-000425
C478
C-CERAMIC, CHIP 0.018 nF, 5 %, 50 V, NP0, TP, 1005
Level
SEC CODE
Design LOC
DESCRIPTIONS
SAMSUNG Proprietary-Contents may change without notice
2-8
STH-A225 Electrical Parts List
2
2203-005050
C479
C-CERAMIC, CHIP 0.0018 nF, 0.25 pF, 50 V, NP0, TP, 1005
2
2203-005050
C480
C-CERAMIC, CHIP 0.0018 nF, 0.25 pF, 50 V, NP0, TP, 1005
2
2203-000138
C482
C-CERAMIC, CHIP 1.5 nF, 10 %, 50 V, X7R, TP, 1005, -
2
2203-000696
C483
C-CERAMIC, CHIP 0.002 nF, 0.25 pF, 50 V, NP0, TP, 1005
2
3708-001396
CN101
CONNECTOR-FPC/FC/PIC 22P, 0.5 mm, SMD-A, SN
2
3711-004289
CN102
CONNECTOR-HEADER BOX, 30P, 2R, 0.5 mm, SMD-S, AUF
2
3710-001634
CN201
CONNECTOR-SOCKET 24P, 1R, 0.5 mm, SMD-A, AUF
2
1405-001082
D101
VARISTOR 5.6 V, 20A, 1 x 0.5 x 0.6 mm, TP
2
1405-001082
D102
VARISTOR 5.6 V, 20A, 1 x 0.5 x 0.6 mm, TP
2
0407-000115
D103
DIODE-ARRAY DAN202U, 80 V, 100 mA, CA2-3, SC-70,
2
1405-001082
D104
VARISTOR 5.6 V, 20A, 1 x 0.5 x 0.6 mm, TP
2
1405-001082
D105
VARISTOR 5.6 V, 20A, 1 x 0.5 x 0.6 mm, TP
2
1405-001082
D202
VARISTOR 5.6 V, 20A, 1 x 0.5 x 0.6 mm, TP
2
1405-001082
D203
VARISTOR 5.6 V, 20A, 1 x 0.5 x 0.6 mm, TP
2
1405-001082
D204
VARISTOR 5.6 V, 20A, 1 x 0.5 x 0.6 mm, TP
2
1405-001082
D205
VARISTOR 5.6 V, 20A, 1 x 0.5 x 0.6 mm, TP
2
0404-001093
D302
DIODE-SCHOTTKY HSMS-282C, 1 V, 30 mA, SOT-323, TP
2
2903-001235
F301
FILTER-CERAMIC BP, 0.45 MHz, -, 6dB, 0.5dB, TP, -
2
2904-001270
F302
FILTER-SAW 130.05 MHz, 0.024 MHz, +-10.5KHz/0.5dB, TP, +-
2
2904-001173
F304
FILTER-SAW 881.5 MHz, 25 MHz, +-12.5MHz/2dB, TP, +-12.5MHz/3.5dB,
2
2909-001119
F306
FILTER-DUPLEXER 881.5 MHz, 836.5 MHz, 4/3dB, TP, 56dB, 40dB
2
2904-001172
F309
FILTER-SAW 836.5 MHz, 25 MHz, +-12.5MHz/1.5, TP, +-12.5MHz/2.5dB,
2
2904-001172
F310
FILTER-SAW 836.5 MHz, 25 MHz, +-12.5MHz/1.5, TP, +-12.5MHz/2.5dB,
2
4709-001226
F313
COUPLER-DIRECTION 800-850 MHz, 15.5dB, 24dB, 2 x 1.25 x 1 mm, TP
2
2903-001235
F314
FILTER-CERAMIC BP, 0.45 MHz, -, 6dB, 0.5dB, TP, -
2
3301-001438
L101
CORE-FERRITE BEAD AB, 75 ohm, 1 x 0.5 x 0.5 mm, 100 mA, TP,
2
3301-001438
L102
CORE-FERRITE BEAD AB, 75 ohm, 1 x 0.5 x 0.5 mm, 100 mA, TP,
2
2703-001868
L103
INDUCTOR-SMD 82 nH, 5 %, 1005
2
2703-001868
L104
INDUCTOR-SMD 82 nH, 5 %, 1005
2
3301-001438
L105
CORE-FERRITE BEAD AB, 75 ohm, 1 x 0.5 x 0.5 mm, 100 mA, TP,
2
2703-001727
L301
INDUCTOR-SMD 22 nH, 5 %, 1 x 0.5 x 0.5 mm
2
2703-000190
L302
INDUCTOR-SMD 330 nH, 10 %, 0.8 x 1.6 x 0.8 mm
2
2703-001860
L303
INDUCTOR-SMD 150 nH, 5 %, 1.6 x 0.8 x 0.8 mm
2
2703-001752
L304
INDUCTOR-SMD 39 nH, 5 %, 1.0 x 0.5 x 0.5 mm
Level
SEC CODE
Design LOC
DESCRIPTIONS
SAMSUNG Proprietary-Contents may change without notice
2-9
STH-A225 Electrical Parts List
2
2703-000143
L305
INDUCTOR-SMD 180 nH, 10 %, 0.8 x 1.6 x 0.8 mm
2
2703-001790
L306
INDUCTOR-SMD 3.3 nH, 0.3 nH, 1.0 x 0.5 x 0.5 mm
2
2007-001298
L307
R-CHIP 51 ohm, 5 %, 1/16 W, DA, TP, 1005
2
2703-001751
L308
INDUCTOR-SMD 3.9 nH, 0.3 nH, 1.0 x 0.5 x 0.5 mm
2
2703-001242
L309
INDUCTOR-SMD 4.7 uH, 10 %, 1.6 x 0.8 x 0.8 mm
2
2703-002036
L310
INDUCTOR-SMD 330 uH, 5 %, 3.2 x 2.5 x 2 mm
2
2703-001730
L311
INDUCTOR-SMD 15 nH, 5 %, 1 x 0.5 x 0.5 mm
2
2703-001734
L312
INDUCTOR-SMD 6.8 nH, 5 %, 1 x 0.5 x 0.5 mm
2
2703-001242
L313
INDUCTOR-SMD 4.7 uH, 10 %, 1.6 x 0.8 x 0.8 mm
2
2703-001790
L314
INDUCTOR-SMD 3.3 nH, 0.3 nH, 1.0 x 0.5 x 0.5 mm
2
2203-000386
L316
C-CERAMIC, CHIP 0.015 nF, 5 %, 50 V, NP0, TP, 1005
2
2703-001747
L317
INDUCTOR-SMD 4.7 nH, 0.3 nH, 1.0 x 0.5 x 0.5 mm
2
2703-001747
L318
INDUCTOR-SMD 4.7 nH, 0.3 nH, 1.0 x 0.5 x 0.5 mm
2
2703-001728
L322
INDUCTOR-SMD 1.5 nH, 0.3 nH, 1 x 0.5 x 0.5 mm
2
2703-001733
L323
INDUCTOR-SMD 8.2 nH, 5 %, 1 x 0.5 x 0.5 mm
2
2703-002028
L324
INDUCTOR-SMD 12 nH, 5 %, 1.0 x 0.5 x 0.5 mm
2
2703-002039
L325
INDUCTOR-SMD 16 nH, 5 %, 2.29 x 1.73 x 1.52 mm
2
2703-001722
L326
INDUCTOR-SMD 18 nH, 5 %, 1.0 x 0.5 x 0.5 mm
2
2703-001747
L327
INDUCTOR-SMD 4.7 nH, 0.3 nH, 1.0 x 0.5 x 0.5 mm
2
2703-001733
L334
INDUCTOR-SMD 8.2 nH, 5 %, 1 x 0.5 x 0.5 mm
2
2703-001786
L335
INDUCTOR-SMD 10 nH, 5 %, 1.0 x 0.5 x 0.5 mm
2
2703-001729
L338
INDUCTOR-SMD 1.8 nH, 0.3 nH, 1 x 0.5 x 0.5 mm
2
2703-001181
L339
INDUCTOR-SMD 27 nH, 10 %, 1 x 0.5 x 0.5 mm
2
2007-001298
L341
R-CHIP 51 ohm, 5 %, 1/16 W, DA, TP, 1005
2
2703-001790
L343
INDUCTOR-SMD 3.3 nH, 0.3 nH, 1.0 x 0.5 x 0.5 mm
2
2703-000175
L344
INDUCTOR-SMD 270 nH, 10 %, 0.8 x 1.6 x 0.8 mm
2
2806-001242
OSC301
OSCILLATOR-VCO 998-1025/2059-2121M, -, -, TP, 2.7 V, 10mA
2
2809-001242
OSC302
OSCILLATOR-VCTCXO 14.4 MHz, 2ppm, 0.2ppm, TP, 2.8 V, -
2
2806-001243
OSC303
OSCILLATOR-VCO 175.05/210.09 MHz, -, -, TP, 2.7 V, 5mA
2
0504-000172
Q101
TR-DIGITAL RN2104, PNP, 100 mW, 47K/47K, SSM, TP
2
0504-000172
Q102
TR-DIGITAL RN2104, PNP, 100 mW, 47K/47K, SSM, TP
2
0501-002318
Q103
TR-SMALL SIGNAL UMW8N, NPN, 150 mW, UMT6, TP, 27-270
2
0504-000168
Q201
TR-DIGITAL RN1104, NPN, 100 mW, 47K/47K, SSM, TP
2
0504-000172
Q202
TR-DIGITAL RN2104, PNP, 100 mW, 47K/47K, SSM, TP
Level
SEC CODE
Design LOC
DESCRIPTIONS
SAMSUNG Proprietary-Contents may change without notice
2-10
STH-A225 Electrical Parts List
2
0501-000225
Q203
TR-SMALL SIGNAL 2SC4617, NPN, 200 mW, EM3, TP, 120-5
2
0501-000225
Q204
TR-SMALL SIGNAL 2SC4617, NPN, 200 mW, EM3, TP, 120-5
2
0504-000168
Q205
TR-DIGITAL RN1104, NPN, 100 mW, 47K/47K, SSM, TP
2
0505-001464
Q206
FET-SILICON SI1305DL, P, 8 V, 0.86A, 0.28 ohm, 0.26 W, SOT-323
2
0505-001469
Q301
FET-SILICON SI1902DL, N, 20 V, +-0.66A, 0.63 ohm, 0.27 W, SOT-363
2
2007-000148
R101
R-CHIP 10 kohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000148
R102
R-CHIP 10 kohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-007135
R103
R-CHIP 18 kohm, 1 %, 1/16 W, DA, TP, 1005
2
2007-000142
R104
R-CHIP 2.7 kohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-001335
R105
R-CHIP 36 kohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-001341
R106
R-CHIP 680 kohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-007943
R107
R-CHIP 560 kohm, 1 %, 1/16 W, DA, TP, 1005
2
2007-000148
R108
R-CHIP 10 kohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-007771
R109
R-CHIP 0 ohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-007771
R110
R-CHIP 0 ohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-007771
R111
R-CHIP 0 ohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-008037
R112
R-CHIP 57.6 kohm, 1 %, 1/16 W, DA, TP, 1005
2
2007-007771
R113
R-CHIP 0 ohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000151
R114
R-CHIP 15 kohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000758
R115
R-CHIP 330 kohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000758
R116
R-CHIP 330 kohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000758
R117
R-CHIP 330 kohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-001295
R118
R-CHIP 39 ohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-001295
R119
R-CHIP 39 ohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-001295
R120
R-CHIP 39 ohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-001295
R121
R-CHIP 39 ohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-001295
R122
R-CHIP 39 ohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-001295
R123
R-CHIP 39 ohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-001295
R124
R-CHIP 39 ohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-001295
R125
R-CHIP 39 ohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000162
R126
R-CHIP 100 kohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000140
R127
R-CHIP 1 kohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-001320
R128
R-CHIP 1.8 kohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000151
R129
R-CHIP 15 kohm, 5 %, 1/16 W, DA, TP, 1005
Level
SEC CODE
Design LOC
DESCRIPTIONS
SAMSUNG Proprietary-Contents may change without notice
2-11
STH-A225 Electrical Parts List
2
2007-000151
R130
R-CHIP 15 kohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-001320
R131
R-CHIP 1.8 kohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000140
R132
R-CHIP 1 kohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-001298
R133
R-CHIP 51 ohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-001298
R134
R-CHIP 51 ohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-001295
R135
R-CHIP 39 ohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000566
R136
R-CHIP 220 kohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000566
R137
R-CHIP 220 kohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000162
R138
R-CHIP 100 kohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000172
R139
R-CHIP 10 ohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000157
R140
R-CHIP 47 kohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000152
R141
R-CHIP 20 kohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000157
R142
R-CHIP 47 kohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000162
R143
R-CHIP 100 kohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000162
R144
R-CHIP 100 kohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000162
R145
R-CHIP 100 kohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000162
R146
R-CHIP 100 kohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000029
R202
R-CHIP 0 ohm, 5 %, 1/10 W, DA, TP, 2012
2
2007-000170
R203
R-CHIP 1 Mohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000172
R206
R-CHIP 10 ohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000636
R207
R-CHIP 270 kohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000157
R208
R-CHIP 47 kohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000162
R209
R-CHIP 100 kohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000138
R210
R-CHIP 100 ohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000138
R211
R-CHIP 100 ohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000148
R213
R-CHIP 10 kohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000143
R214
R-CHIP 4.7 kohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000143
R215
R-CHIP 4.7 kohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000143
R216
R-CHIP 4.7 kohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000173
R217
R-CHIP 22 ohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000173
R218
R-CHIP 22 ohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000173
R219
R-CHIP 22 ohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000173
R220
R-CHIP 22 ohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000173
R221
R-CHIP 22 ohm, 5 %, 1/16 W, DA, TP, 1005
Level
SEC CODE
Design LOC
DESCRIPTIONS
SAMSUNG Proprietary-Contents may change without notice
2-12
STH-A225 Electrical Parts List
2
2007-000173
R222
R-CHIP 22 ohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000173
R223
R-CHIP 22 ohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000173
R224
R-CHIP 22 ohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000173
R225
R-CHIP 22 ohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000173
R226
R-CHIP 22 ohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000173
R227
R-CHIP 22 ohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000173
R228
R-CHIP 22 ohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000173
R229
R-CHIP 22 ohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000162
R230
R-CHIP 100 kohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000162
R232
R-CHIP 100 kohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000162
R233
R-CHIP 100 kohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000162
R234
R-CHIP 100 kohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000172
R235
R-CHIP 10 ohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000167
R236
R-CHIP 390 kohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-007573
R238
R-CHIP 330 kohm, 1 %, 1/16 W, DA, TP, 1005
2
2007-000157
R239
R-CHIP 47 kohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000758
R240
R-CHIP 330 kohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-007771
R241
R-CHIP 0 ohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000162
R242
R-CHIP 100 kohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000162
R243
R-CHIP 100 kohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000162
R244
R-CHIP 100 kohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000162
R245
R-CHIP 100 kohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000162
R246
R-CHIP 100 kohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000146
R247
R-CHIP 6.8 kohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000162
R249
R-CHIP 100 kohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000162
R250
R-CHIP 100 kohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000162
R251
R-CHIP 100 kohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000140
R252
R-CHIP 1 kohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000153
R253
R-CHIP 22 kohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000162
R254
R-CHIP 100 kohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000152
R255
R-CHIP 20 kohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-007573
R256
R-CHIP 330 kohm, 1 %, 1/16 W, DA, TP, 1005
2
2007-000172
R258
R-CHIP 10 ohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-001319
R259
R-CHIP 1.2 kohm, 5 %, 1/16 W, DA, TP, 1005
Level
SEC CODE
Design LOC
DESCRIPTIONS
SAMSUNG Proprietary-Contents may change without notice
2-13
STH-A225 Electrical Parts List
2
2007-000140
R260
R-CHIP 1 kohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000153
R261
R-CHIP 22 kohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-001325
R262
R-CHIP 3.3 kohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-007771
R264
R-CHIP 0 ohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000138
R265
R-CHIP 100 ohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000138
R266
R-CHIP 100 ohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000138
R267
R-CHIP 100 ohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000138
R268
R-CHIP 100 ohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000138
R269
R-CHIP 100 ohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000138
R270
R-CHIP 100 ohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000138
R271
R-CHIP 100 ohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000162
R273
R-CHIP 100 kohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000148
R274
R-CHIP 10 kohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000162
R275
R-CHIP 100 kohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000162
R276
R-CHIP 100 kohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-007771
R278
R-CHIP 0 ohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000173
R279
R-CHIP 22 ohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-007771
R280
R-CHIP 0 ohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000148
R281
R-CHIP 10 kohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-007771
R282
R-CHIP 0 ohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-001319
R301
R-CHIP 1.2 kohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-007771
R302
R-CHIP 0 ohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-003112
R303
R-CHIP 27 ohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-003013
R304
R-CHIP 2.4 kohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000172
R306
R-CHIP 10 ohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000172
R307
R-CHIP 10 ohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-007771
R308
R-CHIP 0 ohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-001311
R309
R-CHIP 270 ohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-003112
R310
R-CHIP 27 ohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000172
R311
R-CHIP 10 ohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000143
R312
R-CHIP 4.7 kohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000140
R313
R-CHIP 1 kohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000174
R314
R-CHIP 47 ohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-001323
R315
R-CHIP 3 kohm, 5 %, 1/16 W, DA, TP, 1005
Level
SEC CODE
Design LOC
DESCRIPTIONS
SAMSUNG Proprietary-Contents may change without notice
2-14
STH-A225 Electrical Parts List
2
2007-000932
R316
R-CHIP 470 ohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-003112
R318
R-CHIP 27 ohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-003112
R319
R-CHIP 27 ohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000143
R320
R-CHIP 4.7 kohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000148
R321
R-CHIP 10 kohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000932
R322
R-CHIP 470 ohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000242
R323
R-CHIP 1.5 kohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000143
R324
R-CHIP 4.7 kohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-003112
R325
R-CHIP 27 ohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-003112
R326
R-CHIP 27 ohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-001339
R327
R-CHIP 180 kohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-003112
R328
R-CHIP 27 ohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-003112
R329
R-CHIP 27 ohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000138
R330
R-CHIP 100 ohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000140
R331
R-CHIP 1 kohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000172
R332
R-CHIP 10 ohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000143
R333
R-CHIP 4.7 kohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000138
R334
R-CHIP 100 ohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000566
R336
R-CHIP 220 kohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000148
R337
R-CHIP 10 kohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-007771
R338
R-CHIP 0 ohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000140
R339
R-CHIP 1 kohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-007771
R340
R-CHIP 0 ohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-007200
R341
R-CHIP 2.4 ohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000143
R342
R-CHIP 4.7 kohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000143
R343
R-CHIP 4.7 kohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000172
R344
R-CHIP 10 ohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000144
R345
R-CHIP 5.1 kohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-001316
R346
R-CHIP 820ohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-007771
R347
R-CHIP 0 ohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000138
R349
R-CHIP 100 ohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000172
R350
R-CHIP 10 ohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000138
R354
R-CHIP 100 ohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000138
R355
R-CHIP 100 ohm, 5 %, 1/16 W, DA, TP, 1005
Level
SEC CODE
Design LOC
DESCRIPTIONS
SAMSUNG Proprietary-Contents may change without notice
2-15
STH-A225 Electrical Parts List
2
2007-000172
R356
R-CHIP 10 ohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-007771
R357
R-CHIP 0 ohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000159
R359
R-CHIP 56 kohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000162
R361
R-CHIP 100 kohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000155
R362
R-CHIP 27 kohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000141
R363
R-CHIP 2.2 kohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000775
R368
R-CHIP 33 kohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000141
R369
R-CHIP 2.2 kohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-001298
R371
R-CHIP 51 ohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000172
R373
R-CHIP 10 ohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-007771
R374
R-CHIP 0 ohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000168
R375
R-CHIP 470 kohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000145
R378
R-CHIP 6.2 kohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000172
R379
R-CHIP 10 ohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000172
R380
R-CHIP 10 ohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-001298
R381
R-CHIP 51 ohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000162
R382
R-CHIP 100 kohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000172
R383
R-CHIP 10 ohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000151
R385
R-CHIP 15 kohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-001333
R386
R-CHIP 18 kohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000162
R387
R-CHIP 100 kohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000172
R389
R-CHIP 10 ohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000172
R390
R-CHIP 10 ohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000142
R391
R-CHIP 2.7 kohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000140
R392
R-CHIP 1 kohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-001323
R393
R-CHIP 3 kohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-007771
R405
R-CHIP 0 ohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-007090
R406
R-CHIP 11 kohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-007771
R407
R-CHIP 0 ohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-000138
R409
R-CHIP 100 ohm, 5 %, 1/16 W, DA, TP, 1005
2
2007-007771
R410
R-CHIP 0 ohm, 5 %, 1/16 W, DA, TP, 1005
2
1404-001165
TH101
THERMISTOR-NTC 10 kohm, 3 %, 4100 K, 30 mW/C, TP
2
1205-001826
U101
IC-TRANSCEIVER D5204-22, TQFP, 80P, 470MIL, PLASTIC, 3.6 V, -, -
2
1203-001979
U103
IC-VOLTAGE REGULATOR 5320, SSOP, 8P, 110MIL, PLASTIC, 6.12 V, 300
Level
SEC CODE
Design LOC
DESCRIPTIONS
SAMSUNG Proprietary-Contents may change without notice
2-16
STH-A225 Electrical Parts List
2
0506-001054
U104
TR-ARRAY IMD10A, NPN/PNP, 2, 300 mW, SMT6, TP, 68-/100-600
2
1201-001639
U105
IC-AUDIO AMP 4882, SOP, 8P, 118MIL, -, -, PLASTIC, 5.5 V, -, -40to+85C,
2
1203-001917
U106
IC-VOLTAGE REGULATOR 5213, SOT-23, 5P, 50MIL, PLASTIC, 3.3, 222
2
2801-004025
U202
CRYSTAL-UNIT 0.032768 MHz, 20ppm, 28-ABK, 1.7fF, 65 kohm, TP
2
1205-001831
U203
IC-TRANSCEIVER D5205, BGA, 192P, 550MIL, PLASTIC, 3.6 V, -, -
2
4302-001119
U204
BATTERY-LI(2ND) 3 V, 0.1 mAh, -, -, 3.1 V, -
2
1107-001227
U206
IC-FLASH MEMORY 28F3204, 2M x 16Bit, CSP, 72P, 315MIL, 110nS, 3 V,
2
1203-001979
U207
IC-VOLTAGE REGULATOR 5320, SSOP, 8P, 110MIL, PLASTIC, 6.12 V,
2
0506-001054
U208
TR-ARRAY IMD10A, NPN/PNP, 2, 300 mW, SMT6, TP, 68-/100-600
2
0505-001462
U209
FET-SILICON 1905, P, -8 V, 0.6A, 0.51 ohm, 0.3 W, SOT-363
2
1203-001302
U210
IC-POSI.ADJUST REG. 5205, SOT-23, 5P, 119MIL, PLASTIC,
2
0505-001462
U211
FET-SILICON 1905, P, -8 V, 0.6A, 0.51 ohm, 0.3 W, SOT-363
2
1203-001979
U212
IC-VOLTAGE REGULATOR 5320, SSOP, 8P, 110MIL, PLASTIC, 6.12 V, 300
2
0505-001462
U213
FET-SILICON 1905, P, -8 V, 0.6A, 0.51 ohm, 0.3 W, SOT-363
2
1203-001835
U214
IC-RESET 3470, SOT23, 5P, -, PLASTIC, 0.99/1.01 V, 300 mW, -
2
1203-002129
U215
IC-VOLTAGE REGULATOR 71622, SOT-23, 5P, 62MIL, PLASTIC, 2.14/2.26
2
1201-001609
U301
IC-RF AMP 2363, SOP, 8P, 62MIL, DUAL, 18dB, PLASTIC, 5 V, -, -
2
3705-001178
U302
CONNECTOR-COAXIAL SMC, JACK, 100 Mohm, 50 ohm, .5DB
2
1205-001986
U304
IC-MIXER UPC8015GK-9EU, TQFP, 80P, 472MIL, PLASTIC, 3 V, -,
2
1201-001634
U305
IC-POWER AMP 2162, LCC, 16P, 157MIL, -, 29dB, PLASTIC , 5.2 V, -, -
2
1201-001006
U306
IC-OP AMP 7101, SOT-23, 5P, -, SINGLE, -, PLAS
2
1201-001636
U307
IC-RF AMP 2376, SOT-23, 6P, 63MIL, SINGLE, 27dB, PLASTIC, 3.3 V, -, -
2
0801-000022
U310
IC-CMOS LOGIC 7S00, NAND GATE, SOP, 5P, 49MIL, SINGLE, TP,
2
0505-001165
U311
FET-SILICON SI3443D V, P, -20 V, +-3.5 mA, 65 Mohm
2
3722-001456
U313
JACK-PHONE 2P, 2.6PI, A uF, BLK, -
2
0406-001083
ZD101
DIODE-TVS -, 6.1/-/7.2 V, 150 W, SOT-323-5L
2
0406-001083
ZD102
DIODE-TVS -, 6.1/-/7.2 V, 150 W, SOT-323-5L
2
0406-001083
ZD103
DIODE-TVS -, 6.1/-/7.2 V, 150 W, SOT-323-5L
2
0406-001083
ZD104
DIODE-TVS -, 6.1/-/7.2 V, 150 W, SOT-323-5L
2
0406-001113
ZD201
DIODE-TVS ESDA5V3L, 5.3/-/5.9 V, 300 W, SOT-23
2
0406-001083
ZD202
DIODE-TVS -, 6.1/-/7.2 V, 150 W, SOT-323-5L
2
0406-001083
ZD203
DIODE-TVS -, 6.1/-/7.2 V, 150 W, SOT-323-5L
2
0406-001083
ZD204
DIODE-TVS -, 6.1/-/7.2 V, 150 W, SOT-323-5L
2
0406-001083
ZD205
DIODE-TVS -, 6.1/-/7.2 V, 150 W, SOT-323-5L
2
0404-001110
ZD206
DIODE-SCHOTTKY RB751S-40, 40 V, 30 mA, SOD-523, TP
2
0404-001110
ZD207
DIODE-SCHOTTKY RB751S-40, 40 V, 30 mA, SOD-523, TP
Level
SEC CODE
Design LOC
DESCRIPTIONS
SAMSUNG Proprietary-Contents may change without notice
3-1
3. STH-A225 Exploded View and its Parts List
1. Cellular phone Exploded View
SAMSUNG
SAMSUNG
1
3
4
5
2
6
7
8
10
9
11
15
16
12
13
14
17
18
19
SAMSUNG Proprietary-Contents may change without notice
3-2
STH-A225 Exploded view and its Part List
2. Cellular phone Parts List
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
FOLDER UPPER
SCREW MACHINE
LCD
MOTOR
SPEAKER
SUA, FOLDER LOWER
LCD WINDOW
SUA, FRONT COVER ASS’Y
VOLUME EKY ASS’Y
KEY PAD
MIC HOLDER
KEY PCB
MIC
SHIELD COVER
MAIN PBA
ANTENNA
SUA, REAR COVER
SCREW MACHINE
BATTERY
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
Description
Remark
SEC CODE
Gold
Silver
Location
No.
colombia
900mAh
GH72-01977B
GH72-01977F
6001-000876
GH07-00092A
3101-001239
3001-001220
GH75-00851B
GH72-00515J
GH75-00848B
GH75-00852B
GH73-00156G
GH73-00547A
GH59-00174A
GH59-00299A
GH72-01980A
GH92-00829A
GH42-00160B
GH75-00849B
6001-001057
GH43-00360B
GH72-01977A
GH72-01977E
6001-000876
GH07-00092A
3101-001239
3001-001220
GH75-00851A
GH72-00515J
GH75-00848A
GH75-00852A
GH73-00156G
GH73-00547A
GH59-00174A
GH59-00299A
GH72-01980A
GH92-00829A
GH42-00160A
GH75-00849A
6001-001057
GH43-00360B
STH-A225 Exploded view and its Part List
SAMSUNG Proprietary-Contents may change without notice
3-3
3. Test Jig
(GH80-00614A)
4. TC
(GH44-00145G) 110V
Mexico, Colombia, Brazil
Serial Cable
Power Supply Cable
5. RF Test Cable
(GH39-00093A)
6. Cigarette Lighter Adaptor
(GH44-00091A)
7. Test Cable
(GH39-00092A)
SAMSUNG Proprietary-Contents may change without notice
4-1
4. STH-A225 Block Diagrams
1. Base Band Part Block Diagram
SAMSUNG Proprietary-Contents may change without notice
4-2
STH-A225 Block diagrams
2. Radio Part Block Diagram
SAMSUNG Proprietary-Contents may change without notice
4-3
STH-A225 Block diagrams
MEMO
SAMSUNG Proprietary-Contents may change without notice
5-1
5. STH-A225 PCB Diagrams
1. Main PCB Top Diagram
C101
C 1 0 2
C103
C104
C105
C 1 0 6
C107
C108
C 1 0 9
C110
C 1 1 1
C113
C 1 1 4
C 1 1 5
C116
C117
C 1 1 8
C 1 3 8
C 1 3 9
C 1 4 0
C143
C 1 4 4
C145
C146
C147
C148
C149
C150
C151
C152
C154
C156
C166
C167
C168
C169
C170
C 1 7 4
C202
C220
C221
C222
C223
C224
C 2 2 5
C226
C227
C228
C229
C232
C 2 3 3
C234
C235
C236
C237
C238
C239
C243
C301
C 3 0 7
C308
C 3 1 0
C322
C323
C 3 2 4
C 3 2 6
C328
C329
C 3 3 0
C 3 3 1
C332
C336
C338
C339
C340
C 3 4 2
C 3 4 3
C346
C 3 4 8
C351
C353
C355
C356
C357
C361
C 3 6 2
C 3 6 3
C367
C368
C369
C370
C 3 7 1
C372
C373
C378
C 3 7 9
C380
C382
C 3 8 3
C 3 8 4
C 3 8 6
C387
C388
C 3 9 0
C 3 9 2
C 3 9 3
C 3 9 4
C 3 9 5
C 3 9 6
C 3 9 7
C 3 9 8
C 3 9 9
C400
C401
C402
C403
C404
C405
C406
C 4 0 7
C 4 0 8
C 4 0 9
C 4 1 0
C 4 1 1
C412
C413
C415
C 4 1 6
C417
C 4 1 8
C419
C420
C 4 2 1
C 4 2 4
C 4 2 5
C426
C 4 2 7
C428
C 4 2 9
C430
C431
C 4 3 2
C 4 3 3
C434
C435
C 4 3 6
C 4 3 7
C438
C439
C440
C441
C442
C443
C444
C445
C 4 4 6
C447
C448
C449
C 4 5 0 C 4 5 1
C452
C 4 5 5
C456
C 4 5 7
C458
C459
C 4 6 0
C 4 6 1
C 4 6 2
C 4 6 3
C464
C 4 6 5
C466
C 4 6 7
C468
C469
C 4 7 0
C471
C 4 7 3
C 4 7 4
C 4 7 5
C476
C477
C478
C479
C480
C 4 8 3
CN102
D301
D302
F301
F308
F309
F310
F311
F312
F313
F314
L 1 0 1
L102
L 3 0 1
L303
L304
L309
L310
L313
L315
L317
L318
L 3 2 2
L323
L324
L325
L326
L327
L328
L329
L330
L332
L333
L334
L335
L336
L 3 3 7
L338
L339
L 3 4 2
OSC302
OSC303
Q101
Q206
Q302
R101
R102
R103
R104
R 1 0 5
R106
R107
R108
R109
R110
R111
R112
R115
R116
R117
R129
R130
R131
R142
R143
R 2 0 3
R 2 0 7
R235
R 2 3 6
R237
R238
R240
R 2 4 2
R243
R255
R 2 5 8
R 2 7 2
R 2 7 3 R 2 7 4
R281
R301
R302
R304
R 3 0 9
R310
R 3 1 2
R316
R 3 1 7
R 3 1 8
R319
R 3 2 0
R321
R 3 2 2
R323
R 3 2 4
R327
R 3 2 8
R331
R 3 3 2
R 3 3 4
R335
R 3 3 6
R 3 3 7
R338
R339
R340
R341
R 3 4 4
R345
R346
R347
R 3 4 8
R 3 4 9
R350
R 3 5 1
R354
R355
R 3 5 6
R357
R 3 5 9
R360
R 3 6 1
R 3 6 2
R 3 6 3
R 3 6 4
R365
R366
R367
R368
R369
R370
R371
R 3 7 2
R373
R 3 7 4
R 3 7 5
R 3 7 7
R378
R380
R 3 8 1
R 3 8 2
R384
R385
R 3 8 6
R 3 8 7
R388
R 3 8 9
R392
R 3 9 3
R 3 9 6
R397
R398
R 3 9 9
R 4 0 0
R 4 0 1
R404
R406
R407
R 4 0 9
R410
TH101
U101
U103
U204
U207
U210
U211
U212
U213
U214
U215
U303
U304
U305
U306
U307
U308
U309
U310
Z D 1 0 2
ZD103
Z D 1 0 4
Z D 2 0 5
ZD206
ZD207
SAMSUNG Proprietary-Contents may change without notice
5-2
2. Main PCB Bottom Diagram
STH-A225 PCB diagrams
AN301
ANT_STOPPER
AU101
C1
12
C1
19
C1
20
C1
21
C122
C1
23
C124
C1
25
C126
C127
C1
28
C129
C130
C1
31
C132
C133
C1
34
C1
35
C136
C1
37
C141
C142
C1
53
C1
55
C157
C158
C1
59
C160
C1
61
C162
C163
C164
C165
C1
71
C172
C1
73
C1
75
C176
C177
C178
C1
79
C180
C181
C2
01
C2
03
C2
04
C205
C2
06
C207
C208
C2
09
C210
C211
C215
C216
C2
17
C2
18
C219
C2
30
C2
31
C2
40
C2
41
C2
42
C244
C3
02
C3
03
C3
04
C3
05 C306
C3
09
C3
11
C3
12
C313
C3
14
C315
C316
C3
18
C3
20
C3
21
C3
25
C327
C3
33
C335
C337
C3
41
C3
44
C3
45
C349
C350
C3
52
C3
54
C3
58
C360
C364
C365
C3
66
C3
74
C375
C376
C3
77
C381
C4
53
C454
C4
72
C4
82
CN101
CN201
D101
D102
D103
D1
04
D105
D202
D2
03
D2
04
D2
05
F302
F304
F306
L1
03
L1
04
L105
L302
L305
L3
06
L307
L3
08
L311
L3
12
L3
14
L3
16
L3
31
L341
L343
L344
OSC301
Q102
Q103
Q201
Q202
Q203
Q204
Q205
Q301
R1
13
R1
14
R118
R1
19
R120
R121
R122
R123
R124
R125
R1
26
R127
R128
R132
R133
R134
R135
R136
R137
R1
38
R1
39
R140
R141
R144
R145
R201
R202
R206
R2
08
R2
09
R210
R211
R2
12
R213
R2
14
R2
15
R2
16
R2
17
R2
18
R2
19
R2
20
R2
21
R2
22
R2
23
R2
24
R2
25
R2
26
R2
27
R2
28
R229
R230
R231
R2
32
R233
R234
R239
R2
41
R244
R2
45
R2
46
R247
R248
R249
R2
50
R2
51
R252
R2
53
R2
54
R2
56
R2
57
R2
59
R260
R2
61
R2
62
R2
63
R2
64
R265
R266
R267
R268
R269
R270
R271
R275
R276
R2
78
R2
79
R2
80
R2
82
R3
03
R305
R306
R307
R3
08
R3
11
R3
13
R314
R3
15
R3
25
R3
26
R329
R3
30
R3
33
R342
R3
43
R376
R379
R3
83
R390
R391
R402
R4
05
R4
08
U104
U105
U106
U202
U203
U206
U208
U209
U301
U302
U311
U313
ZD101
ZD201
ZD202
ZD203
ZD
20
4
SAMSUNG Proprietary-Contents may change without notice
10-1
10. STH-A225 Circuit Description & Circuit Diagrams
STH-A225 provides the AMPS and the Digital TDMA (cellular band only) of compliance with TIA/EIA-137.
The radio operation of the STH-A225 has been implemented with the receiver, the transmitter, and the local
oscillator controlled by the PLL. The circuit of the STH-A225 is described as followings.
1. Baseband Section
1-1. Power Supply
For the POWER ON, with the battery installed on the telephone and by pressing the END key, the BATT
and ON_SW signals will be connected, which it will turn on Q204. In addition, U311 is turned on by Q204,
and thus the BATT is connected to VBAT. Consequently, VBAT is supplied to input of regulators U103 and
U215. The regulator U103 supplies all powers of baseband part (VCC, AVCC, V_VCTCXO). The regulator
U215 supplies IVCC (2.2 V) to Baseband Engine Chip (U203: BEC). The BEC (U203), which is supplied
power from VCC, IVCC and reference clock 14.4 MHz from TCXO (OSC302), will start to run. If BEC will
start to run normally, the BEC output POWER_HOLD signal (low active) which is connected to Q202.
Moreover, Q202, Q204 and U311 are turned on in order. In consequence, BATT is connected to VBAT
continuously. Although END key is released (ON_SW disconnected BATT). The power from U103 and
U215 is used in all baseband part of BEC, IFC (Interface Chip U101).
For the POWER OFF, in this case main application program is running already. The main application
program is checking all GPIO inputs periodically. When press the END key during program is running, the
BATT and ON_SW signals will be connected. This turns on Q204. Therefore, ON_SW_SENSE that is
connected to GPIO_0_5 (U203_ C13) turned logic high to low. The BEC checks this signal, main application
program enter to POWER OFF mode.
1-2. BEC (U203) interface
The BEC (U203) is mainly consist of two parts HOST CPU and Baseband Engine (Figure1). This is an
important component of dual-mode (US-TDMA and AMPS mode) cellular phone. It has 1Kx 32 of internal
ROM and 2Kx32 of internal RAM. This is communicate with a lot of peripheral device, memory (SRAM,
ROM), Key Pad and LCD module. The BEC receives TCXO clock signals from the TCXO and controls the
phone during the operation. The BEC communicates with the IFC through several serial links. These
include CODEC, wideband data, receiver data, transmitter data, and auxiliary data interface Signals.
A master baseband clock (BBCLK: U203_H2) at either 6.2208 MHz or 5.12 MHz or 4.096 MHz, depending
on the operating mode, from the BEC drives the IFC. The major components are as follows:
Separate address and data buses provide a data path to external memory and memory mapped
peripherals. The 22-bit address bus provides a byte addressing range up to 8 MB in each of 4 spaces
decoded by the 4 select signals. The 16-bit data bus in conjunction with the UBE signal allows word or byte
transfers. Table1 shows the ARM memory map. An Intel 28F3204 Stacked Memory chip supplies 4M Bytes
of Flash memory and 512 KBytes of SRAM. Note that in the phone, the SRAM is located at the CS_RES1
block of memory.
SAMSUNG Proprietary-Contents may change without notice
10-2
STH-A225
Circuit Description & Circuit Diagrams
Figure1. BEC interface and block diagram
SAMSUNG Proprietary-Contents may change without notice
10-3
STH-A225
Circuit Description & Circuit Diagrams
Table1. ARM Memory Map
ARM Memory Map
ARM Address Range
Data
Block Size
Device Name
Remarks
0000 0000
0000 0003
32
4 Byte
Internal ROM
R
0000 0004
0000 1FFF
32
8K Byte
Internal RAM
R/W
0002 0000
0002 0FFF
32
4K Byte
Internal ROM
R
0004 0000
0005 FFFF
32/16
NA
Internal Peripherals
R/W
0080 0000
00FF FFFF
8/16
Up to 8 M Byte
SRAM_CS
R/W
0100 0000
017F FFFF
8/16
Up to 8 M Byte
FLASH_CS
R/W
0180 0000
01FF FFFF
8/16
Up to 8 M Byte
CS_RES1
R/W
0200 0000
027F FFFF
8/16
Up to 8 M Byte
CS_RES2
R/W
HOST CPU (inside of BEC:U203)
ARM7TDMI 32-bit microprocessor is used for the main call processing. The CPU controls all the circuitry. The
reference clock 14.4 MHz, coming from the output of the TCXO (OSC302), is connected to VCTCXO_IN (pin
F3). For the power fail mode and the sleep mode, additional crystal oscillator (U202) of 32.768kHz is connected
to pin B2 of the BEC. The interface circuitry consists of reset circuit, address bus (A0-A21), data bus (AD0-
AD15), control signals (MEMWEB, MEMOEB, SRAM_CS, FLASH_CS, DISPLAY_CS, UBE etc), GPIOs, and the
communication ports. The communication ports includes the UART1 and 2, the JTAG, and the SCI. The UART1
supports HP equipment interface, down loading, and data service. The UART2 and the JTAG are used for the
software debugging. The SCI supports the Diagnostic Monitor (DM) function.
FLASH ROM (inside of U206)
The 32Mbit FLASH ROM is used to store code of the application program. Using the down-loader program,
this application program can be changed even after the mobile is fully assembled.
SRAM (inside of U206)
The 4Mbit SRAM is used to store the internal flag information, call processing data, and timer data.
Key Pad Module
The Key Pad module is connected to main board by connector, CN201-1. For key-press recognition, the
structure of key is consisted of 8 x 3 matrix, which is used GPIO input signal SCAN0-7 and GPIO output signal
KEY0-2 of BEC. In addition, this module contains Micro-phone and six backlight LEDs that will help to operate
phone in the dark.
LCD Module
LCD module is connected to main board by connector, CN101. This contains an LCD controller, an EL (Electro-
Luminescent) driver, a speaker, and a vibrator. An LCD controller controls the information of displaying from
the BEC (parallel 8-bit data) to the LCD. The EL driver IC turns on and off the EL dacklight.
Baseband Engin (inside of U203)
This part mainly interface with IFC (U101) and RF part. As for interface of IFC, that will be explained detail in
next section. As important signals are PREAMP_G for receiver path, PA-GATE, ALC_EN for transmitter path,
PLL_DATA, PLL_CLK, PLL_STRB1 for PLL synthesizer, RX_BAT, TX_BAT for power management.
SAMSUNG Proprietary-Contents may change without notice
10-4
STH-A225
Circuit Description & Circuit Diagrams
1-3. IF INTERFACE CHIP (IFC :U101)
The IFC provides the radio IF and audio interfaces (Figure2). Differential Rx I/Q and Tx I/Q signal pairs
interface directly with the RF interface chip (RFIC : U304) device. MOD, AFC, AGC, RSSI, and PA_CNT signals
also directly control the radio circuitry. Three audio paths are implemented. The primary path utilizes the
microphone and speaker, located on the keypad and display board respectively. Both microphone and speaker
utilize the main differential circuits in the IFC to minimize noise pickup. The speaker output is amplified
internally to enable direct connection to the speaker. The second audio path connects to the headset jack. The
headset microphone and speaker are passed to the IFC’s auxiliary input and output, respectively. The headset
jack terminals indicate via the HEADSET_SENSE line when the headset is present as well as when the headset
button is pushed via the SEND_END line. The third audio path to the HFK shares the auxiliary output with the
headset for its speaker and uses the second auxiliary input for its microphone. Since the auxiliary output is not
internally amplified, an external audio amplifier is applied before connection to the two headset and HFK.
Figure 2. IFC interface and block diagram
SAMSUNG Proprietary-Contents may change without notice
10-5
STH-A225
Circuit Description & Circuit Diagrams
The IFC (U101) is mainly consist of IF interface part and AUDIO CODEC part. The IF interface part, witch is
between RF part (mainly U304) and BEC, translate RF data to baseband data for BEC. Mainly, IF interface part
is consist of receiver, transmitter, and some kind of RF control. The IFC also provides several A/D inputs to
monitor system parameters. Battery voltage is periodically measured after scaling via a resistor divider
(BAT_MON: U101_67). A thermistor located near the PA is monitored to obtain temperature status by
TMP_MON (U101_66). Finally, a voltage level from the battery case, identifying the type of battery, is measured
by AUX_MON (U101_65).
Receiver Interface
The U101 receive differential I/Q signals (RX_IN, RX_I, RX_QN, RX_Q: U101_48,49,50,51), or DEMOD signal
(U101_52) which come from RF demodulator (U304_11,12,9,10,16), and translate as digital data. These data is
synchronized by control signals (RX_SYNC, RX_CLK, and BBCLK: U101_31,32,40) is transported to BEC
through RX_DATA (pin U101_30). In addition, the U101 uses AGC_OUT (U101_72) for dynamic range of
receiver signal strength connected to U304_17, AFC_OUT (U101_71) for adjusting reference frequency exactly
connected to TXCO (OSC302_1).
Transmitter Interface
The U101 receives TX_DATA1 (U101_36) synchronized by control signals (TX_SYNC, TX_CLK: U101_33,34),
which come from BEC, and translate this data as differential I/Q signals (TX_IN, TX_I, TX_QN, TX_Q :
U101_61,60,58,57), or MOD signal (U101_63). It transport this data to RF modulation part. In addition, the U101
uses PA_CNT (U101_73),TX_PWR (U101_68) for controlling power of transmitter.
Audio Codec
Three audio paths are implemented in IFC. The primary path utilizes the microphone (U101_11,12) and speaker
(U101_77,79), located on the keypad module and LCD module boards, respectively. Both microphone and
speaker utilize the main differential circuits in the IFC to minimize noise pickup. The speaker output is
amplified internally to enable direct connection to the speaker. The second audio path connects to the headset
jack. The headset microphone and speaker are passed to the IFC’s auxiliary input (U101_5) and output
(U101_2), respectively. The headset jack terminals indicate via the HS_SENSE (Q103_4) to GPIO of BEC
(U203_C11) when the headset is present. As well as when the headset button is pushed via the SEND_END
(Q103_5) to GPIO of BEC (U203_A13). The third audio path to the HFK shares the auxiliary output with the
headset for its speaker and uses the second auxiliary input for its microphone. Since the auxiliary output is not
internally amplified, an external audio amplifier (U105) is applied before connection to the headset and HFK.
SAMSUNG Proprietary-Contents may change without notice
10-6
STH-A225
Circuit Description & Circuit Diagrams
2. RF Section
2-1.Introduction
From the starting point of developing the STH-A225, the cellular and the PCS band operations have been
intended. Therefore, the STH-A225 contains many dual-band components and rooms for PCS band
components, in order to widen the operating band for the next product. The active components is playing
essential role in the radio part are U301 (dual-band LNA), U305 (Cellular band power amplifier), U304
(transceiver including up/down converter, RF and IF PLLs, Rx and Tx AGCs, IQ modulator and
demodulator, limiter, and discriminator), OSC301 (dual-band RF VCO), and OSC303 (dual-band IF VCO).
In order to obtain good selectivity and sensitivity simultaneously, STH-A225 has dual IF conversion
system. The 1st IF and 2nd IF are 130.05 MHz and 450 kHz, respectively.
2-2.Front-End part
RF signal from the air interface passes F305 (diplexer) and F306 (duplexer). The purpose of F305 is the
band selection in conjunction with U303 (SPDT switch) according to the band control signal from the
baseband chipset. F306 plays the role of Rx and Tx filtering and the isolation between Rx and Tx in the
cellular band (AMPS and Digital TDMA).
2-3.Receiver
The Rx signal from F306 goes into U301. U301 amplifies the very weak Rx signal with adding the
negligible thermal noise. U301 features 20 dB gain, 1.3 dB NF, and 7 mA current consumption. For the
wider dynamic Rx AGC (automatic gain controller) range, the gain of U301 is controlled by PREAMP_G
signal coming from U203, resulting in around 30-dB step gain change. By checking the RSSI, U203 decides
to whether turn on U301 or not. The amplified signal goes into F304 (RF SAW filter) in order to suppress
the unwanted band data.
The signal coming out from F304 inflows to the pin 45 (1st Rx mixer input) of U304, and it is
downconverted to the IF of 130.05 MHz. This 1st mixer has around 7 dB conversion gain, 6dB NF, and 5
dBm IIP3. For the downconversion, the local frequency source from OSC301 (dual RF VCO) is used. As for
the local frequency, the Rx frequency plus 1st IF (that is, high injection type local frequency) is used, and
this frequency is controlled by the RF PLL in U304 in conjunction with U203 (baseband IC).
The 1st mixer output is connected to F302 (130.05 MHz 1st IF SAW filter). The main role of F302 is
suppression of undesirable interferers. For the 2nd IF conversion, the output of F302 is connected to the
2nd Rx mixer of U304. The 2nd mixer has the typical characteristics of 13.5 dB gain, 12 dB NF, and -20 dBm
IIP3. The local frequency source for making 2nd downconversion is supplied from U304 internally by 9
times multiplying the fundamental frequency of OSC302 (14.4 MHz VC-TCXO). The downconverted signal
passes F301 (450 kHz Ceramic filter) in order to suppress the unwanted interferers and the image
frequency signals.
Until now, the Rx signal path is common for both of AMPS and Digital TDMA. From the filtered 450 kHz
signal output, AMPS path and TDMA path become separate for proper treating of the Rx signal. To begin
with, AMPS path will be described.
SAMSUNG Proprietary-Contents may change without notice
10-7
STH-A225
Circuit Description & Circuit Diagrams
AMPS (Limiting and Discrimination)
The downconverted signal from the output of F301 enters to the limiter and discriminator of U304. For the
better suppression of the unwanted interferers, discrete LC filter is used in the limiter section. The signal
through the limiter goes into the discriminator (or quadrature detector) of U304 with incorporation of the
quadrature tank circuit (LC resonator) placed outside of U304, and thus the audio signal comes out from the
pin 16 of U304. This demodulated signal is connected to U101.
TDMA (Rx AGC and I, Q Demodulator)
The downconverted signal from the output of F301 enters to the Rx AGC and I, Q demodulator of U304. The
Rx AGC has the performance of 80-dB dynamic range, 10 dB NF, and -85 dBm IIP3. In the process of I, Q
demodulation, 450 kHz local signal, made by dividing 14.4 MHz reference clock, is used.
2-4.Transmitter
In the AMPS mode, Mod signal from U101 (interface IC) is applied to the tuning voltage terminal of
OSC303 (175.05 MHz IF VCO) with the internal IF PLL of U304. In the TDMA mode, Tx I, Q signals
coming from U101 are applied to the I,Q modulator.
The modulated signal goes into the Tx AGC of U304. The Tx AGC has the 65-dB dynamic range.
The output of the Tx AGC enters the upconverter of U304. For the upconversion, the local frequency
source from OSC301 (dual RF VCO) is used, as well. The typical output power of the upconverter is -10
dBm at MAC: 0000. The ACPR of the upconverter is 32 dB at adjacent channel and 60 dB at alternate
channel.
The upconverted signal passes through F310, U307, and F309. F309 and F310 are same RF Tx SAW filters.
U307 (Tx driver) performs the amplification of the input signal by 27 dB, in order to provide enough input
power into U305 (power amplifier). The ACPR of U307 is 33 dB at adjacent channel and 61 dB at alternate
channel.
U305 has 30-dB linear gain, and maximum output power of 31 dBm (AMPS) and 30 dBm (TDMA). The
ACPR of U305 is 29 dB at adjacent channel and 49 dB at alternate channel. This satisfies the TIA/EIA-136
specification. The output power of U305 is transmitted to F313 (Cellular band coupler) in order to help the
Tx power control by using the power detector diode. In result, the Tx power is transmitted to the air
interface via an antenna.
SAMSUNG Proprietary-Contents may change without notice
10-8
STH-A225
Circuit Description & Circuit Diagrams
2-5. Radio component control
U101 monitors the state of the radio part, and delivers the information to U203. Then, U203 sends the
proper control signals to radio relating regulators and AGCs. The radio interface signals are summarized in
the Table 2.
Table 2. Radio Interface Signals
Signal Name
Source/Destination
Function
PON_LD
BEC/RFIC
Limiter/Discriminator power control
TX_RFBAND
BEC/IF VCO
Tx band control (0=PCS, 1=Cell)
VCTCXO_IN
TCXO/BEC
14.4 MHz clock
VCTCXO_PC
BEC/TCXO
14.4 MHz clock power control
PLL_DATA
BEC/RFIC
PLL serial data
PLL_CLK
BEC/RFIC
PLL serial clock
PLL_STRB1
BEC/RFIC
PLL serial strobe
RF_BAND
BEC/Various
Cell/PCS band select (0=Cell, 1=PCS)
PREAMP_G
BEC/Regulator
Rx AGC Gain step
RX_BAT
BEC/RFIC
Receiver power control
TX_BAT
BEC/RFIC
Transmitter power control
ANALOG_DIG
BEC/Oscillators
Band control (0=Analog, 1=Digital)
LOCK_DET
RFIC/BEC
PLL lock detect status
PLL_ON
BEC/Regulator
PLL power control(V_RF1:RFIC)
A_IF_IN
RFIC/IFC
IF comparator input
RX_Q, RX_QN
RFIC/IFC
Differential analog receive Q channel
RX_I, RX_IN
RFIC/IFC
Differential analog receive I channel
TX_Q, TX_QN
IFC/RFIC
Differential analog transmit Q channel
TX_I, TX_IN
IFC/RFIC
Differential analog transmit I channel
MOD
IFC/RFIC
Drive to modulator
TX_PWR
Detector/IFC
Tx power detector
RSSI
RFIC/IFC
Rx Signal Strength Indicator
AFC_OUT
IFC/VCTCXO
Auto Frequency Control voltage
AGC_OUT
IFC/RFIC
Auto Gain Control voltage
PA_CNT
IFC/RFIC
Power Amplifier control voltage
DEMOD
RFIC/IFC
Discriminator output
TXDA_REF
RFIC/IFC
Tx section common mode DC bias
PON_TX
BEC/Regulator
TX up converter power (V_RF2:RFIC)
PON_VRF3
BEC/Regulator
Local Amp power(V_RF3:RFIC)
SAMSUNG Proprietary-Contents may change without notice
10-9
NOTE:PLACE THESE CAP. AS CLOSE AS
NOTE: GPIO INTERNAL PULL-UP
NOTE: THE RESISTOR FOR OPT BEAD
POSSIBLE TO IFIC MIC+ AND MIC- PINS
STH-A221_IFIC
39
C154
R120
10PF
C151
C102
100NF
1UF
6.3V
10UF
C107
C148
C117
100NF
22PF
R117
NC
330K
C126
68PF
C147
23
20
22
R142
C129
47K
100NF
C161
NC
C112
100NF
VBAT
6.3V
2.2UF
C149
C171
NC
C138
NC
1
2
3
45
6
C139
U104
NC
100NF
C110
R141
20K
C115
100NF
1
2
3
4
5
ZD102
C153
12PF
8
C173
100PF
6
NC
C137
Q101
2
3
1
TH101
D101
100NF
C160
C122
68PF
R129
ZD104
1
2
3
4
5
15K
CE1
CE2
6
5
CE3
GND
4
VDD
8
VOUT1
1
2
VOUT2
VOUT3
3
VCC
U103
7
68PF
C120
C135
68PF
R116
330K
39
R135
2
3
4
5
68PF
C121
C177
Q103
1
10PF
C152
10PF
L105
R130
15K
18
R125
39
VCC
1.8K
R128
26
25
AU101
1
2
3
4
ZD103
1
2
3
4
5
220K
R136
R124
39
AVCC
R144
100K
R108
10K
C124
68PF
4
1
D105
39
Q102
2
3
R118
C103
10NF
R113
R112
57.6K,1%
14
0
15
13
C106
100NF
C134
68PF
VCC
51
R133
C174
100NF
C1
14
100NF
C101
100NF
9
AVCC
100PF
C179
7
10
21
L103
82nH
100NF
C111
10PF
C128
330K
36K
R115
100NF
C108
R105
15K
R114
100NF
C104
6
6
7
7
8
8
9
9
18
19
19
2
2
20 20
21
21
22 22
3
3
4
4
5
5
10
11
11
12
12
13 13
14 14
15
15
16 16
17
17
18
CN101
1
1
10
100PF
C116
VCC
10PF
C144
24
C143
100NF
NC
C159
29
30
27
VCC
NC
C146
6
XAUSO
C172
100PF
57
TX_Q
TX_QN
58
TX_SYNC
33
37
VALID_STRB
43
WBORX
WBOTX
44
XAUXI-
5
4
XAUSI2
59
TXDA_REF
TX_BAT
38
34
TX_CLK
36
TX_DATA1
TX_DATA2
35
TX_I
60
TX_IN
61
68
TX_PWR
49
RX_QN
31
RX_SYNC
22
SCLK
SEN
24
SI
23
SO
21
TIMER
17
TMP_MON
66
RSSI
69
41
RST
55
R
T_COMO
RX_CLK
32
RX_DATA
30
RX_I
50
51
RX_IN
RX_Q
48
18
MSTR
73
PA_CNT
2
RAUXO-
REC20+
79
77
REC20-
RINGER
1
RIT
O
_COMI
56
RQTI_COMO
54
20
MDA
T
12
MICI+
MICI-
11
10
MICO
MIXI
9
MOD
63
MODE_STS
26
MOD_COMD
62
45
DGND1
DGND2
46
16
DVDD
D_IF_OUT
42
70
EXT_VREF
25
FSYNC
75
IREF
MCLK
19
14
A
VDD3
74
AVDD4
AVDD5
80
47
A_IF_IN
67
BAT_MON
BBCLK
40
39
BIN
DEMOD
52
AUDCOMRD
3
8
AUDCOMT
O
29
AUX_CLK
AUX_DATA
27
AUX_MON
65
28
AUX_STRB
53
A
V
DD1
A
VDD2
13
AFC_OUT
71
72
AGC_OUT
AGND1
64
AGND2
7
78
AGND3
AGND4
15
AGND5
76
U101
C142
100NF
R109
0
R103
18K,1%
ZD101
1
2
3
4
5
AVCC
51
R134
R110
0
L101
BATT
VCC
BATT
68PF
C170
C169
68PF
C166
C168
68PF
C167
68PF
68PF
0
R111
C131
68PF
100PF
C178
68PF
C123
R107
560K,1%
R106
680K
68PF
C130
VBAT
VAUX
C176
10UF
6.3V
GND
VIN
1
VOUT
5
C181
2.2UF
6.3V
U106
4
BYP
CONT
3
2
V_VCTCXO
68PF
C125
10
R139
R143
100K
C157
R102
10K
NC
R122
39
10PF
C175
C133
68PF
82nH
L104
17
10K
R101
19
16
4
-IN
BYP
2
GND
8
7
GND
OUT
5
1
SHDN
VDD
6
U105
+IN
3
28
C140
NC
68PF
C132
VBAT
C118
R131
1.8K
100NF
100NF
C163
C158
NC
100NF
C105
R145
100K
C109
100NF
11
D102
12
D103
3
1
2
AVCC
L102
R127
VBAT
1K
R137
6.3V
10UF
C141
220K
R119
39
NC
39
C113
68PF
R121
100NF
C145
C136
1K
R132
C156
27PF
C150
10UF
6.3V
AVCC
1UF
C162
R138
100K
5
C180
27PF
C165
100NF
2.7K
R104
R126
100K
C155
12PF
R140
47K
C164
33UF
6.3V
AVCC
R123
39
2
C127
100NF
CN102-1
1
3
C1
19
68PF
AUX_ON
D104
MICRO-
KEY(1)
SCAN(7)
SCAN(5)
SCAN(3)
SCAN(1)
MICRO+
ON_SW
SCAN(6)
SCAN(4)
SCAN(2)
SCAN(0)
KEY(0)
KEY(2)
LED_ON
ALT_LED_ON
SVC_LED_ON
REED_SW
SPK-
SPK+
DISPLAY_CS
TMP_MON
RAUXO
RAUXO
AMP_AUDIO_OUT
MICRO+
MICRO-
VAUX
MEMWEB
WBDTX
DEMOD
BAT_MON
MIC-
VCTCXO_PC
V_VCTCXO
TXDA_REF
TX_CLK
TX_SYNC
TX_DATA1
AMP_EN
SCAN(5)
KEY(0)
SCAN(0)
KEY(2)
SCAN(3)
SCAN(7)
SCAN(1)
SCAN(4)
KEY(1)
SCAN(2)
SCAN(6)
RINGER
BIN
TX_BAT
IFIC_RESET
D_IF_OUT
A_IF_IN
RINGER
RX_I
RX_IN
RX_Q
RX_QN
TX_I
TX_Q
TX_QN
MIC+
TX_AUDIO
XAUXI-
MIC+
MIC-
PA_CNT
V_F
V_F_EN
HS_SENSE
SEND_END
XAUXI-
MIC+
HEADSET_SENSE
REC20-
REC20+
AFC_OUT
AGC_OUT
MOD
MODE_STS
REC20-
REC20+
RSSI
TX_IN
TX_PWR
STRB0
SCLK
DO
FSYNC
SO2
SEN
SCK
SI2
RX_DATA
RX_SYNC
RX_CLK
AUX_CLK
AUX_STRB
AUX_DATA
BBCLK
WBDRX
VALID_STRB
MEMOEB
ADD(2)_T
RESET
SPK+
SPK-
EL_EN
VIBRATOR
DATA(6)_T
DATA(2)_T
DATA(5)_T
DATA(4)_T
DATA(3)_T
DATA(1)_T
DATA(7)_T
DATA(0)_T
HEADSET_SENSE
RX_AUDIO
XAUXI-
RX_AUDIO
HEADSET_SENSE
AMP_AUDIO_OUT
MIC_BIAS_EN
MIC-
3. IFIC Circuit Diagram
STH-A225
Circuit Description & Circuit Diagrams
STH-A225
Circuit Description & Circuit Diagrams
SAMSUNG Proprietary-Contents may change without notice
10-10
U215(201,205)
C244(212,213,214)
CN201
Q207
2012
NOTE: WAITING FOR REPLAY FROM SAMSUNG ABOUT C_F PIN
NOTE: TDMA EVENT -SPARE TIMMING SIGNALS
STH-A221_BASE
D205
R282(204,277)
ZD207
1UF
TP222
1
RESERVED0
2
RESERVED1
RI
16
20
RTS
7
RX_AUDIO
11
TX_AUDIO
8
GND1
GND2
10
12
GND3
19
GND4
GND5
25
23
CTS
9
C/F1
26
C/F2
13
DP_RX_DATA
DP_TX_DATA
14
3
DSR
24
DTR
CN201
17
CD
6.3V
2.2UF
C237
1
2
3
4
5
C238
NC
ZD202
100NF
C211
ZD207
0
R264
100NF
C218
D202
C231
1NF
IVCC
22
U204
R229
R262
NC
R231
WBDTX
XIN
F1
E1
XOUT
VBAT
3.3K
TX_SYNC
UBE
T15
VALID_STRB
J1
VCTCXO
F3
E2
VCTCXO_GND
F4
VCTCXO_PC
VCTCXO_VDD
F2
WBDRX
G1
G2
TEST1
TEST2
C4
A3
TEST3
TESTER_MODE
B3
TX_BA
T
J2
TX_CLK
K2
K4
TX_DA
T
A_1
TX_DA
T
A_2
K3
K1
SRAM_CS
STROB0
B8
C8
STROB1
STROB2
C10
D10
STROB3
K14
TBREAKPT
G15
TDMA_EVENT_1
TDMA_EVENT_2
G16
B4
SEN2
SI2
N2
SIN_1
M16
T11
SIN_2
SLOT_T
D1
1
P2
SO2
L16
SOUT_1
SOUT_2
T10
P16
RI_N
R
T
S_N
T6
H13
RX_BA
T
L4
RX_CLK
RX_DATA
L2
L3
RX_SYNC
SCK2
N1
D9
SCLK
N3
POWER_HOLD
PREAMP_G
J16
PWM_0
D13
A9
PWM_1
PWM_2
B9
C9
PWM_3
RESET
A2
J15
RF_BAND
T3
PDM_1_N
D1
E4
PDM_1_P
PLL_CLK
K15
K16
PLL_DA
T
A
PLL_STRB_1
J13
J14
PLL_STRB_2
POWER_FAIL
C2
C3
MODE_STS
NOPC
B12
C1
1
NR
W
A1
OSC_32K_GND
A6
P0
P1
D7
H16
P
A_GA
T
E
D3
PDM_0_N
PDM_0_P
D2
IVDD4
LOCK_DET
G14
A1
1
MAS0
MAS1
B1
1
MCLK
A12
M15
MEM8/16
T14
MEMOEB
MEMWEB
T13
M2
F13
GP_OUT
H3
IFIC_RESET
T7
IRDA_RXD
IRDA_TXD
T9
IVDD1
R1
R16
IVDD2
IVDD3
A7
C7
D15
GPIO_0_8
GPIO_0_9
D16
A14
GPIO_1_0
GPIO_1_1
B14
C14
GPIO_1_2
GPIO_1_3
A13
B13
GPIO_1_4
GPIO_1_5
C13
A15
GPIO_0_14
GPIO_0_15
B15
F16
GPIO_0_2
GPIO_0_3
E13
E14
GPIO_0_4
GPIO_0_5
E15
E16
GPIO_0_6
GPIO_0_7
D14
FBURST
FLASH_CS
N16
FSYNC
M1
F14
GPIO_0_0
GPIO_0_1
F15
C15
GPIO_0_10
GPIO_0_1
1
C16
B16
GPIO_0_12
GPIO_0_13
A16
D_OUT
D4
EDD1
EDD2
J4
R8
EDD3
EDD4
H15
D12
EDD5
B6
EX_TX_CLK
EX_TX_DA
T
A
C6
A10
C12
DGND6
DGND7
D8
B7
DGND8
DSR_N
T2
T5
DTR_N
D_IF_OUT
H4
D_IN
B10
A8
D7
D8
P13
R14
D9
DCD_N
T4
DGND1
H1
P1
DGND2
DGND3
T8
T16
DGND4
DGND5
H14
D13
D14
N14
N15
D15
D2
P11
N11
D3
D4
R12
P12
D5
D6
N12
R13
CS_RES1
CS_RES2
M14
T1
CTS_N
D0
N10
R11
D1
D10
R15
P14
D11
D12
P15
N13
A5
BB_TICE
D5
BB_TMS
J3
BIN
T12
BOOT_MODE
BVDD
C1
CLK_SEL_0
G4
G3
CLK_SEL_1
M13
ARM_TMS
AUX_CLK
L1
AUX_DA
T
A
M3
M4
AUX_STRB
BBCLK
H2
BB_JT
AG_RESET
A4
BB_TCK
B5
C5
BB_TDI
BB_TDO
D6
A7
A8
P5
R6
A9
AGND
E3
ALC_EN
G13
ARM_TCK
K13
ARM_TDI
L15
L14
ARM_TDO
L13
A19
A2
R3
A20
R10
P10
A21
N4
A3
A4
P4
R4
A5
A6
R5
N5
A11
A12
R7
P7
A13
A14
N7
P8
A15
A16
N8
R9
A17
A18
P9
N9
U203
32K_XIN
B2
B1
32K_XOUT
A0
R2
P3
A1
A10
P6
N6
4.7K
R214
VCC
U311
1
2
5
6
3
G
4
6.3V
S-VCC
D3
S-VSS
B8
S-WE#
VPP
E4
C229
10UF
NC7
NC8
H3
H10
NC9
S-CS1# G10
D8
S-CS2
F3
S-LB#
F5
S-OE#
S-UB# F4
D9
NC1
NC10
H11
H12
NC11
NC2
A2
A11
NC3
NC4
A12
C4
NC5
NC6
H1
H2
F-OE#
F-RP# D4
D10
F-VCC
A10
F-VCCQ
H8
F-VSS
F-VSS
A9
C3
F-WE#
E3
F-WP#
A1
C9
DQ4
DQ5
C10
C8
DQ6
DQ7
B10
F8
DQ8
DQ9
F7
H7
F-CE#
H9
E8
DQ10
DQ11
E6
D7
DQ12
DQ13
C7
B9
DQ14
DQ15
B7
E9
DQ2
DQ3
E10
H5
A4
A5 H4
G6
A6
A7 G5
B4
A8
A9 B6
F9
DQ0
DQ1
F10
A14
A15 A5
B3
A16
A17 G4
G3
A18
A19 E5
G8
A2
A20 A3
A3 G7
H6
A0
A1 G9
B5
A10
A11 A4
A8
A12
A13 A7
A6
VCC
U206
7
CE1
CE2
6
5
CE3
GND
4
VDD
8
VOUT1
1
2
VOUT2
VOUT3
3
U212
100K
R243
R268
100
47K
R208
10NF
C242
22
R240
330K
2
3
1
R227
R261
22K
Q203
R273
100K
C222
10UF
6.3V
R275
100K
15PF
C203
C223
R218
22
VCC
VBAT
10K
R281
R228
270K
R207
22
D204
C217
NC
RX
TX
100K
R254
HP_PWR
C216
NC
R224
R246
VCC
22
6.3V
100K
C206
C235
33UF
R248
100NF
R241
NC
R253
0
D203
22K
ZD205
G2
S1
1
4
S2
U213
D1
6
3 D2
2 G1
5
100
R278
R210
0
10
R258
R272
NC
VCC
VCC
C244
NC
C202
100PF
C201
100PF
R266
100
C219
100NF
5
1 S1
S2 4
VCC
U209
6
D1
D2
3
G1
2
G2
0
R282
6.3V
C243
C239
33UF
6.3V
33UF
2.2UF
C228
6.3V
3
2
C220
2.2UF
6.3V
Q201
1
R236
390K
R217
22
C227
2.2UF
6.3V
VCC
R201
NC
100K
R250
22
R219
U210
ADJ
4
3
EN
GND
2
IN
1
OUT
5
BVDD
R251
100K
100K
R242
VCC
R269
100
VCC2
3
5
_RESET
100K
R232
U214
GND
2
1
SRT
4
VCC1
R203
1M
R225
22
100
R267
1
2
3
45
6
U208
10
R235
R247
6.8K
100K
R209
R260
1K
Q205
1
3
2
1UF
C224
1UF
C210
VCC
VCC
VCC
NC
C215
C226
10K
R213
VBAT
6.3V
10UF
C205
100NF
100
R265
D205
NC
R263
BOOT
C209
100NF
R249
100K
3 CONT
GND
2
1
VIN
5
VOUT
IVCC
BVDD
U215
BYP 4
470PF
C225
1K
1
2
3
4
5
R252
22
ZD203
R221
R244
100K
22PF
C241
47K
R239
R223
22
100NF
C233
C208
100NF
22
R226
20K
R255
100NF
C232
R211
C207
100NF
VBAT
100
0
R280
R216
R234
100K
1
2
3
4.7K
R256
ZD201
R212
NC
330K,1%
7
6
CE2
CE3
5
4
GND
8
VDD
1
VOUT1
VOUT2
2
3
VOUT3
U207
CE1
6.3V
ZD206
C236
2.2UF
BATT
GND
15PF
C204
R215
4.7K
0
R202
R257
2
3
1
NC
Q202
22
R222
22
R220
R238
330K,1%
100
R271
R276
100K
R206
10
C230
100NF
SI1305DL
Q206
D
3
G
1
S
2
10K
R274
VCC
6.3V
10UF
C221
6
D1
D2
3
G1
2
G2 5
1 S1
S2
4
U211
R233
U202
FC-255
R237
100K
ZD204
1
2
3
4
5
NC
3
1
VCC
Q204
2
VCC
100K
R245
1.2K
R259
100K
VBAT
R230
22
R279
BATT
R270
100
6.3V
2.2UF
C234
100NF
C240
BATT
BATT
RESET
SI2
C_FNSTRB
GBOOT_DI
BATT
HP_PWR
SIN2
SOUT2
V_RF3
V_RF1
VRX
AUX_ON
GBOOT_DI
DP_RX_DATA
DSR
SIN2
SCAN(7)
GBOOT_DI
RESET
SIN2
DO
SOUT2
RAPID
RX_CLK
VCTCXO_IN
STROB1
PDM_0_N
PA_GATE
V_F
SCLK
REED_SW
HP_PWR
DP_RX_DA
T
A
RESET
C_FNSTRB
SCLK
DO
C_FNSTRB
FLASH_CS
RTS
SRAM_CS
CTS
DTR
UBE
ADD(0)
FLASH_WP
V_F
RI
DP_TX_DATA
MEMOEB
CD
HP_PWR
MEMWEB
ADD(11)
DATA(7)_T
ADD(10)
DATA(6)_T
RX_AUDIO
ADD(9)
DATA(5)_T
ADD(8)
DATA(4)_T
SOUT2
CTS
ADD(7)
DATA(3)_T
ADD(6)
DATA(2)_T
ADD(5)
DATA(1)_T
ADD(3:21)
ADD(4)
DATA(0)_T
TX_AUDIO
DP_RX_DATA
ADD(3)
DP_TX_DATA
ADD(2)_T
HP_PWR
ADD(1)
RI
CD
LED_ON
ADD(21)
ADD(20)
HP_PWR
ADD(19)
DATA(15)
ADD(18)
DATA(14)
ON_SW_SENSE
ADD(17)
DATA(13)
ADD(16)
DATA(12)
GBOOT_DI
ON_SW
ADD(15)
DATA(11)
ADD(14)
DATA(10)
DSR
ADD(13)
DATA(9)
DATA(8:15)
ADD(12)
DATA(8)
RTS
DTR
TX_SYNC
TX_DA
T
A
1
AUX_CLK
AUX_STRB
AUX_DA
T
A
V_DET
DATA(6)_T
DATA(6)
RF_BAND_PCS
RF_BAND
DATA(5)_T
DATA(5)
DATA(4)_T
DATA(4)
DATA(3)_T
DATA(3)
DATA(2)_T
DATA(2)
PDM
DATA(1)_T
DATA(1)
PLL_ON
DATA(0)_T
DATA(0)
ADD(2)_T
ADD(2)
EL_EN
POWER_HOLD
V_IF_VCO
V_DRV_PCS
RAPID
DATA(7)_T
DATA(7)
DP_TX_DA
T
A
RT
S
DTR
CD
RI
DSR
CTS
V_F_EN
FLASH_WP
STRB0
DO
GBOOT_DI
SCLK
D_IF_OUT
LOCK_DET
ANALOG_DIG
ALC_EN
P
A_GA
T
E
TX_BA
T
RX_BA
T
PREAMP_G
RF_BAND
PLL_CLK
PLL_STRB1
PLL_DA
T
A
TX_CLK
ADD(12)
ADD(11)
ADD(10)
ADD(9)
ADD(8)
ADD(7)
ADD(6)
IFIC_RESET
ADD(5)
BBCLK
V_RF2
ADD(4)
MODE_STS
ADD(3)
VALID_STRB
PON_TX
ADD(2)
BIN
ADD(0:21)
ADD(1)
WBDRX
TX_BAT
ADD(0)
WBDTX
SIN2
RX_DATA
V_DRV_CELL
IF_ON
SOUT2
RX_SYNC
VCTCXO_PC
V_PA_BIAS_PCS
DATA(11)
DATA(10)
V_PA_BIAS_CELL
DATA(9)
DATA(8)
POWER_HOLD
DATA(7)
DATA(6)
DATA(5)
DATA(4)
RF_BAND
RF_BAND_PCS
TX_PWR
DATA(3)
DATA(2)
DATA(0:15)
DATA(1)
DATA(0)
ADD(21)
PDM
ADD(20)
ADD(19)
ADD(18)
ADD(17)
ADD(16)
ADD(15)
ADD(14)
ADD(13)
SCAN(4)
SCAN(5)
SCAN(6)
KEY(0)
KEY(1)
KEY(2)
SVC_LED_ON
AL
T_LED_ON
PON_VRF3
PON_LD
PON_TX
SEND_END
IF_ON
ON_SW_SENSE
DISPLAY_CS
SO2
SRAM_CS
SCK
FLASH_CS
SEN
FSYNC
UBE
MEMOEB
MEMWEB
DATA(15)
DATA(14)
DATA(13)
DATA(12)
V_LNA_DIG
RX_BAT
PREAMP_G
V_LNA_ANALOG
PLL_ON
ANALOG_DIG
ANALOG_DIG
PON_VRF3
LNA_VCC
TX_RFBAND
VIBRA
T
O
R
MIC_BIAS_EN
AMP_EN
HS_SENSE
ARM_TDI
ARM_TDO
ARM_TMS
ARM_TCK
ARM_TBRK
SLOT_T
SCAN(0)
SCAN(1)
SCAN(2)
SCAN(3)
4. BASE Circuit Diagram
SAMSUNG Proprietary-Contents may change without notice
10-11
STH-A225
Circuit Description & Circuit Diagrams
TL2
TL9
Note:
1UF
TL5
TL10
TL3
NC
TL8
2.C401,C402,C443,C444 are High Q capacitors
TL7
1.L325,L332 are High Q inductor (Coilcraft 0805HQ series)
TL1
TL4
12nH
NC
STH-A221_RF
(P=1.8pF)
100PF
C475
C311
100NF
NC
C425
R376
0
4.7K
C417
10NF
R375
R333
R303
470K
L314
27ohm
100NF
3.3nH
C379
56PF
C363
10PF
C328
4
1
2
L303
150nH
U306
5
3
L338
1.8NH
C392
1.8PF
C362
10PF
VCC
10PF
C308
U308
GC
3
2
GND
GND 5
4
RFIN
1
RFOUT
6
51
R381
100PF
R367
0
C415
L318
27nH
R310
27ohm
100PF
4.7K
C404
100PF
C321
R312
1NF
C323
L331
NC
25
GG
78
G
PO
1
VCC
6
VSW
3
4
VT
OSC301
G
G9
RX
3
TX
1
2.2NF
C353
G25
G26
29
6
G3
G4
78
G5
G6
91
0
G7
11
G8
12
21
22
G19
G2
5
G20
23
G21
24
G22
25
26
G23
G24
27
28
13
14
G11
G12
15
16
G13
17
G14
18
G15
G16
19
20
G17
G18
F306
ANT
2
4
G1
G10
C477
10PF
3
OUT
4
TER
NC
C446
F308
6
COUP
GND1
2
GND2
5
1
IN
6.3V
C428
4.7PF
C345
10UF
R390
10
10PF
C397
3.9PF
C408
R342
4.7K
R341
2.4
L307
51
1NF
C304
0
R400
R329
27ohm
NC
C456
C411
1NF
1NF
C372
4.7K
R320
R385
15K
R357
0
NC
C429
15PF
C386
C402
12PF
100
R355
R364
0
C471
R309
270
1.8PF
NC
R317
C365
100PF
R378
1.8PF
C480
6.2K
C324
C406
4.7nH
2.2NF
C466
15PF
100NF
L316
R377
1K
0
R407
OUT
3
1
VC
4
VCC
OSC302
GND
2
10PF
C314
NC
C341
R354
100
15PF
C450
L326
4.7nH
L317
1.8PF
C387
18nH
4.7NF
C433
68
TX_IB
72
TX_I/Q_REF
TX_Q
71
70
TX_QB
VCC
30
C369
10NF
RXQ
10
9
RXQB
7
TCXO
TXGND
61
TXIF_GND
73
TXIF_VCC
67
TXVCC
60
TX_I
69
QUAD
18
19
RSSI
RXI
12
11
RXIB
27
RXIF_GND1
RXIF_GND2
14
RXIF_VCC1
26
13
RXIF_VCC2
53
PLL1_CP
76
PLL2_CP
PLL2_GND
77
74
PLL2_IN
PLL2_VCC
75
78
PON_LD
80
PON_RX
PON_TX
79
57
PCSOUT
64
PCS_IF_FIL
TER_1
62
PCS_IF_FLITER_2
43
PCS_IN
49
PCS_LO_AMP_IN
55
PLL1FLSW
PLL1GND
56
51
PLL1VCC
MIX2GND
38
MIX2IN
34
35
MIX2INB
37
MIX2OUT
MIX2VCC
36
MIXOUTB
40
MOSGND
4
MOS_VCC
6
LIMOUT
20
47
LOAMP_GND
LO_AMP_VCC
50
39
MIX1GND
MIX1GND
46
MIX1VCC
42
MIX1_INB
44
41
MIX1_OUT
FM_AUDIO
16
66
GCA_CONT
33
GND
IOSGND
8
5
LD
23
LIM1OUT
25
LIM1/AGCIN
21
LIM2IN
3
DATA
DRV_GND
58
1
EN
15
FEEDBACK
31
FIL
TER1-A
FIL
TER1-B
32
FIL
TER2-A
28
29
FIL
TER2-B
45
CELIN
59
CELLOUT
CELL_IF_FIL
TER_1
65
CELL_IF_FIL
TER_2
63
CELL_LO_AMP_IN
48
CLK
2
CP1_GND
54
CP1_VCC
52
U304
17
AGC
BYP
ASS
22
BYP
ASS
24
100PF
C463
180nH
15PF
C350
L305
5
EN2
2
GND
GND
7
RFIN1
8
RFIN2
6
RFOUT1
1
3
RFOUT2
U301
EN1
4
L301
22nH
IN
1
3
OUT
15PF
C458
F314
2
G1
G2
4
5
G3
G4
6
C421
100PF
18K
L327
4.7nH
R386
10
R389
R404
0
270nH
L344
G1
2
4
G2
G3
5
6
G4
1
IN
OUT
3
F301
R335
51
16nH
L325
F309
1
G
3
GG
46
G
IN
2
OUT
5
100PF
C303
R392
R405
0
1K
COUP
6
G1
2
5
G2
IN
1
3
ISO
OUT
4
F313
C312
NC
C403
27ohm
R325
R406
11K
1NF
220K
R336
3.3nH
1nH
L333
OUT2
VC1
6
VC2
4
L306
2
GND
5
IN
OUT1
1
3
0
R347
U303
51
L341
100PF
C395
C400
1NF
R345
5.1K
R361
100K
100
R330
15PF
C451
C424
10NF
100NF
C315
10
R332
AN301
22PF
C301
100NF
C398
R410
1UF
C367
C337
100PF
0
R344
10
U307
GC
3
2
GND
GND
5
4
RFIN
1
RFOUT
6
VCC
100NF
18PF
C478
C343
C375
470PF
C376
33NF
C361
100PF
C325
1K
15PF
R322
R339
47NF
C448
470
100PF
C459
L323
8.2nH
R388
NC
C354
15PF
C306
1NF
2PF
27K
R362
C416
R323
1.5K
R327
180K
4.7K
R324
100NF
C344
100PF
10
C357
1
OUT
2
R307
U302
3
GND1
GND2
4
GND3
5
6
GND4
IN
C430
47NF
R401
C454
100NF
NC
R321
10K
NC
R351
NC
7
VMODE
VPD1
6
VPD2
8
C426
GND1
17
GND
4
RFIN
10
RFOUT
1
VCC2
VCC1
3
14
VCC
VCC2
15
VCC2
16
2F0
13
9
BGND
GND2
2
5
100
U309
R334
NC
L315
R346
820
2
G1
5
G2
1
S1
4
S2
Q301
D1
6
3
D2
0
R398
R319
27ohm
100NF
C358
L322
1.5nH
R349
100
1.5NF
C377
NC
R402
C470
10NF
G
6
2
IN
5
OUT
F304
1
G G
3 4
G
C438
0.5PF
R396
3K
C437
100NF
1
3
2
R370
Q302
4
G
G
6
2
IN
5
OUT
150
F310
G
1
G
3
C338
10NF
0
R365
1.2nH
100NF
C342
L342
C348
100NF
R301
1.2K
R331
1K
100NF
C419
100NF
R302
0
C326
L335
10nH
R305
NC
C382
1NF
C449
33UF
100PF
C455
4
SW
2
VCC
VT
3
NC
R397
OSC303
5
G
G
6
7
G
G
8
1
RFOUT
C310
100NF
10UF
6.3V
100
R409
C364
10NF
C464
C434
C410
100PF
3.9nH
L308
2.2PF
C390
2.7nH
100PF
C368
L336
R372
NC
8PF
100K
C474
C443
5PF
R387
R318 27ohm
3K
R315
R368
33K
C476
1UF
1NF
C412
R350
10
L311
15nH
1NF
C356
220nF
C413
L328
12nH
R304
2.4K
C472
5PF
C457
0.5PF
47NF
C467
100NF
C370
8.2NF
C442
L343
3.3nH
C374
10PF
1PF
C440
C336
100NF
47NF
C465
C420
10NF
L304
39nH
OUT
ANT_STOPPER
C349
NC
F311
1
GND1
GND2
4
2
IN
3
R371
51
R328
27ohm
100NF
L302
330nH
C331
R311
10
2.2PF
1.8PF
C441
C439
1.5PF
C333
C399
100PF
10
R356
C309
R313
1K
C320
10PF
NC
NC
C462
3
4.7K
R366
F312
GND1
1
4
GND2
IN
2
OUT
1NF
C313
C366
100NF
C330
100PF
1
R308
0
D301
3
2
2
1
8PF
C305
D302
3
R374
0
100PF
C327
C371
1NF
5PF
C401
1.8PF
C473
5PF
C444
1.8PF
C479
R343
4.7uH
L309
4.7K
100PF
NC
C352
NC
C461
C351
L310
330uH
C469
15PF
100NF
C388
R363
2.2K
C431
100PF
R316
470
22PF
C396
R306
100PF
C340
10
C302
100NF
R338
0
R359
56K
C483
2PF
L332
NC
R408
4
G3 G4
6
IN
5
2
OUT
F302
1
G1 G2
3
C482
1.5NF
C445
10NF
C381
10NF
L324
12nH
C409
100NF
R393
3K
3.9PF
C316
C318
100PF
56PF
C418
NC
330PF
C329
R348
C407
8PF
2.7NF
C346
10NF
C427
1NF
C452
0
R340
10
R380
1PF
C447
C378
10NF
R399
NC
C453
2.2PF
C335
NC
L337
4.7nH
L329
15nH
L312
6.8nH
14 15
VCC1
VCC1
16
6
VMODE
VREG1
5
VREG2
7
2
GND
3
GND
GND
9
GND
17
RFIN
4
12
RFOUT
RFOUT
11
10
RFOUT
VCCB
U305
13
2F0
8
BGND
GND
1
100PF
C355
10NF
C384
R382
100K
68PF
C307
27ohm
R326
L330
3.9nH
R373
10
NC
R384
R314
47
R360
C322
5PF
R337
10
100PF
10K
100PF
C393
3
GND
1
2
4
5
VCC
C394
U310
15PF
C468
C380
10UF
6.3V
10NF
C383
10
C339
1UF
R379
C332
C405
100NF
100NF
C436
10PF
27nH
L339
10NF
C460
C435
1.8PF
4.7uH
L313
R369
2.2K
2.7K
R391
6.3V
10UF
C360
C432
10NF
C373
8.2nH
L334
100K
R383
10
V_LNA_DIG
V_LNA_ANALOG
VBAT
MOD_FET
ANALOG_DIG
RX_BA
T
PLL_CLK
PLL_DATA
PLL_STRB1
PON_LD
RX_BAT
ALC_EN
RX_I
RX_IN
RX_Q
RX_QN
TX_I
TX_IN
TXDA_REF
TX_Q
TX_QN
MOD_FET
V_IF_VCO
MOD
V_IF_VCO
TX_RFBAND
V_RF2
PA_CNT
PA_CNT
TX_PWR
VBAT
RX_BAT
ANALOG_DIG
V_DET
V_RF2
RF_BAND
V_PA_BIAS_CELL
RSSI
AFC_OUT
V_VCTCXO
TX_BAT
V_RF1
V_RF3
LNA_VCC
V_RF1
PA_CNT
V_DRV_PCS
V_DRV_PCS
V_PA_BIAS_PCS
V_DRV_CELL
V_DRV_CELL
LOCK_DET
V_RF1
VCTCXO_IN
V_RF1
DEMOD
AGC_OUT
A_IF_IN
V_RF1
VRX
VRX
VRX
5. RF Circuit Diagram
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